DE19647846C1 - Chip card manufacturing method - Google Patents

Abstract

In the method, a semiconductor chip module is inserted in a recess (2) in the surface of the card carrier (1), in electrical contact with an inductive signal transmission device provided by an antenna coil (3). The antenna coil, or its end terminations (4) are located within the recess for the semiconductor chip module and wound in a spiral for absorbing the flexure and/or torsion forces in the vicinity of the semiconductor chip module connections.

Description

The invention relates to a method for producing a Chip card, with a half located on a module conductor chip inserted in a recess of a card carrier and with an inductive signal transmission device in the form an antenna coil is contacted.

It is known in the manufacture of a chip card, in particular special one in which both means for contactless Data transmission as well as a galvanic contact level there is a module in a card body, which comprises a semiconductor chip.

The module with semiconductor chip is preferably in an off in the card body and by means of joining or the same with the card body while receiving a correspond laminated mechanical and electrical connection.  

For example, an electrical connection between the module and card body or Kon located on the card body clock that with a coil to produce a contactless This creates a connection to the surroundings come that an anisotropic conductive adhesive in the area of Connection points and / or the connection points of the respective Applied for a contactless data transfer and the adhesive so far at least in the area of the connection points is compressed or compressed that an electrically conductive Bridge is created.

DE 195 00 925 A1 describes a chip card for contactless Data transmission of the type mentioned above, where there se a transmission module built into a card body perat becomes. An antenna in the form of a coil is also used inductive contactless data transmission provided. For electrical coupling between a chip module and the Transfer modules are formed pads. The actual connection is made, for example, by a Soldering process or by ultrasonic welding. With mechanical Alternating stress, however, there is a risk that the electrical connection, in particular between the chip module and the transmission module, which has the antenna coil, resolves, causing malfunctions or a total failure for the chip card can result.

The modules used in the production of chip cards grei usually back on a plastic carrier on which the semiconductor chip mentioned at the beginning, optionally with so-called contact surfaces is arranged. That so Prefabricated ISO module is with the card carrier, the z. B. from Polycarbonate can be connected. This connection or inserting the module into the card body in a z. B. milled recess is usually made using the adhesive processes mentioned when using a hot or Hot melt adhesive.  

In the case when combo cards that are used both for contactless are also suitable for contact use, or con tactless cards are to be produced, another must Contact level with connection points for the induction loop, d. H. for the signal transmission device. These connection points are in the known state of the Technology preferably raised on the surface of the module and / or on the surface or on the side surfaces of the Aus within the card carrier. With such arrangements it is then possible to glue module and card holders gladly by manufacturing the electrically conductive connector in a single operation. It has however, showed that the required temperature and time re gime to make both electrical and reliable mechanical connections is subject to tight tolerances, so that if process parameters are not optimal, long-term stability cards produced in this way is reduced  and that it is due to the dimensions and the plastic Features of the module and card holder for Verwin Tensions and tensions in the map are consequently disturbed electrical connections.

In addition, there is the Signal transmission devices the problem that the formation the cavity must be done extremely precisely to ensure that on the one hand the contact areas are exposed, on the other on the other hand, excessive material removal is avoided.

It is therefore an object of the invention to provide a method for manufacturing provide a smart card, one on a module located semiconductor chip in a recess of a card Carrier is used and this module with a inductive signal transmission device in the form of an antenna Contact coil should be electrically contacted so that when Make the recess in the card body with large Security the corresponding contact areas exposed and it is still guaranteed that Torsional and / or bending stresses within the card body do not increase an undesirable change in the electrical connections to lead.

The object of the invention is achieved with a Ver drive according to the features of claim 1, the Subclaims at least useful configurations and Training includes.

According to a first basic idea of the invention, the Antenna coil connecting ends of the signal transmission device, that protrude into the recess in the card body, meandering or spiral-shaped.

Due to the meandering or spiral shape of the antenna coils concluding ensures that bending and / or torsion forces that later on the card body and thus act on the contact surface, can be absorbed, so  that it is ensured that no undesirable changes of the contact properties occur.

In one embodiment of the invention, the antennas have coil connecting ends with the shape of a spiral spiral spring Distance between turns.

The formation of the antenna coil connection ends takes place at a preferred embodiment of the invention, that the meandering or spiral turns with one to Recess center related to the card's longitudinal or cross-section increasing course. By this measure is ensured that the subsequent insertion of the off take in the card body, preferably by milling, a sufficiently large contact point is given. This contact then forms with the electrical pads of the Module or the semiconductor chip a contact connection, so that the inductive signal transmission between the environment and the chip can be done by means of an antenna.

Because of the increasing course of the meandering or spiral end of the antenna coil formed at the Milling compensated tolerances never to be avoided, so that the Manufacturing technology effort in the manufacture of Chip card can be reduced overall.

The actual contacting process can then under back grabbed a conductive glue or by itself Known solder and / or weld connections are made, wherein required thermal energy via the back of the module to the Contact connection points can be fed.

All in all, the method according to the invention succeeds Contact connections from sufficient long-term stability form, the arrangement of the antenna coil within the Card body, for example when pouring the same in can be done in a known manner. By the ones you want The process becomes spring effects of the antenna coil connection ends safety when retrofitting the module with half  conductor chip increased. Due to the advantageous rising The course of the turns is a safe milling of the antenna coil or the antenna coil connecting ends in the manufacture of Recess or cavity ensures that the most important prerequisite for the production of Contact connection between module and antenna guaranteed is.

The invention is based on an embodiment as well are explained in more detail with the aid of figures.

Here show:

Fig. 1 is a chip card in plan view with recognizable Ausneh tion and antenna meander and

FIG. 2 shows a cross section along the line AA of the chip card according to FIG. 1.

The chip card 1 shown in the figures has a recess or cavity 2 . The recess 2 serves to receive a module, not shown, consisting of a carrier substrate and a semiconductor chip fastened thereon.

The carrier substrate or the module can have electrical contact surfaces which interact with the terminal when the card is inserted into the terminal. The semiconductor chip is chip-contacted in a known manner on the carrier substrate and has electrical contact areas which are used for connection to an inductive signal transmission device, namely an antenna 3 . The antenna 3 ( FIG. 2) is located in the material of the chip card 1 and, in a manner known per se, interacts inductively with a corresponding coil, which is arranged in a reading terminal.

In one embodiment, the carrier substrate has the Module on the side of the actual chip contact areas that electrically connectable to the antenna coil connection ends are.  

As can be seen in the plan view according to FIG. 1, in the exemplary embodiment of the invention the antenna coil connection ends 4 are formed as meanders. The meander shape extends essentially over the area of the electrical connection surfaces of the module to be used.

The recess 2 , which can be seen from the cross-sectional view according to FIG. 2, has a chip receiving area 5 and an overlying z. B. milled surface 6 for the carrier substrate. In the example according to FIG. 2, the module formed from the chip and carrier substrate is brought with the chip facedown into the chip receiving area 5 , the carrier substrate almost completely closing the corresponding milled surface 6 .

On the underside of the carrier substrate, not shown, there are electrical connection surfaces which can be connected to the contact points 7 of the antenna coil connection ends 4 , for example by means of conductive adhesive, soldering, welding or the like.

The embodiment shown in FIG. 2, for example, with antenna coil connecting ends 4 having an increasing profile toward the center of the recess 2 , ensures when inserting the recess into the card body or into the chip card 1 that contact points 7 are milled with sufficient certainty, ie are exposed.

Due to the meandering shape of the antenna coil connecting ends 4 min at least in the contact area or also through the formation of the connecting ends 4 as a spiral spiral spring with a winding spacing, bending and torsional forces have an adverse effect on the quality of contact of the electrical connection points, both in the manufacturing process and in later use of the card .

After inserting the module and establishing the electrical connection between the connection ends 4 and the module connection surfaces, the open side of the recess can be closed by means of a cover plate or by means of a laminating film. Any remaining intermediate spaces are filled with a plastic mass.

In a further embodiment of the invention a spatially coiled spiral spring, preferably in cylin drischer or truncated cone shape for the formation of the antenna end coil terminal ends.

Reference list

1 chip card or card carrier
2 recess
3 antenna
4 antenna coil connecting ends
5 chip receiving area
6 milled surface for carrier substrate
7 contact points.

Claims (3)

1. A method for producing a chip card, wherein a semiconductor chip located on a module is inserted in a recess in a card carrier and contacted with an inductive signal transmission device in the form of an antenna coil, characterized in that the antenna coil ( 3 ) or the antenna coil connecting ends ( 4 ) at least in Area of electrical connection surfaces of the module or the semiconductor chip within the recess ( 2 ) for absorbing bending and / or torsional forces is meandering or spiral. 2. The method according to claim 1, characterized in that the antenna coil connection ends ( 4 ) are designed as spiral bending springs with a winding spacing. 3. The method according to claim 1 or 2, characterized in that the formation of the antenna coil connection ends with a to the recess center in relation to the card longitudinal or cross-sectional increasing course of the meandering or spiral turns takes place, so that when the recess ( 2 ) is made in the card body ( 1 ) preferably by milling a safe exposure of contact points ( 7 ) is given.