[go: up one dir, main page]

DE1275032B - Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod - Google Patents

Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod

Info

Publication number
DE1275032B
DE1275032B DES98115A DES0098115A DE1275032B DE 1275032 B DE1275032 B DE 1275032B DE S98115 A DES98115 A DE S98115A DE S0098115 A DES0098115 A DE S0098115A DE 1275032 B DE1275032 B DE 1275032B
Authority
DE
Germany
Prior art keywords
rod
rod part
heating device
crucible
free zone
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DES98115A
Other languages
German (de)
Inventor
Dr Rer Nat Wolfgang Keller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to DES89317A priority Critical patent/DE1218404B/en
Priority to CH1115564A priority patent/CH413785A/en
Priority to SE14136/64A priority patent/SE309965B/xx
Priority to GB3442/65A priority patent/GB1044592A/en
Priority to NL656506040A priority patent/NL138766B/en
Priority to FR17994A priority patent/FR1444259A/en
Priority to BE664435D priority patent/BE664435A/xx
Application filed by Siemens Corp filed Critical Siemens Corp
Priority to DES98115A priority patent/DE1275032B/en
Priority to DES98712A priority patent/DE1263698B/en
Priority to NL6605968A priority patent/NL6605968A/xx
Priority to DK251066AA priority patent/DK124458B/en
Priority to DK260666AA priority patent/DK124459B/en
Priority to NL666607827A priority patent/NL146402B/en
Priority to CH837666A priority patent/CH442246A/en
Priority to CH837566A priority patent/CH442245A/en
Priority to FR65422A priority patent/FR90825E/en
Priority to FR68096A priority patent/FR91257E/en
Priority to SE9375/66A priority patent/SE323654B/xx
Priority to BE683852D priority patent/BE683852A/xx
Priority to GB30903/66A priority patent/GB1079870A/en
Priority to US564118A priority patent/US3477811A/en
Priority to GB31122/66A priority patent/GB1081600A/en
Priority to SE10177/66A priority patent/SE323655B/xx
Priority to BE685153D priority patent/BE685153A/xx
Priority to US664211A priority patent/US3414388A/en
Publication of DE1275032B publication Critical patent/DE1275032B/en
Priority to US853596A priority patent/US3658598A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00Single-crystal growth by zone-melting; Refining by zone-melting
    • C30B13/28Controlling or regulating
    • C30B13/30Stabilisation or shape controlling of the molten zone, e.g. by concentrators, by electromagnetic fields; Controlling the section of the crystal
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00Single-crystal growth by zone-melting; Refining by zone-melting
    • C30B13/28Controlling or regulating
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B13/00Single-crystal growth by zone-melting; Refining by zone-melting
    • C30B13/32Mechanisms for moving either the charge or the heater
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • C30B15/08Downward pulling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/901Levitation, reduced gravity, microgravity, space
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/91Downward pulling
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/911Seed or rod holders
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/912Replenishing liquid precursor, other than a moving zone
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10S117/917Magnetic
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T117/00Single-crystal, oriented-crystal, and epitaxy growth processes; non-coating apparatus therefor
    • Y10T117/10Apparatus
    • Y10T117/1024Apparatus for crystallization from liquid or supercritical state
    • Y10T117/1032Seed pulling
    • Y10T117/1072Seed pulling including details of means providing product movement [e.g., shaft guides, servo means]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Silicon Compounds (AREA)
  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Description

BUNDESREPUBLIK DEUTSCHLAND DEUTSCHES -007W^ PATENTAMTFEDERAL REPUBLIC OF GERMANY GERMAN -007W ^ PATENT OFFICE

AUSLEGESCHRIFTEDITORIAL

Int. CL:Int. CL:

Nummer:
Aktenzeichen:
Anmeldetag:
Auslegetag:
Number:
File number:
Registration date:
Display day:

BOIdBOId

BOIjBOIj

Deutsche Kl.: 12 c-2German class: 12 c-2

12 g-17/1012 g-17/10

P 12 75 032.2-43 (S 98115)P 12 75 032.2-43 (S 98115)

10. Juli 1965July 10, 1965

14. August 1968August 14, 1968

Das Hauptpatent 1218 404 betrifft ein Verfahren zum tiegelfreien Zonenschmelzen eines lotrecht an seinen Enden gehalterten kristallinen Stabes, insbesondere Halbleiterstabes, dessen Halterungen, von denen mindestens eine um ihre lotrechte Achse in Drehung versetzt wird, relativ zueinander und zu einer den Stab ringförmig umgebenden Heizeinrichtung in Richtung der Stabachse mit derart aufeinander abgestimmten Geschwindigkeiten bewegt werden, daß die Dicke des aus der Schmelze wieder erstarrenden Stabteils über die lichte Weite der Heizeinrichtung hinaus vergrößert wird.The main patent 1218 404 relates to a method for crucible-free zone melting of a perpendicular its ends held crystalline rod, in particular semiconductor rod, the holders of at least one of which is set in rotation about its vertical axis, relative to one another and to a heating device surrounding the rod in the shape of a ring in the direction of the rod axis with such one another coordinated speeds are moved that the thickness of the melt solidifies again Rod part is enlarged beyond the clear width of the heating device.

Gemäß dem Hauptpatent ist dieses Verfahren so ausgebildet, daß die sich drehende Halterung des wieder erstarrenden Stabteils relativ zur Heizeinrichtung seitlich verschoben wird.According to the main patent, this method is designed so that the rotating holder of the re-solidifying rod part is shifted laterally relative to the heating device.

Das Verfahren gemäß dem Hauptpatent hat insbesondere den Vorteil, daß das Arbeiten im Bereich des Überganges vom ursprünglichen Querschnitt zum neuen vergrößerten Querschnitt wesentlich erleichtert wird. Außerdem besteht die Möglichkeit, Halbleiterstäbe mit gegenüber vorbekannten Verfahren weiter vergrößertem Querschnitt herzustellen. Und schließlich besteht auch die Möglichkeit, das Stabende, dessen Querschnitt vergrößert wird, oberhalb der Heizspule anzuordnen.The method according to the main patent has the particular advantage that working in the field of The transition from the original cross-section to the new, enlarged cross-section is made much easier will. In addition, there is the possibility of using semiconductor rods using previously known methods produce enlarged cross-section. And finally there is also the option of removing the end of the rod, whose cross-section is enlarged, to be arranged above the heating coil.

Das vorliegende Verfahren stellt eine Abwandlung und weitere Verbesserung des Verfahrens gemäß dem Hauptpatent dar. Es ist dadurch gekennzeichnet, daß nach Erreichen der gewünschten Dicke des wieder erstarrenden Stabteils die Halterung djteses Stabteils relativ zur Heizeinrichtung fortlaufend seitlich hin- und herbewegt wird. Diese Abwandlung des Verfahrens gemäß dem Hauptpatent bringt insbesondere den Vorteil mit sich, daß der Widerstandsverlauf über den Stabquerschnitt vergleichsmäßig wird.The present method represents a modification and further improvement of the method according to the Main patent. It is characterized in that after reaching the desired thickness of the re-solidifying Rod part the holder of each rod part is continuously moved back and forth laterally relative to the heating device. This modification of the procedure according to the main patent has the particular advantage that the resistance curve over the rod cross-section becomes comparative.

An Hand von Ausführungsbeispielen soll die Erfindung näher erläutert werden. In denThe invention is to be explained in more detail on the basis of exemplary embodiments. In the

Fig. 1 bis 5 sind verschiedene Phasen des erfindungsgemäßen Verfahrens dargestellt;Figures 1 through 5 are different phases of the invention Procedure shown;

F i g. 6 zeigt eine andere Ausführungsform;F i g. 6 shows another embodiment;

Fig. 7 ist ein schematisches Diagramm der Verteilung des spezifischen Widerstandes über den Querschnitt eines nach einem Zonenschmelzverfahren mit konzentrischen Stabhalterungen behandelten Halbleiterstabes. Fig. 7 is a schematic diagram of the distribution the specific resistance across the cross section of a zone melting process concentric rod holders treated semiconductor rod.

In F i g. 1 ist in einem Halbleiterstab 2 mit Hilfe einer Induktionsheizspule 3, die mit Hochfrequenzstrom gespeist wird, eine Schmelzzone 4 erzeugt. Am unteren Ende des Stabes 2 ist ein Keimkristall 5 angeschmolzen, welcher z. B. ein Einkristall sein kann, der zum Einkristallzüchten dient. Der Keimkristall 5 Verfahren zum tiegelfreien Zonenschmelzen eines kristallinen Stabes, insbesondere HalbleiterstabesIn Fig. 1 is in a semiconductor rod 2 with the help of an induction heating coil 3, which with high frequency current is fed, a melting zone 4 is generated. At the lower end of the rod 2 a seed crystal 5 is melted, which z. B. can be a single crystal used for single crystal growth. The seed crystal 5 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod

Zusatz zum Patent: 1218 404Addendum to the patent: 1218 404

Anmelder:Applicant:

Siemens Aktiengesellschaft, Berlin und München, 8520 Erlangen, Werner-von-Siemens-Str. 50Siemens Aktiengesellschaft, Berlin and Munich, 8520 Erlangen, Werner-von-Siemens-Str. 50

Als Erfinder benannt:Named as inventor:

Dr. rer. nat. Wolfgang Keller, 8551 Pretzfeld - -Dr. rer. nat. Wolfgang Keller, 8551 Pretzfeld - -

und damit der untere Stabteil werden um die lotrechte Achse in Drehung versetzt, indem z. B. die untere Halterung mit Hilfe eines Elektromotors angetrieben wird. Wie aus der Zeichnung hervorgeht,and thus the lower rod part are set in rotation about the vertical axis by z. B. the lower bracket is driven with the help of an electric motor. As can be seen from the drawing,

as ist die Schmelzzone im Zeitpunkt, der in F i g. 1 dargestellt ist, an der Stelle angelangt, an der der Übergang vom dünnen Keimkristall zur normalen Stabdicke erreicht ist.
In Fig. 2 werden die weiteren Verfahrensmaßnahmen in einem späteren Zeitpunkt durch entsprechende Pfeile dargestellt. Der Keimkristall 5 wird nicht nur nach unten mit Bezug auf die ruhend angenommene Heizspule 3 bewegt, sondern gleichzeitig in der Bildebene nach rechts. Hierdurch wird auch die Schmelzzone 4 nach rechts auseinandergezogen. Da der untere Stabteil 5 um seine eigene Achse rotiert, wächst das aus der Schmelze auskristallisierende Material im wesentlichen symmetrisch zur Drehachse der unteren Stabhalterung auf.
as is the melting zone at the point in time shown in FIG. 1 has reached the point at which the transition from the thin seed crystal to the normal rod thickness is reached.
In FIG. 2, the further procedural measures are shown at a later point in time by corresponding arrows. The seed crystal 5 is not only moved downward with respect to the heating coil 3, which is assumed to be stationary, but at the same time to the right in the image plane. This also pulls the melting zone 4 apart to the right. Since the lower rod part 5 rotates about its own axis, the material which crystallizes out of the melt grows essentially symmetrically to the axis of rotation of the lower rod holder.

Der obere Stabteil 2 wird im entsprechenden Verhältnis von oben nachgeschoben. Er kann ebenfalls um seine Längsachse gedreht werden.The upper rod part 2 is pushed in from above in the corresponding ratio. He can also be around its longitudinal axis can be rotated.

In F i g. 3 ist ein noch späterer Zeitpunkt des Verfahrens dargestellt, in dem durch Verschiebung des Keimkristalls 5 nach rechts ein weiteres Anwachsen des Stabdurchmessers des unteren Stabteils 2 a bis zum Solldurchmesser erreicht ist. In diesem Zeitpunkt wird die Richtung der seitlichen Verschiebung der unteren Halterung umgekehrt und diese Halterung nunmehr von rechts nach links bewegt.In Fig. 3 shows a still later stage in the procedure is shown, up to the target diameter is reached in which, by displacement of the seed crystal 5 to the right a further increase of the rod diameter of the lower rod part 2 a. At this point in time, the direction of the lateral displacement of the lower bracket is reversed and this bracket is now moved from right to left.

In der Fig. 4 ist ein späterer Zeitpunkt des Verfahrens dargestellt, in dem der linke Endpunkt der4 shows a later point in time in the method in which the left end point of the

809 590/384809 590/384

Bewegung der den Keimkristall 5 haltenden unteren Stabhalterung erreicht ist. Wie der Pfeil andeutet, wird bei fortlaufender Weiterbewegung beider Stabteile in Richtung der Stabachse nach unten hier wiederum die Richtung der seitlichen Verschiebung umgekehrt.Movement of the lower rod holder holding the seed crystal 5 is achieved. As the arrow indicates becomes down here as both rod parts continue to move in the direction of the rod axis again reversed the direction of the lateral displacement.

In F i g. 5 ist ein weiterer Zustand erreicht, in dem die Richtung der Hin- und Herbewegung erneut umgekehrt wird.In Fig. 5 another state is reached in which the direction of the reciprocating movement is reversed again will.

Im Beispiel ist angenommen, daß der Stab auf seinen doppelten Durchmesser vergrößert werden soll, daß also der Stabquerschnitt vervierfacht wird. In diesem Fall muß also mit Bezug auf die Heizspule 3 der obere Stabteil 2 mit der vierfachen Geschwindigkeit nachgeschoben werden, mit der der untere Stabteil Za von der Heizspule weggezogen wird. Man kann z. B. annehmen, daß der untere Stabteil Za mit einer Geschwindigkeit von 2mm/min nach unten bewegt wird, während der obere Stabteil 2 mit einer Geschwindigkeit von 8 mm/min nach unten bewegt wird. Die Drehgeschwindigkeit des unteren Stabteils kann etwa 5 bis 100 U/min betragen, vorzugsweise etwa 20 U/min. Die Hin- und Herbewegung der unteren Halterung kann etwa 5- bis 20mal pro Minute durchgeführt werden.In the example it is assumed that the rod is to be enlarged to double its diameter, i.e. that the rod cross-section is quadrupled. In this case, with respect to the heating coil 3, the upper rod part 2 must be pushed in at four times the speed with which the lower rod part Za is pulled away from the heating coil. You can z. For example, assume that the lower rod part Za is moved downwards at a speed of 2 mm / min, while the upper rod part 2 is moved downwards at a speed of 8 mm / min. The speed of rotation of the lower rod part can be approximately 5 to 100 rpm, preferably approximately 20 rpm. The reciprocating movement of the lower bracket can be performed about 5 to 20 times per minute.

In Fig. 6 ist eine andere Ausführungsform des erfindungsgemäßen Verfahrens veranschaulicht, bei der der wieder erstarrende Stabteil 12« oberhalb der Heizspule 13 nach oben weggezogen und auch der Stabteil 12 relativ zur Heizspule 13 nach oben bewegt wird. Die Schmelzzone 14 kann auf Grund der großen Haftfläche am oberen Stabteil 12 a gehalten werden, wenn sie besonders kurz in Richtung der Stabachse dimensioniert wird. Hierfür ist besonders eine Beheizung durch eine flache Induktionsheizspule mit spiralig angeordneten Windungen vorteilhaft.In Fig. 6 is another embodiment of the Illustrates the method according to the invention, in which the resolidifying rod part 12 ″ above the Heating coil 13 is pulled upwards and the rod part 12 is also moved upwards relative to the heating coil 13 will. The melting zone 14 can be held due to the large adhesive surface on the upper rod part 12 a if it is dimensioned particularly short in the direction of the rod axis. This is special heating by a flat induction heating coil with spirally arranged windings is advantageous.

In F i g. 7 ist über einem Stabdurchmesser die Verteilung der spezifischen Widerstandswerte aufgetragen, die als Ergebnis einiger tiegelfreier Zonenschmelzprozesse beobachtet wurde. Man ist bestrebt, eine möglichst gleichmäßige Verteilung zu erreichen. Ohne besondere Maßnahmen zeigt sich aber die in F i g. 7 dargestellte Verteilung, daß nämlich die Werte des spezifischen Widerstandes ρ von einem mit Null bezeichneten Rand des Stabes beginnend, zunächst gleichmäßig sind und nach der mit r bezeichneten Mitte des Stabes hin deutlich um mehrere Prozent sinken, während sie zum anderen Rand D des Stabes hin wieder auf den ersten Betrag symmetrisch zur Mitte ansteigen und diesen Betrag bis zum Rand D des Stabes beibehalten. Demgegenüber werden durch ständiges Hin- und Herbewegen der rotierenden Halterung des wieder erstarrenden Stabteils die mit einem erniedrigten spezifischen Widerstand aus der Schmelze auskristallisierenden Materialteilchen nahezu über den gesamten Querschnitt des wieder erstarrenden Stabteils verteilt, so daß praktisch keine Differenzen mehr in Erscheinung treten können.In Fig. 7, the distribution of the specific resistance values is plotted over a rod diameter, which was observed as the result of some crucible-free zone melting processes. The aim is to achieve a distribution that is as even as possible. Without special measures, however, the in FIG. 7, namely that the values of the specific resistance ρ starting from an edge of the rod denoted by zero are initially uniform and decrease significantly by several percent towards the center of the rod denoted by r , while they decrease towards the other edge D of the rod rise again to the first amount symmetrically to the center and maintain this amount up to the edge D of the rod. In contrast, by constantly moving the rotating support of the re-solidifying rod part, the material particles crystallizing out of the melt with a reduced specific resistance are distributed over almost the entire cross-section of the re-solidifying rod part, so that practically no differences can appear.

Claims (1)

Patentanspruch:Claim: Verfahren zum tiegelfreien Zonenschmelzen eines lotrecht an seinen Enden gehalterten kristallinen Stabes, insbesondere Halbleiterstabes, dessen Halterungen, von denen mindestens eine um ihre lotrechte Achse in Drehung versetzt wird, relativ zueinander und zu einer den Stab ringförmig umgebenden Heizeinrichtung in Richtung der Stabachse mit derart aufeinander abgestimmten Geschwindigkeiten bewegt werden, daß die Dicke des aus der Schmelze wieder erstarrenden Stabteils über die lichte Weite der Heizeinrichtung hinaus vergrößert wird, wobei die sich drehende Halterung des wieder erstarrenden Stabteils relativ zur Heizeinrichtung seitlich verschoben wird, gemäß Patent 1218404, dadurch gekennzeichnet, daß nach Erreichen der gewünschten Dicke des wieder erstarrenden Stabteils, die Halterung dieses Stabteils relativ zur Heizeinrichtung fortlaufend seitlich hin- und herbewegt wird.Method for crucible-free zone melting of a crystalline held vertically at its ends Rod, in particular semiconductor rod, its holders, of which at least one is set in rotation about its vertical axis, relative to one another and to a ring-shaped rod surrounding heating device in the direction of the rod axis with such coordinated Speeds are moved that the thickness of the melt resolidifies Rod part is enlarged beyond the clear width of the heating device, the rotating Holder of the re-solidifying rod part is shifted laterally relative to the heating device, according to patent 1218404, characterized in that after reaching the desired Thickness of the re-solidifying rod part, the holder of this rod part relative to the heating device is continuously moved back and forth laterally. Hierzu 1 Blatt Zeichnungen1 sheet of drawings 809 590/384 8.68 © Bundesdruckerei Berlin809 590/384 8.68 © Bundesdruckerei Berlin
DES98115A 1964-02-01 1965-07-10 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod Pending DE1275032B (en)

Priority Applications (26)

Application Number Priority Date Filing Date Title
DES89317A DE1218404B (en) 1964-02-01 1964-02-01 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
CH1115564A CH413785A (en) 1964-02-01 1964-08-26 Method for enlarging the rod cross-section during crucible-free zone melting of a rod-shaped body made of crystalline material, in particular of semiconductor material, held vertically at its ends
SE14136/64A SE309965B (en) 1964-02-01 1964-11-23
GB3442/65A GB1044592A (en) 1964-02-01 1965-01-26 A method of melting a rod of crystalline material zone by zone
NL656506040A NL138766B (en) 1964-02-01 1965-05-12 METHOD OF ENLARGING THE CROSS SECTION OF A MONOCRYSTALLINE ROD-SHAPED BODY USING CRISCHLESS ZONE MELTING.
FR17994A FR1444259A (en) 1964-02-01 1965-05-21 Method of enlarging the cross-section of bars during melting of crucible-free zone of a bar-shaped body made of crystalline material, in particular semiconductor
BE664435D BE664435A (en) 1964-02-01 1965-05-25
DES98115A DE1275032B (en) 1964-02-01 1965-07-10 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DES98712A DE1263698B (en) 1964-02-01 1965-08-07 Process for crucible-free zone melting
NL6605968A NL6605968A (en) 1964-02-01 1966-05-03
DK251066AA DK124458B (en) 1964-02-01 1966-05-17 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod.
DK260666AA DK124459B (en) 1964-02-01 1966-05-21 Method for crucible zone melting of a crystalline rod, in particular a semiconductor rod.
NL666607827A NL146402B (en) 1964-02-01 1966-06-06 METHOD OF ENLARGING THE CROSS-SECTION OF A LEAD RIGHT AT ITS END CRYSTALLINE ROD-SHAPED BODY USING CRISCHLESS ZONE MELTING.
CH837666A CH442246A (en) 1964-02-01 1966-06-09 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
CH837566A CH442245A (en) 1964-02-01 1966-06-09 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
FR65422A FR90825E (en) 1964-02-01 1966-06-14 Method of enlarging the cross-section of bars during melting of crucible-free zone of a bar-shaped body made of crystalline material, in particular a semiconductor
FR68096A FR91257E (en) 1964-02-01 1966-07-04 Method of enlarging the cross-section of bars during melting of crucible-free zone of a bar-shaped body made of crystalline material, in particular semiconductor
SE9375/66A SE323654B (en) 1964-02-01 1966-07-08
BE683852D BE683852A (en) 1964-02-01 1966-07-08
GB30903/66A GB1079870A (en) 1964-02-01 1966-07-08 A method of melting a rod of crystalline material zone-by-zone
US564118A US3477811A (en) 1964-02-01 1966-07-11 Method of crucible-free zone melting crystalline rods,especially of semiconductive material
GB31122/66A GB1081600A (en) 1964-02-01 1966-07-11 A method of melting a rod of crystalline material zone-by-zone
SE10177/66A SE323655B (en) 1964-02-01 1966-07-26
BE685153D BE685153A (en) 1964-02-01 1966-08-05
US664211A US3414388A (en) 1964-02-01 1967-08-29 Method and apparatus for increasing the cross section of a crystalline rod during crucible-free zone melting
US853596A US3658598A (en) 1964-02-01 1969-08-19 Method of crucible-free zone melting crystalline rods, especially of semiconductor material

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DES89317A DE1218404B (en) 1964-02-01 1964-02-01 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
NL656506040A NL138766B (en) 1964-02-01 1965-05-12 METHOD OF ENLARGING THE CROSS SECTION OF A MONOCRYSTALLINE ROD-SHAPED BODY USING CRISCHLESS ZONE MELTING.
DES98115A DE1275032B (en) 1964-02-01 1965-07-10 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DES98712A DE1263698B (en) 1964-02-01 1965-08-07 Process for crucible-free zone melting

Publications (1)

Publication Number Publication Date
DE1275032B true DE1275032B (en) 1968-08-14

Family

ID=27437570

Family Applications (3)

Application Number Title Priority Date Filing Date
DES89317A Pending DE1218404B (en) 1964-02-01 1964-02-01 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DES98115A Pending DE1275032B (en) 1964-02-01 1965-07-10 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DES98712A Pending DE1263698B (en) 1964-02-01 1965-08-07 Process for crucible-free zone melting

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DES89317A Pending DE1218404B (en) 1964-02-01 1964-02-01 Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod

Family Applications After (1)

Application Number Title Priority Date Filing Date
DES98712A Pending DE1263698B (en) 1964-02-01 1965-08-07 Process for crucible-free zone melting

Country Status (9)

Country Link
US (3) US3477811A (en)
BE (3) BE664435A (en)
CH (3) CH413785A (en)
DE (3) DE1218404B (en)
DK (2) DK124458B (en)
FR (1) FR1444259A (en)
GB (3) GB1044592A (en)
NL (3) NL138766B (en)
SE (3) SE309965B (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1272886B (en) * 1966-09-24 1968-07-18 Siemens Ag Device for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DE1544301A1 (en) * 1966-09-28 1970-05-27 Siemens Ag Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DE1619996A1 (en) * 1967-03-18 1971-07-08 Siemens Ag Method for producing a single-crystal rod, in particular from semiconductor material
US3607109A (en) * 1968-01-09 1971-09-21 Emil R Capita Method and means of producing a large diameter single-crystal rod from a polycrystal bar
DE1960088C3 (en) * 1969-11-29 1974-07-25 Siemens Ag, 1000 Berlin Und 8000 Muenchen Device for crucible-free zone melting of a crystalline rod
DE2234512C3 (en) * 1972-07-13 1979-04-19 Siemens Ag, 1000 Berlin Und 8000 Muenchen Process for the production of (reoriented semiconductor single crystal rods with a specific resistance thawing towards the center of the rod
US4002523A (en) * 1973-09-12 1977-01-11 Texas Instruments Incorporated Dislocation-free growth of silicon semiconductor crystals with <110> orientation
US5156211A (en) * 1991-06-10 1992-10-20 Impact Selector, Inc. Remotely adjustable fishing jar and method for using same
JP2820027B2 (en) 1994-05-24 1998-11-05 信越半導体株式会社 Semiconductor single crystal growth method
RU2324017C1 (en) * 2006-08-28 2008-05-10 Федеральное Государственное Унитарное Предприятие "Всероссийский научно-исследовательский институт токов высокой частоты им. В.П. Вологдина" (ФГУП ВНИИТВЧ им. В.П. Вологдина) Process to manufacture silicon hollow monocrystals

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2972525A (en) * 1953-02-26 1961-02-21 Siemens Ag Crucible-free zone melting method and apparatus for producing and processing a rod-shaped body of crystalline substance, particularly semiconductor substance
NL126240C (en) * 1958-02-19
US3036892A (en) * 1958-03-05 1962-05-29 Siemens Ag Production of hyper-pure monocrystal-line rods in continuous operation
US3036812A (en) * 1958-11-19 1962-05-29 Dewrance & Co Butterfly valves
AT223659B (en) * 1960-11-25 1962-10-10 Siemens Ag Process for the production of dislocation-free single crystal silicon by crucible-free zone melting

Also Published As

Publication number Publication date
CH442246A (en) 1967-08-31
NL138766B (en) 1973-05-15
US3414388A (en) 1968-12-03
NL146402B (en) 1975-07-15
NL6506040A (en) 1966-11-14
BE685153A (en) 1967-02-06
SE323654B (en) 1970-05-11
DE1218404B (en) 1966-06-08
DK124458B (en) 1972-10-23
BE664435A (en) 1965-11-25
CH413785A (en) 1966-05-31
SE323655B (en) 1970-05-11
US3477811A (en) 1969-11-11
FR1444259A (en) 1966-07-01
SE309965B (en) 1969-04-14
DE1263698B (en) 1968-03-21
DK124459B (en) 1972-10-23
NL6607827A (en) 1967-02-08
CH442245A (en) 1967-08-31
GB1044592A (en) 1966-10-05
NL6605968A (en) 1967-01-11
GB1081600A (en) 1967-08-31
US3658598A (en) 1972-04-25
BE683852A (en) 1967-01-09
GB1079870A (en) 1967-08-16

Similar Documents

Publication Publication Date Title
DE3586944T2 (en) DEVICE FOR SEPARATING SEMICONDUCTOR DISCS.
DE1135671B (en) Method for producing a pn junction and / or a gradient of an electrically active element in a semiconductor crystal
DE2628559B2 (en) Method and device for hydrothermal growth of quartz
DE1275032B (en) Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DE1177119B (en) Process for the production of hyperpure silicon
DE1254131B (en) Process for controlling the thickness of flat, dendritic crystals made of silicon, germanium or semiconductor compounds during continuous drawing from a melt
DE3805118C2 (en)
DE1519901A1 (en) Method for crucible-free zone melting of a crystalline rod
EP0535303A1 (en) Apparatus for winding coils for electric machines
DE3813711C2 (en) Process and device for finishing collector blanks
DE1254590B (en) Method for crucible-free zone melting of semiconductor material, in particular silicon
DE2908925C2 (en) Fur cutter
DE1128413B (en) Process for the production of decomposition-free single-crystal silicon by crucible-free zone melting
DE1278413B (en) Process for pulling thin rod-shaped semiconductor crystals from a semiconductor melt
DE1960088C3 (en) Device for crucible-free zone melting of a crystalline rod
DE1212051B (en) Process for crucible zone melting of rods made of silicon
DE1148525B (en) Method for enlarging the cross-section of the rod during crucible-free zone melting of a rod made of crystalline material, in particular semiconductor material
AT223659B (en) Process for the production of dislocation-free single crystal silicon by crucible-free zone melting
DE1519894C3 (en) Process for crucible-free zone melting
DE1062431B (en) Method and device for remelting elongated bodies by zone melting
Cordes et al. Versetzungen in Antimonkristallen
DE1544301A1 (en) Method for crucible-free zone melting of a crystalline rod, in particular a semiconductor rod
DE1182206B (en) Process for the production of a rod from highly pure semiconductor material by crucible-free zone melting
DE621132C (en) Arrangement for period conversion, which consists of two asynchronous frequency converters with different numbers of poles and a common drive motor
DE752519C (en) Device for layer-by-layer removal of the filter cake from rotary filters with auxiliary filter layers

Legal Events

Date Code Title Description
E77 Valid patent as to the heymanns-index 1977