DE102008053596A1 - Method for cleaning wafer block, involves dissecting wafer block in individual thin wafers, where wafer block has wafers held on carrier device, where wafer block is driven in cleaning device, and wafer block is moved on transport level - Google Patents

Abstract

The method involves dissecting a wafer block in individual thin wafers. The wafer block has wafers that are held on a carrier device (17), where the wafer block is driven in a cleaning device (11). The wafer block is moved on a transport level during driving in the cleaning device. The wafer block is driven back and forth over the cleaning agent in the cleaning device which acts on the wafer block by spraying with cleaning fluid. Independent claims are included for the following: (1) a device for executing a method for cleaning a wafer block; and (2) a carrier device for a wafer block.

Description

Field of application and status of the technique

The Invention relates to a method for cleaning a wafer block, which has been sawn into individual thin wafers, an apparatus for carrying out this method and a support means for sawing into individual wafers Wafer block to keep, especially during cleaning.

It is for example from the DE 10 2008 028 213 A1 known to stick a wafer block to a so-called beam, usually a thick glass plate. The wafer block can then be grasped and moved on this beam, in particular in order to saw it into individual wafers, which then continue to stick to the beam with its upper edge. Furthermore, the sawed wafer block can then be held with the beam on a carrier device and driven for cleaning in a cleaning chamber of a cleaning device.

From the DE 10 2007 058 260 A1 or the DE 10 2006 059 810 A1 It is known to introduce a wafer block sawed into individual thin wafers on a carrier device into a cleaning device and then to spray it with cleaning liquid with fixed or pivotable nozzles around it. It is also possible to rotate the sawed wafer block about a pivot axis parallel to its longitudinal central axis, in particular if the nozzle devices are stationary. So the best possible cleaning can be done. After cleaning, the sawed wafer block is taken out of the cleaning device by means of the carrier device and further brought to untyping, ie for detaching the individual wafers from the beam and then singulating. In this cleaning method, the handling of the sawed wafer block exerts a considerable mechanical stress on the individual wafers so that they can be damaged.

Task and solution

Of the Invention is based on the object, an aforementioned method, an aforementioned device for carrying out the To provide a method and a said carrier device, with which disadvantages of the prior art can be avoided and in particular a gentle and thorough cleaning the individual wafer or the sawn wafer block is possible.

Solved This object is achieved by a method having the features of the claim 1, a device for carrying out the method with the features of claim 9 and a carrier device with the features of claim 10. Advantageous and preferred Embodiments of the invention are subject of the further claims and will be explained in more detail below. It will be some of the features described below for procedures only, Device or carrier device described. You should here regardless of both the procedure as well as the device or the carrier device apply can. The wording of the claims is by express reference to the content of the description.

It it is envisaged that the wafer block on the beam in single thin Wafer has been sawn, as is usual. The sawed wafer block or the individual wafers are held on a support means, with which the wafer block is moved to a cleaning device to be in it to be cleaned. According to the invention Wafer block when entering the cleaning device, at the Cleaning and when moving out of the cleaning device in or moved on the same transport plane, the transport plane in particular is horizontal. This means that in the vertical direction no changing forces on the wafers and above all acting on the holder in the carrier device, which reduces the risk of damage.

Of another is the sawed wafer block in the cleaning device repeatedly moved back and forth on nozzle devices past, with which at least from the side cleaning fluid applied or sprayed onto the sawn wafer block or is sprayed on. This means that cleaning fluid is not sprayed onto a substantially fixed wafer block, but the wafer block thereby at substantially fixed nozzle devices is moved past. This has the advantage that it does not only a cleaning in the so-called in-line process possible is, but also one by the movement of the sawn Waferblocks adjustable action of the cleaning fluid on the wafer block is possible. The wafer block becomes advantageous with its entire length on all Nozzle devices moved past before moving its direction reversed and moved back again.

Advantageous Although the nozzle devices are along the direction of movement of the sawed wafer block immovable. You can however, to be movable towards him, possibly also around an axis can be turned around in this direction. By a possible approach of the nozzle devices On longitudinal sides of the wafer block can cleaning fluid as accurately as possible and as small as possible Removal be applied.

In a further embodiment of the invention can be advantageously provided that the sawed wafer block is cleaned in the cleaning device both from the right and from the left or is sprayed with cleaning liquid, ie from both sides. The spray direction can advantageously be substantially horizontal, wherein also a part of the cleaning liquid can be sprayed obliquely. For this purpose, the said nozzle devices are advantageously arranged to the left and right of the wafer block or its transport path.

In Yet another embodiment of the invention, it is possible that the cleaning liquid is alternately from the left Side and then again from the right side to the sawed Wafer block is applied, in particular such that a strip with a certain width of the wafer block, for example 10 cm to 20 cm, at the same time being sprayed from one side. This can be done by offset on both sides arranged nozzle devices be reached, so this in the said 10 cm to 20 cm are offset from each other. This can be prevented that on a certain longitudinal section of the wafer block sprayed on both sides cleaning liquid which will not penetrate far enough between the individual wafers can. An offset should be at least the width of an advantageous Nozzle device or the jet of the discharged from her Be cleaning fluid.

The cleaning liquid can be offset on one side of the sawed wafer block in the vertical direction from top to bottom, preferably in each case in the direction of movement or main direction of movement of the wafer block. This then has the effect on the longitudinal area sprayed with cleaning fluid in each case, so that a sprayed area migrates from top to bottom so that the cleaning or washing out of impurities from top to bottom, that is supported by gravity, can take place. This can be achieved by staggered nozzle openings on the nozzle devices. Reference is made to the filed on the same day parallel German patent application of the same applicant with the character P 49115 EN the contents of which are incorporated herein by express reference.

When Cleaning fluid can be used in water, possibly in different qualities or mixed with a cleaning agent. This Detergent may also be added differently in time.

In Another embodiment of the invention can be provided that the sawn wafer block, advantageously including support means, is rotated at least once about its longitudinal axis, preferably around 90 °. Then the sides of the wafers are free, so to speak and are easily accessible for cleaning the intervening Areas. It is even possible that he once left around rotated 90 ° and then right again. This Turning advantageously takes place outside of a range of Spraying with cleaning fluid. By the Turning may improve the cleaning effect be achieved.

In front it is all about a wafer block turned in this way namely very beneficial if cleaning fluid is applied from above onto the rotated wafer block with substantially vertical flow direction down. This can then the wafers or their intermediate areas flow well through for cleaning. For this purpose, the cleaning device advantageously over exactly the transport path corresponding nozzle or Schwalleinrichtungen on. These nozzle or Schwalleinrich lines can Although for the sake of simplicity similar to the others the side be formed, but they are advantageous as a simple Nozzle fields formed. The cleaning fluid does not have to be applied from the top with particularly great pressure because it is being moved down by gravity anyway and also very well through the wafers over their entire width can. The cleaning liquid should be over the entire width of the wafers are applied, so that the best possible Flow is achieved.

In Yet another embodiment of the invention can be provided the sawed wafer block in the cleaning device too moisten, in particular by spraying with water or the like. from moistening devices such as nozzles odgl .. So can be prevented that in a very slow driving through the Waferblocks by the cleaning device certain areas, especially end areas, dry before coming back with cleaning fluid be sprayed, and thus possibly still Do not re-dry contaminants that are not completely removed. This Moistening can be advantageous with a small distance to the nozzle devices take place, for example, directly behind it, at least in the transport direction, and extend to near the end of the cleaning device. So can a wafer block about the essential part of his Length be moistened.

The cleaning device thus has a transport path extending in the horizontal plane for the wafer block on or for the carrier device on which the wafer block is held. The transport path can be formed for example by a roller conveyor with driven rollers. The support means may be formed so that, although the sawed-wafer block with overhead beam there Rin is attached, it projects beyond this down so that the support means can be easily placed on the roller conveyor and then transported or moved.

The inventive carrier device has a frame running above the wafer block, when the wafer block is attached to the support means is. Furthermore, it has a frame below the wafer block on, wherein advantageously the two frames are parallel to each other or have the same distance. They are on the front of the Carrier device in front of and behind the wafer block with each other connected and form a kind of cage or a frame for a cage for the wafer block. At least the upper frame is advantageously open and formed circumferentially. Thus, in the open area, for example, a kind of side member or the like. be provided, which spans the open frame. He may be trained to have the wafer block hung from him or can be attached. Furthermore, by such a open frame the overall weight will be kept low. Especially Advantageous embodiment of the invention is the lower frame formed substantially corresponding to the upper frame.

One Carrier or the carrier device for the wafer block can be laterally in front of embodiment of the invention the side surfaces of the wafer block extending rods or the like. exhibit. You can odgl at the end plates. to the Be fixed end faces of the support means and this stiffen and in particular form a kind of cage. Similar Rods can run underneath the wafer block as Carrying bars, he can advantageously even rest on it for support. On top of that, the wafers can lie on after unsticking, so that they continue to be sort of a stack of individual pieces Wafern in the carrier device are. That's the way they can be relatively easy to be brought to a subsequent separation.

The can laterally next to the wafer block extending rods as a holding device for the wafer block or the individual sawed wafer be formed, for example, as a brush-like Holding device or brush rods. You can For example, be so movable, in particular special rotatable that they either have a certain distance to the wafer block or can be brought into an engaged position with the wafers. Are these holders brush rods, so can their fine bristles in spaces between individual wafers intervention.

The Carrier device is advantageously designed so that they overlap each other on each side of the wafer block survives him. So above all is the above lying Transport of the wafer block possible by simply the carrier device, for example on a roller conveyor or the like. is placed. Furthermore, the carrier device should be formed so that at least the said end plates laterally do not survive over the wafer block or not wider than the wafer block. Only mounts for the said lateral support rods or the like. can survive laterally, but should be as narrow as possible. This can, as follows from the figures it is still clear that nozzle heads, where the carrier device along with wafer block moves past is as close to the side surfaces of the Waferblocks can reach, without the front plates or the carrier device to stay or to be disturbed by this. Above and below can the Face plates easily project beyond the wafer block, there there Yes, the frames are also provided on which the carrier device rests. The frames, in turn, can be wider than the ones Face plates and the wafer block, since they are so far above or under the wafer block are the nozzle heads fit in between so as not to be disturbed.

These and other features are excluded from the claims also from the description and the drawings, wherein the individual features in each case alone or to several in the form of subcombination in one embodiment of the invention and in other fields be realized and advantageous as well as for protectable versions represent protection here becomes.

The Subdivision of the application into individual sections and intermediate headings do not limit the statements made thereunder to their universality.

Brief description of the drawings

embodiments The invention are shown schematically in the drawings and will be explained in more detail below. In the drawings demonstrate:

1 a top view of a part of a cleaning device according to the invention with a wafer block on a transport path between nozzle devices,

2 a side view of an entire cleaning device according to the invention with cleaning and Entklebung and

3 to 6 various perspective views of the wafer block in a carrier device according to the invention including nozzle heads of Nozzle devices.

Detailed description the embodiments

In 1 is a cleaning device 11 in a section in top view, showing a transport path 13 with a variety of roles 15 has, which form a roller conveyor. The rollers are advantageously driven individually or in total. The cleaning device 11 advantageously has a surrounding chamber, as in 2 is shown. This will be explained in more detail.

On the transport track 13 there is a cage-like support means 17 with a wafer block in it, which is not visible in the plan view. This will be discussed in more detail later. Essentially, however, is the carrier device 17 cage-like and encloses the wafer block.

It can be seen as the left of the transport path 13 two nozzle devices 30a and to the right of it two nozzle devices 30b are provided. They each have retaining arms 31a and 31b on, at the front end in each case a nozzle head 33a respectively. 33b is arranged. It can be seen, which will be explained in more detail below, that the nozzle heads 33 very close to the side of the carrier device 17 moved with wafer block in it or respectively the lower nozzle head 33a and 33b even in the carrier device 17 reaches into it.

With the arrow T is the main direction of movement of the carrier device 17 including wafer block through the cleaning device 11 shown. This means that the carrier device 17 on the transport track 13 or the roles 15 Although several times with their complete length on the nozzle heads 33 is passed, so to speak, is driven back and forth. Usually, however, it is provided that they are in 1 is retracted from below and pulled out the top, so in the direction of arrow T at least once more the nozzle heads 33 happens the other way around.

In 2 is a side view of an entire cleaning device 11 not only cleaning a sawed wafer block 40 takes place, but also the previously described Entklebung, so the release of the individual sawn wafer from the beam or the side member 41 to which they are still stuck. The cleaning device 11 has a retractable module on the far left 43 on, with the carrier devices 17 including wafer blocks 40 in it to the cleaning device 11 brought in and then retracted. It can be seen that the retraction module 43 roll 15 that is at the height of the transport path 13 with the other roles 15 are. Again, so can the above-described, consistently horizontal transport of the wafer blocks 40 be performed.

The cleaning module 45 is, as can be seen and easily imagined, formed as a kind of closed or closable chamber. This can be revealed by flaps opening from the side, sliding doors or the like. be achieved.

It can be seen that the top view 1 the interior of the cleaning module, so to speak 45 shows. The nozzle devices 30 with the nozzle heads 33 are approximately in the middle of the length of the cleaning module 45 arranged. It can be seen as a carrier device 17 including wafer block 40 with their full length at the nozzle devices 30 can be moved past and thereby lie completely outside the range of spraying with cleaning fluid.

For example, along the in 2 shown, the right end position can be arranged an aforementioned moistening, which is not shown here, so over the distance from the nozzle devices 30 almost to the right end. A moistening device can be designed as a simple spraying devices. Above all, it can cause the wafer block 40 outside the nozzle devices 30 so to speak, does not dry, in particular that the contaminants adhering to it do not start to dry and adhere again.

Not shown but still easy to implement is the inventive reciprocating the carrier device 17 on the rollers 15 is located at the nozzle devices 30 past. So can the nozzle devices 30 for example, be passed three or five times. Usually, the cleaning module 45 closed so that no cleaning liquid spouts out.

Not shown but easy to imagine in 1 an aforementioned further nozzle device over the transport path of the wafer block 40 be provided to discharge cleaning liquid over this in the position shown, when the wafer block including Trägereinrich device 17 rotated by 90 °. This cleaning liquid can then flow freely and favored by gravity, the spaces between the individual wafers and clean or flooding impurities down. Since the full width of the wafers is reached and flowed through by the cleaning fluid in unhindered motion, good cleaning is possible.

For example, a cycle time for cleaning may be about 15 minutes. If this is not enough for a desired throughput, there are several cleaning modules 45 next to each other or to provide one behind the other.

Right next to the cleaning module 45 closes in direction of movement T directly a detackifying module 47 at. This will be described only briefly, since it is described in detail in the German patent application filed on the same day by the same applicant with the character P 49114 EN the contents of which are incorporated herein by express reference.

The decoupling module 47 is similarly constructed like a chamber and in turn has the transport path 13 with roles 15 on. Furthermore, the detackifying module 47 two dismounting chambers 51a and 51b on, which are arranged one behind the other in the direction of movement T and also behind one another by a carrier device 17 including sawn wafer block 40 be approached. The decompression chambers 51a and 51b can be formed substantially the same and are accessible by movable, in particular liftable, side wall parts in the direction of movement T. A carrier device 17 including wafer block 40 So it gets into a decompression chamber 51 moved into it, then this is closed and then the Entklebevorgang begins.

After the detox module 47 becomes the carrier device 17 due to their cage-like construction with the brush rods 25 and the lower carrying bars 28 on which the of the side member 41 dissolved individual wafers can rest, even if they still simultaneously through the brush rods 25 moved out onto an extension module 49 , Again, this has the roles 15 in the transport track 13 on. From there, the carrier device 17 be moved with the individual wafers on, for example, in a per se known device in which the wafers are sorted, so to speak, or be removed individually from the formed wafer stack for further handling and processing.

Further details about the carrier device 17 are from the 3 to 6 to see. The carrier device 17 contains, so to speak, the wafer block in its interior 40 that with a top on a standard wide side member 41 , also called beam, is attached. Advantageously, the beam is a glass plate and the attachment is done by sticking. For this purpose, for example, the German patent application DE 10 2008 028 213 A1 the same applicant.

The side member 41 is on a retaining plate 19 attached. This holding plate in turn is in an upper surrounding frame 21a held. The upper frame surrounds 21 the holding plate 19 and thus stands laterally far over side surfaces of the wafer block 40 above.

The upper frame 21a has two end plates 23a and 23b on, with whom he is firmly connected. These face plates do not protrude beyond the side surface of the wafer block 40 above. With their lower area they are with a lower frame 23b firmly connected, the one out 3 can be seen, well below the wafer block 40 runs. Similar to the upper frame 21a is the bottom frame 23b circumferentially formed with a large opening.

By frame 21a and 21b as well as face plates 23a and 23b is the wafer block 40 not only held firmly, but also surrounded and protected on all sides. In particular, this carrier device 17 very easy on the transport track 13 with the roles 15 be placed and transported, the wafer block 40 kept in his cage so to speak, easily accessible.

Furthermore, it can still be seen that of a face plate 23a to the other face plate 23b on the sides two elongated brush rods 25 are provided. The brush rods 25 have bristles 26 on, which have a length of a few centimeters and in the in 6 shown position upwards. Here are the brush rods 25 rotatably arranged about its longitudinal axis. Are they rotated in the direction of rotation R, ie in 6 clockwise, so grab the bristles 26 into the side surface of the wafer block 40 or in the narrow spaces between the individual wafers into which the wafer block 40 sawn. Similar brush rods are from the DE 10 2005 028 112 A1 to which reference is made and the content of which is incorporated herein by express reference. This twisting of the brush rods 25 may after inserting the wafer block 40 in the carrier device 17 manually or automatically. Even if only a brush rod 25 explicitly with bristles 26 is shown, this may, for example, in 4 , on all brush bars 25 be provided, alternatively only to some.

Below the wafer block are two carrying bars 28 coming from the front plates 23 are held. On them are the sawed wafers as described above, especially after detackifying. These can be the carrying rods 28 have a suitably designed surface, for example, gummed or soft anyway.

From the front view in 5 is also to realize that the framework 21a and 21b are the same width. This makes it possible, during the cleaning process, the carrier device 17 to grab and 90 ° in one direction or the other to turn its longitudinal axis and then back to the transport path 13 sit up. This makes it possible, so to speak, the direction in the cleaning liquid from the nozzle devices 30 on the wafer block 40 is sprayed, change. In an advantageous embodiment, the width of the entire transport device 17 doing with respect to the frame 21 similar to the height, so regardless of how the carrier device 17 including wafer block on the conveyor 13 is laid, the total width is not too different.

For a more detailed description of the nozzle heads 33 will be on the 6 to 8th the aforementioned P 49115 EN by the same Applicant and the contents of which are incorporated herein by express reference.

QUOTES INCLUDE IN THE DESCRIPTION

This list The documents listed by the applicant have been automated generated and is solely for better information recorded by the reader. The list is not part of the German Patent or utility model application. The DPMA takes over no liability for any errors or omissions.

Cited patent literature

• DE 102008028213 A1 [0002, 0041]
• - DE 102007058260 A1 [0003]
• - DE 102006059810 A1 [0003]
• - DE 49115 [0011, 0048]
• - DE 49114 [0038]
• DE 102005028112 A1 [0045]

Claims (15)

A method for cleaning a wafer block which has been sawed into individual thin wafers, wherein the wafer block is held with the wafers on a carrier device, wherein the wafer block is moved into a cleaning device for cleaning therein, characterized in that the wafer block when entering the cleaning device , is moved in the cleaning and extension on the same transport plane, wherein the wafer block in the cleaning device repeatedly back and forth past cleaning agents acting at least from the side of the wafer block by applying or spraying with cleaning liquid. Method according to claim 1, characterized in that that the cleaning agent or individual nozzle devices thereof stationary along the direction of movement of the wafer block are held, preferably the cleaning agent towards the wafer block are to be moved or moved. Method according to claim 1 or 2, characterized that cleaning fluid by means of nozzle devices the detergent from the left and from the right side of the wafer block is brought. Method according to claim 3, characterized that the cleaning liquid is alternately offset from is brought to the left and right of the wafer block, preferably arranged an offset between the left and right Nozzle devices at least the longitudinal extent a nozzle device in the direction of movement. Method according to one of the preceding claims, characterized in that applying the cleaning liquid on the side of the wafer block in the vertical direction from the top to offset along the direction of movement of the wafer block, preferably along the main direction of movement of the wafer block through the cleaning device from top to bottom along this Main movement direction offset. Method according to one of the preceding claims, characterized in that the wafer block including carrier means during the cleaning process at least once around its longitudinal axis is rotated, preferably by 90 °, in particular once turned both in one direction by 90 ° as well as in the other direction. Method according to Claim 6, characterized that cleaning fluid from the top of the rotated wafer block is applied with a substantially vertical flow direction downward. Method according to one of the preceding claims, characterized in that the wafer block in the cleaning device is moistened, preferably with a small distance to the cleaning agents, in particular, the cleaning agent is approximately in the middle of the Cleaning device are provided and a humidification up to the end regions of the cleaning device or a cleaning chamber he follows. Apparatus for carrying out the method according to one of the preceding claims, characterized the device has a transport path running in a horizontal plane for the wafer block including carrier device, wherein the transport path passes through a cleaning device, in the cleaning agent with nozzle devices for cleaning of the wafer block by spraying with cleaning fluid or water are arranged. Carrier device for a wafer block for carrying out the method according to one of the claims 1 to 8, characterized in that the carrier device a frame above the wafer block and a frame below the wafer block, with the frames at the front ends and are connected behind the wafer block and the top one Frame is adapted to attach the wafer block to him. Support device according to claim 10, characterized characterized in that at least the upper frame in the manner of an open circumferential frame is formed, at least along the longitudinal side dominates the wafer block, in particular this also towering in length. Support device according to claim 11, characterized characterized in that the lower frame corresponding to the upper frame is trained. Support device according to one of claims 10 to 12, characterized in that the upper frame has a side rail has, preferably along its central longitudinal axis, which spans the open frame, with the side rail is designed to hang the wafer block on him or to fix. Carrier device according to one of claims 10 to 13, characterized in that between the upper frame and the lower frame on the sides of the wafer block at least one longitudinal holding device for the wafer block or the sawn wafer is provided, in particular a brush-like holding device, which is preferably engageable from a position spaced from the wafer block in an engaged position, wherein in the engaged position bristles of the brush engage in spaces between individual wafers. Support device according to one of claims 10 to 14, characterized in that in the lower region of the carrier device provided at least one longitudinal support rod is below the suspended wafer block and above the lower frame, wherein preferably the support rod between a front face plate and a rear face plate extends.