DE10081207D2 - Ultraschall-Drahtbondeinrichtung - Google Patents
Ultraschall-DrahtbondeinrichtungInfo
- Publication number
- DE10081207D2 DE10081207D2 DE10081207T DE10081207T DE10081207D2 DE 10081207 D2 DE10081207 D2 DE 10081207D2 DE 10081207 T DE10081207 T DE 10081207T DE 10081207 T DE10081207 T DE 10081207T DE 10081207 D2 DE10081207 D2 DE 10081207D2
- Authority
- DE
- Germany
- Prior art keywords
- wire bonding
- bonding device
- ultrasonic wire
- ultrasonic
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
- B23K20/106—Features related to sonotrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
- H01R43/0207—Ultrasonic-, H.F.-, cold- or impact welding
-
- H10W72/07141—
-
- H10W72/07173—
-
- H10W72/07533—
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10081207T DE10081207D2 (de) | 1999-05-07 | 2000-05-08 | Ultraschall-Drahtbondeinrichtung |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19921177A DE19921177A1 (de) | 1999-05-07 | 1999-05-07 | Ultraschall-Drahtbondeinrichtung |
| PCT/DE2000/001434 WO2000067944A1 (de) | 1999-05-07 | 2000-05-08 | Ultraschall-drahtbondeinrichtung |
| DE10081207T DE10081207D2 (de) | 1999-05-07 | 2000-05-08 | Ultraschall-Drahtbondeinrichtung |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DE10081207D2 true DE10081207D2 (de) | 2001-10-18 |
Family
ID=7907361
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19921177A Withdrawn DE19921177A1 (de) | 1999-05-07 | 1999-05-07 | Ultraschall-Drahtbondeinrichtung |
| DE10081207T Expired - Fee Related DE10081207D2 (de) | 1999-05-07 | 2000-05-08 | Ultraschall-Drahtbondeinrichtung |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE19921177A Withdrawn DE19921177A1 (de) | 1999-05-07 | 1999-05-07 | Ultraschall-Drahtbondeinrichtung |
Country Status (3)
| Country | Link |
|---|---|
| AU (1) | AU5671900A (de) |
| DE (2) | DE19921177A1 (de) |
| WO (1) | WO2000067944A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8129220B2 (en) | 2009-08-24 | 2012-03-06 | Hong Kong Polytechnic University | Method and system for bonding electrical devices using an electrically conductive adhesive |
| DE212017000184U1 (de) | 2016-07-15 | 2019-02-19 | Telsonic Holding Ag | Vorrichtung zum Ultraschallschweißen und Sonotrode für eine solche Vorrichtung |
| EP3269492A1 (de) | 2016-07-15 | 2018-01-17 | Telsonic Holding AG | Vorrichtung zum ultraschallschweissen und sonotrode für eine solche vorrichtung |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62150838A (ja) * | 1985-12-25 | 1987-07-04 | Hitachi Ltd | 検出方法および装置 |
| JPS6345520A (ja) * | 1986-05-20 | 1988-02-26 | Shinko Denshi Kk | 振動式荷重測定装置 |
| US4976392A (en) * | 1989-08-11 | 1990-12-11 | Orthodyne Electronics Corporation | Ultrasonic wire bonder wire formation and cutter system |
| US5169050A (en) * | 1991-06-03 | 1992-12-08 | General Scanning, Inc. | Wire bonder with improved actuator |
| DE29510274U1 (de) * | 1995-06-24 | 1995-09-14 | Schunk Ultraschalltechnik GmbH, 35435 Wettenberg | Vorrichtung zum Verschweißen von Metallteilen mittels Ultraschall |
| JPH0945721A (ja) * | 1995-08-03 | 1997-02-14 | Kaijo Corp | ワイヤ案内装置及びワイヤ案内方法並びに該装置を具備したワイヤボンディング装置 |
| EP0864392B1 (de) * | 1997-03-13 | 2001-08-16 | F & K Delvotec Bondtechnik GmbH | Bondkopf |
-
1999
- 1999-05-07 DE DE19921177A patent/DE19921177A1/de not_active Withdrawn
-
2000
- 2000-05-08 WO PCT/DE2000/001434 patent/WO2000067944A1/de not_active Ceased
- 2000-05-08 AU AU56719/00A patent/AU5671900A/en not_active Abandoned
- 2000-05-08 DE DE10081207T patent/DE10081207D2/de not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| AU5671900A (en) | 2000-11-21 |
| WO2000067944A1 (de) | 2000-11-16 |
| DE19921177A1 (de) | 2000-11-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 8139 | Disposal/non-payment of the annual fee |