DE202006005160U1 - Water cooling system for use in CPU of computer, has channel designed in base for accommodating coolant, and recycling device placed in cavity for recycling coolant - Google Patents
Water cooling system for use in CPU of computer, has channel designed in base for accommodating coolant, and recycling device placed in cavity for recycling coolant Download PDFInfo
- Publication number
- DE202006005160U1 DE202006005160U1 DE202006005160U DE202006005160U DE202006005160U1 DE 202006005160 U1 DE202006005160 U1 DE 202006005160U1 DE 202006005160 U DE202006005160 U DE 202006005160U DE 202006005160 U DE202006005160 U DE 202006005160U DE 202006005160 U1 DE202006005160 U1 DE 202006005160U1
- Authority
- DE
- Germany
- Prior art keywords
- water
- channel
- coolant
- housing
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H10W40/47—
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Structures Of Non-Positive Displacement Pumps (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Die Erfindung betrifft allgemein ein Wasserkühlsystem, insbesondere ein solches, wie es zum Kühlen einer CPU in einem Computer verwendet wird.The The invention relates generally to a water cooling system, in particular such as for cooling a CPU is used in a computer.
Einhergehend mit der immer höheren Arbeitsgeschwindigkeit von CPUs wird deren Wärmeentwicklung immer höher, so dass es immer schwieriger wird, sie auf der korrekten Arbeitstemperatur zu halten.accompanying with the ever higher Working speed of CPUs, their heat development is getting higher, so that it gets harder and harder to keep them at the correct working temperature to keep.
Die
Jedoch
sind mit der Wärmesenke,
der Wasserpumpe, dem Kühler,
dem Wasserbehälter
und den Leitungen bei diesem bekannten Kühlsystem
Der Erfindung liegt die Aufgabe zugrunde, ein Kühlsystem mit Wasserkühlung zu schaffen, das kompakt aufgebaut werden kann.Of the Invention is based on the object, a cooling system with water cooling create that can be built compact.
Diese Aufgabe ist durch das Kühlsystem gemäß dem beigefügten Anspruch 1 gelöst. Bei ihm wird direkt das Gehäuse dazu verwendet, das Kühlwasser zu kühlen. Ferner ist eine kompakte Umwälzeinrichtung vorhanden, die für die Funktionen der Wasserspeicherung, Wasserumwälzung und des Wärmeaustauschs sorgt.These Task is through the cooling system according to the appended claim 1 solved. With him directly the case used the cooling water to cool. Furthermore, a compact circulation device available for the functions of water storage, water circulation and heat exchange provides.
Ein Kühlsystem gemäß der Erfindung verfügt über ein Gehäuse, eine Umwälzeinrichtung und einen Kühler. Das Gehäuse verfügt über mindestens eine Fläche aus einem Wärme leitenden Metall in Kontakt mit einer Wärmequelle. Das Gehäuse verfügt über eine Vertiefung am Boden mit einem dort ausgebildeten Kanal zum Aufnehmen von Kühlflüssigkeit, und es verfügt über einen Einlass und einen Auslass, die mit der Vertiefung verbunden sind. Weiterhin sind zwei Leitungen vorhanden, um Verbindungen zum Einlass und zum Auslass des Kühlers herzustellen. Die Umwälzeinrichtung ist in der Vertiefung angeordnet, um die Kühlflüssigkeit umzuwälzen. Infolgedessen wird von der Wärmequelle erzeugte Wärme direkt zum Gehäuse geleitet, und durch die Kühlflüssigkeit, die durch die Umwälzeinrichtung umgewälzt wird, zum Kühler geleitet.One cooling system according to the invention has one Casing, a circulation device and a cooler. The housing has at least one area from a heat conductive metal in contact with a heat source. The case has one Well on the ground with a trained there channel for recording of cooling liquid, and it has one Inlet and an outlet, which are connected to the recess. Furthermore, there are two lines to connect to the inlet and to the outlet of the radiator manufacture. The circulation device is disposed in the recess to circulate the cooling liquid. Consequently gets from the heat source generated heat directly to the housing passed, and by the cooling liquid, by the circulation device circulated becomes, to the cooler directed.
Der Kanal kann mit mehreren Öffnungen, vorstehenden Säulen und Wirbelschlitzen am Boden der Vertiefung versehen sein, um die Wärmeaustauschfläche zu erhöhen. Die Umwälzeinrichtung verfügt über einen Rotor, einen Behälter und einen Stator. Der Rotor verfügt über einen Magnetpol und ein Laufrad, und der Stator verfügt über eine Leiterplatte, eine Spule und einen Kern. Das Laufrad befindet sich unmittelbar über dem Kanal, damit durch seine Drehung die Strömungsrate der Kühlflüssigkeit erhöht werden kann, um die Wärmeaustauscheffizienz zu verbessern.Of the Channel may have several openings, protruding columns and vortices are provided at the bottom of the recess to the Increase heat exchange surface. The Circulating device has a Rotor, a container and a stator. The rotor has one Magnetic pole and an impeller, and the stator has a printed circuit board, one Coil and a core. The impeller is located directly above the Channel, so that by its rotation, the flow rate of the cooling liquid elevated can be to heat exchange efficiency too improve.
Die Erfindung wird nachfolgend anhand von durch Figuren veranschaulichten Ausführungsformen näher erläutert.The Invention will now be illustrated by figures embodiments explained in more detail.
Wo immer es möglich ist, sind in den Zeichnungen und der zugehörigen Beschreibung dieselben Bezugszeichen dazu verwendet, dieselben oder ähnliche Teile zu kennzeichnen.Where always possible are the same in the drawings and the associated description Reference numeral used to identify the same or similar parts.
Gemäß den
Das
Gehäuse
Ferner
verfügt
das Gehäuse
Wie
es in der
Gemäß der
Wie
es in der
Gemäß der
Bei
der Ausführungsform
wird das direkt an der CPU
Claims (12)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW094210693U TWM279915U (en) | 2005-06-24 | 2005-06-24 | Water-cooling heat dissipation mechanism |
| TW094210693 | 2005-06-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE202006005160U1 true DE202006005160U1 (en) | 2006-07-20 |
Family
ID=36776676
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE202006005160U Expired - Lifetime DE202006005160U1 (en) | 2005-06-24 | 2006-03-30 | Water cooling system for use in CPU of computer, has channel designed in base for accommodating coolant, and recycling device placed in cavity for recycling coolant |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE202006005160U1 (en) |
| TW (1) | TWM279915U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202011102654U1 (en) | 2011-06-06 | 2011-08-19 | Megware Computer Gmbh | Arrangement for operating a high-performance computer |
| DE102013019245A1 (en) | 2013-10-24 | 2015-04-30 | Alexander Dominik Höbel | Device for cooling electronic components |
| DE202018102582U1 (en) | 2018-01-23 | 2018-05-22 | MEGWARE Computer Vertrieb und Service GmbH | High temperature direct liquid cooled high performance computer system |
| CN109769362A (en) * | 2019-03-08 | 2019-05-17 | 陈新宇 | A kind of Cabinet that communication waterproof performance is good |
| CN113660824A (en) * | 2021-06-30 | 2021-11-16 | 杭州长川科技股份有限公司 | Cooling structure, indenter assembly and test equipment |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI580344B (en) | 2016-02-24 | 2017-04-21 | 訊凱國際股份有限公司 | Water Colling System |
| CN113655868B (en) * | 2020-05-12 | 2025-03-25 | 中兴通讯股份有限公司 | Heat dissipation structure, heat dissipation method, terminal and storage medium |
-
2005
- 2005-06-24 TW TW094210693U patent/TWM279915U/en not_active IP Right Cessation
-
2006
- 2006-03-30 DE DE202006005160U patent/DE202006005160U1/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202011102654U1 (en) | 2011-06-06 | 2011-08-19 | Megware Computer Gmbh | Arrangement for operating a high-performance computer |
| DE102013019245A1 (en) | 2013-10-24 | 2015-04-30 | Alexander Dominik Höbel | Device for cooling electronic components |
| DE202018102582U1 (en) | 2018-01-23 | 2018-05-22 | MEGWARE Computer Vertrieb und Service GmbH | High temperature direct liquid cooled high performance computer system |
| CN109769362A (en) * | 2019-03-08 | 2019-05-17 | 陈新宇 | A kind of Cabinet that communication waterproof performance is good |
| CN113660824A (en) * | 2021-06-30 | 2021-11-16 | 杭州长川科技股份有限公司 | Cooling structure, indenter assembly and test equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM279915U (en) | 2005-11-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R207 | Utility model specification |
Effective date: 20060824 |
|
| R150 | Utility model maintained after payment of first maintenance fee after three years |
Effective date: 20090424 |
|
| R082 | Change of representative |
Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWA, DE Representative=s name: TER MEER STEINMEISTER & PARTNER GBR PATENTANWAELTE |
|
| R081 | Change of applicant/patentee |
Owner name: CHEMTRON RESEARCH LLC, DOVER, US Free format text: FORMER OWNER: COOLER MASTER CO., LTD., CHUNG-HO, TAIPEH, TW Effective date: 20120116 Owner name: CHEMTRON RESEARCH LLC, US Free format text: FORMER OWNER: COOLER MASTER CO., LTD., CHUNG-HO, TW Effective date: 20120116 |
|
| R082 | Change of representative |
Representative=s name: TER MEER STEINMEISTER & PARTNER PATENTANWAELTE, DE Effective date: 20120116 |
|
| R151 | Utility model maintained after payment of second maintenance fee after six years |
Effective date: 20120126 |
|
| R152 | Utility model maintained after payment of third maintenance fee after eight years | ||
| R152 | Utility model maintained after payment of third maintenance fee after eight years |
Effective date: 20140221 |
|
| R071 | Expiry of right |