DE1207181B - Covering agent for the production of etched patterns on metal foils - Google Patents
Covering agent for the production of etched patterns on metal foilsInfo
- Publication number
- DE1207181B DE1207181B DEB65321A DEB0065321A DE1207181B DE 1207181 B DE1207181 B DE 1207181B DE B65321 A DEB65321 A DE B65321A DE B0065321 A DEB0065321 A DE B0065321A DE 1207181 B DE1207181 B DE 1207181B
- Authority
- DE
- Germany
- Prior art keywords
- production
- covering
- resistant
- acid
- metal foils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 239000011888 foil Substances 0.000 title claims description 5
- 239000002184 metal Substances 0.000 title claims description 5
- 229910052751 metal Inorganic materials 0.000 title claims description 5
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 10
- 239000011347 resin Substances 0.000 claims description 10
- 239000002253 acid Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000000975 dye Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 229920000180 alkyd Polymers 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 229920001800 Shellac Polymers 0.000 claims description 2
- DCYOBGZUOMKFPA-UHFFFAOYSA-N iron(2+);iron(3+);octadecacyanide Chemical compound [Fe+2].[Fe+2].[Fe+2].[Fe+3].[Fe+3].[Fe+3].[Fe+3].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-].N#[C-] DCYOBGZUOMKFPA-UHFFFAOYSA-N 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- 229960003351 prussian blue Drugs 0.000 claims description 2
- 239000013225 prussian blue Substances 0.000 claims description 2
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 claims description 2
- 229940113147 shellac Drugs 0.000 claims description 2
- 235000013874 shellac Nutrition 0.000 claims description 2
- 239000004208 shellac Substances 0.000 claims description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 230000000873 masking effect Effects 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 238000010186 staining Methods 0.000 claims 1
- 239000003513 alkali Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004922 lacquer Substances 0.000 description 3
- 235000011121 sodium hydroxide Nutrition 0.000 description 3
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 238000005554 pickling Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- RMAQACBXLXPBSY-UHFFFAOYSA-N silicic acid Chemical compound O[Si](O)(O)O RMAQACBXLXPBSY-UHFFFAOYSA-N 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000012800 visualization Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0166—Polymeric layer used for special processing, e.g. resist for etching insulating material or photoresist used as a mask during plasma etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0769—Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
- H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
- H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- ing And Chemical Polishing (AREA)
Description
BUNDESREPUBLIK DEUTSCHLANDFEDERAL REPUBLIC OF GERMANY
DEUTSCHESGERMAN
PATENTAMTPATENT OFFICE
AUSLEGESCHRIFTEDITORIAL
Int. α.:Int. α .:
Nummer.
Aktenzeichen:
Anmeldetag:
Auslegetag:Number.
File number:
Registration date:
Display day:
C23fC23f
Deutsche KL: 48 dl-1/02German KL: 48 dl-1/02
B65321VIb/48dl
23. Dezember 1961
16. Dezember 1965B65321VIb / 48dl
December 23, 1961
December 16, 1965
Die Erfindung betrifft die Verwendung von säurebeständigen, aber in alkalischen wäßrigen Lösungen leicht löslichen oder verseifbaren Harzen.The invention relates to the use of acid-resistant, but in alkaline aqueous solutions easily soluble or saponifiable resins.
Bei der Herstellung sogenannter gedruckter Schaltungen nach einem Ätzverfahren wird auf ein mit Kupferfolie kaschiertes Trägermaterial ein entsprechendes Leitungsmuster mittels einer säurebeständigen Farbe aufgedruckt und die freien Teile in entsprechenden Ätzbädern mit mehr oder minder saurer Reaktion weggeätzt.When producing so-called printed circuits using an etching process, one with Copper foil-clad carrier material a corresponding line pattern by means of an acid-resistant Color printed and the free parts in corresponding etching baths with more or less acidic reaction etched away.
Das Aufdrucken der Abdeckmittel als Leitungsmuster erfolgt vorzugsweise im Siebdruckverfahren mit besonders konsistenten Lacken, welchen Verdickungsmittel, Füll- und Farbstoffe beigegeben sind. Als Lacke dienen dabei meistens säurebeständige, wasserfeste, unverseifbare Harze, z. B. Cumaronharze. The printing of the covering means as a line pattern is preferably carried out using the screen printing process with particularly consistent lacquers, which thickeners, fillers and dyes are added. Acid-resistant, water-resistant, unsaponifiable resins, e.g. B. coumarone resins.
Nach dem Ätzen wird die säurewiderstandsfähige Lackschicht für gewöhnlich in organischen Lacklösungsmitteln wie Xylol, Benzin oder vorzugsweise Trichloräthylen abgelöst, wobei besonders hierfür geeignete Waschapparate verwendet werden. Vor dem Waschvorgang müssen die Platten jedoch getrocknet werden.After etching, the acid-resistant lacquer layer is usually in organic lacquer solvents such as xylene, gasoline or preferably trichlorethylene replaced, especially this suitable washing machines are used. However, the plates must be dried before washing will.
Für die Herstellung sogenannter gedruckter Schaltungen, die ein Massenerzeugnis sind, ist aber ein möglichst automatisch arbeitendes, kontinuierliches Verfahren erwünscht, bei dem keine Einzelbearbeitung der Teile erfolgt und alle Behandlungsstufen aus einfachen, insbesondere chemischen Tauchprozessen bestehen.For the production of so-called printed circuits, which are a mass product, is a As automatically as possible, continuous process is desired, in which no individual processing of the parts and all treatment stages from simple, in particular chemical, immersion processes exist.
Bei den bekannten kontinuierlich arbeitenden Verfahren werden jedoch, insbesondere durch das Reinigen und Zwischentrocknen, aufwendige Apparaturen erforderlich und die Herstellung langwierig.In the known continuously operating processes, however, in particular by the Cleaning and intermediate drying, complex equipment required and the production time-consuming.
Bei der Herstellung von geätzten Mustern auf Metallfolien, insbesondere bei der Herstellung von gedruckten Schaltungen nach dem Siebdruckverfahren, lassen sich diese Nachteile gemäß der Erfindung durch die Verwendung von säurebeständigen, aber in alkalischen wäßrigen Lösungen leicht löslichen oder verseifbaren Harzen als Abdeckmittel vermeiden. Hierbei eignen sich besonders Phenol-Novolack, Kolophonium, Naturschellack, Maleinatharze oder Alkydharze als Abdeckmittel.In the production of etched patterns on metal foils, especially in the production of printed circuits by the screen printing process, these disadvantages according to the Invention through the use of acid-resistant, but in alkaline aqueous solutions Avoid easily soluble or saponifiable resins as covering agents. Here are particularly suitable Phenol novolac, rosin, natural shellac, maleinate resins or alkyd resins as covering agents.
Es ist zwar bekannt, bei Ätzverfahren als Abdeckmittel Harze, z. B. Alkydharze oder Maleinharz, zu
verwenden, die sich mit hochprozentigen, eventuell stark erwärmten alkalischen Lösungsmitteln wie
Natronlauge lösen lassen, jedoch eignen sich derartig verhältnismäßig alkalifeste Stoffe nicht für die
Herstellung von gedruckten Schaltungen, da das die Abdeckmittel bei der Herstellung von geätzten
Mustern auf MetallfolienAlthough it is known to use resins, e.g. B. alkyd resins or maleic resin to use, which can be solved with high-percentage, possibly strongly heated alkaline solvents such as caustic soda, but such relatively alkali-resistant substances are not suitable for the production of printed circuits, as the cover means in the production of etched
Patterns on metal foils
Anmelder:Applicant:
Blaupunkt-Werke G. m. b. H.,
Hildesheim, Robert-Bosch-Str. 200Blaupunkt-Werke G. mb H.,
Hildesheim, Robert-Bosch-Str. 200
Als Erfinder benannt:Named as inventor:
Dipl.-Chem. Karl Hoffmann, HildesheimDipl.-Chem. Karl Hoffmann, Hildesheim
Leitungszüge bildende Kupfer im allgemeinen auf ein Hartpapier aufkaschiert ist, dessen Zusammensetzung auf einer Phenol-Resolharz-Basis beruht. Dieses Hartpapier würde infolge seiner geringen Alkalifestigkeit zumindest angelöst werden, was insbesondere bei geringen Oberflächenverunreinigungen zwischen den einzelnen Leiterbahnen z. B. zu Kriechströmen bzw. zu untragbaren Isolationswiderständen führen kann.Conductor forming copper is generally laminated to a hard paper, the composition of which is based on a phenolic resole resin. This hard paper would be due to its low Alkali resistance are at least partially dissolved, which is particularly the case with low surface contamination between the individual conductor tracks z. B. to leakage currents or intolerable insulation resistance can lead.
Weiterhin ist es gemäß einer Weiterbildung der Erfindung von Vorteil, wenn das Abdeckmittel zur Erzielung einer größeren Konsistenz einen Füllstoff und zur Sichtbarmachung einen Farbstoff, insbesondere einen säurewiderstandsfähigen und alkalilöslichen Füll- und Farbstoff enthält. Dabei können die Füll- und Farbstoffe in hochdisperser Form im Abdeckmittel enthalten sein und vorzugsweise aus Kieselsäure und Berliner Blau bestehen.Furthermore, according to a development of the invention, it is advantageous if the covering means for To achieve a greater consistency, a filler and, for visualization, a dye, in particular contains an acid-resistant and alkali-soluble filler and dye. Here you can the fillers and dyes are contained in highly dispersed form in the covering agent and preferably from Silicic acid and Prussian blue exist.
Das alkalische Lösungsmittel kann eine wäßrige Alkalilauge, z. B. NaOH, mit einer Konzentration von 1 bis 2% sein.The alkaline solvent can be an aqueous alkali, e.g. B. NaOH, at a concentration from 1 to 2%.
Nach einer Weiterbildung der Erfindung, unter Verwendung eines Abdeckmittels mit der kennzeichnenden Eigenschaft der Alkalilöslichkeit, wird eine durchgehend nasse Behandlung der gedruckten Schaltung in einer wie in der GalvanotechnikAccording to a development of the invention, using a covering means with the characterizing Property of alkali solubility, is a continuous wet treatment of the printed Circuit in a like in electroplating
üblichen Wanderanlage ermöglicht, ohne daß eine Zwischentrocknung und die Verwendung teurer oder gefährlicher organischer Lösungsmittel erforderlich ist. Die Benutzung der bekannten Lösungsmittel erforderte nach der bisherigen Technik außerdem in den meisten Fällen die Anwendung aufwendiger Ultraschallwaschgeräte oder eine mechanische bzw. manuelle Nachreinigung jeder einzelnen gedrucktenusual hiking system allows without an intermediate drying and the use of expensive or hazardous organic solvent is required. The use of known solvents In most cases, the previous technology also required a more complex application Ultrasonic washers or mechanical or manual cleaning of each individual printed
'-■ '■ "·-■' ' : 509758/419'- ■' ■ "· - ■ '' : 509758/419
1010
Schaltung, um eine ausreichende Reinigung zu erzielen. Das erfindungsgemäße Abdeckmittel wird durch einfaches Eintauchen während 1 bis 2 Minuten in einer 1 bis 2%igen Natronlauge bei Zimmertemperatur rückstandslos abgelöst.Circuit to achieve adequate cleaning. The covering means according to the invention is by simply dipping for 1 to 2 minutes in a 1 to 2% sodium hydroxide solution at room temperature removed without leaving any residue.
Da die gewählten Füll- und Farbstoffe im Alkalibad ebenfalls leicht zersetzt bzw. dispergiert werden, kann die weitere Reinigung der gedruckten Schaltung durch Blankbeizen ebenfalls mittels eines einfachen Tauchverfahrens in passenden Beizlösungen erfolgen. Eine einfache Trocknung, die sogenannte Schlußoder Fertigtrocknung, beendet den Herstellungsprozeß. Since the selected fillers and dyes are also easily decomposed or dispersed in the alkali bath, the further cleaning of the printed circuit by blank pickling can also be done using a simple Dipping process take place in suitable pickling solutions. A simple drying process, the so-called final or finished drying, ends the manufacturing process.
Claims (6)
Deutsche Auslegeschrift Nr. 1085 170;
britische Patentschrift Nr. 813 803;
USA.-Patentschrift 2 975140;
Paul Eisler, »Gedruckte Schaltungen«, 1961, 220.Considered publications:
German Auslegeschrift No. 1085 170;
British Patent No. 813,803;
U.S. Patent 2,975,140;
Paul Eisler, "Printed Circuits", 1961, 220.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEB65321A DE1207181B (en) | 1961-12-23 | 1961-12-23 | Covering agent for the production of etched patterns on metal foils |
| GB4670562A GB1002046A (en) | 1961-12-23 | 1962-12-11 | Method for producing etched printed circuits on metal foils |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEB65321A DE1207181B (en) | 1961-12-23 | 1961-12-23 | Covering agent for the production of etched patterns on metal foils |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1207181B true DE1207181B (en) | 1965-12-16 |
Family
ID=6974728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEB65321A Pending DE1207181B (en) | 1961-12-23 | 1961-12-23 | Covering agent for the production of etched patterns on metal foils |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1207181B (en) |
| GB (1) | GB1002046A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3201880A1 (en) * | 1982-01-22 | 1983-08-04 | Egbert 6106 Erzhausen Kühnert | Process for the residue-free removal of coatings from printed circuit boards and apparatus for performing the process |
| JP3533665B1 (en) | 2002-12-17 | 2004-05-31 | オムロン株式会社 | A method for manufacturing an electronic component module and a method for manufacturing a data carrier capable of reading electromagnetic waves. |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB813803A (en) * | 1955-08-31 | 1959-05-21 | Saunders Roe Ltd | Improvements relating to etch-resistant materials and etching methods |
| DE1085170B (en) * | 1958-03-15 | 1960-07-14 | Pictograph Ltd | Method and device for the production of printing forms or printing blocks |
| US2975140A (en) * | 1954-07-27 | 1961-03-14 | Klem Chemicals Inc | Organic finish remover and method |
-
1961
- 1961-12-23 DE DEB65321A patent/DE1207181B/en active Pending
-
1962
- 1962-12-11 GB GB4670562A patent/GB1002046A/en not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2975140A (en) * | 1954-07-27 | 1961-03-14 | Klem Chemicals Inc | Organic finish remover and method |
| GB813803A (en) * | 1955-08-31 | 1959-05-21 | Saunders Roe Ltd | Improvements relating to etch-resistant materials and etching methods |
| DE1085170B (en) * | 1958-03-15 | 1960-07-14 | Pictograph Ltd | Method and device for the production of printing forms or printing blocks |
Also Published As
| Publication number | Publication date |
|---|---|
| GB1002046A (en) | 1965-08-18 |
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