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DE112007003051A5 - Mikromechanisches Bauelement und Herstellungsverfahren desselben - Google Patents

Mikromechanisches Bauelement und Herstellungsverfahren desselben Download PDF

Info

Publication number
DE112007003051A5
DE112007003051A5 DE112007003051T DE112007003051T DE112007003051A5 DE 112007003051 A5 DE112007003051 A5 DE 112007003051A5 DE 112007003051 T DE112007003051 T DE 112007003051T DE 112007003051 T DE112007003051 T DE 112007003051T DE 112007003051 A5 DE112007003051 A5 DE 112007003051A5
Authority
DE
Germany
Prior art keywords
manufacturing
micromechanical device
micromechanical
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE112007003051T
Other languages
English (en)
Other versions
DE112007003051B4 (de
Inventor
Harald Schenk
Thilo Sandner
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Original Assignee
Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV filed Critical Fraunhofer Gesellschaft zur Foerderung der Angewandten Forschung eV
Publication of DE112007003051A5 publication Critical patent/DE112007003051A5/de
Application granted granted Critical
Publication of DE112007003051B4 publication Critical patent/DE112007003051B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0035—Constitution or structural means for controlling the movement of the flexible or deformable elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • G02B26/0841—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD the reflecting element being moved or deformed by electrostatic means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/04—Optical MEMS
    • B81B2201/042—Micromirrors, not used as optical switches
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0181—See-saws
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/05—Type of movement
    • B81B2203/058—Rotation out of a plane parallel to the substrate

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Mechanical Light Control Or Optical Switches (AREA)
DE112007003051T 2007-01-23 2007-01-23 Mikromechanisches Bauelement mit erhöhter Steifigkeit und Verfahren zum Herstellen desselben Active DE112007003051B4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2007/000559 WO2008089786A1 (de) 2007-01-23 2007-01-23 Mikromechanisches bauelement mit erhöhter steifigkeit und verfahren zum herstellen desselben

Publications (2)

Publication Number Publication Date
DE112007003051A5 true DE112007003051A5 (de) 2009-10-01
DE112007003051B4 DE112007003051B4 (de) 2012-12-20

Family

ID=38055392

Family Applications (1)

Application Number Title Priority Date Filing Date
DE112007003051T Active DE112007003051B4 (de) 2007-01-23 2007-01-23 Mikromechanisches Bauelement mit erhöhter Steifigkeit und Verfahren zum Herstellen desselben

Country Status (2)

Country Link
DE (1) DE112007003051B4 (de)
WO (1) WO2008089786A1 (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009033191A1 (de) * 2009-07-07 2011-01-13 Technische Universität Dresden Reduzierung der dynamischen Deformation von Translationsspiegeln mit Hilfe von trägen Massen
NL2007886C2 (en) 2011-11-29 2013-05-30 Innoluce B V Mems scanning micromirror.
JP6049364B2 (ja) * 2012-09-11 2016-12-21 スタンレー電気株式会社 光偏向器
JP6261923B2 (ja) * 2013-09-17 2018-01-17 スタンレー電気株式会社 光偏向ミラー及びこれを用いた光偏向器
US9663354B2 (en) 2014-05-14 2017-05-30 Infineon Technologies Ag Mechanical stress-decoupling in semiconductor device
DE102017222404A1 (de) * 2017-12-11 2019-06-13 Blickfeld GmbH Zweiteiliger spiegel
JP7074042B2 (ja) * 2018-12-11 2022-05-24 トヨタ自動車株式会社 スタックフレーム
DE102018132830A1 (de) * 2018-12-19 2020-06-25 Blickfeld GmbH Spiegel

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4317611A (en) * 1980-05-19 1982-03-02 International Business Machines Corporation Optical ray deflection apparatus
EP1119032B8 (de) * 1992-04-22 2008-03-19 Denso Corporation Verfahren zum Erzeugen einer Halbleitervorrichtung
DE4224599C2 (de) * 1992-07-23 2000-09-21 Contec Ges Fuer Ind Elektronik Elektrostatische Ablenkeinheit
US6303464B1 (en) * 1996-12-30 2001-10-16 Intel Corporation Method and structure for reducing interconnect system capacitance through enclosed voids in a dielectric layer
JP4602542B2 (ja) * 2000-12-18 2010-12-22 オリンパス株式会社 光偏向器用のミラー揺動体
US20090065429A9 (en) * 2001-10-22 2009-03-12 Dickensheets David L Stiffened surface micromachined structures and process for fabricating the same
JP2005506909A (ja) * 2001-10-22 2005-03-10 モンタナ ステート ユニバーシティ−ボーズマン 補強面微細加工構造物およびその製造方法
JP3862623B2 (ja) * 2002-07-05 2006-12-27 キヤノン株式会社 光偏向器及びその製造方法
DE102004005804B4 (de) * 2004-02-06 2007-04-05 X-Fab Semiconductor Foundries Ag Verfahren zur Verfüllung von Isolationsgräben unter Nutzung von CMOS-Standardprozessen zur Realisierung dielektrisch isolierter Gebiete auf SOI Scheiben
US7268057B2 (en) * 2005-03-30 2007-09-11 Micron Technology, Inc. Methods of filling openings with oxide, and methods of forming trenched isolation regions

Also Published As

Publication number Publication date
WO2008089786A1 (de) 2008-07-31
DE112007003051B4 (de) 2012-12-20

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R016 Response to examination communication
R018 Grant decision by examination section/examining division
R020 Patent grant now final

Effective date: 20130321