[go: up one dir, main page]

DE102004015546A1 - Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung - Google Patents

Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung Download PDF

Info

Publication number
DE102004015546A1
DE102004015546A1 DE102004015546A DE102004015546A DE102004015546A1 DE 102004015546 A1 DE102004015546 A1 DE 102004015546A1 DE 102004015546 A DE102004015546 A DE 102004015546A DE 102004015546 A DE102004015546 A DE 102004015546A DE 102004015546 A1 DE102004015546 A1 DE 102004015546A1
Authority
DE
Germany
Prior art keywords
state
stored
light
integrated circuit
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
DE102004015546A
Other languages
English (en)
Other versions
DE102004015546B4 (de
Inventor
Stefan Seidenberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies AG
Original Assignee
Infineon Technologies AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Infineon Technologies AG filed Critical Infineon Technologies AG
Priority to DE102004015546A priority Critical patent/DE102004015546B4/de
Publication of DE102004015546A1 publication Critical patent/DE102004015546A1/de
Application granted granted Critical
Publication of DE102004015546B4 publication Critical patent/DE102004015546B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/50—Monitoring users, programs or devices to maintain the integrity of platforms, e.g. of processors, firmware or operating systems
    • G06F21/55—Detecting local intrusion or implementing counter-measures
    • G06F21/554—Detecting local intrusion or implementing counter-measures involving event detection and direct action
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
    • G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
    • G06F21/86—Secure or tamper-resistant housings
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
    • G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
    • G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
    • G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
    • H10W42/40—

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Security & Cryptography (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Software Systems (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Storage Device Security (AREA)

Abstract

Es ist ein Halbleiterchip mit einer integrierten Schaltung (1) und einer lichtempfindlichen Zustandsänderungseinrichtung (2) vorgesehen, die den in einer Zustandsspeichereinrichtung (3) gespeicherten Zustand bei Lichteinfall ändert, und einer Überwachungseinrichtung, die den in der Zustandsspeichereinrichtung gespeicherten Zustand überwacht.
DE102004015546A 2004-03-30 2004-03-30 Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung Expired - Fee Related DE102004015546B4 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE102004015546A DE102004015546B4 (de) 2004-03-30 2004-03-30 Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102004015546A DE102004015546B4 (de) 2004-03-30 2004-03-30 Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung

Publications (2)

Publication Number Publication Date
DE102004015546A1 true DE102004015546A1 (de) 2005-10-20
DE102004015546B4 DE102004015546B4 (de) 2011-05-12

Family

ID=35033972

Family Applications (1)

Application Number Title Priority Date Filing Date
DE102004015546A Expired - Fee Related DE102004015546B4 (de) 2004-03-30 2004-03-30 Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung

Country Status (1)

Country Link
DE (1) DE102004015546B4 (de)

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006000936A1 (de) * 2006-01-05 2007-07-12 Infineon Technologies Ag Halbleiterbauelement mit einer Schutzschaltung, Schutzschaltung für Halbleiterbauelemente und Betriebsverfahren für eine Schutzschaltung
DE102007058003A1 (de) * 2007-12-03 2009-06-25 Infineon Technologies Ag Halbleiterbauelement, Sensorelement, Verwendung eines Halbleiterbauelements sowie Verfahren zur Abwehr von Lichtangriffen
EP2680184A1 (de) * 2012-06-27 2014-01-01 EM Microelectronic-Marin SA Integrierter Schaltkreis, der gegen aktive Angriffe von Piraten geschützt ist
US10012250B2 (en) 2016-04-06 2018-07-03 Palo Alto Research Center Incorporated Stress-engineered frangible structures
US10026579B2 (en) 2016-07-26 2018-07-17 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
US10026651B1 (en) 2017-06-21 2018-07-17 Palo Alto Research Center Incorporated Singulation of ion-exchanged substrates
EP3285399A3 (de) * 2016-07-26 2018-07-25 Palo Alto Research Center, Incorporated Sensor und heizer zur stimulusinitiierten selbstzerstörung eines substrats
US10262954B2 (en) 2015-04-23 2019-04-16 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
USRE47570E1 (en) 2013-10-11 2019-08-13 Palo Alto Research Center Incorporated Stressed substrates for transient electronic systems
US10717669B2 (en) 2018-05-16 2020-07-21 Palo Alto Research Center Incorporated Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US10903173B2 (en) 2016-10-20 2021-01-26 Palo Alto Research Center Incorporated Pre-conditioned substrate
US10947150B2 (en) 2018-12-03 2021-03-16 Palo Alto Research Center Incorporated Decoy security based on stress-engineered substrates
US10969205B2 (en) 2019-05-03 2021-04-06 Palo Alto Research Center Incorporated Electrically-activated pressure vessels for fracturing frangible structures
US11904986B2 (en) 2020-12-21 2024-02-20 Xerox Corporation Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels
US12013043B2 (en) 2020-12-21 2024-06-18 Xerox Corporation Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763002A (en) * 1979-03-22 1988-08-09 University Of Texas System Photon detector
US5060261A (en) * 1989-07-13 1991-10-22 Gemplus Card International Microcircuit card protected against intrusion
EP0510434A2 (de) * 1991-04-26 1992-10-28 Hughes Aircraft Company Vorrichtung und Verfahren zur Verhinderung der Analyse eines geschützten Stromkreises
DE4414927A1 (de) * 1993-04-30 1994-11-10 Eg & G Reticon Corp Verbesserte Dioden-Adressierstruktur zum Adressieren eines Arrays aus Wandlern
US5465349A (en) * 1990-10-19 1995-11-07 Gemplus Card International System for monitoring abnormal integrated circuit operating conditions and causing selective microprocessor interrupts
DE19601390C2 (de) * 1996-01-16 1998-07-16 Siemens Ag Mikrochip
EP1089219A2 (de) * 1999-10-01 2001-04-04 Giesecke & Devrient GmbH Verfahren zur Sicherung eines Datenspeichers
US20010003374A1 (en) * 1999-12-09 2001-06-14 U.S. Philips Corporation Semiconductor device comprising a security coating and smartcard provided with such a device
DE10101281C1 (de) * 2001-01-12 2002-06-06 Infineon Technologies Ag Schutzschaltung gegen die Möglichkeit des Ausspionierens von Daten bzw. Informationen
DE10101995A1 (de) * 2001-01-18 2002-07-25 Philips Corp Intellectual Pty Schaltungsanordnung und Verfahren zum Schützen mindestens einer Chipanordnung vor Manipulation und/oder vor Mißbrauch
DE10140045A1 (de) * 2001-08-16 2003-03-13 Infineon Technologies Ag IC-Chip mit Schutzstruktur
DE10237338A1 (de) * 2002-08-14 2004-03-11 Siemens Ag Herstellung einer Umverdrahtungslage auf einem Trägermaterial

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE356436T1 (de) * 1998-08-19 2007-03-15 Infineon Technologies Ag Halbleiterchip mit oberflächenabdeckung gegen optische untersuchung der schaltungsstruktur
DE10345240A1 (de) * 2003-09-29 2005-05-04 Infineon Technologies Ag Integrierte Schaltung mit Strahlungssensoranordnung

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4763002A (en) * 1979-03-22 1988-08-09 University Of Texas System Photon detector
US5060261A (en) * 1989-07-13 1991-10-22 Gemplus Card International Microcircuit card protected against intrusion
US5465349A (en) * 1990-10-19 1995-11-07 Gemplus Card International System for monitoring abnormal integrated circuit operating conditions and causing selective microprocessor interrupts
EP0510434A2 (de) * 1991-04-26 1992-10-28 Hughes Aircraft Company Vorrichtung und Verfahren zur Verhinderung der Analyse eines geschützten Stromkreises
DE4414927A1 (de) * 1993-04-30 1994-11-10 Eg & G Reticon Corp Verbesserte Dioden-Adressierstruktur zum Adressieren eines Arrays aus Wandlern
DE19601390C2 (de) * 1996-01-16 1998-07-16 Siemens Ag Mikrochip
EP1089219A2 (de) * 1999-10-01 2001-04-04 Giesecke & Devrient GmbH Verfahren zur Sicherung eines Datenspeichers
US20010003374A1 (en) * 1999-12-09 2001-06-14 U.S. Philips Corporation Semiconductor device comprising a security coating and smartcard provided with such a device
DE10101281C1 (de) * 2001-01-12 2002-06-06 Infineon Technologies Ag Schutzschaltung gegen die Möglichkeit des Ausspionierens von Daten bzw. Informationen
DE10101995A1 (de) * 2001-01-18 2002-07-25 Philips Corp Intellectual Pty Schaltungsanordnung und Verfahren zum Schützen mindestens einer Chipanordnung vor Manipulation und/oder vor Mißbrauch
DE10140045A1 (de) * 2001-08-16 2003-03-13 Infineon Technologies Ag IC-Chip mit Schutzstruktur
DE10237338A1 (de) * 2002-08-14 2004-03-11 Siemens Ag Herstellung einer Umverdrahtungslage auf einem Trägermaterial

Cited By (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006000936B4 (de) * 2006-01-05 2009-11-12 Infineon Technologies Ag Halbleiterbauelement mit Schutzschaltung gegen Lichtangriffe
US8222700B2 (en) 2006-01-05 2012-07-17 Infineon Technologies Ag Protection circuit and operating method thereof
DE102006000936A1 (de) * 2006-01-05 2007-07-12 Infineon Technologies Ag Halbleiterbauelement mit einer Schutzschaltung, Schutzschaltung für Halbleiterbauelemente und Betriebsverfahren für eine Schutzschaltung
DE102007058003A1 (de) * 2007-12-03 2009-06-25 Infineon Technologies Ag Halbleiterbauelement, Sensorelement, Verwendung eines Halbleiterbauelements sowie Verfahren zur Abwehr von Lichtangriffen
DE102007058003B4 (de) * 2007-12-03 2019-12-05 Infineon Technologies Ag Halbleiterbauelement, Sensorelement, Verwendung eines Halbleiterbauelements sowie Verfahren zur Abwehr von Lichtangriffen
EP2680184A1 (de) * 2012-06-27 2014-01-01 EM Microelectronic-Marin SA Integrierter Schaltkreis, der gegen aktive Angriffe von Piraten geschützt ist
USRE49059E1 (en) 2013-10-11 2022-05-03 Palo Alto Research Center Incorporated Stressed substrates for transient electronic systems
USRE47570E1 (en) 2013-10-11 2019-08-13 Palo Alto Research Center Incorporated Stressed substrates for transient electronic systems
US10262954B2 (en) 2015-04-23 2019-04-16 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
US10541215B1 (en) 2015-04-23 2020-01-21 Palo Alto Research Center Incorporated Transient electronic device with ion-exchanged glass treated interposer
US10012250B2 (en) 2016-04-06 2018-07-03 Palo Alto Research Center Incorporated Stress-engineered frangible structures
US10202990B2 (en) 2016-04-06 2019-02-12 Palo Alto Research Center Incorporated Complex stress-engineered frangible structures
US10648491B2 (en) 2016-04-06 2020-05-12 Palo Alto Research Center Incorporated Complex stress-engineered frangible structures
US10224297B2 (en) 2016-07-26 2019-03-05 Palo Alto Research Center Incorporated Sensor and heater for stimulus-initiated fracture of a substrate
US10332717B2 (en) 2016-07-26 2019-06-25 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
EP3285399A3 (de) * 2016-07-26 2018-07-25 Palo Alto Research Center, Incorporated Sensor und heizer zur stimulusinitiierten selbstzerstörung eines substrats
US10026579B2 (en) 2016-07-26 2018-07-17 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
US10903176B2 (en) 2016-07-26 2021-01-26 Palo Alto Research Center Incorporated Method of forming a photodiode
US10950406B2 (en) 2016-07-26 2021-03-16 Palo Alto Research Center Incorporated Self-limiting electrical triggering for initiating fracture of frangible glass
US11810871B2 (en) 2016-10-20 2023-11-07 Palo Alto Research Center Incorporated Pre-conditioned self-destructing substrate
US10903173B2 (en) 2016-10-20 2021-01-26 Palo Alto Research Center Incorporated Pre-conditioned substrate
US10026651B1 (en) 2017-06-21 2018-07-17 Palo Alto Research Center Incorporated Singulation of ion-exchanged substrates
US11459266B2 (en) 2018-05-16 2022-10-04 Palo Alto Research Center Incorporated Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US10717669B2 (en) 2018-05-16 2020-07-21 Palo Alto Research Center Incorporated Apparatus and method for creating crack initiation sites in a self-fracturing frangible member
US10947150B2 (en) 2018-12-03 2021-03-16 Palo Alto Research Center Incorporated Decoy security based on stress-engineered substrates
US10969205B2 (en) 2019-05-03 2021-04-06 Palo Alto Research Center Incorporated Electrically-activated pressure vessels for fracturing frangible structures
US11904986B2 (en) 2020-12-21 2024-02-20 Xerox Corporation Mechanical triggers and triggering methods for self-destructing frangible structures and sealed vessels
US12013043B2 (en) 2020-12-21 2024-06-18 Xerox Corporation Triggerable mechanisms and fragment containment arrangements for self-destructing frangible structures and sealed vessels

Also Published As

Publication number Publication date
DE102004015546B4 (de) 2011-05-12

Similar Documents

Publication Publication Date Title
DE102004015546A1 (de) Halbleiterchip mit integrierter Schaltung und Verfahren zum Sichern einer integrierten Halbleiterschaltung
US8161450B2 (en) Re-programmable modular power management circuit
WO2004011984A3 (en) Retainer, exposure apparatus, and semiconductor device fabrication method
EP1605524A4 (de) Anbringglied für lichtemittierende elemente und halbleiterbaustein damit
DE60104688D1 (de) Mehrschichtfilm mit hohem modul
WO2006023149A3 (en) Led package methods and systems
ATE480856T1 (de) Deaktivierung von fehlerhaften flash-speicher- halbleiterchips
EP1493308A4 (de) Lichtemissionseinrichtung mit halbleiter-nanokristallen
DE60320799D1 (de) Halbleitervorrichtung mit halbleiterchip
WO2006101984A3 (en) Internally generating patterns for testing in an integrated circuit device
US7020019B2 (en) System and method for destructive purge of memory device
DE602008001364D1 (de) Belichtungsspiegel und damit versehene Belichtungsvorrichtung
DE50303421D1 (de) Stellvorrichtung mit Formgedächtniselement
EP1577938A4 (de) Halbleiterbauelement, integriertes dram-schaltungsbauelement und herstellungsverfahren daf r
DE60139533D1 (de) Elektronisches Gerät mit einem Substrat für die Schaltung
EP1737032A4 (de) Einrichtung mit integrierter halbleiterschaltung und schaltnetzteil das diese verwendet
TW200615107A (en) Release film for encapsulation of semiconductor chip
WO2009019788A1 (ja) 半導体集積回路
DE50300312D1 (de) Integrierte schaltung mit einer abtast-halte-einrichtung
ATE422259T1 (de) Steuergerät für einen datenstromspeicher
DE50312399D1 (de) Halbleiterbauelement mit csp-gehäuse
TW200703329A (en) Ferroelectric storage device
EP1538666A4 (de) Integriertes halbleiterschaltungsbauelement
ATE238879T1 (de) Spannvorrichtung
DE602005005223D1 (de) Beleuchtungsvorrichtung mit Leuchtdioden vom Flip-Chip -Typ und Verfahren zu ihrer Herstellung

Legal Events

Date Code Title Description
ON Later submitted papers
OP8 Request for examination as to paragraph 44 patent law
R082 Change of representative
R020 Patent grant now final

Effective date: 20110813

R119 Application deemed withdrawn, or ip right lapsed, due to non-payment of renewal fee