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DE102015201833B4 - Haltetisch und Verwendung des Haltetischs - Google Patents

Haltetisch und Verwendung des Haltetischs Download PDF

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Publication number
DE102015201833B4
DE102015201833B4 DE102015201833.4A DE102015201833A DE102015201833B4 DE 102015201833 B4 DE102015201833 B4 DE 102015201833B4 DE 102015201833 A DE102015201833 A DE 102015201833A DE 102015201833 B4 DE102015201833 B4 DE 102015201833B4
Authority
DE
Germany
Prior art keywords
wafer
reinforcing portion
annular reinforcing
holding table
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE102015201833.4A
Other languages
German (de)
English (en)
Other versions
DE102015201833A1 (de
Inventor
Saki Kimura
Toshio Tsuchiya
Takeshi Dejima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Corp filed Critical Disco Corp
Publication of DE102015201833A1 publication Critical patent/DE102015201833A1/de
Application granted granted Critical
Publication of DE102015201833B4 publication Critical patent/DE102015201833B4/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • H10P72/50—
    • H10P72/70—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
    • B23K37/04—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work
    • B23K37/0408—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass for holding or positioning work for planar work
    • H10P54/00—
    • H10P72/0428—
    • H10P72/76—
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
    • B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
    • H10P52/00—
    • H10P72/7402—
    • H10P72/7416—

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Laser Beam Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Dicing (AREA)
  • Jigs For Machine Tools (AREA)
DE102015201833.4A 2014-02-05 2015-02-03 Haltetisch und Verwendung des Haltetischs Active DE102015201833B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-020641 2014-02-05
JP2014020641A JP6317935B2 (ja) 2014-02-05 2014-02-05 保持テーブル

Publications (2)

Publication Number Publication Date
DE102015201833A1 DE102015201833A1 (de) 2015-08-06
DE102015201833B4 true DE102015201833B4 (de) 2020-10-29

Family

ID=53547291

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102015201833.4A Active DE102015201833B4 (de) 2014-02-05 2015-02-03 Haltetisch und Verwendung des Haltetischs

Country Status (7)

Country Link
JP (1) JP6317935B2 (zh)
KR (1) KR102175865B1 (zh)
CN (1) CN104816100B (zh)
DE (1) DE102015201833B4 (zh)
MY (1) MY181072A (zh)
SG (1) SG10201500647RA (zh)
TW (1) TWI637460B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6371579B2 (ja) * 2014-05-12 2018-08-08 株式会社ディスコ チャックテーブル
JP6564669B2 (ja) * 2015-10-06 2019-08-21 株式会社ディスコ デバイスの製造方法
JP6672053B2 (ja) 2016-04-18 2020-03-25 株式会社ディスコ ウェーハの加工方法
DE102016110378B4 (de) * 2016-06-06 2023-10-26 Infineon Technologies Ag Entfernen eines Verstärkungsrings von einem Wafer
DE102016111629B4 (de) * 2016-06-24 2022-10-27 Infineon Technologies Ag Verfahren zum Herstellen einer Halbleitervorrichtung
JP2018101678A (ja) * 2016-12-20 2018-06-28 株式会社ディスコ 被加工物の加工方法
JP6770443B2 (ja) 2017-01-10 2020-10-14 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体ウェハ
JP6955919B2 (ja) * 2017-07-06 2021-10-27 リンテック株式会社 除去装置および除去方法
JP7045811B2 (ja) * 2017-07-06 2022-04-01 リンテック株式会社 除去装置および除去方法
JP2019016691A (ja) * 2017-07-06 2019-01-31 リンテック株式会社 除去装置および除去方法
KR102409260B1 (ko) * 2020-05-19 2022-06-17 주식회사 에이엘티 타이코 웨이퍼 링 제거장치 및 타이코 웨이퍼 링 제거방법
KR20220048938A (ko) 2020-10-13 2022-04-20 가부시기가이샤 디스코 레이저 가공 장치
JP7807203B2 (ja) * 2020-10-13 2026-01-27 株式会社ディスコ レーザー加工装置
CN112599413B (zh) * 2021-03-04 2021-05-14 成都先进功率半导体股份有限公司 一种晶圆芯片切割方法
CN113275769B (zh) * 2021-07-22 2021-09-21 南通智谷数控机械有限公司 一种智能控制清理毛边的海绵切割机
JP7680301B2 (ja) * 2021-08-02 2025-05-20 株式会社Ｓｃｒｅｅｎホールディングス 光照射装置、および、光照射方法
JP7788242B2 (ja) * 2021-09-24 2025-12-18 株式会社ディスコ 加工装置
CN114843178B (zh) * 2022-04-28 2025-12-05 华虹半导体(无锡)有限公司 太鼓减薄晶圆的取环方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049888A (ja) * 1983-08-30 1985-03-19 Dainippon Printing Co Ltd レ−ザ−断裁装置
JP2007019461A (ja) * 2005-04-27 2007-01-25 Disco Abrasive Syst Ltd ウェーハの加工方法及びウェーハ
DE102008022745A1 (de) * 2007-05-11 2008-11-20 Disco Corp. Waferunterteilungsverfahren
JP2012023175A (ja) * 2010-07-14 2012-02-02 Disco Abrasive Syst Ltd ウェーハの加工方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61138489U (zh) * 1985-02-19 1986-08-28
US6955956B2 (en) * 2000-12-26 2005-10-18 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device
CN201067832Y (zh) * 2007-07-30 2008-06-04 深圳市大族激光科技股份有限公司 一种激光加工用的加工平台
JP5686570B2 (ja) * 2010-10-29 2015-03-18 株式会社ディスコ ウエーハ支持プレートの使用方法
JP5269260B1 (ja) * 2011-07-28 2013-08-21 三菱電機株式会社 レーザ加工装置およびレーザ加工制御装置
JP5606412B2 (ja) * 2011-08-29 2014-10-15 富士フイルム株式会社 パターン形成装置、パターン形成方法及びパターン形成基板の製造方法
CN202861627U (zh) * 2012-09-21 2013-04-10 北京工业大学 大功率激光吸收装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6049888A (ja) * 1983-08-30 1985-03-19 Dainippon Printing Co Ltd レ−ザ−断裁装置
JP2007019461A (ja) * 2005-04-27 2007-01-25 Disco Abrasive Syst Ltd ウェーハの加工方法及びウェーハ
DE102008022745A1 (de) * 2007-05-11 2008-11-20 Disco Corp. Waferunterteilungsverfahren
JP2012023175A (ja) * 2010-07-14 2012-02-02 Disco Abrasive Syst Ltd ウェーハの加工方法

Also Published As

Publication number Publication date
JP6317935B2 (ja) 2018-04-25
CN104816100A (zh) 2015-08-05
SG10201500647RA (en) 2015-09-29
TWI637460B (zh) 2018-10-01
MY181072A (en) 2020-12-17
DE102015201833A1 (de) 2015-08-06
JP2015147231A (ja) 2015-08-20
KR20150092705A (ko) 2015-08-13
TW201532182A (zh) 2015-08-16
KR102175865B1 (ko) 2020-11-06
CN104816100B (zh) 2019-09-06

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R012 Request for examination validly filed
R016 Response to examination communication
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021670000

Ipc: H01L0021683000

R018 Grant decision by examination section/examining division
R020 Patent grant now final
R079 Amendment of ipc main class

Free format text: PREVIOUS MAIN CLASS: H01L0021683000

Ipc: H10P0072700000