DE1121435B - Use of a three-component alloy consisting of copper-palladium-nickel as a hard solder to connect metal objects that are exposed to temperatures of 55 ° C and more - Google Patents
Use of a three-component alloy consisting of copper-palladium-nickel as a hard solder to connect metal objects that are exposed to temperatures of 55 ° C and moreInfo
- Publication number
- DE1121435B DE1121435B DEM39095A DEM0039095A DE1121435B DE 1121435 B DE1121435 B DE 1121435B DE M39095 A DEM39095 A DE M39095A DE M0039095 A DEM0039095 A DE M0039095A DE 1121435 B DE1121435 B DE 1121435B
- Authority
- DE
- Germany
- Prior art keywords
- nickel
- palladium
- copper
- temperatures
- exposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 title claims description 16
- 229910045601 alloy Inorganic materials 0.000 title claims description 15
- 239000000956 alloy Substances 0.000 title claims description 15
- 229910000679 solder Inorganic materials 0.000 title claims description 13
- 229910052759 nickel Inorganic materials 0.000 title claims description 10
- 229910052751 metal Inorganic materials 0.000 title claims description 6
- 239000002184 metal Substances 0.000 title claims description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 10
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000005219 brazing Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 229910000851 Alloy steel Inorganic materials 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910021538 borax Inorganic materials 0.000 description 2
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 2
- 239000004327 boric acid Substances 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 239000004328 sodium tetraborate Substances 0.000 description 2
- 235000010339 sodium tetraborate Nutrition 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- QXZUUHYBWMWJHK-UHFFFAOYSA-N [Co].[Ni] Chemical compound [Co].[Ni] QXZUUHYBWMWJHK-UHFFFAOYSA-N 0.000 description 1
- NKRHXEKCTWWDLS-UHFFFAOYSA-N [W].[Cr].[Co] Chemical compound [W].[Cr].[Co] NKRHXEKCTWWDLS-UHFFFAOYSA-N 0.000 description 1
- -1 about 150i0 Chemical compound 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- DDTIGTPWGISMKL-UHFFFAOYSA-N molybdenum nickel Chemical compound [Ni].[Mo] DDTIGTPWGISMKL-UHFFFAOYSA-N 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/32—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C
- B23K35/322—Selection of soldering or welding materials proper with the principal constituent melting at more than 1550 degrees C a Pt-group metal as principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550 degrees C
- B23K35/302—Cu as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Ceramic Products (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Description
Verwendung einer aus Kupfer-Palladium-Nickel bestehenden Dreistoff-Legierung als Hartlot zum Verbinden von Metallgegenständen, die Temperaturen von 550° C und mehr ausgesetzt sind Um Metallteile hart zu löten, die bei Temperaturen von mehr als 550 C beansprucht werden, muß man Lotlegierungen verwenden, die nicht nur gut fließen und ein entsprechendes Füllvermögea besitzen, sondern auch Verbindungen ergeben, die bei diesen Gebrauchstemperaturen ausreichende mechanische Eigenschaften aufweisen und von guter Zunderbeständigkeit sind. Bekannte, aus 1 bis 45 % Palladium, bis zu 3 % Nickel, Rest Kupfer bestehende Hartlote besitzen bei hohen Temperaturen keine ausreichende Zunderbeständigkeit, während die bekannten Hartlotlegierungen auf Basis Nickel-Palladium-Mangan zwar in der Hitze fest und beständig sind, sich jedoch nur mit Schwierigkeiten zu Drähten, Folien oder dergleichen Lotformen verarbeiten lassen. Für einen anderen Gebrauchszweck, nämlich für Dentallote, werden Legierungen mit 20 bis 600/c Palladium, etwa 150i0, Kupfer, Rest Nickel benutzt, z. B. zum Verlöten von Zahnprothesen aus nichtrostendem Stahl oder von Teilen aus Kobalt-Chrom-Wolfram-Legicrungen.Use of a three-component alloy consisting of copper-palladium-nickel as hard solder for joining metal objects, the temperatures of 550 ° C and more exposed To hard solder metal parts that are exposed to temperatures of more than 550 C, you have to use solder alloys that are not only good flow and have a corresponding filling capacity, but also connections result in sufficient mechanical properties at these temperatures of use and are of good resistance to scaling. Known, from 1 to 45% palladium, Up to 3% nickel, the remainder copper, have existing hard solders at high temperatures insufficient scaling resistance, while the known brazing alloys based on nickel-palladium-manganese although they are solid and stable in the heat however, it is difficult to process them into wires, foils or similar forms of solder permit. Alloys are used for another purpose, namely for dental solders with 20 to 600 / c palladium, about 150i0, copper, the remainder nickel used, z. B. for soldering of dentures made of stainless steel or of parts made of cobalt-chromium-tungsten alloys.
Gegenstand der Erfindung ist nun die Verwendung einer aus Kupfer-Palladium-Nickel bestehenden Dreistoff-Legierung mit 10 bis 560/0 Palladium, 7 0 bis 600/c Nickel, Rest 11 bis 69% Kupfer, mit der Maßgabe, daß die Zusammensetzung innerhalb des schraffierten Feldes des in der Zeichnung dargestellten Dreistoffsystems liegt, als Hartlot zum Verbinden von Metallgegenständen, die Temperaturen von 550° C und mehr ausgesetzt werden. The invention now relates to the use of a three-component alloy consisting of copper-palladium-nickel with 10 to 560/0 palladium, 7 0 to 600 / c nickel, the remainder 11 to 69% copper, with the proviso that the composition is within the The hatched field of the three-component system shown in the drawing is used as a hard solder for connecting metal objects that are exposed to temperatures of 550 ° C and more.
Dieser Bereich wird durch die die nachfolgenden Punkte verbindende
Linie begrenzt:
Zur Herstellung einer guten Lotverbindung ist es zweckmäßig, den auf den zu verbindenden Legierungen etwa befindlichen Oxydfilm zu entfernen, was beispielsweise durch Löten in Wasserstoffatmosphäre unter Verwendung eines aus Borax, Borsäure oder aus einer Mischung von Borax und Borsäure bestehenden Flußmittels geschehen kann.To produce a good solder connection, it is useful to use the to remove any oxide film from the alloys to be joined, for example by soldering in a hydrogen atmosphere using one made of borax, boric acid or a flux consisting of a mixture of borax and boric acid can.
Die erfindungsgemäß zu verwendenden Lotlegierungen sind von besonderer Dünnflüssigkeit, so daß sie nicht nur gut durch Öffnungen, Spalte und Löcher, deren Abmessungen in der Größenordnung von Kapillaren liegen, hindurchfließen, sondern auch große Öffnungen ausfüllen. Deshalb ist es nicht erforderlich, die zu verlötenden Oberflächen durch Bearbeiten genau passend zu machen.The solder alloys to be used according to the invention are special Thin liquid, so that it can not only pass through openings, gaps and holes, whose Dimensions on the order of Capillaries lie, flow through, but also fill in large openings. So it doesn't require that too to make soldering surfaces exactly matched by machining.
Ein weiterer Vorteil der Legierungen ist es, daß sie zum Hartlöten unter Vakuum besser geeignet sind als die bekannten Legierungen, da sie in ihrem Fließbereich eine geringere Neigung zum Verdampfen zeigen.Another advantage of the alloys is that they can be used for brazing under vacuum are more suitable than the known alloys because they are in their Show less tendency to evaporate.
Claims (1)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB30765/57A GB838951A (en) | 1957-10-01 | 1957-10-01 | Improvements relating to brazing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1121435B true DE1121435B (en) | 1962-01-04 |
Family
ID=10312790
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEM39095A Pending DE1121435B (en) | 1957-10-01 | 1958-09-26 | Use of a three-component alloy consisting of copper-palladium-nickel as a hard solder to connect metal objects that are exposed to temperatures of 55 ° C and more |
Country Status (3)
| Country | Link |
|---|---|
| BE (1) | BE571676A (en) |
| CH (1) | CH376755A (en) |
| DE (1) | DE1121435B (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE684186C (en) * | 1937-05-13 | 1939-11-23 | Degussa | Use of palladium alloys for dental purposes |
| GB573176A (en) * | 1943-02-03 | 1945-11-09 | Mond Nickel Co Ltd | Improvements relating to soldering and brazing |
-
1958
- 1958-09-26 DE DEM39095A patent/DE1121435B/en active Pending
- 1958-09-30 CH CH6453758A patent/CH376755A/en unknown
- 1958-10-01 BE BE571676D patent/BE571676A/fr unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE684186C (en) * | 1937-05-13 | 1939-11-23 | Degussa | Use of palladium alloys for dental purposes |
| GB573176A (en) * | 1943-02-03 | 1945-11-09 | Mond Nickel Co Ltd | Improvements relating to soldering and brazing |
Also Published As
| Publication number | Publication date |
|---|---|
| BE571676A (en) | 1958-10-31 |
| CH376755A (en) | 1964-04-15 |
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