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DE10195604T1 - Laserkondensor und Laserbearbeitungseinrichtung - Google Patents

Laserkondensor und Laserbearbeitungseinrichtung

Info

Publication number
DE10195604T1
DE10195604T1 DE10195604T DE10195604T DE10195604T1 DE 10195604 T1 DE10195604 T1 DE 10195604T1 DE 10195604 T DE10195604 T DE 10195604T DE 10195604 T DE10195604 T DE 10195604T DE 10195604 T1 DE10195604 T1 DE 10195604T1
Authority
DE
Germany
Prior art keywords
laser
processing device
condenser
laser processing
laser condenser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE10195604T
Other languages
English (en)
Inventor
Yasunori Igasaki
Satoshi Matsumoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hamamatsu Photonics KK
Original Assignee
Hamamatsu Photonics KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hamamatsu Photonics KK filed Critical Hamamatsu Photonics KK
Publication of DE10195604T1 publication Critical patent/DE10195604T1/de
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/06—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the phase of light
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/108—Beam splitting or combining systems for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/12—Beam splitting or combining systems operating by refraction only
    • G02B27/123—The splitting element being a lens or a system of lenses, including arrays and surfaces with refractive power
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/14—Beam splitting or combining systems operating by reflection only
    • G02B27/144—Beam splitting or combining systems operating by reflection only using partially transparent surfaces without spectral selectivity
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Laser Beam Processing (AREA)
  • Semiconductor Lasers (AREA)
  • Liquid Crystal (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
DE10195604T 2000-02-14 2001-02-14 Laserkondensor und Laserbearbeitungseinrichtung Withdrawn DE10195604T1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000035170A JP2001228449A (ja) 2000-02-14 2000-02-14 レーザ集光装置及びレーザ加工装置
PCT/JP2001/001032 WO2001059505A1 (en) 2000-02-14 2001-02-14 Laser condensing apparatus and laser machining apparatus

Publications (1)

Publication Number Publication Date
DE10195604T1 true DE10195604T1 (de) 2003-04-03

Family

ID=18559410

Family Applications (1)

Application Number Title Priority Date Filing Date
DE10195604T Withdrawn DE10195604T1 (de) 2000-02-14 2001-02-14 Laserkondensor und Laserbearbeitungseinrichtung

Country Status (5)

Country Link
US (1) US20030010889A1 (de)
JP (1) JP2001228449A (de)
AU (1) AU2001232285A1 (de)
DE (1) DE10195604T1 (de)
WO (1) WO2001059505A1 (de)

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JP3977038B2 (ja) * 2001-08-27 2007-09-19 株式会社半導体エネルギー研究所 レーザ照射装置およびレーザ照射方法
JP4739616B2 (ja) * 2001-09-25 2011-08-03 新日本製鐵株式会社 亜鉛メッキ鋼板の重ねレーザ溶接方法および装置
KR100910016B1 (ko) * 2001-10-25 2009-07-30 하마마츠 포토닉스 가부시키가이샤 위상 변조 장치 및 위상 변조 방법
WO2003076150A1 (en) * 2002-03-12 2003-09-18 Mitsuboshi Diamond Industrial Co., Ltd. Method and system for machining fragile material
GB0213809D0 (en) * 2002-06-15 2002-07-24 Brocklehurst John R Dynamic shaping of laser beams
US6836284B2 (en) * 2003-04-01 2004-12-28 Tri-Star Technologies Laser marking using a digital micro-mirror device
US7016018B2 (en) * 2003-06-04 2006-03-21 Fuji Photo Film Co., Ltd. Exposure device
US7107908B2 (en) * 2003-07-15 2006-09-19 Special Devices, Inc. Firing-readiness diagnostic of a pyrotechnic device such as an electronic detonator
US7203210B2 (en) * 2003-12-29 2007-04-10 The Boeing Company Methods and devices for forming a high-power coherent light beam
US7327914B1 (en) * 2004-08-10 2008-02-05 The Board Of Trustees Of The Leland Stanford Junior University Adaptive optical signal processing with multimode waveguides
JP4761432B2 (ja) * 2004-10-13 2011-08-31 株式会社リコー レーザ加工装置
JP4647965B2 (ja) * 2004-10-22 2011-03-09 株式会社リコー レーザ加工方法及びレーザ加工装置及びにこれよって作製された構造体
JP5050232B2 (ja) * 2007-02-20 2012-10-17 株式会社総合車両製作所 レーザ溶接用ヘッド
JP4402708B2 (ja) * 2007-08-03 2010-01-20 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP4959590B2 (ja) * 2008-01-15 2012-06-27 浜松ホトニクス株式会社 観察装置
JP4961359B2 (ja) * 2008-01-16 2012-06-27 浜松ホトニクス株式会社 観察装置
BRPI0913578A2 (pt) * 2008-05-14 2017-06-06 Dermtech Int diagnose de melanoma e lentigo solar por análise de ácido nucléico
EP2335862B1 (de) * 2008-08-26 2016-10-19 Hamamatsu Photonics K.K. Laserbearbeitungsvorrichtung und laserbearbeitungsverfahren
JP5692969B2 (ja) 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
JP5148575B2 (ja) * 2009-09-15 2013-02-20 浜松ホトニクス株式会社 レーザ加工方法、及び、レーザ加工装置
JP5255109B2 (ja) * 2011-12-05 2013-08-07 浜松ホトニクス株式会社 レーザ加工方法、レーザ加工装置及びその製造方法
JP5863891B2 (ja) * 2014-07-01 2016-02-17 浜松ホトニクス株式会社 レーザ加工装置、レーザ加工装置の制御方法、レーザ装置の制御方法、及び、レーザ装置の調整方法
FR3026940B1 (fr) * 2014-10-08 2021-09-03 Univ Jean Monnet Dispositif et procede pour la decoupe d'une cornee ou d'un cristallin
CN107270832A (zh) * 2017-08-04 2017-10-20 望新（上海）科技有限公司 一种hud非球面反射镜面型检测光路及检测方法
DE102018105254B4 (de) * 2018-03-07 2020-06-04 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und Vorrichtung zur Bearbeitung mittels interferierender Laserstrahlung
CN113146054A (zh) * 2020-01-23 2021-07-23 上海新微技术研发中心有限公司 激光加工装置及激光加工方法
US20230048420A1 (en) * 2020-01-29 2023-02-16 Pulsar Photonics Gmbh Laser processing device and method for laser-processing a workpiece
JP2023131916A (ja) * 2022-03-10 2023-09-22 浜松ホトニクス株式会社 ホログラム用データ生成システム及びホログラム用データ生成方法

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JPH0876053A (ja) * 1994-09-08 1996-03-22 Matsushita Graphic Commun Syst Inc 記録装置
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Also Published As

Publication number Publication date
JP2001228449A (ja) 2001-08-24
US20030010889A1 (en) 2003-01-16
WO2001059505A1 (en) 2001-08-16
AU2001232285A1 (en) 2001-08-20

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Legal Events

Date Code Title Description
8128 New person/name/address of the agent

Representative=s name: GROSSE, BOCKHORNI, SCHUMACHER, 81476 MUENCHEN

8128 New person/name/address of the agent

Representative=s name: GROSSE, SCHUMACHER, KNAUER, VON HIRSCHHAUSEN, 8033

8141 Disposal/no request for examination