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DE10244625A1 - Wärmeabfuhrvorrichtung - Google Patents

Wärmeabfuhrvorrichtung Download PDF

Info

Publication number
DE10244625A1
DE10244625A1 DE10244625A DE10244625A DE10244625A1 DE 10244625 A1 DE10244625 A1 DE 10244625A1 DE 10244625 A DE10244625 A DE 10244625A DE 10244625 A DE10244625 A DE 10244625A DE 10244625 A1 DE10244625 A1 DE 10244625A1
Authority
DE
Germany
Prior art keywords
heat
heat transfer
transfer body
dissipation device
heat dissipation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
DE10244625A
Other languages
German (de)
English (en)
Inventor
Chin-Kuang Luo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of DE10244625A1 publication Critical patent/DE10244625A1/de
Ceased legal-status Critical Current

Links

Classifications

    • H10W40/43—
    • H10W40/25—

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
DE10244625A 2002-07-01 2002-09-25 Wärmeabfuhrvorrichtung Ceased DE10244625A1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW91114537 2002-07-01
TW091114537 2002-07-01

Publications (1)

Publication Number Publication Date
DE10244625A1 true DE10244625A1 (de) 2004-01-22

Family

ID=21688314

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10244625A Ceased DE10244625A1 (de) 2002-07-01 2002-09-25 Wärmeabfuhrvorrichtung

Country Status (4)

Country Link
US (1) US20040000394A1 (ja)
JP (1) JP2004040069A (ja)
DE (1) DE10244625A1 (ja)
GB (1) GB2390482A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7878232B2 (en) 2004-07-09 2011-02-01 GE Lighting Solutions, LLC Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6911231B2 (en) * 1996-10-25 2005-06-28 New Qu Energy Limited Method for producing a heat transfer medium and device
KR101087861B1 (ko) * 2004-03-15 2011-11-30 엘지전자 주식회사 컴퓨터의 열원냉각장치
KR101273359B1 (ko) * 2011-05-09 2013-06-11 강준수 버퍼영역을 구비하는 열풍기
TW201339513A (zh) * 2012-03-16 2013-10-01 Hon Hai Prec Ind Co Ltd 貨櫃冷卻系統
WO2014203374A1 (ja) * 2013-06-20 2014-12-24 三菱電機株式会社 車両用の電力変換装置
WO2016116172A1 (en) * 2015-01-23 2016-07-28 Quantum Technologie (Deutschland) Gmbh Quantum medium formula and preparation process for heat transfer
CN106163154B (zh) * 2016-07-20 2019-04-09 广东网域科技有限公司 一种高强度交换机
CN107613732B (zh) * 2017-09-28 2024-06-07 深圳兴奇宏科技有限公司 机箱散热结构
CN108925107B (zh) * 2018-07-11 2020-04-10 佛山市众盈电子有限公司 一种负载和温度双控的电源装置
CN112197429A (zh) * 2020-10-10 2021-01-08 江苏九州电器有限公司 一种电热器的通风结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0910235A1 (en) * 1997-09-30 1999-04-21 Lucent Technologies Inc. Composite heat sink
US5917697A (en) * 1998-01-27 1999-06-29 Wang; Daniel CPU cooling arrangement
US6132823A (en) * 1996-10-25 2000-10-17 Qu; Yuzhi Superconducting heat transfer medium
DE20010663U1 (de) * 2000-06-15 2000-10-26 Schlomka, Georg, 21640 Neuenkirchen Kühlelement und Kühleinrichtung
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4520425A (en) * 1982-08-12 1985-05-28 Mitsubishi Denki Kabushiki Kaisha Control apparatus with improved structure for cooling circuit elements
WO1995025255A1 (en) * 1992-09-28 1995-09-21 Aavid Engineering, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
CA2310358A1 (en) * 1999-06-01 2000-12-01 Showa Aluminum Corporation Heat sinks for cpus for use in personal computers
US6410982B1 (en) * 1999-11-12 2002-06-25 Intel Corporation Heatpipesink having integrated heat pipe and heat sink
GB2364179A (en) * 2000-06-30 2002-01-16 Jern Ru Ind Co Ltd A heat dissipation device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6132823A (en) * 1996-10-25 2000-10-17 Qu; Yuzhi Superconducting heat transfer medium
EP0910235A1 (en) * 1997-09-30 1999-04-21 Lucent Technologies Inc. Composite heat sink
US5917697A (en) * 1998-01-27 1999-06-29 Wang; Daniel CPU cooling arrangement
DE20010663U1 (de) * 2000-06-15 2000-10-26 Schlomka, Georg, 21640 Neuenkirchen Kühlelement und Kühleinrichtung
US6408935B1 (en) * 2000-08-16 2002-06-25 Thermal Corp. Heat sink assembly with over-molded cooling fins

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7878232B2 (en) 2004-07-09 2011-02-01 GE Lighting Solutions, LLC Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management

Also Published As

Publication number Publication date
JP2004040069A (ja) 2004-02-05
GB2390482A (en) 2004-01-07
GB0221463D0 (en) 2002-10-23
US20040000394A1 (en) 2004-01-01

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Legal Events

Date Code Title Description
OP8 Request for examination as to paragraph 44 patent law
8131 Rejection