DE10043816C1 - Device for electrochemically metallizing, etching, oxidizing and reducing material in electrolytic apparatus comprises rigid base body, electrical contacts arranged on base body, contact isolator, counter electrode and electrical connection - Google Patents

Abstract

Device comprises a rigid base body (6); electrical contacts (4) arranged on the base body which are stable so that they can press on the surface of the material to be treated to form an electrical connection; contact isolators (5) electrically arranged next to the contacts to completely cover the contacts on both sides; and counter electrodes (7) arranged on the base body directly next to the contacts on the other side of the isolators. An electrical connection of the electrical contacts connected together on the base body on one side and the counter electrodes connected together on the other side using an electrical conductor from the base body to a bath current source. Preferred Features: The base body is electrically conducting and has an electrochemically active surface which forms the counter electrode on the side facing the material to be treated.

Description

The invention relates to a device for electrochemical metallization, Etching, oxidizing and reducing goods. The invention is suitable for use in electrolytic systems such. B. immersion baths, horizontal and vertical continuous systems, conveyor systems, clocked machines and cup Plater. With the device, full surfaces and mutually electrically isolated Structures with and without trenches, blind holes and through holes, as in PCB technology, hybrid technology and wafer technology, be treated electrolytically. It is also used in the field of gal vanoplastics possible.

The device is preferably in an arrangement and for carrying out a Procedure used in the concurrently filed patent application "Arrangement and method for electrochemically treated material" of the same Inventor are described. On this application DE 100 43 817.2-45 directed.

For the electrolytic treatment, at least the surface must be electrically conductive be able. This surface is electrically contacted and with a pole for the power source required for the electrolytic treatment. This Power source is called bath power source in the following. The other pole is with the counter electrode electrically connected. With electrolytic plastic treatment  or wafer treatment, in particular when derar plating good, the very thin, electrically conductive base layers only allow the use of low current densities with correspondingly long expositi onszeiten. Structures on electrically non-conductive substrates can be created with the Do not contact usual contact means at all.

In the document DE 196 12 555 A1 a method and an apparatus for electrochemical treatment of electrically insulated structures. Finely stranded and electrically arranged transversely to the transport direction of the goods Conductive brushes touch the surfaces to be treated electrolytically. There are counter electrodes between the rows of brushes. To the brushes and The bath current source is connected to counter electrodes. Through the continuous transport of the goods along these brushes and counter electrodes the isolated structures are contacted electrically and electrolytically one after the other treated.

When electroplating, the fine-wire brushes are cathodic and the opposite electrodes connected anodically. The cathodically polarized brushes are used in the This device is preferably galvanized compared to the structures, because at electrical brushing and brushing over the brushes the electric field between the brushes and the counter electrodes not possible. Between the insulation and the surface to be treated there is always a gap on this surface to avoid scratching. This leads to the preferred electroplating of the brushes and also because because the brushes around the voltage drop across the contact resistance between the end of the brush and the surface of the goods is more cathodic are than the good itself. Because of the light brushing over the brushes the good thing is this resistance is great and constantly fluctuating. A decrease tion of this annoying large contact resistance of the soft brushes is this device impossible. The brushes are therefore galvanized hard and useless in no time. They have to be about every minute be demetallized electrolytically. For this, u. a. mutually cathodic cal and anodically connected brushes and counter electrodes are proposed. This means that only half of the existing brushes participate in the actual one  electrolytic treatment. During the continuous grinding of the They are subject to mechanically sensitive brushes in the rough production environment permanent wear. It is also particularly disadvantageous that the for wafer treatment and for circuit board treatment in fine conductor technology the miniaturization of the brushes and counter electrodes is not necessary is possible. Such fine brushes are economical for precision engineering non-solvable requirements. Mechanization to manufacture is out closed.

The object of the invention is to describe a device for electrolytic treatment of goods, in particular for the treatment of electrically insulated ten structures with very small dimensions, such as z. B. in the ladder plate technology occur, is suitable and does not have the disadvantages mentioned having. Furthermore, the device should be simple, inexpensive and ver broad process steps for their production to be accessible, and indeed when the smallest structures are processed electrolytically with the device that should. It should also be simple for solid surfaces and large structures be producible. Furthermore, the device is intended for a rough electrolytic Production operations must be robust. In particular, it should be stable and wide have wear-resistant electrical contact strips.

The object is achieved by the device described in claim 1.

The device is used during electrolytic loading action pressed against the surface to be treated. The con tact surfaces of the contacts and the surrounding insulating medium firmly on the Surface on. Back pressure is introduced at the back of the goods. at flat, to be treated on both sides this introduction can also by a further device according to the invention on the other side of the goods. It is essential that between the goods and the device during the electro lytic treatment no relative movement takes place. The contacts and the  Insulating agents do not grind on the surface of the goods. For this Basically, the contacts can also come from a solid, stable work fabric, robustly designed and to drastically reduce con clock resistance are firmly pressed onto the surface to be treated.

To isolate the electrical field, the contacts with the exception of Contact surfaces completely electrically insulated. Together with the contacts this insulation firmly pressed onto the surface of the material to be treated. Interfering galvanizing of the contacts is thus reliably avoided.

For the gradual transport of the goods, the device is removed from the surface lifted off the same. Then the goods are briefly fed at the same time timely electrolyte exchange and pressing the device again the surface of the goods and continuing the electrolytic treatment, that is another treatment step.

By pressing the contacts to the surface of the goods, the and the respective counter electrode is formed an electrolytic small cell. In the stable contacts and the insulating material support the cones when making contact clock electrode and thus the attached counter electrodes to behan surface safely and accurately. So that are also very small Distances of the counter electrodes to the surface can be realized without the risk an anode / cathode short circuit in the small cell. As a small Ab stands are 0.2 mm to 0.5 mm.

All small lines of the device are preferred to a bath power source wise flexible electrical conductors connected. The device is marked net by the electrolytically relevant individual parts, namely the contacts and the Insulating agents that together form the contact strips, as well as the counterelectronics the. The contact strips and the counter electrodes together form a con structural unity. As a device according to the invention, it becomes a contact electrode called.

The invention is described in detail below. 1 to 8 also serve this purpose . The drawings are shown schematically and are not to scale.

Fig. 1 shows a contact electrode in the form of a very small section in cross section with the electrical connections to the bath current source.

Fig. 2 shows basic embodiments of the contact electrode for the various applications.

Fig. 3 shows a contact electrode with inclined contact strips for resilient contact.

Fig. 4 shows a contact electrode with channels in the base body for electrolyte introduction and for electrolyte discharge.

Fig. 5 shows in principle an example manufacturing steps of a contact electrode, in particular with very small dimensions of the contact strips.

Fig. 6 shows an example of basic manufacturing steps of a further contact electrode, with very small dimensions of the electrode spacing and the contact strips.

Fig. 7 shows another example of basic manufacturing steps of a contact electrode with rigid contact strips which are formed by the base body.

Fig. 8 shows another example of basic manufacturing steps of a contact electrode, especially for small cells with large dimensions.

In Fig. 1, the material to be treated electrolytically is designated by 1. It can be an electrically conductive part. However, it can also be a non-conductor which has an electrically conductive layer 2 on the surface to be treated electrolytically. This layer can be full-surface. But it can also have interruptions, ie structures that are electrically insulated from each other. These structures come e.g. B. in PCB technology and in hybrid technology. They sometimes have very small dimensions down to 0.05 mm square, in diameter, or as a conductor track. Furthermore, these layers are extremely thin in plastic electroplating or in wafer technology. The layers therefore have a very low electrical conductivity. This allows the use of only very low current densities according to the prior art. The device according to the invention is also suitable for the electrolytic treatment of material with blind holes and / or with through holes and with the properties mentioned. Likewise also for the construction of spatial structures of galvanoplastic as well as for the electrolytic etching, oxidation and reduction of goods.

For this purpose, at least one electrically conductive contact strip 3 contacts the surface 2 of the good 1 . The contact strip 3 is elongated in the plane of the drawing. It consists of the electrical contact 4 , which completely encloses contact insulation 5 on both sides. The contact strips 3 are immovably attached to a base body 6 . Between the contact strips 3 , counter electrodes 7 on the base body 6 are immovably fixed. In the illustration of FIG. 1, the base body 6 consists of an electrically non-conductive material. The contacts 4 and the counter electrodes 7 are connected to the bath current source 12 by means of electrical conductors 8 . The polarity in Fig. 1 is entered as an example for the electroplating or for the electrochemical reduction of the material.

Is z. B. the base body 6 made of an electrically conductive material, this can form the counter electrodes 7 themselves. The associated electrical rule's in Fig. 1 are omitted. The electrical conductors to the contacts 4 can be produced, for example, using the coating methods of printed circuit board technology and / or wafer technology. In this example, the contacts 4 are fastened to the base body 6 in an insulated manner. Overall, it can be seen with reference to FIG. 1 that it is easy to manufacture profile-like structures on the device according to the invention. These structures can be realized with very small dimensions for fine conductor technology and hybrid technology as contact strips 3 and counter electrodes 7 . It can also be seen that equally large dimensions of the contact strips and the counter electrodes can be realized. The known methods of mechanical engineering and precision engineering are suitable for this.

The contact electrode 30 consists, among other things, of the solid and rigid base body 6 . In one dimension, this is preferably as large as the good 1 to be treated. In continuous systems, for example, this means that the dimension transverse to the direction of transport corresponds at least to the width of the goods. In the case of flat and flat goods, such as wafers or printed circuit boards, the surface of the contact electrode 30 is also flat. For spatially shaped goods, the surface of the contact electrode is adapted to the shape of the goods. A very uniform electrolytic treatment is thus achieved. The peak effects that usually occur with molded parts are avoided.

The base body 6 consists of metal or an electrical non-conductor. These materials, like all other materials of the invention, must be chemically stable with respect to the electrolyte used in each case. If electrodes and contacts are subjected to anodic stress, they must also be electrochemically resistant and active. Usually meet precious metals, mixed oxide coatings z. B. with iridium or diamond layers, the z. B. are on-board, these requirements.

The contacts 4 attached to the base body 6 or the counter electrodes 7 can be formed by the base body itself. In these cases, a base body 6 made of metal, such as titanium, is advantageously used. The other part of the contact electrode must then be attached to the base body in an electrically insulated manner and be electrically connected to one another separately. The counter electrodes 7 are located in the immediate vicinity of the contacts 4 .

Fig. 2 shows the fundamentally possible embodiments of the contact electrode 30 with small and large contact distances and small and large anode / cathode distances. Due to the immobile fastening of the counter electrodes 7 and the contact strips 3 on the base body 6 , very small distances from the contact strips to the contact strips and the counter electrode 7 lying therebetween can be produced. The distance between the counterelectrode 7 and the surface of the good 1 can be realized just as small. These small dimensions are particularly suitable for treating the smallest structures. If required, these dimensions of the order of magnitude of 0.5 mm and less can be realized for precisely machined structures. On the other hand, very large mutual distances between the contact strips 3 and / or the anode / cathode distances of the counter electrodes 7 can also be realized for the electrolytic treatment of solid surfaces. Practical dimensions are up to 50 mm.

The choice of the contact material depends on the respective application. The surface quality of the goods has a significant influence on the selection. Unevenness of the order of one µm occurs during wafer treatment. Printed circuit boards and hybrids are flat, or height differences in the order of magnitude of the resist thickness or the thickness of solder mask, ie about 40 µm, must be compensated for. Elastic material, such as B. Conductor foils also adapt themselves to massive metal contacts. This in particular re when, with one-sided electrolytic treatment from the opposite side, the support and the counter pressure via an elastic material, such as. B. is initiated via a mat. This mat is located between a pressing body, at least in the dimensions of the goods, and the back of the goods. It also presses uneven surfaces of foils firmly onto the rigid, solid contacts. Solid metal contacts are therefore suitable for flat or at least slightly flexible goods. Uneven surfaces to be treated are advantageous with supple, e.g. B. contacted resilient metal strips. The spring effect can be increased if these contacts do not approach the surface of the good, not vertically, but at an angle of greater than 0 ° to close to 90 °. This is achieved according to FIG . B. also by appropriate inclination of the contact strips while the vertical approach of the contact electrode to the good.

A further adjustment to unevenness is made by cuts in the resilient metal contacts, that is achieved by feathered contacts. As Contacts are also suitable brushes, consisting of metal wires, which, however, in Contrary to the prior art must be so stiff in itself that they are in the Surface of the goods are pressed together with the insulation can. Stable wire brushes are particularly suitable for contact electrodes large dimensions of the contact distances and the anode / cathode distances.  

Particularly advantageous for producing the contacts 4 proves to be an elastic and electrically conductive material. The contact adapts itself automatically to all irregularities and touches the goods very gently. Such materials are available in the form of rubber, silicone and elastomers. They are filled with fillers consisting of fine or finest metal powder, metal flakes and similar metal particles. The diameter of the filler particles is approximately 10 µm. The electrical conductivity that such materials achieve is approximately 10 ^-3 Ωcm. This comes close to the conductivity of electrochemically resistant metals such as titanium. Contact insulations 5 can be attached to the side of the elastic contacts 4 such that the contacts 4 and the contact insulations 5 form a unit. The manufacture of the same elastic material proves to be very advantageous. They differ only in the metallic filler in contact 4 , which is not added to the contact insulation. Such elastic materials are such. B. known as micro connectors. Alternating electrically conductive and non-conductive silicone layers with layer thicknesses down to 0.1 mm are used under light pressure for electrical connection of electronic assemblies. The elastic materials also have the great advantage of processing such. B. by means of liquid coatings such as painting, pouring, spraying, spraying and extruding. As Kontaktiso lierung 5 is also any other chemically stable and non-conductive material, for example by means of high-rate electron beam vaporization brought elastic, very thin ceramic or glass layers. There are also insulating strips that are glued to the contacts 4 or are attached to the contact 4 and / or to the base body 6 by joining technology or positive locking. As will be shown in the manufacturing process of the contact electrode, the contact insulation 5 can advantageously also be applied by spraying, spraying, pouring, brushing or by electrophoretic application of a non-conductive material similar to a coating. This means that even very thin layers, e.g. B. for insulation, easy to manufacture. In any case, this insulation extends to the actual contact surface of the contact 4 without covering this surface. During the treatment, in addition to the contact 4 , the contact insulation 5 also sits on the material and thus completely isolates the contact 4 .

All contacts 4 of a contact electrode 30, on the one hand, and all counter electrodes 7, on the other hand, are each preferably electrically connected to one another in each case on one end face of the basic body 6 . From these star points is by means of a z. B. flexible conductor provides the electrical connection to the bath power source. The base body 6 itself forms a component of the contact electrode, for. B. the counter electrode 7 , the contacts 4 can be combined on two opposite sides of the base body. This is advantageous for particularly wide contact electrodes, ie for long contact strips 3 . These are therefore fed in on both sides. All conductors for combining the contacts 4 and the counter electrodes 7 are electrically insulated by means of a chemically resistant insulator.

In another embodiment of the contact electrode 30 , the contact strips 3 are attached to the electrically conductive base body 6 so that the electrochemically active surface of the base body 6 also forms the counter electrodes. These are electrically connected to one another by the base body. The base body 6 consists of an electrical insulator, such as. B. made of ceramic, glass, or plastic, at least the side facing the good is to be made conductive by a metallization. The metallization must also be electro-chemically active if it is used as an anode. The known chemical and physical coating processes are suitable for metallization.

An electrically conductive base body 6 can also be designed such that it also forms the contacts 4 . These are then electrically connected to one another via the base body 6 .

The contact strips 3 and the counter electrodes 7 preferably run parallel to one another. Together they can have any run on the base body. For example, in curved lines or in a triangular curve. However, a straight course is preferably selected, namely transversely to the feed direction of the material through the electrolytic system.

By gradually opening and closing the contact electrode, the small cell 9 formed by the material 1 and the counterelectrode 7 is each supplied with electrolyte which has not been worked out. The electrolytic treatment in one step can last as long as the ion concentration of the electrolyte for the process at the phase boundary is within the permissible limits. Another time limit for the oxidation and reduction is the amount of locally produced gas.

FIG. 4 shows a contact electrode 30 , which enables an increased electrolyte exchange in the small cells during the treatment. For the sake of illustration, the top view is shown without a lid. The electrolyte exchange can be increased by introducing electrolyte through holes 10 in the counter electrodes 7 . All electrolyte inlet holes 10 are connected to one another by electrolyte inlet channels 13 and an inlet manifold 14 on the base body 6 and are connected to an electrolyte pump via flexible hoses (not shown). The electrolyte outflow from the small cells takes place on the end faces of the base body 6 . A further increase in electrolyte exchange and / or forced gas discharge is achieved through electrolyte discharge holes 11 , also in the base body 6 and through the counter electrodes 7 . The electrolyte can escape from the small cells 9 through these holes. The electrolyte discharge holes 11 can also be brought together on the base body 6 by further electrolyte discharge ducts 15 and separately from the electrolyte introduction ducts 13 by means of diversion collection ducts 29 . A suction pump, not shown, connected to the contact electrode 30 via flexible hoses, causes an intensity-adjustable and forced electrolyte circuit through the small cells 9 . A treatment step can be selected correspondingly longer in time. The small electrolyte volume in the small cell, which is possible in comparison to electrolytic systems according to the prior art, enables a largely continuous electrolyte exchange in the small cell to be achieved with comparatively very small quantities of electrolyte circulating. So it is very advantageously exchanged electrolyte only where it is needed. This means that only a small amount of electrolyte has to be present in the electrolytic system. On the base body 6 BEFE stigungselemente are attached, which are suitable to attach the contact electrode in the electrolytic system and to move by means of a movement member.

Another advantage of the invention is that, among other things, the widespread chemical or physical coating processes can be used in the production of the contacts and the counter electrodes. Examples of this include layer construction techniques in wafer technology, hybrid technology and printed circuit board technology as well as the processes for liquid coating. In this way, the contacts 4 , the contact insulations 5 and the counter electrodes 7 can be produced on a base body, which consists of an insulator, by electrolessly chemically additive construction of electrically conductive layers and of insulating layers. These techniques also include electrolytic and chemical etching, laminating, electroplating, sputtering, plasma processes, electron beam coating and the entire structuring process using resist or laser beam technology. The coating processes are briefly referred to as chemical or physical coating processes. All coating processes assume a very good adhesive strength of the layers on the base body and among each other.

Some typical methods for producing the contact electrode 30 are described below with reference to FIGS. 5 to 11. It is expressly pointed out that combinations of these processes are also claimed for protection, as are combinations with other techniques for producing layers and structures.

Fig. 5 shows a very small section of a contact electrode in cross section with the manufacturing steps a to e.

In Fig. 5a, the base body 6 consists of an electrochemically active material, which is also electrically conductive. At least the side that later faces the good must be electrochemically active. On this page an auxiliary layer 16 is adherent z. B. laminated with an adhesive. Through this auxiliary layer 16 through into the base body 6 parallel cuts A, also called trenches 17 , are introduced. This can, depending on the size z. B. by milling, grinding, wire EDM, solid-state laser cutting, investment casting or etching. In Fig. 5b, these trenches 17 and the surface of the auxiliary layer 16 are coated with an electrically insulating layer 18. This can e.g. B. by liquid coating such as spraying, painting electrophoretically, dipping or pouring. High-rate electron-beam vapor deposition with glass or ceramic, which produces hard and very thin insulating layers with a thickness of a few µm, is also suitable. These thin layers are elastic and are also suitable for plastic coating. In Fig. 5c, the isolated trenches 17 with a contact material 19 by z. B. poured or sprayed filled. As a contact material such. B. low melting metals. Particularly advantageous is an elastic and electrically conductive material that can be processed by casting or spraying who can, such as. B. silicone, which is mixed with metal particles. If the electrically insulating layer 18 is produced with the same elastic material, but without metal particles, this results in an outstandingly elastic contact strip 3 .

In Fig. 5d, the surface has been leveled up to the auxiliary layer 16. For planning Ren are z. B. cutting, milling, chemical mechanical polishing (CMP) or grinding. FIG. 5e shows the finished contact strips 3, which are arranged fixedly on the base body 6 and secured. The counter electrode 7 was exposed by removing the auxiliary layer 16 . This removal can be by etching, chemical or physical detachment such as. B. by Lö medium or heat. The strips of auxiliary layer 16 can also be removed mechanically, e.g. B. by shearing or pulling. The counter electrode 7 must be cleaned so that the electrochemically active surface is free. In the case of an anode, this surface generally consists of a mixed oxide coating, a noble metal coating or other anodically resistant and electrically conductive layers such as, for example, B. a boron-doped diamond coating.

The contact strips 3 and the counter electrodes 7 are fixed to the base body of the contact electrode, in contrast to the prior art, immovably. Together they form a unit. They can only be moved together. However, this immobility does not relate to the small movements of the contacts 4 together with the contact insulations 5 due to elasticity.

When producing the electrically conductive contacts 4 , the end connections of the contacts are also produced by means of the same or a different electrically conductive material. Electrical insulation is applied to these connections to protect against unwanted side currents. The counter electrodes 7 are already connected to each other by the electrically conductive base body 6 . The base body 6 is also a mechanically stable construction element. Overall, these elements are so stable that they can absorb all forces, especially the contact pressure.

Fig. 6 shows a very small section of a further contact electrode in cross section with the manufacturing steps a to g.

On the base body 6 already described above in Fig. 6a, an insulating base coating 20 is applied. The coating processes in question were also described. For this reason, the list and description of all the manufacturing options for individual process steps that have already been described should be omitted below. An electrically conductive layer 21 is applied to the insulating base coating 20 by chemical or physical methods.

Fig. 6b shows an electrically non-conductive resist 22 which has already been structured. For example, a photoresist that has been laminated, structurally exposed and developed, as used in printed circuit board technology. Only the places intended for the counter electrodes remain covered here.

In Fig. 6c, the contact material 19 for the contacts and the front electrical connections to each other was electrolytically built. Precious metals are suitable as contact materials such as. B. platinum. FIG. 6d shows the basic body with removed in the region of the counter electrodes 7 resist 22, the conductive layer 21 and the remote Isoliergrundbeschichtung 20 removed. Suitable for this are, for. B. milling, etching or laser cutting. FIG. 6e shows a lining of the trenches with an insulating 23rd At the same time, the front connections are isolated. This insulating coating 23 was, in Fig. 6f to the active surface of the basic body 6 in the region of the Gegene lektroden 7 removed. Fig. 6g shows the exposed surface of the contacts 4 and hence the finished contact strip 3.

FIG. 7 shows a very small section of a further contact electrode in cross section with the manufacturing steps a to e.

In the electrically conductive, preferably metallic base body 6 , made of z. B. Titanium of FIG. 7a, the profile-like contacts 4 have been formed by milling or etching, investment casting, solid-state laser cutting or wire EDM. The undercut, which is not absolutely necessary, promotes the hold of the counter electrodes to be introduced. On the base body 6 formed in this way, an insulating base coating 24 and an electrically conductive layer 25 have been introduced in FIG. 7b. The conductive layer 25 is up to the area of the Gegenelek electrodes 7 and the end connections by z. B. partial etching, milling or by laser treatment of the input region of the counter electrodes 7 removed. The contact electrode processed in this way is shown in FIG. 6c. In Fig. 6d, the counter electrodes 7 by z. B. Electroplating a precious metal reinforced. At the same time, their front connections are strengthened and electrically isolated by an insulating coating. The insulating base coating 24 on the contact surface of the contacts 4 is then removed, preferably by grinding and / or polishing. The finished contact strips 3 are shown in FIG. 7e.

Fig. 8 shows a very small section of a further contact electrode in cross section with the manufacturing steps a through e.

On the electrochemically active and electrically conductive base body 6 an insulating base coating 26 has been applied over the entire surface in FIG . B. by lamination. Then the contact material 27 is applied over the entire surface, for. B. also by lamination. This contact material 27 can be a metal sheet, preferably made of titanium, or a mat made of an elastic and at the same time electrically conductive material. In Fig. 8b at the points where the counter electrodes are formed, the contact material 27 and the insulating base coating 26 by z. B. milling, laser cutting, water cutting, eroding or structure etching have been removed. At the same time, the front connections are formed. In Fig. 8c, an insulating layer 28 has been applied. This layer can consist of a hard insulating material. Is an elastic contact material 27 has been used, for. B. from metal powder enriched silicone, the insulating layer 28 is preferably made of a thin elastic material, for. B. also made of silicone. In Fig. 8d, the insulating layer 28 has been removed at the locations of the counterelectrodes 7 . The finished contact electrode is shown in Fig. 8e. The contacts 4 were exposed by leveling.

This process is suitable for the production of contact electrodes for the bear processing of fine structures. But it is also special for the production of Suitable contact strips and counter electrodes with large dimensions.

For the manufacture of the contact electrode, in particular one with large dimensions of the contact strips 3 , methods such as are known from precision engineering and apparatus construction are also suitable. The contacts 4 are made of metal or elastic and electrically conductive materials by mechanical processing. The same applies to the insulating materials. The base body 6 is made of metal before given.

LIST OF REFERENCE NUMBERS

1

good to be treated

2

electrically conductive layer

3

Contact strips

4

Contact

5

Contact insulation

6

body

7

counter electrode

8th

electrical conductor

9

small cell

10

Elektrolyteinleitlöcher

11

Elektrolytausleitlöcher

12

bath current

13

Elektrolyteinleitkanäle

14

Lead-collecting duct

15

Elektrolytausleitkanäle

16

auxiliary layer

17

Incisions, trenches

18

insulating

19

Contact material

20

Isoliergrundbeschichtung

21

electrically conductive layer

22

resist

23

insulating

24

Isoliergrundbeschichtung

25

electrically conductive layer

26

Isoliergrundbeschichtung

27

Contact material

28

insulating

29

Ausleit collection passage

30

contact electrode

Claims (23)

1. Device for electrochemical metallization, etching, oxidizing and reducing goods in an electrolytic system, preferably for use as a contact electrode, consisting of counter electrodes ( 7 ) and parallel contact strips ( 3 ), which surface to be treated ( 2 ) make electrical contact and thus form electrolytic small cells ( 9 ), during the electrolytic treatment between the contact electrode and the surface of the material to be treated there is no relative movement with:

• a) a rigid base body ( 6 ) which is adapted in size and in spatial shape to the surface of the material ( 1 ) to be treated,
• b) electrical contacts ( 4 ) arranged on the base body, which are inherently stable in such a way that they can be pressed onto the surface of the material to be treated for the electrical connection,
• c) in addition to the contacts ( 4 ) arranged electrical insulation means ( 5 ) which completely cover the contacts on both sides with the exception of the contact surfaces,
• d) counter electrodes ( 7 ), which are attached in the immediate vicinity of the contacts ( 4 ) on the side of the insulating means ( 5 ) on the base body ( 6 ) so that they are supported by the stable contacts and by the insulating means even at a very high level a small distance from the surface of the good to be treated cannot form an electrical short circuit with this surface,
• e) an electrical connection of the electrically connected contacts on the base body on the one hand and the interconnected Ge counterelectrodes on the other hand by means of electrical conductors from the base body to a bath current source.

2. Device according to claim 1, characterized by an electrically conductive basic body with an electrochemically active surface, which on the the well-facing side also forms the counter electrode. 3. Device according to claim 1, characterized by an electrically not conductive base body, with a surface facing the material, the is electrically conductive and electrochemically active through a metallization. 4. Apparatus according to claim 1 to 3, characterized by contacts ( 4 ), consisting of an elastic and at the same time electrically conductive material for safe contacting even on uneven surfaces to be treated. 5. The device according to claim 1 to 3, characterized by contacts, best Made of solid metal in the form of strips. 6. The device according to claim 1 to 3, characterized by contacts, best made of feathered metal strips. 7. The device according to claim 1 to 3, characterized by contacts, best sturdy wire brushes. 8. The device according to claim 1 and 3, characterized by an electric conductive and profiled body, which on the facing the property Side at the same time forms the contacts. 9. Device according to claims 1 to 8, characterized by materials of the contacts and the counter electrodes, at least on the surfaces are electrochemically stable. 10. Device according to claims 1 to 9, characterized by a con clock insulation that is chemically resistant.   11. The device according to claims 1 to 10, characterized by contact strips and counter electrodes that are parallel to each other and together the basic body have any course, but preferably egg NEN straight across the feed direction of the goods. 12. The device according to at least one of claims 1 to 11, characterized by electrical insulating means ( 5 ) and contacts ( 4 ) which form a unit in the form of micro connectors. 13. The device according to at least one of claims 1 to 12, characterized by openings ( 10 ) in the counter electrodes ( 7 ) through which electrolyte is introduced into the small cells ( 9 ), and which is laterally discharged from these again. 14. The device according to at least one of claims 1 to 13, characterized by further openings ( 11 ) in the counterelectrodes through which the electrolyte and the resulting gas are additionally discharged for increased electrolyte exchange. 15. The device according to at least one of claims 1 to 14, characterized by arrangement of the contact strips ( 3 ), counter electrodes ( 7 ) and the elec trical insulating means ( 5 ) on the base plate at an angle of 90 ° to greater than zero degrees with respect to Surface of the good. 16. The device according to at least one of claims 1 to 15, characterized by an electrical connection of all contact strips ( 3 ) with each other on egg ner front side of the base body and all counter electrodes with each other on the opposite side of the base body. 17. The device according to at least one of claims 1 to 16, characterized through an electrochemical and chemically stable insulation over it Links.   18. The device according to at least one of claims 1 to 17, characterized by connecting channels ( 13 ) on the top of the base body ( 6 ) for connecting all the electrolyte inlet holes ( 10 ) and connecting these channels through an inlet manifold ( 14 ) in the base body for introducing the Electrolytes using a pump. 19. The device according to at least one of claims 1 to 18, characterized by connecting channels ( 15 ) on the top of the base body for Ver connection of all electrolyte discharge holes ( 11 ) and connection of these channels through a diversion collecting channel ( 29 ) in the base body for discharging the electrolyte. 20. The device according to at least one of claims 1 to 19, characterized through a base body, which is together with the contact strips and adapts the counter electrodes to the spatial shape of the good so that under Avoid peak effects an even electrolytic treatment Forming takes place. 21. The device according to at least one of claims 1 to 20, characterized by a dimension of the base body transverse to the feed direction, the is equal to or larger than the dimension of the good in this direction. 22. The device according to at least one of claims 1 to 21, characterized through contacts, insulating material and counter electrodes, which are un are movably attached. 23. The device according to at least one of claims 1 to 22, characterized through mechanical fastening elements on the base body for installing the Device in an electrolytic system.