CN2903656Y - A high-power LED lighting luminaire - Google Patents
A high-power LED lighting luminaire Download PDFInfo
- Publication number
- CN2903656Y CN2903656Y CNU2005200660563U CN200520066056U CN2903656Y CN 2903656 Y CN2903656 Y CN 2903656Y CN U2005200660563 U CNU2005200660563 U CN U2005200660563U CN 200520066056 U CN200520066056 U CN 200520066056U CN 2903656 Y CN2903656 Y CN 2903656Y
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- Prior art keywords
- circuit board
- pcb circuit
- power led
- led lighting
- utility
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 claims description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241001465382 Physalis alkekengi Species 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
Images
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及到一种照明灯具,特别是一种大功率LED照明发光灯具。The utility model relates to a lighting fixture, in particular to a high-power LED lighting lighting fixture.
背景技术Background technique
目前,随着能源的日渐紧张,节约能源和实用已成为一些现代产品的基本要求。而照明灯具就是一种最耗能源的必需品。在现有的许多用于照明的灯具中,多是白炽灯、日光灯、气体放电灯等,这些灯的亮度非常足,给人们带来了许多方便,但它们仍存在以下一些不足,如能源利用率比较低,发热量大,寿命短,维护成本高和操作的危险性比较大。而LED灯具有节能省电、发光效率高、寿命长、安全性高、控制灵活及绿色环保等特性,但现有的LED普遍存在发光亮度的不足之处。At present, with the increasing tension of energy, saving energy and being practical have become the basic requirements of some modern products. Lighting fixtures are one of the most energy-consuming necessities. Among the many existing lamps and lanterns used for lighting, most of them are incandescent lamps, fluorescent lamps, gas discharge lamps, etc. The brightness of these lamps is very sufficient and brings a lot of convenience to people, but they still have the following deficiencies, such as energy utilization The efficiency is relatively low, the calorific value is large, the life is short, the maintenance cost is high and the risk of operation is relatively large. LED lamps have the characteristics of energy saving, high luminous efficiency, long life, high safety, flexible control and environmental protection, but the existing LEDs generally have insufficient luminous brightness.
实用新型内容Utility model content
本实用新型的目的在于针对现有技术的不足,提供一种大功率LED照明发光灯具,它不但节能而且发光强度高。The purpose of the utility model is to provide a high-power LED lighting luminaire, which not only saves energy but also has high luminous intensity.
本实用新型的目的通过下述技术方案予以实现。The purpose of this utility model is achieved through the following technical solutions.
本实用新型的一种大功率LED照明发光灯具,其由基体、PCB电路板、与PCB板电路用导线相连接的发光芯片组成,本实用新型的特征在于:所述的PCB电路板的底面压合在基体上表面,PCB电路板上设有至少一个容纳发光芯片的通孔,发光芯片与基体植入固接在一起。A high-power LED lighting light-emitting lamp of the present utility model is composed of a substrate, a PCB circuit board, and a light-emitting chip connected with a lead wire of the PCB circuit board. The utility model is characterized in that: the bottom surface of the PCB circuit board is pressed Combined with the upper surface of the substrate, the PCB circuit board is provided with at least one through hole for accommodating the light-emitting chip, and the light-emitting chip and the substrate are implanted and fixed together.
所述的基体为铝材结构或为铝材与铜材组合结构,利用特定形状的铝材或为铝材与铜材的组合作为基体,可以有效地解决灯具的散热问题,并将一个新制程实用化。所述的PCB电路板与基体用塑胶压合。所述的基体设有散热片结构。所述的发光芯片用树脂封装在PCB电路板的通孔内,也可以使用其他辅材作为封装材料。所述的基体为矩形或圆形结构,基体还可以设置为其他的一些几何形状。一个LED灯或多个LED灯组合结构的发光强度可以满足一般的照明要求。The substrate is an aluminum structure or a combined structure of aluminum and copper, using a specific shape of aluminum or a combination of aluminum and copper as the substrate can effectively solve the heat dissipation problem of the lamp, and a new manufacturing process Practical. The PCB circuit board and the substrate are pressed together with plastic. The base body is provided with a heat sink structure. The light-emitting chip is encapsulated in the through hole of the PCB circuit board with resin, and other auxiliary materials can also be used as the encapsulation material. The base body is a rectangular or circular structure, and the base body can also be set in some other geometric shapes. The luminous intensity of one LED lamp or a combined structure of multiple LED lamps can meet general lighting requirements.
本实用新型一种大功率LED照明发光灯具的优点是:节能省电、发光效率高、寿命长、安全性高、控制灵活、绿色环保并且发光强度高。The utility model has the advantages of a high-power LED lighting luminaire: energy saving, high luminous efficiency, long service life, high safety, flexible control, environmental protection and high luminous intensity.
为使熟悉该项技术者可确实了解本实用新型的特征及其目的与功效,以下将结合附图对本实用新型较佳实施例予以详细说明。In order to enable those skilled in the art to truly understand the features, purposes and effects of the utility model, preferred embodiments of the utility model will be described in detail below in conjunction with the accompanying drawings.
附图说明Description of drawings
图1是本实用新型的组合结构示意图;Fig. 1 is the composite structure schematic diagram of the present utility model;
图2是本实用新型的分解结构示意图;Fig. 2 is a schematic diagram of an exploded structure of the utility model;
图3是本实用新型的胶板分解示意图;Fig. 3 is the exploded schematic view of the rubber sheet of the present invention;
图4是图3的局部放大图;Fig. 4 is a partially enlarged view of Fig. 3;
图5是本实用新型的另一实施例。Fig. 5 is another embodiment of the utility model.
附图标号说明:Explanation of reference numbers:
10、基体 11、散热片结构 20、发光芯片10.
30、PCB电路板 40、导线 50、胶板30.
60、电源连接部60. Power connection part
具体实施方式Detailed ways
下面结合附图与具体实施方式对本实用新型作进一步描述:Below in conjunction with accompanying drawing and specific embodiment the utility model is further described:
如附图1至图5所示,本实用新型是这样实施的:As shown in accompanying drawing 1 to Fig. 5, the utility model is implemented like this:
图1至图4是本实用新型的一个实施例,其中,大功率LED照明发光灯具由基体、PCB电路板、发光芯片、胶板、导线及电源连接部组成,其中矩形基体为铝材结构,在它的四周设有散热片结构。与已有的技术相比,本实施例中的铝材结构和其散热片结构可以更有效地解决灯的散热问题,并将一个新制程实用化。PCB电路板的底面压合在基体上表面,PCB电路板上设有多个容纳发光芯片的通孔,多个发光芯片植在基体上,而发光芯片与PCB电路板用导线连接起来。PCB电路板与基体用胶板压合,胶板在与PCB电路板通孔的相应位置也设有通孔。发光芯片用树脂封装在PCB电路板的通孔内。灯具中的PCB电路板通过电源连接线与电源相连接。Figures 1 to 4 are an embodiment of the present invention, wherein the high-power LED lighting lamp is composed of a substrate, a PCB circuit board, a light-emitting chip, a plastic sheet, a wire and a power connection part, wherein the rectangular substrate is an aluminum structure, There are fin structures around it. Compared with the existing technology, the aluminum material structure and its heat sink structure in this embodiment can more effectively solve the heat dissipation problem of the lamp, and make a new manufacturing process practical. The bottom surface of the PCB circuit board is pressed on the upper surface of the substrate, and the PCB circuit board is provided with a plurality of through holes for accommodating light-emitting chips. The plurality of light-emitting chips are planted on the substrate, and the light-emitting chips and the PCB circuit board are connected by wires. The PCB circuit board and the substrate are pressed together with a rubber plate, and the rubber plate is also provided with a through hole at a position corresponding to the through hole of the PCB circuit board. The light-emitting chip is packaged in the through hole of the PCB circuit board with resin. The PCB circuit board in the lamp is connected with the power supply through the power connection line.
图5是本实用新型的另一种实施例,其中的基体、PCB电路板和胶板均为圆形结构。Fig. 5 is another embodiment of the present invention, wherein the substrate, the PCB circuit board and the rubber sheet are all circular structures.
以上所述,仅是本实用新型一种大功率LED照明发光灯具的较佳实施例而已,并非对本实用新型的技术范围作任何限制,凡是依据本实用新型的技术实质对以上的实施例所作的任何细微修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above is only a preferred embodiment of a high-power LED lighting lamp of the present utility model, and does not limit the technical scope of the present utility model. Any minor modifications, equivalent changes and modifications still belong to the scope of the technical solution of the present utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200660563U CN2903656Y (en) | 2005-10-24 | 2005-10-24 | A high-power LED lighting luminaire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005200660563U CN2903656Y (en) | 2005-10-24 | 2005-10-24 | A high-power LED lighting luminaire |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2903656Y true CN2903656Y (en) | 2007-05-23 |
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ID=38079070
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005200660563U Expired - Fee Related CN2903656Y (en) | 2005-10-24 | 2005-10-24 | A high-power LED lighting luminaire |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2903656Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010009624A1 (en) * | 2008-07-25 | 2010-01-28 | 浙江天宇灯饰有限公司 | A decorative lamp |
| CN102306689A (en) * | 2011-05-24 | 2012-01-04 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102832312A (en) * | 2011-06-17 | 2012-12-19 | 李铁军 | Novel LED (light emitting diode) packaging structure |
-
2005
- 2005-10-24 CN CNU2005200660563U patent/CN2903656Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010009624A1 (en) * | 2008-07-25 | 2010-01-28 | 浙江天宇灯饰有限公司 | A decorative lamp |
| CN102306689A (en) * | 2011-05-24 | 2012-01-04 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102306689B (en) * | 2011-05-24 | 2013-01-02 | 江苏永兴多媒体有限公司 | Method for producing light-emitting diode (LED) bracket based on thermally conductive plastics |
| CN102832312A (en) * | 2011-06-17 | 2012-12-19 | 李铁军 | Novel LED (light emitting diode) packaging structure |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |