DE102005014836A1 - Verfahren und Mittel zum Isolieren der Elemente eines Sensorarrays - Google Patents
Verfahren und Mittel zum Isolieren der Elemente eines Sensorarrays Download PDFInfo
- Publication number
- DE102005014836A1 DE102005014836A1 DE102005014836A DE102005014836A DE102005014836A1 DE 102005014836 A1 DE102005014836 A1 DE 102005014836A1 DE 102005014836 A DE102005014836 A DE 102005014836A DE 102005014836 A DE102005014836 A DE 102005014836A DE 102005014836 A1 DE102005014836 A1 DE 102005014836A1
- Authority
- DE
- Germany
- Prior art keywords
- energy
- sensor
- substrate
- prorogation
- obstacle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
- 239000000758 substrate Substances 0.000 title abstract 4
- 239000000463 material Substances 0.000 title abstract 3
- 230000004888 barrier function Effects 0.000 title abstract 2
- 230000008878 coupling Effects 0.000 title abstract 2
- 238000010168 coupling process Methods 0.000 title abstract 2
- 238000005859 coupling reaction Methods 0.000 title abstract 2
- 238000012285 ultrasound imaging Methods 0.000 title 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B5/00—Cleaning by methods involving the use of air flow or gas flow
- B08B5/02—Cleaning by the force of jets, e.g. blowing-out cavities
- B08B5/023—Cleaning travelling work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0292—Electrostatic transducers, e.g. electret-type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/16—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by purification, e.g. by filtering; by sterilisation; by ozonisation
- F24F3/167—Clean rooms, i.e. enclosed spaces in which a uniform flow of filtered air is distributed
-
- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
- G10K11/002—Devices for damping, suppressing, obstructing or conducting sound in acoustic devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Multimedia (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- General Engineering & Computer Science (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Abstract
Eine Vorrichtung, die ein Array von Sensoren aufweist, das auf einem Substrat mit einer Halbleiteroberfläche aufgebaut oder in dieses eingebaut ist, und Mittel zum Isolieren jedes Sensorelementes gegenüber seinen Nachbarn werden geschaffen. In dem Fall, dass die Sensoren Ultraschall-Transducerelemente sind, wird eine akustische Isolierung in Gestalt von Gräben zwischen benachbarten Transducerelementen zum Verringern des akustischen Übersprechens geschaffen. Die Gräben können mit einem akustisch dämpfenden Material gefüllt sein. Zwischen benachbarten Transducerelementen wird zur Verringerung des elektrischen Übersprechens eine elektrische Isolierung in Gestalt von Halbleiterübergängen geschaffen. In einem Beispiel werden entgegengerichtete pn-Dioden durch Ionenimplantation in Zonen gebildet, die zwischen benachbarten Transducerelementen angeordnet sind. Diese Art der Isolierung kann einzeln oder zusammen angewandt werden.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/814,956 US20040190377A1 (en) | 2003-03-06 | 2004-03-31 | Method and means for isolating elements of a sensor array |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE102005014836A1 true DE102005014836A1 (de) | 2005-10-20 |
Family
ID=35034299
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE102005014836A Ceased DE102005014836A1 (de) | 2004-03-31 | 2005-03-30 | Verfahren und Mittel zum Isolieren der Elemente eines Sensorarrays |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20040190377A1 (de) |
| JP (1) | JP4868758B2 (de) |
| KR (1) | KR20060044973A (de) |
| CN (1) | CN1677706A (de) |
| DE (1) | DE102005014836A1 (de) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2091265A4 (de) * | 2006-11-08 | 2010-12-15 | Hitachi Medical Corp | Ultraschallsonde und ultrasonografische einrichtung damit |
| DE102012220811A1 (de) * | 2012-11-14 | 2014-05-15 | Intelligendt Systems & Services Gmbh | Vorrichtung und Verfahren zur Ultraschallprüfung eines Bauteils mit einer Einschlüsse oder Hohlräume aufweisenden Zwischenlage |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8576474B2 (en) | 2004-08-14 | 2013-11-05 | Fusao Ishii | MEMS devices with an etch stop layer |
| EP1907133A4 (de) * | 2005-06-17 | 2012-05-09 | Kolo Technologies Inc | Mikro-elektro-mechanischer wandler mit isolierverlängerung |
| US7514851B2 (en) * | 2005-07-13 | 2009-04-07 | Siemens Medical Solutions Usa, Inc. | Curved capacitive membrane ultrasound transducer array |
| CN104646260B (zh) * | 2005-10-18 | 2018-08-28 | 株式会社日立制作所 | 超声波探头 |
| JP4755500B2 (ja) * | 2006-01-26 | 2011-08-24 | 株式会社日立製作所 | 超音波探触子 |
| JP4804961B2 (ja) * | 2006-03-03 | 2011-11-02 | オリンパスメディカルシステムズ株式会社 | 超音波振動子及びそれを搭載した体腔内超音波診断装置 |
| JP4842010B2 (ja) * | 2006-05-09 | 2011-12-21 | 株式会社日立メディコ | 超音波探触子及び超音波診断装置 |
| JP4776691B2 (ja) * | 2006-09-28 | 2011-09-21 | 株式会社日立製作所 | 超音波探触子及び超音波撮像装置 |
| JP4271252B2 (ja) * | 2006-10-12 | 2009-06-03 | オリンパスメディカルシステムズ株式会社 | 超音波振動子セル、超音波振動子エレメント、超音波振動子アレイ及び超音波診断装置 |
| JP5269307B2 (ja) * | 2006-12-14 | 2013-08-21 | 株式会社日立メディコ | 超音波探触子及び超音波診断装置 |
| EP2130495A4 (de) * | 2007-03-20 | 2012-03-28 | Hitachi Medical Corp | Ultraschallsonde und verfahren zu ihrer herstellung und ultraschall-diagnosegerät |
| US20080242979A1 (en) * | 2007-03-30 | 2008-10-02 | Rayette Ann Fisher | Combined X-ray detector and ultrasound imager |
| JP5282305B2 (ja) * | 2007-05-10 | 2013-09-04 | コニカミノルタ株式会社 | 超音波探触子および超音波診断装置 |
| JP5438983B2 (ja) * | 2008-02-08 | 2014-03-12 | 株式会社東芝 | 超音波プローブ及び超音波診断装置 |
| JP5350092B2 (ja) * | 2008-06-24 | 2013-11-27 | キヤノン株式会社 | 機械電気変換素子及び機械電気変換装置の製造方法 |
| JP5594986B2 (ja) * | 2008-06-24 | 2014-09-24 | キヤノン株式会社 | 機械電気変換素子及び機械電気変換装置の製造方法 |
| US9173047B2 (en) | 2008-09-18 | 2015-10-27 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
| WO2010033867A1 (en) * | 2008-09-18 | 2010-03-25 | Visualsonics Inc. | Methods for acquisition and display in ultrasound imaging |
| US9184369B2 (en) | 2008-09-18 | 2015-11-10 | Fujifilm Sonosite, Inc. | Methods for manufacturing ultrasound transducers and other components |
| JP5409251B2 (ja) * | 2008-11-19 | 2014-02-05 | キヤノン株式会社 | 電気機械変換装置およびその製造方法 |
| US20100168582A1 (en) * | 2008-12-29 | 2010-07-01 | Boston Scientific Scimed, Inc. | High frequency transducers and methods of making the transducers |
| US10129656B2 (en) * | 2009-01-30 | 2018-11-13 | Avago Technologies International Sales Pte. Limited | Active temperature control of piezoelectric membrane-based micro-electromechanical devices |
| JP5342005B2 (ja) * | 2009-09-17 | 2013-11-13 | 株式会社日立メディコ | 超音波探触子及び超音波撮像装置 |
| CN101719368B (zh) * | 2009-11-04 | 2011-12-07 | 中国科学院声学研究所 | 高声强定向声波发射装置 |
| US9138203B2 (en) | 2010-02-26 | 2015-09-22 | Hitachi Medical Corporation | Ultrasonic probe and ultrasonic imaging apparatus using the same |
| JP2011259371A (ja) * | 2010-06-11 | 2011-12-22 | Canon Inc | 容量型電気機械変換装置の製造方法 |
| CN102573654B (zh) | 2010-08-06 | 2014-12-10 | 奥林巴斯医疗株式会社 | 超声波诊断装置 |
| US8409102B2 (en) | 2010-08-31 | 2013-04-02 | General Electric Company | Multi-focus ultrasound system and method |
| JP5961246B2 (ja) * | 2011-03-22 | 2016-08-02 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 基板に対して抑制された音響結合を持つ超音波cmut |
| JP5807226B2 (ja) * | 2011-06-27 | 2015-11-10 | 株式会社Ingen MSL | 振動素子及び振動素子の製造方法 |
| US9530955B2 (en) | 2011-11-18 | 2016-12-27 | Acist Medical Systems, Inc. | Ultrasound transducer and processing methods thereof |
| CN102420286A (zh) * | 2011-12-09 | 2012-04-18 | 中国船舶重工集团公司第七一五研究所 | 一种多层复合结构压电元器件及其制备方法 |
| US8541853B1 (en) * | 2012-03-22 | 2013-09-24 | Texas Instruments Incorporated | High frequency CMUT |
| US9061320B2 (en) * | 2012-05-01 | 2015-06-23 | Fujifilm Dimatix, Inc. | Ultra wide bandwidth piezoelectric transducer arrays |
| US9454954B2 (en) | 2012-05-01 | 2016-09-27 | Fujifilm Dimatix, Inc. | Ultra wide bandwidth transducer with dual electrode |
| US8767512B2 (en) | 2012-05-01 | 2014-07-01 | Fujifilm Dimatix, Inc. | Multi-frequency ultra wide bandwidth transducer |
| KR20140033992A (ko) * | 2012-09-11 | 2014-03-19 | 삼성전자주식회사 | 초음파 변환기 |
| KR101909131B1 (ko) | 2012-09-11 | 2018-12-18 | 삼성전자주식회사 | 초음파 변환기 및 그 제조방법 |
| US9660170B2 (en) | 2012-10-26 | 2017-05-23 | Fujifilm Dimatix, Inc. | Micromachined ultrasonic transducer arrays with multiple harmonic modes |
| CN104054355B (zh) * | 2012-11-16 | 2018-12-04 | 阿西斯特医疗系统有限公司 | 超声换能器及其加工方法 |
| US20140184023A1 (en) * | 2012-12-31 | 2014-07-03 | Volcano Corporation | Layout and Method of Singulating Miniature Ultrasonic Transducers |
| KR101484959B1 (ko) * | 2013-02-05 | 2015-01-21 | 삼성메디슨 주식회사 | 초음파 트랜스듀서, 이를 포함한 초음파 프로브 및 초음파 진단 장치 |
| JP6273743B2 (ja) * | 2013-09-30 | 2018-02-07 | セイコーエプソン株式会社 | 超音波デバイスおよびプローブ並びに電子機器および超音波画像装置 |
| KR102126033B1 (ko) * | 2013-10-23 | 2020-06-23 | 삼성전자주식회사 | 초음파 변환기 및 이를 채용한 초음파 진단장치 |
| US9536511B2 (en) | 2013-12-31 | 2017-01-03 | Acist Medical Systems, Inc. | Ultrasound transducer stack |
| EP3099222B1 (de) * | 2014-01-28 | 2020-08-12 | Vayyar Imaging Ltd | Sensoren für eine tragbare vorrichtung |
| JP6347539B2 (ja) * | 2014-03-27 | 2018-06-27 | 国立研究開発法人日本原子力研究開発機構 | 超音波検査装置 |
| US10898924B2 (en) | 2014-07-16 | 2021-01-26 | Koninklijke Philips N.V. | Tiled CMUT dies with pitch uniformity |
| CN106660072B (zh) * | 2014-07-16 | 2019-03-19 | 皇家飞利浦有限公司 | 具有节距均匀性的平铺的cmut切片 |
| JP6299511B2 (ja) * | 2014-07-31 | 2018-03-28 | セイコーエプソン株式会社 | 超音波デバイス並びにプローブおよび電子機器 |
| KR20160023154A (ko) * | 2014-08-21 | 2016-03-03 | 삼성전자주식회사 | 초음파 변환기 |
| US10545107B2 (en) | 2015-04-26 | 2020-01-28 | Vayyar Imaging Ltd | System, device and methods for measuring substances' dielectric properties using microwave sensors |
| WO2016174679A2 (en) | 2015-04-27 | 2016-11-03 | Vayyar Imaging Ltd | System and methods for calibrating an antenna array using targets |
| WO2016174680A1 (en) | 2015-04-29 | 2016-11-03 | Vayyar Imaging Ltd | System, device and methods for localization and orientation of a radio frequency antenna array |
| WO2016178235A1 (en) | 2015-05-05 | 2016-11-10 | Vayyar Imaging Ltd | System and methods for three dimensional modeling of an object using a radio frequency device |
| WO2016181398A1 (en) | 2015-05-11 | 2016-11-17 | Vayyar Imaging Ltd | System, device and methods for imaging of objects using electromagnetic array |
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| US10290948B2 (en) | 2015-08-02 | 2019-05-14 | Vayyar Imaging Ltd | System and method for radio frequency penetration imaging of an object |
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| US11084062B2 (en) | 2015-11-02 | 2021-08-10 | Koninklijke Philips N.V. | Ultrasound transducer array, probe and system |
| US10436896B2 (en) | 2015-11-29 | 2019-10-08 | Vayyar Imaging Ltd. | System, device and method for imaging of objects using signal clustering |
| JP2018019024A (ja) * | 2016-07-29 | 2018-02-01 | キヤノン株式会社 | 振動を発生させる振動部品が実装されるプリント基板 |
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| FR3060844B1 (fr) * | 2016-12-15 | 2018-12-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Dispositif microelectronique acoustique |
| EP3606094B1 (de) * | 2017-03-29 | 2025-04-02 | AGC Inc. | Glasplattenkomponente |
| CN107315070A (zh) * | 2017-07-05 | 2017-11-03 | 南京航空航天大学 | 一种超声辅助型mos气体传感器的结构 |
| CN108178121B (zh) * | 2018-02-07 | 2024-05-03 | 北京先通康桥医药科技有限公司 | 触诊探头及其制造方法 |
| JP7039411B2 (ja) | 2018-07-20 | 2022-03-22 | 株式会社東芝 | 光検出器、光検出システム、ライダー装置及び車 |
| EP3857308A4 (de) * | 2018-09-25 | 2022-06-08 | Exo Imaging Inc. | Bildgebungsvorrichtungen mit selektiv veränderlichen eigenschaften |
| JP7222851B2 (ja) | 2019-08-29 | 2023-02-15 | 株式会社東芝 | 光検出器、光検出システム、ライダー装置、及び車 |
| CN110448331B (zh) * | 2019-09-12 | 2024-08-23 | 深圳市索诺瑞科技有限公司 | 一种空气填充的超声换能器 |
| EP3931636B1 (de) * | 2020-03-05 | 2025-10-01 | Exo Imaging Inc. | Ultraschallbildgebungsvorrichtung mit programmierbarer anatomie und strömungsbildgebung |
| EP4138539B1 (de) | 2020-04-24 | 2024-10-09 | Agco Corporation | Verfahren zur messung von ernteguteigenschaften |
| WO2021214579A1 (en) | 2020-04-24 | 2021-10-28 | Agco Corporation | Agricultural machines comprising capacitive sensors, and related methods and apparatus |
| CN111884647B (zh) * | 2020-08-13 | 2023-09-29 | 中国工程物理研究院电子工程研究所 | 一种压电微机械声波换能器阵列耦合隔离方法 |
| EP4135584A4 (de) * | 2021-03-29 | 2023-08-09 | Exo Imaging, Inc. | Gräben zur reduzierung des übersprechens in mut-arrays |
| CN113162460B (zh) * | 2021-04-16 | 2023-05-30 | 西北工业大学 | 一种静电式旋转、直线往复运动耦合能量收集器 |
| US12486159B2 (en) | 2021-06-30 | 2025-12-02 | Exo Imaging, Inc. | Micro-machined ultrasound transducers with insulation layer and methods of manufacture |
| CN116553469A (zh) * | 2022-03-24 | 2023-08-08 | 台湾积体电路制造股份有限公司 | 混合超声换能器系统 |
| CN114890372B (zh) * | 2022-05-07 | 2023-07-18 | 四川大学 | 一种带隔离沟槽的pmut的设计及制备方法 |
| EP4559588A1 (de) * | 2023-11-21 | 2025-05-28 | Dyconex AG | Ultraschallwandlervorrichtung |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4307613A (en) * | 1979-06-14 | 1981-12-29 | University Of Connecticut | Electronically focused ultrasonic transmitter |
| EP0215972B1 (de) * | 1985-09-24 | 1990-12-05 | Hewlett-Packard GmbH | Schaltmatrix |
| JP2998662B2 (ja) * | 1996-11-15 | 2000-01-11 | 日本電気株式会社 | 半導体装置 |
| US6120449A (en) * | 1998-11-25 | 2000-09-19 | General Electric Company | Method and apparatus for compensating for inoperative elements in ultrasonic transducer array |
| US6262946B1 (en) * | 1999-09-29 | 2001-07-17 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer arrays with reduced cross-coupling |
| FR2801971B1 (fr) * | 1999-12-07 | 2002-02-15 | St Microelectronics Sa | Emetteur et recepteur acoustiques integres, et procede de fabrication correspondant |
| KR100348177B1 (ko) * | 2000-01-13 | 2002-08-09 | 조동일 | 단결정 실리콘의 마이크로머시닝 기법에서의 깊은 트렌치절연막을 이용한 절연 방법 |
| JP2002209299A (ja) * | 2000-12-28 | 2002-07-26 | Toshiba Corp | 半導体振動センサ |
| US6669644B2 (en) * | 2001-07-31 | 2003-12-30 | Koninklijke Philips Electronics N.V. | Micro-machined ultrasonic transducer (MUT) substrate that limits the lateral propagation of acoustic energy |
| US6784600B2 (en) * | 2002-05-01 | 2004-08-31 | Koninklijke Philips Electronics N.V. | Ultrasonic membrane transducer for an ultrasonic diagnostic probe |
| US7087023B2 (en) * | 2003-02-14 | 2006-08-08 | Sensant Corporation | Microfabricated ultrasonic transducers with bias polarity beam profile control and method of operating the same |
| US6836159B2 (en) * | 2003-03-06 | 2004-12-28 | General Electric Company | Integrated high-voltage switching circuit for ultrasound transducer array |
-
2004
- 2004-03-31 US US10/814,956 patent/US20040190377A1/en not_active Abandoned
-
2005
- 2005-03-30 JP JP2005097702A patent/JP4868758B2/ja not_active Expired - Fee Related
- 2005-03-30 KR KR1020050026320A patent/KR20060044973A/ko not_active Ceased
- 2005-03-30 DE DE102005014836A patent/DE102005014836A1/de not_active Ceased
- 2005-03-31 CN CNA2005100651412A patent/CN1677706A/zh active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2091265A4 (de) * | 2006-11-08 | 2010-12-15 | Hitachi Medical Corp | Ultraschallsonde und ultrasonografische einrichtung damit |
| US8758253B2 (en) | 2006-11-08 | 2014-06-24 | Hitachi Medical Corporation | Ultrasonic probe and ultrasonic diagnostic apparatus using the same |
| EP3270607A1 (de) * | 2006-11-08 | 2018-01-17 | Hitachi, Ltd. | Ultraschallsonde und ultrasonografische einrichtung |
| DE102012220811A1 (de) * | 2012-11-14 | 2014-05-15 | Intelligendt Systems & Services Gmbh | Vorrichtung und Verfahren zur Ultraschallprüfung eines Bauteils mit einer Einschlüsse oder Hohlräume aufweisenden Zwischenlage |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1677706A (zh) | 2005-10-05 |
| JP2005295553A (ja) | 2005-10-20 |
| JP4868758B2 (ja) | 2012-02-01 |
| US20040190377A1 (en) | 2004-09-30 |
| KR20060044973A (ko) | 2006-05-16 |
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