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DE19882125T1 - Direkte Abscheidung von Palladium - Google Patents

Direkte Abscheidung von Palladium

Info

Publication number
DE19882125T1
DE19882125T1 DE19882125T DE19882125T DE19882125T1 DE 19882125 T1 DE19882125 T1 DE 19882125T1 DE 19882125 T DE19882125 T DE 19882125T DE 19882125 T DE19882125 T DE 19882125T DE 19882125 T1 DE19882125 T1 DE 19882125T1
Authority
DE
Germany
Prior art keywords
palladium
direct deposition
deposition
direct
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE19882125T
Other languages
English (en)
Other versions
DE19882125B4 (de
Inventor
Sunity Kumar Sharma
Kuldip Kumar Bhasin
Subhash C Narang
Asutosh Nigam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Whitaker LLC
Original Assignee
Whitaker LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker LLC filed Critical Whitaker LLC
Publication of DE19882125T1 publication Critical patent/DE19882125T1/de
Application granted granted Critical
Publication of DE19882125B4 publication Critical patent/DE19882125B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
    • C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
DE19882125T 1997-02-28 1998-02-24 Direkte Abscheidung von Palladium Expired - Fee Related DE19882125B4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/808,302 1997-02-28
US08/808,302 US5894038A (en) 1997-02-28 1997-02-28 Direct deposition of palladium
PCT/US1998/003598 WO1998038351A1 (en) 1997-02-28 1998-02-24 Direct deposition of palladium

Publications (2)

Publication Number Publication Date
DE19882125T1 true DE19882125T1 (de) 2000-01-05
DE19882125B4 DE19882125B4 (de) 2009-03-19

Family

ID=25198407

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19882125T Expired - Fee Related DE19882125B4 (de) 1997-02-28 1998-02-24 Direkte Abscheidung von Palladium

Country Status (5)

Country Link
US (1) US5894038A (de)
JP (1) JP4108135B2 (de)
AU (1) AU6184698A (de)
DE (1) DE19882125B4 (de)
WO (1) WO1998038351A1 (de)

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US20030148024A1 (en) * 2001-10-05 2003-08-07 Kodas Toivo T. Low viscosity precursor compositons and methods for the depositon of conductive electronic features
EP1290068B1 (de) * 2000-06-02 2010-08-25 SRI International Polymermembranzusammensetzung
US6630062B1 (en) 2000-08-04 2003-10-07 Delphi Technologies, Inc. Poison resistant sensor
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US6555159B2 (en) 2000-12-18 2003-04-29 Delphi Technologies, Inc. Coating for gas sensors
US7316855B2 (en) * 2001-06-01 2008-01-08 Polyfuel, Inc. Fuel cell assembly for portable electronic device and interface, control, and regulator circuit for fuel cell powered electronic device
ATE400904T1 (de) * 2001-06-01 2008-07-15 Polyfuel Inc Austauschbare brennstoffpatrone, brennstoffzellenaggregat mit besagter brennstoffpatrone für tragbare elektronische geräte und entsprechendes gerät
US6706234B2 (en) 2001-08-08 2004-03-16 Nanotek Instruments, Inc. Direct write method for polarized materials
US20060001726A1 (en) * 2001-10-05 2006-01-05 Cabot Corporation Printable conductive features and processes for making same
US6951666B2 (en) * 2001-10-05 2005-10-04 Cabot Corporation Precursor compositions for the deposition of electrically conductive features
US7524528B2 (en) * 2001-10-05 2009-04-28 Cabot Corporation Precursor compositions and methods for the deposition of passive electrical components on a substrate
US20030108664A1 (en) * 2001-10-05 2003-06-12 Kodas Toivo T. Methods and compositions for the formation of recessed electrical features on a substrate
US7629017B2 (en) * 2001-10-05 2009-12-08 Cabot Corporation Methods for the deposition of conductive electronic features
KR20040077655A (ko) * 2001-10-19 2004-09-06 슈페리어 마이크로파우더스 엘엘씨 전자 형상 증착용 테잎 조성물
US7553512B2 (en) * 2001-11-02 2009-06-30 Cabot Corporation Method for fabricating an inorganic resistor
US7258899B1 (en) * 2001-12-13 2007-08-21 Amt Holdings, Inc. Process for preparing metal coatings from liquid solutions utilizing cold plasma
US6911385B1 (en) * 2002-08-22 2005-06-28 Kovio, Inc. Interface layer for the fabrication of electronic devices
US8071168B2 (en) * 2002-08-26 2011-12-06 Nanoink, Inc. Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
US20040146769A1 (en) * 2002-12-02 2004-07-29 Michael Birschbach Fuel cell cartridge for portable electronic device
US20040151978A1 (en) * 2003-01-30 2004-08-05 Huang Wen C. Method and apparatus for direct-write of functional materials with a controlled orientation
DE602004032478D1 (de) * 2004-01-29 2011-06-09 Nippon Mining Co Eidung und verfahren zur stromlosen metallabscheidung unter verwendung davon
US20050276911A1 (en) * 2004-06-15 2005-12-15 Qiong Chen Printing of organometallic compounds to form conductive traces
US8383014B2 (en) 2010-06-15 2013-02-26 Cabot Corporation Metal nanoparticle compositions
US20060163744A1 (en) * 2005-01-14 2006-07-27 Cabot Corporation Printable electrical conductors
US8167393B2 (en) * 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US7824466B2 (en) 2005-01-14 2010-11-02 Cabot Corporation Production of metal nanoparticles
WO2006076610A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Controlling ink migration during the formation of printable electronic features
WO2006076613A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Metal nanoparticle compositions
ATE485171T1 (de) * 2005-01-14 2010-11-15 Cabot Corp Sicherheitseinrichtungen sowie verwendung und herstellungsverfahren davon
WO2006076615A1 (en) * 2005-01-14 2006-07-20 Cabot Corporation Ink-jet printing of compositionally no-uniform features
WO2006076606A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation Optimized multi-layer printing of electronics and displays
US20060190917A1 (en) * 2005-01-14 2006-08-24 Cabot Corporation System and process for manufacturing application specific printable circuits (ASPC'S) and other custom electronic devices
WO2006076608A2 (en) * 2005-01-14 2006-07-20 Cabot Corporation A system and process for manufacturing custom electronics by combining traditional electronics with printable electronics
US7625637B2 (en) * 2006-05-31 2009-12-01 Cabot Corporation Production of metal nanoparticles from precursors having low reduction potentials
US8110254B1 (en) 2006-09-12 2012-02-07 Sri International Flexible circuit chemistry
US7981508B1 (en) 2006-09-12 2011-07-19 Sri International Flexible circuits
US7946690B2 (en) * 2007-02-20 2011-05-24 Mvm Technologies, Inc. Printhead fabricated on flexible substrate
US8628818B1 (en) 2007-06-21 2014-01-14 Sri International Conductive pattern formation
US7989029B1 (en) 2007-06-21 2011-08-02 Sri International Reduced porosity copper deposition
US8895874B1 (en) 2009-03-10 2014-11-25 Averatek Corp. Indium-less transparent metalized layers
US8962512B1 (en) * 2011-01-05 2015-02-24 Stc.Unm Synthesis of PD particles by alcohols-assisted photoreduction for use in supported catalysts
US8574665B2 (en) 2011-06-06 2013-11-05 Xerox Corporation Palladium precursor composition
US8986819B2 (en) 2011-06-06 2015-03-24 Xerox Corporation Palladium precursor composition
US8568824B2 (en) * 2011-06-06 2013-10-29 Xerox Corporation Palladium precursor composition
US8741036B2 (en) 2012-02-02 2014-06-03 Xerox Corporation Composition of palladium unsaturated organoamine complex and palladium nanoparticles
US8741037B2 (en) * 2012-02-02 2014-06-03 Xerox Corporation Composition of palladium unsaturated carboxylate and palladium nanoparticles
US8613796B1 (en) * 2012-09-17 2013-12-24 Xerox Corporation Palladium precursor composition having a fluorinated component
TW201614748A (en) * 2013-01-23 2016-04-16 Heraeus Materials Tech Gmbh Coated wire for bonding applications, method for manufacturing the same, and application thereof in an electronic device
JP2016537819A (ja) * 2013-11-21 2016-12-01 ヘレウス ドイチェラント ゲーエムベーハー ウント カンパニー カーゲー 接合適用のためのコーティングされたワイヤ
JP7072812B2 (ja) * 2018-03-05 2022-05-23 学校法人 芝浦工業大学 導体の製造方法、配線基板の製造方法及び導体形成用組成物

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US4176085A (en) * 1970-07-09 1979-11-27 Atlantic Richfield Company Palladium-containing catalyst
US4042392A (en) * 1975-04-14 1977-08-16 Eastman Kodak Company Formazan images by physical development of catalytic metal nuclei image
US4046569A (en) * 1975-04-14 1977-09-06 Eastman Kodak Company Physical development of pd(ii) photosensitive complexes with a leucophthalocyanine dye and a reducing agent therefor
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GB2171721B (en) * 1985-01-25 1989-06-07 Omi Int Corp Palladium and palladium alloy plating
DE3826046A1 (de) * 1987-08-17 1989-03-02 Asea Brown Boveri Verfahren zur herstellung von metallischen schichten
US4933204A (en) * 1988-09-23 1990-06-12 Rockwell International Corporation Method of producing a gold film
DE3922233A1 (de) * 1989-07-06 1991-01-17 Guenter Link Verfahren zur abscheidung von metallen aus metallorganischen verbindungen mittels photonenstrahlung
US5021398A (en) * 1989-10-26 1991-06-04 Amp Incorporated Method of forming patterned oxide superconducting films
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US5281447A (en) * 1991-10-25 1994-01-25 International Business Machines Corporation Patterned deposition of metals via photochemical decomposition of metal-oxalate complexes

Also Published As

Publication number Publication date
DE19882125B4 (de) 2009-03-19
WO1998038351A1 (en) 1998-09-03
AU6184698A (en) 1998-09-18
JP2001513848A (ja) 2001-09-04
JP4108135B2 (ja) 2008-06-25
US5894038A (en) 1999-04-13

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Legal Events

Date Code Title Description
8110 Request for examination paragraph 44
8364 No opposition during term of opposition
R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee

Effective date: 20130903