DE1169114B - Use of epoxy resins to join and / or shape structural parts - Google Patents
Use of epoxy resins to join and / or shape structural partsInfo
- Publication number
- DE1169114B DE1169114B DEM41464A DEM0041464A DE1169114B DE 1169114 B DE1169114 B DE 1169114B DE M41464 A DEM41464 A DE M41464A DE M0041464 A DEM0041464 A DE M0041464A DE 1169114 B DE1169114 B DE 1169114B
- Authority
- DE
- Germany
- Prior art keywords
- epoxy resins
- structural parts
- join
- resins
- shape structural
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003822 epoxy resin Substances 0.000 title claims description 9
- 229920000647 polyepoxide Polymers 0.000 title claims description 9
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 title claims description 8
- 238000000034 method Methods 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 6
- 239000000945 filler Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000007493 shaping process Methods 0.000 claims description 2
- 229920003002 synthetic resin Polymers 0.000 claims description 2
- 239000000057 synthetic resin Substances 0.000 claims description 2
- 241001076195 Lampsilis ovata Species 0.000 claims 1
- 239000004033 plastic Substances 0.000 claims 1
- 229920005989 resin Polymers 0.000 description 12
- 239000011347 resin Substances 0.000 description 12
- 238000000465 moulding Methods 0.000 description 9
- 239000000203 mixture Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 229920001568 phenolic resin Polymers 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 239000008187 granular material Substances 0.000 description 3
- 239000005011 phenolic resin Substances 0.000 description 3
- 239000004848 polyfunctional curative Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000007792 addition Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 description 1
- DYDNPESBYVVLBO-UHFFFAOYSA-N formanilide Chemical compound O=CNC1=CC=CC=C1 DYDNPESBYVVLBO-UHFFFAOYSA-N 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000012764 mineral filler Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- LYRFLYHAGKPMFH-UHFFFAOYSA-N octadecanamide Chemical compound CCCCCCCCCCCCCCCCCC(N)=O LYRFLYHAGKPMFH-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/58—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation characterised by the form or material of the contacting members
- H01R4/66—Connections with the terrestrial mass, e.g. earth plate, earth pin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/40—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/06—Manufacture of commutators
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
Verwendung von Epoxyharzen zur Verbindung und/oder Formung von Konstruktionsteilen Die Erfindung betrifft die Verwendung von feinteiligen, härtbaren Preßmassen auf Grundlage von Epoxyharzen, einer hohen Füllstoffmenge und Härtungsmitteln zum Verbinden und/oder gleichzeitigen Formen von elektrischen Konstruktionselementen im Preßverfahren.Use of epoxy resins to join and / or shape structural parts The invention relates to the use of finely divided, hardenable molding compounds Based on epoxy resins, a high amount of filler and hardeners for bonding and / or simultaneous molding of electrical construction elements in the pressing process.
Bisher wurden als Preßmassen hauptsächlich Harze auf der Basis Phenol-Formaldehyd verwendet, die sich bei hohem Druck gut wärmeverpressen lassen, doch haftet diesen Harzen unter anderem der Nachteil an, daß sie sich oberflächlich mit Metallen oder anderen Konstruktionsteilen nicht festverkleben lassen, so daß mechanische Verankerungen erforderlich sind, die wiederum die Konstruktion komplizieren und verteuern. Ein weiterer Nachteil dieser Harzgruppen ist der nach dem Verpressen auftretende Nachschwund, der zusätzlich zu dem normalen Schwund beim Preßvorgang auftritt. Auch die Wärmefestigkeit dieser Harze ist begrenzt. Ein weiterer Nachteil der Verwendung solcher Harze liegt in der langen, oft 24 Stunden überschreitenden Temperzeit, wenn sie zur Erhöhung der Wärmefestigkeit und der Beseitigung des Nachschwundes angewendet wird. So far, resins based on phenol-formaldehyde have mainly been used as molding compounds are used, which can be heat-pressed well at high pressure, but this sticks Resins, among other things, the disadvantage that they are superficially with metals or Do not allow other structural parts to be glued so that mechanical anchorages are required, which in turn complicate the construction and make it more expensive. A Another disadvantage of these resin groups is the shrinkage that occurs after pressing, which occurs in addition to the normal shrinkage during the pressing process. Also the heat resistance these resins are limited. Another disadvantage of using such resins is in the long tempering time, often exceeding 24 hours, when it increases the heat resistance and the elimination of post-shrinkage is applied.
Es ist auch vorgeschlagen worden, Epoxyharze preßfähig zu machen, jedoch wurden meist Gemische mit Phenol-Novolak-Harzen oder Anilin-Formaldehyd-Harzen hergestellt, die jedoch zu anderen technischen Eigenschaften führten wie sie erfindungsgemäß angestrebt werden. Ferner sind Trennmittel wie Stearinsäureamid als Mischungskomponenten vorgeschlagen worden. It has also been proposed to make epoxy resins compressible, however, mixtures with phenol-novolak resins or aniline-formaldehyde resins were mostly used produced, which, however, led to other technical properties than those according to the invention to be striven for. Release agents such as stearic acid amide are also used as components of the mixture has been proposed.
Auch hierbei ändern sich naturgemäß die Eigenschaften, insbesondere geht die Klebkraft verloren. Here, too, the properties naturally change, in particular the adhesive strength is lost.
Dies wurde angestrebt, weil man gerade Preßmassen herstellen wollte, die sich in dieser Hinsicht und in der leichten Entformbarkeit von den bekannten Preßmassen nicht unterscheiden.This was aimed at because one wanted to produce molding compounds, which differ in this respect and in the ease of demoulding from the known No distinction between molding compounds.
Im Gegensatz hierzu geht die Erfindung den Weg, die Klebkraft der Epoxyharze zu erhalten und dabei gleichzeitig technische Werte zu erzielen, die bisher entweder nicht erreichbar waren oder Preßdrucke und Preßzeiten erforderten, die sich ebenso wie die verwendeten Beimischungen ungünstig in den Kosten auswirkten. In contrast, the invention goes the way, the bond strength of the To obtain epoxy resins and at the same time to achieve technical values that up to now either were not available or required press pressures and press times, which, like the admixtures used, had an unfavorable effect on costs.
Nach der Erfindung werden bekannte Epoxyharze und Härter in Verbindung mit möglichst hohen Zuschlägen mineralischer Füllstoffe verwendet. Diese Mischung wird in an sich bekannter Weise hergestellt und granuliert ohne daß eine Aushärtung eintritt. According to the invention, known epoxy resins and hardeners are combined used with the highest possible additions of mineral fillers. This mixture is produced in a manner known per se and granulated without curing entry.
Hierbei bleibt die Klebkraft des Epoxyharzes voll erhalten, weil Zuschläge von Trennmitteln außerdem bewußt unterlassen werden. Zugleich werden technische Werte erzielt, die mit den bekannten Preßmassen nicht erreicht wurden. Um diese beiden Vorteile, Klebkraft und gute technische Werte zu erreichen, ist es nicht mehr erforderlich, dem Gemisch weitere chemische Grundstoffe beizufügen.The adhesive strength of the epoxy resin is retained in full because of aggregates release agents are also deliberately avoided. At the same time become technical Achieved values that were not achieved with the known molding compounds. Around It is not the two advantages of achieving adhesive strength and good technical values more necessary to add further chemical raw materials to the mixture.
Insbesondere mit Rücksicht auf den erstrebten hohen Gehalt an Füllstoffen wird eine vorzugsweise höhere Ausgangstemperatur gewählt, bei der das Gießharz mit dem Härter und den Füllstoffen gut zu verarbeiten ist. Nach der Mischung wird zunächst verhindert, daß der sonst einsetzende Aushärtungsprozeß erfolgt. Dies kann durch entsprechend rasche Abkühlung bewirkt werden. Bei normaler Temperatur unterbleibt alsdann die Aushärtung. Es tritt vielmehr eine Erstarrung ein, durch die die bisher breiige Masse mechanisch hart und granulierfähig wird, ohne daß eine chemische Aushärtung erfolgt. Especially with regard to the desired high filler content a preferably higher starting temperature is selected at which the casting resin with the hardener and the fillers are easy to process. After mixing is done first prevents the hardening process that would otherwise begin from taking place. This can be done by correspondingly rapid cooling can be effected. Does not take place at normal temperature then the hardening. Rather, a solidification occurs through which the hitherto pulpy mass becomes mechanically hard and granulatable without chemical hardening he follows.
Danach wird zu einem Granulat vermahlen das nunmehr schüttfähig ist und unter Zuführung von Wärme bei geringem Druck zum Fließen gebracht werden kann, um die Konstruktionsteile, z. B. Metallkörper, an ihrer Innen- oder Außenfläche zu umschließen. Then it is ground to a granulate that is now pourable and can be made to flow with the addition of heat at low pressure, around the construction parts, e.g. B. metal body, on their inner or outer surface to enclose.
Es ergibt sich noch ein weiterer Vorteil, der die Herstellungskosten wesentlich herabsetzt. Bekanntlich müssen Phenolharzpreßmassen mit einem Preßdruck von etwa 150 bis 300kp/cm2 verpreßt werden, so daß hierfür besonders schwere Maschinen erforderlich sind. Da ein nach der Erfindung aus Gießharz gewonnenes Granulat jedoch nur einen Bruchteil, beispielsweise etwa 5 bis 100/o, dieser Drücke erfordert, so werden die Maschinenkosten entsprechend geringer. Auf bereits vorhandenen schweren Maschinen kann mit diesem Granulat in Vielfachwerkzeugen gefertigt werden. There is still another advantage, which is the manufacturing cost significantly reduces. It is known that phenolic resin molding compounds must have a molding pressure from about 150 to 300kp / cm2 are pressed, so that this is particularly heavy machines required are. Since a granulate obtained from casting resin according to the invention, however only a fraction, for example about 5 to 100 / o, of these pressures requires so the machine costs are correspondingly lower. On already existing heavy ones Machines can be manufactured with this granulate in multiple tools.
Da der Aushärtungsprozeß bis zum Einschüttvorgang noch nicht eingesetzt hat, ist die Reaktions-bzw. Klebefähigkeit des Gießharzes voll erhalten geblieben. Infolgedessen entfallen auch alle mehr oder weniger komplizierten und aufwendigen Oberflächengestaltungen an den mit dem Harz in Berührung kommenden Konstruktionsteilen, wie sie z. B. bei der Herstellung von Kollektoren unter Verwendung von Phenolharzen erforderlich sind. Natürlich bleibt es unbelassen, die Oberfläche durch mechanische oder chemische Aufrauhung zu vergrößern und damit in an sich bekannter Weise die Haftfähigkeit, insbesondere bei kleinsten Berührungsflächen, zu verbessern. Since the hardening process has not yet started until the pouring process has, is the reaction or. The adhesive properties of the casting resin have been fully retained. As a result, all more are omitted or less complicated and elaborate surface designs on those that come into contact with the resin Structural parts as they are, for. B. in the manufacture of collectors using of phenolic resins are required. Of course, it is left untouched, the surface to enlarge by mechanical or chemical roughening and thus in itself known Way to improve the adhesion, especially with the smallest contact areas.
Es hat sich herausgestellt, daß die Aushärtung völlig nachschwundfrei erfolgt, und daß eine bei Phenolharzen nicht erreichte Hitzebeständigkeit erzielt wird. Deshalb können derartige Konstruktionselemente, beispielsweise nachträglich, in ein Lötbad gebracht und hierbei Temperaturen bis zu etwa 3600 C ausgesetzt werden. Auch die Beständigkeit bei Dauertemperaturen von etwa 2500 C ist heraufgesetzt. It has been found that the hardening is completely free of post-shrinkage takes place, and that a heat resistance not achieved with phenolic resins is achieved will. Therefore, such construction elements can, for example, subsequently, placed in a solder bath and exposed to temperatures of up to about 3600 C. Resistance to permanent temperatures of around 2500 C is also increased.
Die exotherme Reaktion beim Aushärtungsprozeß verläuft ohne schädliche Auswirkung, da sie durch den hohen Füllstoffanteil nicht zum Tragen kommt. The exothermic reaction during the hardening process takes place without any harmful effects Effect, as it is not used due to the high filler content.
Hieraus ergibt sich, daß auch größere und massive Formteile, z. B. Isolatoren, die nach den bisherigen Verfahren auf Gießharzbasis nicht zu fertigen waren, nunmehr im Preßverfahren hergestellt werden können.This means that larger and massive moldings, such. B. Insulators that cannot be manufactured using the previous methods based on cast resin were, can now be produced by pressing.
Die erfindungsgemäße Verwendung von feinteiligen, härtbaren Kunstharzmassen auf Grundlage von Epoxyharzen, einer hohen Füllstoffmenge und Härtungsmitteln ist deshalb nicht nur zum Verbinden, sondern auch zum gleichzeitigen Formen selbst kompakter Konstruktionselemente, wie Kollektoren, Kohlebürstenhalter usw., im Preßverfahren besonders vorteilhaft. The use according to the invention of finely divided, curable synthetic resin compositions based on epoxy resins, a high amount of filler and curing agents therefore not only for connecting, but also for simultaneous shaping itself more compact Construction elements such as collectors, carbon brush holders, etc., in the pressing process particularly advantageous.
Claims (1)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| NL251275D NL251275A (en) | 1959-05-08 | ||
| DEM41464A DE1169114B (en) | 1959-05-08 | 1959-05-08 | Use of epoxy resins to join and / or shape structural parts |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DEM41464A DE1169114B (en) | 1959-05-08 | 1959-05-08 | Use of epoxy resins to join and / or shape structural parts |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE1169114B true DE1169114B (en) | 1964-04-30 |
Family
ID=7304027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DEM41464A Pending DE1169114B (en) | 1959-05-08 | 1959-05-08 | Use of epoxy resins to join and / or shape structural parts |
Country Status (2)
| Country | Link |
|---|---|
| DE (1) | DE1169114B (en) |
| NL (1) | NL251275A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| BE559783A (en) * | 1956-08-03 | 1900-01-01 | ||
| DE1038752B (en) * | 1956-04-04 | 1958-09-11 | Ciba Geigy | Use of an arylamine-formaldehyde resin as a curing agent for epoxy resins |
| DE1046877B (en) * | 1956-08-30 | 1958-12-18 | Bataafsche Petroleum | Heat-curable molding, coating and adhesive based on epoxy resin |
| DE1050538B (en) * | 1959-02-12 | LICENTIA Patent-Verwaltungs GmbH Hamburg | Process for the production of insulating bodies from mica for electrotechnical purposes | |
| DE1054705B (en) * | 1958-01-20 | 1959-04-09 | Leuna Werke Veb | Process for optionally multi-stage curing of epoxy resins |
-
0
- NL NL251275D patent/NL251275A/xx unknown
-
1959
- 1959-05-08 DE DEM41464A patent/DE1169114B/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE1050538B (en) * | 1959-02-12 | LICENTIA Patent-Verwaltungs GmbH Hamburg | Process for the production of insulating bodies from mica for electrotechnical purposes | |
| DE1038752B (en) * | 1956-04-04 | 1958-09-11 | Ciba Geigy | Use of an arylamine-formaldehyde resin as a curing agent for epoxy resins |
| BE559783A (en) * | 1956-08-03 | 1900-01-01 | ||
| DE1046877B (en) * | 1956-08-30 | 1958-12-18 | Bataafsche Petroleum | Heat-curable molding, coating and adhesive based on epoxy resin |
| DE1054705B (en) * | 1958-01-20 | 1959-04-09 | Leuna Werke Veb | Process for optionally multi-stage curing of epoxy resins |
Also Published As
| Publication number | Publication date |
|---|---|
| NL251275A (en) | 1900-01-01 |
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