DE10081207D2 - Ultrasonic wire bonding device - Google Patents

Ultrasonic wire bonding device

Info

Publication number: DE10081207D2
Authority: DE; Germany
Prior art keywords: wire bonding; bonding device; ultrasonic wire; ultrasonic; wire
Prior art date: 1999-05-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE10081207T

Other languages

German (de)

Inventor

Frank Walther

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Hesse and Knipps GmbH

Original Assignee

Hesse and Knipps GmbH

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-05-07

Filing date

2000-05-08

Publication date

2001-10-18

2000-05-08 Application filed by Hesse and Knipps GmbH filed Critical Hesse and Knipps GmbH

2000-05-08 Priority to DE10081207T priority Critical patent/DE10081207D2/en

2001-10-18 Application granted granted Critical

2001-10-18 Publication of DE10081207D2 publication Critical patent/DE10081207D2/en

2020-05-09 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
- H10W72/07141—
- H10W72/07173—
- H10W72/07533—

Landscapes

Engineering & Computer Science (AREA)
Mechanical Engineering (AREA)
Manufacturing & Machinery (AREA)
Wire Bonding (AREA)

DE10081207T 1999-05-07 2000-05-08 Ultrasonic wire bonding device Expired - Fee Related DE10081207D2 (en)

Priority Applications (1)

Application Number	Priority Date	Filing Date	Title
DE10081207T DE10081207D2 (en)	1999-05-07	2000-05-08	Ultrasonic wire bonding device

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
DE19921177A DE19921177A1 (en)	1999-05-07	1999-05-07	Ultrasonic wire bonding device
PCT/DE2000/001434 WO2000067944A1 (en)	1999-05-07	2000-05-08	Ultrasonic wire bonding device
DE10081207T DE10081207D2 (en)	1999-05-07	2000-05-08	Ultrasonic wire bonding device

Publications (1)

Publication Number	Publication Date
DE10081207D2 true DE10081207D2 (en)	2001-10-18

Family

ID=7907361

Family Applications (2)

Application Number	Title	Priority Date	Filing Date
DE19921177A Withdrawn DE19921177A1 (en)	1999-05-07	1999-05-07	Ultrasonic wire bonding device
DE10081207T Expired - Fee Related DE10081207D2 (en)	1999-05-07	2000-05-08	Ultrasonic wire bonding device

Family Applications Before (1)

Application Number	Title	Priority Date	Filing Date
DE19921177A Withdrawn DE19921177A1 (en)	1999-05-07	1999-05-07	Ultrasonic wire bonding device

Country Status (3)

Country	Link
AU (1)	AU5671900A (en)
DE (2)	DE19921177A1 (en)
WO (1)	WO2000067944A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8129220B2 (en)	2009-08-24	2012-03-06	Hong Kong Polytechnic University	Method and system for bonding electrical devices using an electrically conductive adhesive
DE212017000184U1 (en)	2016-07-15	2019-02-19	Telsonic Holding Ag	Apparatus for ultrasonic welding and sonotrode for such a device
EP3269492A1 (en)	2016-07-15	2018-01-17	Telsonic Holding AG	Apparatus for ultrasonic welding and sonotrode for such a device

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS62150838A (en) *	1985-12-25	1987-07-04	Hitachi Ltd	Method and apparatus for detection
JPS6345520A (en) *	1986-05-20	1988-02-26	Shinko Denshi Kk	Vibration tape load measuring instrument
US4976392A (en) *	1989-08-11	1990-12-11	Orthodyne Electronics Corporation	Ultrasonic wire bonder wire formation and cutter system
US5169050A (en) *	1991-06-03	1992-12-08	General Scanning, Inc.	Wire bonder with improved actuator
DE29510274U1 (en) *	1995-06-24	1995-09-14	Schunk Ultraschalltechnik GmbH, 35435 Wettenberg	Device for welding metal parts using ultrasound
JPH0945721A (en) *	1995-08-03	1997-02-14	Kaijo Corp	Wire guiding device, wire guiding method, and wire bonding device equipped with the device
EP0864392B1 (en) *	1997-03-13	2001-08-16	F & K Delvotec Bondtechnik GmbH	Bonding head

1999
- 1999-05-07 DE DE19921177A patent/DE19921177A1/en not_active Withdrawn
2000
- 2000-05-08 WO PCT/DE2000/001434 patent/WO2000067944A1/en not_active Ceased
- 2000-05-08 AU AU56719/00A patent/AU5671900A/en not_active Abandoned
- 2000-05-08 DE DE10081207T patent/DE10081207D2/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
AU5671900A (en)	2000-11-21
WO2000067944A1 (en)	2000-11-16
DE19921177A1 (en)	2000-11-16

Publication	Publication Date	Title
DE60003761D1 (en)	2003-08-14	Ultrasonic bonding tool
DE60024818D1 (en)	2006-01-19	STRAMM DEVICE
DE60041382D1 (en)	2009-03-05	Ultrasonic vibration device
DE69937739D1 (en)	2008-01-24	SEMICONDUCTOR DEVICE
DE60036069D1 (en)	2007-10-04	Ultrasonic bonding method and device
DE69808397D1 (en)	2002-11-07	ultrasound device
NO20005375D0 (en)	2000-10-25	Ultrasound gjennomstrømningsmÕleinnretning
DE60005959D1 (en)	2003-11-20	SEMICONDUCTOR DEVICE
DE69912132D1 (en)	2003-11-20	ULTRASOUND DEVICE REMOTE CONNECTION
DE50007787D1 (en)	2004-10-21	BONDING ADHESIVES
DE10194843T1 (en)	2003-08-21	connecting device
EP1229591A4 (en)	2007-01-03	SEMICONDUCTOR DEVICE
DE60019144D1 (en)	2005-05-04	SEMICONDUCTOR DEVICE
DE60041030D1 (en)	2009-01-22	Semiconductor device
DE10081394D2 (en)	2002-05-29	diagnostic device
DE60102024D1 (en)	2004-03-25	connecting device
DE10081207D2 (en)	2001-10-18	Ultrasonic wire bonding device
FR2791372B1 (en)	2001-05-25	BONDE SIPHOIDE
NO20012390D0 (en)	2001-05-15	Ultrasonic cleaning device
DE60009999T2 (en)	2005-04-21	Semiconductor device
DE60000538D1 (en)	2002-11-07	STAUCH DEVICE
DK200000305U3 (en)	2002-02-22	ultrasonic
DE10085220T1 (en)	2002-10-31	Cable connecting device
DE60000751D1 (en)	2002-12-19	connecting device
DE69913651D1 (en)	2004-01-29	Ultrasonic washing device

Legal Events

Date	Code	Title	Description
2004-03-18	8139	Disposal/non-payment of the annual fee