DE102005035809A1 - Electronic module is formed by mounting of wired sensor onto a ceramic circuit plate carrying a control module - Google Patents

Abstract

The electronic sensor (1) is mounted on a frame (2)and has wire leads (8) that connect with a ceramic circuit plate (3). The connection is provided by a conductive adhesive (7). The sensor connects via surface tracks (5) with a mounted control unit (4).

Description

The The invention relates to an electronic component according to the preamble of claim 1 and a method for its preparation according to the Preamble of claim 7.

ceramic circuit support find in electronics everywhere There application, where their electrical insulating property, their temperature resistance and their mechanical stability are in demand. They are usually made of aluminum oxide or aluminum nitride. On the circuit board are, for example, produced by screen printing printed conductors integrated. The on the carrier arranged circuits comprise active components, such as power modules, passive components, such as resistors or capacitors, and usually a control unit for signal acquisition, evaluation and control.

The modern technology places high demands on compact designs, thus requires a high degree of integration, and low production costs, something as possible high degree of automation means. This is for example with so-called integrated ones Shift circuits the case. The different, preferably passive, components in layers in a manufacturing process the circuit carrier applied. Circuits with additional, Non-layered components are also called Hybrid circuits. Such devices can be packaged, unhoused or passive components or be processors. These so-called hybrid components be by soldering or wire bonding electrically contacted and / or mechanically fixed.

electromechanical In particular, actuators convert electrical energy into mechanical energy Energy around. Sensors supply signals to a control unit, this one evaluates the signals and controls the movement of the actuator. at compact actuators are sensors and control unit in a common actuator housing integrated. Such an actuator may be a Tauchspulenaktor when example for a translationally acting actuator having a locking mechanism drives. As an example for a rotationally acting actuator is an electric motor led, the Shaft of ignition distributor driving in a motor vehicle.

to Determination and regulation of the actual position of the actuator are in both make usually used components such as sensors. The sensation can at the output, z. B. at a downstream transmission, or by utilization of the sensor signals of the integrated in the electric motor, needed for commutation Sensors.

at The use of the sensors integrated in the actuator is not additional Sensing example of an additional signal generator more necessary. The disadvantage here is that the sensors and the Control electronics locally are separated from each other and the production of the electrical connection between both with a considerable additional expense and material accompanied.

cost reducing and space-saving would be Affect a mounting of the sensor on the circuit board, if there Actual position of the actuator can also be determined. However, many will Electronic components, for example sensors with special properties, like measuring the magnetic flux density, only as wired Components offered. A special version for the hybrid equipment is too expensive, or is not even from the electronics suppliers offered.

It is therefore an object of the present invention, an electronic To create a component in which leaded components space-saving are arranged and which is also inexpensive to produce.

These The object is achieved by an electronic component having the features of claim 1.

The electronic according to the invention Component comprises at least one wired electronic component and at least one control unit on a ceramic circuit carrier. This is according to the invention Component connected by means of a component recording with the circuit carrier.

The Component recording is preferably adhered to the circuit substrate. In particular, as an adhesive for making the connection between the component holder and the circuit carrier provided an epoxy adhesive. In contrast to a silicone adhesive occur in epoxy Harden no adverse outgassing of various volatile constituents, which could negatively affect subsequent bond processes. Preferably is the component recording on a conductor path-free area of the circuit carrier glued. Will for space reasons the component recording on a provided with a conductor track Glued area, so make sure that an electrically insulating Epoxy adhesive is used.

Advantageously, the device is through the component holder fixed on the circuit board and simultaneously positioned in the X, Y and Z direction.

Especially the circuit carrier has at least a conductor track, wherein the component by means of conductive adhesive with the conductor is electrically connected. About the track is that Component also electrically connected to the control unit.

to Making the connection between the wired component and the conductor has become an electrically conductive epoxy adhesive, in front all a silver filled Epoxy adhesive proved to be particularly suitable.

One Another object of the present invention is a method for producing an electronic component described above to accomplish.

These The object is achieved by a method having the features of claim 7.

At the inventive method for producing an electronic component with at least one wired electronic component and at least one control unit on a ceramic circuit board, the device is in introduced a component recording.

On the circuit carrier with at least one conductor track is preferably for connecting the component recording with the circuit board at appropriate locations applied an adhesive. In the same operation is preferably conductive adhesive for Connecting the device to the track on the designated Places applied.

With Advantage, the component recording is placed with the device on the circuit board, wherein the component recording on the circuit carrier and at least one component legs of the wired component the corresponding trace is glued. This is also the electrical Connection made between the device and the control unit.

Especially the component is fixed during insertion into the component holder and simultaneously with the connection of the component holder with the circuit support on the circuit carrier positioned in the X, Y and Z directions.

By the direct connection of the wired electronic components to the ceramic circuit carrier Can be used on constructive parts such as intermediate circuit board, plastic carrier overmolded conductor tracks and injected sensors as well as contacting modules like plugs, showing the contact between sensor and circuit carrier or Establish control unit, be waived.

Of the Space occupied by the electronic component becomes more compact, the manufacturing process easier and less expensive. In addition, the Level control of the sensor to be sensed part on the Component recording directly on the circuit board.

In The following description describes the features and details the invention in conjunction with the accompanying drawings with reference to embodiments explained in more detail. there are features and relationships described in individual variants in principle all embodiments transferable. In the drawings show:

1 the state of the art;

2 a longitudinal section through the electronic component;

3 an exploded view of the wired electronic component with appropriate component recording;

4 a three-dimensional view of the built-in device on the circuit board.

1 shows the arrangement of a sensor as a wired electronic component 1 on an actuator as it usually occurs in the prior art. The speed of a motor shaft is sensed here 11 a not shown electric motor via a fixed to the motor shaft 11 connected magnets 10 , As storage 12 the motor shaft 10 For example, serves a conventional ball bearing. The sensor or the component 1 is on a fixed mounted in the electric motor separate circuit board 9 soldered.

This circuit board 9 includes only the sensor 1 , An electrical interface, not shown, to the control unit, for example, a soldered connector, and also not shown traces to the sensor 1 as electrical connection of the same to the plug. The control unit, which is the one from the sensor 1 Evaluates sent signals and controls the motor, usually represents its own assembly.

2 shows a longitudinal section through the electronic component according to the invention. The electronic component comprises a wired electronic nice component 1 and at least one control unit 4 on a ceramic circuit carrier 3 , The tracks 5 For the electrical connection between the individual components, in particular, they are already printed on the circuit carrier before the components are applied. Preferably, the device sits 1 in a dedicated component holder 2 , The wired electronic component 1 may for example be a Hall sensor or a device for producing the electrical contact between an electric motor, not shown, of an actuator and its supply.

The component holder 2 is preferably with the help of an adhesive 7 in particular on a conductor-path-free region of the circuit carrier 3 glued. The use of an epoxy adhesive has proven to be particularly advantageous since it does not degrade during curing and thus does not impair the quality of subsequent bonding or soldering processes due to possible contamination. Will the component recording 2 for reasons of space, not on a conductor-path-free area of the circuit carrier 3 Of course, an electrically insulating epoxy adhesive must be used.

In particular, the component 1 with the gluing of the component holder 2 positioned on the circuit carrier in the X, Y and Z directions. This is in the further application of the electronic component of great advantage, since in the sensing of the actual position of an actuator, the position of the device 1 , For example, sensor, decisive for the actuator.

At least one component leg 8th of the wired component 1 is preferably with the conductive adhesive 6 with the associated trace 5 bonded. Thus, the device 1 with the control unit 4 over the track 5 electrically connected.

For this Application is an electrically conductive epoxy adhesive particularly suitable. Advantageously, a silver-filled epoxy adhesive is because of his particularly high electrical conductivity.

3 shows the component holder 2 and the wired component 1 in a perspective exploded view. After the device 1 in the recording 2 is introduced, it can optionally be additionally equipped with a cover 13 , which is preferably connected by means of a latching mechanism with the receptacle, are fixed in the XY plane. This additional fixation can also be realized by gluing.

4 shows an example of component recording 2 , of the component 1 and the cover 13 in the assembled state. The component holder 2 is here with the glue 7 to a conductor-free region of the circuit substrate 3 glued. The wired component 1 is with the conductive adhesive 6 with the corresponding trace 5 on the circuit carrier 3 electrically connected. At the other end of the track 5 is not shown in particular the control unit 4 for example via bonding wires with the conductor track 5 electrically contacted or connected.

A soldering of the component holder 2 and the component 1 instead of the gluing process would not be well suited at this point, since the soldering process, the bonding surfaces would be contaminated, and so the subsequent subsequent bonding process would be adversely affected. Bonding the bonding surfaces before soldering, and subsequently removing the bond, would be too costly.

In summary, the electronic component according to the invention provides a space-saving and cost-saving arrangement of a wired component 1 , in particular a sensor, and a control unit 4 on a ceramic circuit carrier 3 dar. The method of manufacturing the device 1 is designed to save material and can be advantageously carried out fully automatically, which also has a cost-reducing effect.

1

leaded electronic component,

for example sensor

2

component receptacle

3

ceramic circuit support

4

control unit

5

conductor path

6

conductive adhesive

7

Glue on component pickup

8th

component leads

9

circuit board

10

magnet

11

motor shaft of the actor

12

storage the motor shaft

13

cover of the component

Claims (10)

Electronic component with at least one wired electronic component ( 1 ) and at least one control unit ( 4 ) on a ceramic circuit carrier ( 3 ), characterized in that the component ( 1 ) by means of a component recording ( 2 ) with the circuit carrier ( 3 ) connected is. Electronic component according to Claim 1, characterized in that the component receptacle me ( 2 ) on the circuit carrier ( 3 ) is glued. Electronic component according to claim 2, characterized in that as an adhesive ( 7 ) for establishing the connection between the component receptacle ( 2 ) and the circuit carrier ( 3 ) An epoxy adhesive is provided. Electronic component according to one of Claims 1 to 3, characterized in that the component ( 1 ) in the X, Y and Z directions through the component receptacle ( 2 ) is positioned. Electronic component according to one of Claims 1 to 4, characterized in that the circuit carrier ( 3 ) at least one conductor track ( 5 ), wherein the component ( 1 ) by means of conductive adhesive ( 6 ) with the conductor track ( 5 ) and via the conductor track ( 5 ) with the control unit ( 4 ) is electrically connected. Electronic component according to claim 5, characterized in that the conductive adhesive ( 6 ) for establishing the connection between the component ( 1 ) and the track ( 5 ) is an electrically conductive epoxy adhesive. Method for producing an electronic component with at least one wired electronic component ( 1 ) and at least one control unit ( 4 ) on a ceramic circuit carrier ( 3 ), characterized in that the component ( 1 ) in a component recording ( 2 ) is introduced. Method according to Claim 7, characterized in that the circuit carrier ( 3 ) at least one conductor track ( 5 ), with glue ( 6 . 7 ) for connecting the component receptacle ( 2 ) with the circuit carrier ( 3 ) and for connecting the component ( 1 ) with the conductor track ( 5 ) on the corresponding points of the circuit carrier ( 3 ) and the track ( 5 ) is applied. Method according to claim 7 or 8, characterized in that the component receptacle ( 2 ) with glue ( 7 ) on the circuit carrier ( 3 ) and at the same time at least one component leg ( 8th ) of the component ( 1 ) with conductive adhesive ( 6 ) on the track ( 5 ) is glued. Method according to one of the preceding claims, characterized in that the component ( 1 ) when introduced into the component receptacle ( 2 ) simultaneously on the circuit carrier ( 3 ) is positioned in the X, Y and Z directions.