DE1113812B - Process for the production of filled plastics with tracking resistance on the basis of epoxy resins - Google Patents
Process for the production of filled plastics with tracking resistance on the basis of epoxy resinsInfo
- Publication number
- DE1113812B DE1113812B DES63194A DES0063194A DE1113812B DE 1113812 B DE1113812 B DE 1113812B DE S63194 A DES63194 A DE S63194A DE S0063194 A DES0063194 A DE S0063194A DE 1113812 B DE1113812 B DE 1113812B
- Authority
- DE
- Germany
- Prior art keywords
- fillers
- mixed
- production
- epoxy resins
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 12
- 238000000034 method Methods 0.000 title claims description 12
- 229920000647 polyepoxide Polymers 0.000 title claims description 12
- 239000004033 plastic Substances 0.000 title claims description 6
- 229920003023 plastic Polymers 0.000 title claims description 6
- 238000004519 manufacturing process Methods 0.000 title claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title claims description 4
- 239000000945 filler Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 claims description 2
- 229910000423 chromium oxide Inorganic materials 0.000 claims description 2
- 229910044991 metal oxide Inorganic materials 0.000 claims description 2
- 150000004706 metal oxides Chemical class 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000007493 shaping process Methods 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 15
- 239000011347 resin Substances 0.000 description 15
- 239000010453 quartz Substances 0.000 description 11
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 11
- 239000000203 mixture Substances 0.000 description 8
- 239000004848 polyfunctional curative Substances 0.000 description 7
- 235000013312 flour Nutrition 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000013543 active substance Substances 0.000 description 3
- SMZOGRDCAXLAAR-UHFFFAOYSA-N aluminium isopropoxide Chemical compound [Al+3].CC(C)[O-].CC(C)[O-].CC(C)[O-] SMZOGRDCAXLAAR-UHFFFAOYSA-N 0.000 description 3
- 238000000137 annealing Methods 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 229910021556 Chromium(III) chloride Inorganic materials 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- QSWDMMVNRMROPK-UHFFFAOYSA-K chromium(3+) trichloride Chemical compound [Cl-].[Cl-].[Cl-].[Cr+3] QSWDMMVNRMROPK-UHFFFAOYSA-K 0.000 description 1
- 235000007831 chromium(III) chloride Nutrition 0.000 description 1
- 239000011636 chromium(III) chloride Substances 0.000 description 1
- 239000003245 coal Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004870 electrical engineering Methods 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 230000007062 hydrolysis Effects 0.000 description 1
- 238000006460 hydrolysis reaction Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- JPJALAQPGMAKDF-UHFFFAOYSA-N selenium dioxide Chemical compound O=[Se]=O JPJALAQPGMAKDF-UHFFFAOYSA-N 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H33/00—High-tension or heavy-current switches with arc-extinguishing or arc-preventing means
- H01H33/02—Details
- H01H33/021—Use of solid insulating compounds resistant to the contacting fluid dielectrics and their decomposition products, e.g. to SF6
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/02—Ingredients treated with inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09C—TREATMENT OF INORGANIC MATERIALS, OTHER THAN FIBROUS FILLERS, TO ENHANCE THEIR PIGMENTING OR FILLING PROPERTIES ; PREPARATION OF CARBON BLACK ; PREPARATION OF INORGANIC MATERIALS WHICH ARE NO SINGLE CHEMICAL COMPOUNDS AND WHICH ARE MAINLY USED AS PIGMENTS OR FILLERS
- C09C3/00—Treatment in general of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties
- C09C3/06—Treatment with inorganic compounds
- C09C3/063—Coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Organic Insulating Materials (AREA)
- Epoxy Resins (AREA)
Description
Verfahren zur Herstellung von gefüllten kriechstromfesten Kunststoffen auf Grundlage von Epoxyharzen In der Elektrotechnik werden vielfach kriechstromfeste Kunststoffe bendtigt. Abgesehen von den ungesattigen Polyester-, Melamin- und Anilinharzen, die ungefüllt gute Kriechstromfestigkeit aufweisen, ist die weitaus grdl3te Zahl der Kunstharze als nicht kriechstromfest zu bezeichnen. Die schlechte Kriechstromfestigkeit der übrigen Harze tritt vor allem dann auBerordentlich stark in Erscheinung, wenn die Harze mit Füllstoffen wie Quarzpulver, Talkum usw. versetzt werden. Man stellt vielfach fest, daf3 z. B. Gie13-harze - insbesondere einer ihrer wichtigsten Vertreter, die Epoxyharze, die in ungefülltem Zustand ausreichende Kriechstromfestigkeit haben -, vüllig versagen, wenn sie mit Füllstoffen vermischt werden, was sehr hâufig notwendig ist, um die mechanischen Eigenschaften der Harze zu verbessern oder den beim Harten auftretenden Schwund zu reduzieren oder die Anwendung kostspieliger Harze durch Zugabe eines billigen Füllstoffes wirtschaftlich zu gestalten.Process for the production of filled plastics with tracking resistance based on epoxy resins Plastics ends. Apart from the unsaturated polyester, melamine and aniline resins, which have good tracking resistance when unfilled is by far the largest number of synthetic resins to be described as not tracking current resistant. The poor tracking resistance of the other resins is particularly evident when fillers such as quartz powder, talc, etc. are added to the resins. One poses often stated that z. B. Gie13 resins - especially one of their most important representatives, the epoxy resins, which have sufficient tracking resistance in the unfilled state - fail completely when mixed with fillers, which is very often necessary is to improve the mechanical properties of the resins or when hardening reduce the shrinkage that occurs or the use of expensive resins Adding a cheap filler to make it economical.
Man hat daher schon versucht, geeignete Füllstoffe ausfindig zu machen, um unabhângig von der Eigenart des Harzes kriechstromfeste Mischungen herzustellen. Diese Versuche sind erfolglos verlaufen, und es ist lediglich festgestellt worden, dali die Verwendung von Aluminiumhydroxyd als Füllstoff zu kriechstromfesten Produkten führt (AIEE Transactions, 77, August 1958, S. 632). Mischt man z. B. ein handelsübliches Epoxyharz mit Aluminiumhydroxyd (oder Aluminiumoxyhydrat) im Gewichtsverhâltnis 1 : 1 und hârtet es ans, dann stellt man bei der Prüfung auf Kriechstromfestigkeit nach DIN 53 480 (VDE 0303) fest, da13 sich nach 100 Tropfen noch kein Kriechweg ausgebildet hat. Diese Wirkung des Aluminiumoxydes geht aber sofort verloren, wenn es nicht mehr allein, sondern in Mischung mit z. B. Quarzmehl verwendet wird. Ein Harz, dem z. B. die gleiche Gewichtsmenge Füllstoff, bestehend ans 50% Aluminiumoxyhydrat und 50'0/a Quarzmehl, beigefügt wurde, zeigt schon nach 3 Tropfen einen Kriechweg und ist daher als nicht mehr kriechstromfest zu bezeichnen, verwendet man nur Quarzmehl als Füllstoff, dann bildet sich ebenfalls schon nach 3 Tropfen ein Kriechweg. Es ist also nicht mdglich, kriechstromfeste gefüllte Harze dadurch herzustellen, da13 man den üblichen Füllstoffen Aluminiumhydroxyd in einem bestimmten Mengenverhâltnis zusetzt.Attempts have therefore already been made to find suitable fillers, in order to produce mixtures that are resistant to tracking, regardless of the nature of the resin. These attempts have been unsuccessful and it has only been ascertained dali the use of aluminum hydroxide as a filler for products that are resistant to tracking currents leads (AIEE Transactions, 77, August 1958, p. 632). If you mix z. B. a commercially available Epoxy resin with aluminum hydroxide (or aluminum oxyhydrate) in the weight ratio 1: 1 and if it hardens, then the test for leakage current resistance is tested according to DIN 53 480 (VDE 0303), there is still no creepage distance after 100 drops has trained. This effect of the aluminum oxide is lost immediately if it no longer alone, but in a mixture with z. B. quartz flour is used. A Resin, the z. B. the same amount by weight of filler, consisting of 50% aluminum oxyhydrate and 50'0 / a quartz powder was added, shows a creepage distance after just 3 drops and is therefore no longer resistant to tracking, only quartz powder is used as a filler, a creepage path is also formed after just 3 drops. It It is therefore not possible to produce filled resins with resistance to tracking by one of the usual fillers aluminum hydroxide in a certain proportion clogs.
Es ist min gefunden worden, dag man durch Zusatz von katalytisch wirksamen Stoffen, sofern sie auf der Oberfiâche des zur Verwendung vorgesehenen anorganischen oder organischen Füllstoffes erzeugt bzw. niedergeschlagen sind, kriechstromfeste Kunststoffe erhült. Die wirksamen Stoffe kënnen in stark variierenden Gewichtsverhaltnissen angewendet werden.It has been found that by adding catalytically active substances Substances, provided they are on the surface of the inorganic intended for use or organic filler are generated or deposited, tracking current-resistant Plastics received. The active substances can vary widely in weight be applied.
Als wirksame Stoffe kommen an sich bekannte Metalloxyde und Metallhydroxyde in Frage. Als besonders geeignet haben sich Eisenoxyd, Kupferoxyd, Chromoxyd, Selenoxyd, Aluminiumoxyd, Aluminiumhydroxyd usw. erwiesen.Metal oxides and metal hydroxides known per se are used as active substances in question. Iron oxide, copper oxide, chromium oxide, selenium oxide, Aluminum oxide, aluminum hydroxide, etc. proved.
Die Hiirtung kann in verschiedener Weise durchgeführt werden. Die Auswahl der jeweils am besten geeigneten Hârtungsmethode und Hartungsmittel richtet sich dabei nach dem jeweiligen Anwendungszweck. 1m allgemeinen wird die Hârtung bei Raumtemperatur durch Zusatz von basischen Katalysatoren und kurzen Tempern bei verhültnismal3ig niedrigen Temperaturen bewirkt.The care can be carried out in various ways. the Selection of the most suitable curing method and curing agent in each case depending on the respective application. In general, the hardening becomes at room temperature by adding basic catalysts and brief annealing causes relatively low temperatures.
Die erfindungsgemâB hergestellten Produkte kônnen für vielerlei Zwecke Anwendung finden, vor allem aber als Kunststoffe der Elektrotechnik, insbesondere zur Herstellung von Giel3kdrpem und als Einbettungsmasse für elektrische Bauelemente. Die erfindungsgemal3 hergestellten Produkte kdnnen ferner auch als Uberzüge und Klebstoffe Verwendung finden.The products made according to the invention can be used for many purposes Find application, but above all as plastics in electrical engineering, in particular for the production of Giel3kdrpem and as an embedding compound for electrical components. The products produced according to the invention can also be used as coatings and Find adhesives use.
Die nachfolgenden Beispiele erlâutern die Erfindung. Das in den Beispielen verwendete Epoxyharz, für das im Rahmen der Erfindung kein Schutz beansprucht wird, wurde wie folgt hergestellt: Herstellung der Epoxyharzmasse 100 g eines flüssigen Glycidylpolyâthers (Epoxyzahl 0,50) werden mit 12,2 g Triâthylentetramin innig vermischt. Die Mischung wird 15 Stunden bei Raumtemperatur gehârtet und anschlief3end 2 Stunden bei 60° C getempert.The following examples explain the invention. That in the examples epoxy resin used, for which no protection is claimed in the context of the invention, was made as follows: Production of the epoxy resin composition 100 g of a liquid glycidyl polyether (epoxy number 0.50) are mixed with 12.2 g of trietylenetetramine intimately mixed. The mixture is cured for 15 hours at room temperature and then Annealed at 60 ° C for 2 hours.
Bei der Prüfung auf Kriechstromfestigkeit nach DIN 53 480 wird nach 100 Tropfen noch kein Kriechweg festgestellt. Das Muster zeigt starke Ausbrennungen, und das Ausbleiben einer leitenden Kohlebrücke dürfte darauf zurückzuführen sein, da13 die primâr entstehenden Kohlebrücken durch verflüssigte Anteile des Harzes sofort wieder zugeschmolzen werden.When testing for creep resistance according to DIN 53 480, after 100 drops no creepage distance found. The pattern shows severe burns, and the lack of a conductive coal bridge is likely due to that the primarily resulting carbon bridges are caused by liquefied parts of the resin be melted shut again immediately.
Gibt man zu 20 g des mit Hârter vermischten Harzes 20 g Quarzmehl, vermengt gut und hârtet aus - wie oben beschrieben -, so stellt man bei der Prüfung auf Kriechstromfestigkeit schon nach 3 Tropfen eine leitende Kohlebrücke fest.If you add 20 g of quartz flour to 20 g of the resin mixed with hardener, blends well and hardens - as described above - that is how one poses in the test A conductive carbon bridge is fixed for tracking resistance after just 3 drops.
Beispiel 1 20 g des mit Hârter vermischten Epoxyharzes werden mit 20 g Füllstoff vermengt, der nach folgendem Verfahren hergestellt ist: 2 g des Selenreaktionsgemisches nach Wieninger werden mit 10 ml konzentrierter Salpetersâure geldst und die Mure abgeraucht. Der verbleibende Rückstand wird in 15 ml Wasser gelôst und 18 g Quarzmehl hinzugegeben. Nach inniger Vermischung wird das Wasser abgedampft und die erhaltene Mischung sorgfâltig getrocknet.Example 1 20 g of the epoxy resin mixed with hardener are mixed with 20 g of filler are mixed, which is produced according to the following process: 2 g of the selenium reaction mixture According to Wieninger, 10 ml of concentrated nitric acid are used to make the mud smoked. The remaining residue is dissolved in 15 ml of water and 18 g of quartz flour added. After intimate mixing, the water is evaporated and the resulting Mix carefully dried.
Der so hergestellte Füllstoff wird innig mit dem Harz-Hârter-Gemisch vermischt und 15 Stunden bei Raumtemperatur und anschlieBend etwa 2 Stunden bei 60° C getempert.The filler produced in this way becomes intimate with the resin-hardener mixture mixed and 15 hours at room temperature and then about 2 hours at Annealed at 60 ° C.
Nach dem Aushârten des so gefüllten Harzes bildete sich bei der Prüfung erst nach 12 Tropfen ein Kriechweg.After the resin filled in this way had hardened, it formed during the test a creepage distance only after 12 drops.
Beispiel 2 20 g des mit Hârter vermischten Epoxyharzes werden mit 20 g eines Füllstoffes vermengt, der nach folgendem Verfahren hergestellt ist: 6 g Kupfernitrat werden in 20 ml Wasser gelôst und in diese Lôsung 18 g Quarzmehl eingetragen und gut verrührt. Nach Abdampfen des Wassers wird der Füllstoff 2 Stunden bei 800° C geglüht.Example 2 20 g of the epoxy resin mixed with hardener are mixed with Mixing 20 g of a filler produced according to the following process: 6 g of copper nitrate are dissolved in 20 ml of water and 18 g of quartz flour are added to this solution entered and stirred well. After the water has evaporated, the filler becomes 2 hours annealed at 800 ° C.
Nach der Aushârtung des Harzes - wie im Beispiel 1 beschrieben - bildete sich nach 11 Tropfen ein Kriechweg.After curing of the resin - as described in Example 1 - formed after 11 drops there is a creepage path.
Beispiel 3 20 g des mit Hârter vermischten Epoxyharzes werden mit 20 g eines Füllstoffes vermengt, der nach folgendem Verfahren hergestellt ist: 1,75 g Chrom(III)-chlorid werden mit 5 ml konzentrierter Schwefelsâure versetzt und anschliel3end abgeraucht. Der Rückstand wird mit 20 ml Wasser aufgenommen und darin 19,5 g Quarzmehl gut verrührt, Nach Trocknung des Füllstoffes wird er 2 Stunden bei 800° C geglüht. Die Prüfung des gemâ13 Beispiel 1 ausgehârteten Harzes ergab nach 100 Tropfen noch keine Kriechwegbildung.Example 3 20 g of the epoxy resin mixed with hardener are mixed with 20 g of a filler are mixed, which is produced according to the following process: 1.75 5 ml of concentrated sulfuric acid are added to g chromium (III) chloride and then smoked. The residue is taken up with 20 ml of water and 19.5 g of quartz flour therein stirred well. After the filler has dried, it is calcined at 800 ° C. for 2 hours. Testing of the resin cured according to Example 1 still showed 100 drops no tracking.
Beispiel 4 20 g des mit Hârter vermischten Epoxyharzes werden mit 20 g Füllstoff vermischt, der nach folgendem Verfahren hergestellt ist: 8 g Aluminiumisopropylat werden in 20 ml Trichlorâthylen geldst und zu dieser Lôsung 18 g Quarzmehl gegeben. Nach guter Durchmischung lâ13t man das Lüsungsmittel bei Raumtemperatur abdampfen. Durch die herrschende Luftfeuchtigkeit wird gleichzeitig das Aluminiumisopropylat hydrolysiert. Anschliel3end wird der lufttrockene Füllstoff 1 Stunde bei 70° C im Trockenschrank erwârmt, um Reste des LSsungsmittels und den durch Hydrolyse entstandenen Isopropylalkohol abzudampfen. Daraufhin wird 2 Stunden bei 800° C geglüht.Example 4 20 g of the epoxy resin mixed with hardener are mixed with 20 g of filler mixed, which is produced according to the following process: 8 g of aluminum isopropylate are poured into 20 ml of trichlorethylene and 18 g of quartz flour are added to this solution. After thorough mixing, the solvent is allowed to evaporate at room temperature. Due to the prevailing air humidity, the aluminum isopropylate becomes at the same time hydrolyzed. The air-dry filler is then immersed for 1 hour at 70 ° C The drying cabinet is warmed up to remove residues of the solvent and those caused by hydrolysis To evaporate isopropyl alcohol. This is followed by annealing at 800 ° C. for 2 hours.
Die Prüfung eines Harzkôrpers, ausgehâriet nach dem ira Beispiel1 beschriebenen Verfahren, ergab nach 100 Tropfen noch keine Kriechwegbildung.The test of a resin body, unhardened according to the example I1 described method, did not result in tracking after 100 drops.
Beispiel 5 20 g des mit Hârter vermischten Epoxyharzes werden mit 20 g Füllstoff vermischt, der nach folgendem Verfahren hergestellt ist: 0,02 g Aluminiumisopropylat werden in 20 ml Trichlorâthylen gelüst und 20 g Quarzmehl in die Lüsung eingetragen. Die Weiterbehandlung erfolgt, wie im Beispiel4 angegeben, wobei jedoch das abschhel3ende Glühen nicht durchgeführt wird. Der Anteil des Aluminiumhydroxyds betrâgt 0,04% (bezogen auf Quarzmehl).Example 5 20 g of the epoxy resin mixed with hardener are mixed with 20 g of filler mixed, which is produced according to the following process: 0.02 g of aluminum isopropylate are dissolved in 20 ml of trichlorethylene and 20 g of quartz powder are added to the solution. The further treatment takes place as indicated in example 4, but with the final step Annealing is not performed. The proportion of aluminum hydroxide is 0.04% (based on quartz powder).
Bei der Prüfung des ausgehârteten Harzes bildete sich nach 100 Tropfen noch kein Kriechweg.When the hardened resin was tested, drops formed after 100 no creepage yet.
Claims (1)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| BE591298D BE591298A (en) | 1959-05-29 | ||
| DES63194A DE1113812B (en) | 1959-05-29 | 1959-05-29 | Process for the production of filled plastics with tracking resistance on the basis of epoxy resins |
| CH517760A CH398081A (en) | 1959-05-29 | 1960-05-06 | Process for the production of plastics with resistance to tracking |
| FR828413A FR1292950A (en) | 1959-05-29 | 1960-05-27 | Process for the production of synthetic materials resistant to leakage currents |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DES63194A DE1113812B (en) | 1959-05-29 | 1959-05-29 | Process for the production of filled plastics with tracking resistance on the basis of epoxy resins |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1113812B true DE1113812B (en) | 1961-09-14 |
Family
ID=7496201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DES63194A Pending DE1113812B (en) | 1959-05-29 | 1959-05-29 | Process for the production of filled plastics with tracking resistance on the basis of epoxy resins |
Country Status (3)
| Country | Link |
|---|---|
| BE (1) | BE591298A (en) |
| CH (1) | CH398081A (en) |
| DE (1) | DE1113812B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1189277B (en) * | 1962-06-07 | 1965-03-18 | Licentia Gmbh | Process for the production of tracking resistant, hardened insulating molded bodies |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1048024B (en) * | 1955-04-07 | 1958-12-31 | Westinghouse Electric Corp | Heat-hardenable compound for embedding and electrical insulation of metallic parts |
-
0
- BE BE591298D patent/BE591298A/fr unknown
-
1959
- 1959-05-29 DE DES63194A patent/DE1113812B/en active Pending
-
1960
- 1960-05-06 CH CH517760A patent/CH398081A/en unknown
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1048024B (en) * | 1955-04-07 | 1958-12-31 | Westinghouse Electric Corp | Heat-hardenable compound for embedding and electrical insulation of metallic parts |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1189277B (en) * | 1962-06-07 | 1965-03-18 | Licentia Gmbh | Process for the production of tracking resistant, hardened insulating molded bodies |
Also Published As
| Publication number | Publication date |
|---|---|
| CH398081A (en) | 1965-08-31 |
| BE591298A (en) |
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