CN2874772Y - Integrated light emitting unit - Google Patents
Integrated light emitting unit Download PDFInfo
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- CN2874772Y CN2874772Y CN200520104061.9U CN200520104061U CN2874772Y CN 2874772 Y CN2874772 Y CN 2874772Y CN 200520104061 U CN200520104061 U CN 200520104061U CN 2874772 Y CN2874772 Y CN 2874772Y
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Abstract
一种集成发光单元,包括发光二极管1、平面导光体2、散热片3、电路基板4、电源输入端5组成。多个发光二极管封装于平面导光体2内部,其发光面指向平面导光体2的外圆周端面,发光二极管发出的光线经平面导光体2传播,并由外端面输出。电路基板上具有电源输入端5、恒流驱动电路、发光二极管。散热片与电路基板、平面导光体紧密结合装配在一起,构成了结构紧凑、散热良好、外缘发光的高亮度发光二极管集成发光单元,该单元可独立使用或间隔使用,构成装饰灯,也可以多个单元紧密贴合,层叠使用,电源输入端并联,可以构成美观实用、安全可靠、任意功率的发光二极管灯。
An integrated light emitting unit is composed of a light emitting diode 1 , a plane light guide 2 , a heat sink 3 , a circuit substrate 4 , and a power input terminal 5 . A plurality of light-emitting diodes are packaged inside the planar light guide 2, and their light-emitting surfaces point to the outer peripheral end face of the planar light guide 2. The light emitted by the light-emitting diodes propagates through the planar light guide 2 and is output from the outer end face. The circuit substrate has a power input terminal 5, a constant current drive circuit and a light emitting diode. The heat sink is closely combined with the circuit substrate and the plane light guide to form a high-brightness light-emitting diode integrated light-emitting unit with compact structure, good heat dissipation, and outer edge light. This unit can be used independently or at intervals to form a decorative lamp. Multiple units can be closely bonded and used in layers, and the power input terminals can be connected in parallel to form a beautiful, practical, safe and reliable light-emitting diode lamp with any power.
Description
技术领域technical field
本实用新型涉及一种以发光二极管构成的外缘发光的集成发光单元,包括平面导光体、发光二极管、电路基板、恒流电路及散热片,并具有电源引出线。该单元可使用普通的直流电源驱动,多个此种发光单元层叠使用,其电源输入端并联,可方便的构成外形美观、使用方便、安全可靠、成本低廉的大功率发光二极管灯。The utility model relates to an integrated light-emitting unit composed of light-emitting diodes that emit light at the outer edge, which includes a plane light guide body, a light-emitting diode, a circuit substrate, a constant current circuit and a heat sink, and has a power supply lead-out line. The unit can be driven by a common DC power supply. Multiple light-emitting units of this type are stacked and connected in parallel to form a high-power LED lamp with beautiful appearance, convenient use, safety, reliability and low cost.
背景技术Background technique
近年来,市场上已出现了亮度高、高效节能、使用寿命长的发光二极光管器件(LED),并出现了多种形式的由发光二极管构成的发光二极管灯。In recent years, light-emitting diode devices (LEDs) with high brightness, high efficiency and energy saving, and long service life have appeared on the market, and various forms of light-emitting diode lamps composed of light-emitting diodes have appeared.
但由于发光二极管(LED)器件为电流型器件,光线发射方向单一,需要使用直流电压驱动,驱动电压低,工作时产生的大量热量,故在制成大功率器件时通常由单个大功率管芯或多个管芯并联构成,单管的电流大,电压低,热量高,需要制成平面型结构,通常其一面为发光面,另一面为散热面。使用时需要特殊的电压转换装置为其供电,并配合专用的散热片或大型的散热结构方可以正常工作。由此类器件构成的发光二极管(LED)灯,通常为LED器件呈平面分布的结构,须配以专用的反光装置及灯具,不仅成本高,效率低,眩光严重,安全性差,由于使用不便,也难以直接取代目前所使用的光源。However, since the light-emitting diode (LED) device is a current-type device, the direction of light emission is single, it needs to be driven by DC voltage, the driving voltage is low, and a large amount of heat is generated during operation, so it is usually made of a single high-power die Or multiple tube cores are connected in parallel. The current of a single tube is large, the voltage is low, and the heat is high. It needs to be made into a planar structure. Usually, one side is a light-emitting surface and the other side is a heat-dissipating surface. It needs a special voltage conversion device to power it when in use, and it can work normally with a dedicated heat sink or a large heat dissipation structure. Light-emitting diode (LED) lamps composed of such devices usually have a planar distribution structure of LED devices and must be equipped with special reflective devices and lamps, which not only have high cost, low efficiency, serious glare, and poor safety, but are also inconvenient to use. It is also difficult to directly replace the currently used light sources.
中国国家知识产权局的申请号为200410027387.6的发明专利提出了一种由发光二极管和导光板装配构成的单元,并由此构成的发光二极管灯,为制造大功率、高亮度、安全性好、兼容性强的发光二极管灯提供了一种可行的解决方案。但该专利所涉及的实施方案由于需要精密装配工艺配合,其实施成本较高。本实用新型作为该专利实施方案的改进,改进了散热结构,使结构更加合理,并可有效的简化制造工艺,降低制造成本,更加有利产品的推广和普及。The invention patent with the application number of 200410027387.6 of the State Intellectual Property Office of China proposes a unit composed of light-emitting diodes and light guide plates, and the light-emitting diode lamps formed from this are used to manufacture high-power, high-brightness, good safety, compatible Strong LED lights offer a viable solution. However, since the implementation scheme involved in this patent requires the cooperation of precision assembly technology, its implementation cost is relatively high. As an improvement of the patent implementation, the utility model improves the heat dissipation structure, makes the structure more reasonable, can effectively simplify the manufacturing process, reduce the manufacturing cost, and is more conducive to the promotion and popularization of products.
发明内容Contents of the invention
本实用新型所解决的技术问题在于提供了一种由多个普通结构的小功率的发光二极管及圆形结构的导光体构成的发光单元,此发光单元由发光二极管芯或小型封装的发光二极管及透明的导光体组成,其特征在于多个发光二极管管芯封装于同一个具有中心内孔的圆形导光体内,发光二极管管芯位于导光体的内圆附近,其发光面朝向导光体的外边缘,其发射的光线经导光体传播,由于光线在平面光导体内可发生全反射效应,在光导体内高效传播,光线可集中从导光体外边缘端面射出,就构成了边缘发光的发光单元。The technical problem solved by the utility model is to provide a light-emitting unit composed of a plurality of low-power light-emitting diodes of common structure and a light guide body of circular structure. and a transparent light guide, characterized in that a plurality of light-emitting diode dies are packaged in the same circular light guide with a central inner hole, the light-emitting diode die is located near the inner circle of the light guide, and its light-emitting surface faces the guide The outer edge of the light body, the light emitted by it propagates through the light guide body. Since the light can have a total reflection effect in the planar light guide body, it can be efficiently transmitted in the light guide body, and the light can be concentrated and emitted from the outer edge of the light guide body, which constitutes an edge glow. light emitting unit.
本实用新型的特征还在于,所述导光体具有中心圆孔,其外缘形状可以为圆形、椭圆、梨形、不规则曲线形、正方形、长方形、菱形、三角形、多边形。The utility model is also characterized in that the light guide body has a central circular hole, and its outer edge shape can be circular, elliptical, pear-shaped, irregular curved, square, rectangular, rhombus, triangular, polygonal.
本实用新型的特征还在于,发光二极管的发光面指向导光体的外边缘,发光二极管的引出脚与电路基板的连接部分垂直于导光体平面。The utility model is also characterized in that the light-emitting surface of the light-emitting diode points to the outer edge of the light guide body, and the connection part between the lead-out pin of the light-emitting diode and the circuit substrate is perpendicular to the plane of the light guide body.
本实用新型除上述发光二极管(芯)及光导体外,其特征还在于还包括用于安装连接发光二极管LED的电路基板、用于驱动发光二极管组的恒流驱动电路、及与电路基板相接触,用于给发光二极管及其它发热元件散热的散热片。In addition to the above-mentioned light-emitting diode (core) and photoconductor, the utility model is also characterized in that it also includes a circuit substrate for installing and connecting the light-emitting diode LED, a constant current drive circuit for driving the light-emitting diode group, and is in contact with the circuit substrate. Heat sink for cooling light-emitting diodes and other heating elements.
本实用新型由于使用了多个发光二极管(芯),其特征在于每个管芯都由独立的引出脚,其引出脚在安装连接段是垂直于导光体和电路基板的。Because the utility model uses a plurality of light-emitting diodes (cores), it is characterized in that each tube core has an independent lead-out pin, and the lead-out pin is perpendicular to the light guide body and the circuit substrate in the installation connection section.
所述发光二极管(芯)的发光颜色(波长)可以为红色、绿色、黄色、蓝色、白色或混合色。The emission color (wavelength) of the light emitting diode (core) can be red, green, yellow, blue, white or mixed colors.
本实用新型的特征还在于还包括一个电路基板,电路基板上有用于焊接发光二极管的焊盘,焊盘连接其它电路,可通过改变电路基板上的电路连线改变其连接关系(如串联或并联)。电路基板形状与导光体相似,并具有一个较大的中心孔。电路基板可以使用普通材料的覆铜板,也可以使用金属基材的覆铜板制成。The utility model is also characterized in that it also includes a circuit substrate, on which there are pads for welding light-emitting diodes, the pads are connected to other circuits, and the connection relationship can be changed by changing the circuit connections on the circuit substrate (such as series or parallel connection). ). The circuit substrate is shaped like a light guide and has a large central hole. The circuit substrate can be made of copper-clad laminates of common materials, or copper-clad laminates of metal substrates.
本实用新型的特征还在于在电路基板安装有至少一组恒流电路,每组恒流电路驱动连接到电路基板上的一组发光二极管。恒流电路与其所驱动的发光二极管组的连接关系为串联。所述恒流电路的作用在于为其所驱动的发光二极管组在输入电压为额定电压或额定电压以上的电压时,为发光二极管提供基本恒定符合设定值的稳定驱动电流。The utility model is also characterized in that at least one set of constant current circuits is installed on the circuit substrate, and each set of constant current circuits drives a set of light emitting diodes connected to the circuit substrate. The connection relationship between the constant current circuit and the LED groups it drives is in series. The function of the constant current circuit is to provide the light-emitting diodes with a stable driving current that basically meets the set value when the input voltage of the light-emitting diode group driven by it is a rated voltage or a voltage above the rated voltage.
所述发光单元由于采用多个发光二极管串联的方式,在相同的输入功率下,提高了输入电压,降低了输入电流,使器件的发热情况得到了改善,降低了对电路基板和其它相关元件的要求,简化了制造工艺,因而显著降低了成本。Since the light-emitting unit adopts a plurality of light-emitting diodes in series, under the same input power, the input voltage is increased, the input current is reduced, the heat generation of the device is improved, and the damage to the circuit substrate and other related components is reduced. Requirements, simplify the manufacturing process, and thus significantly reduce the cost.
本实用新型的特征还在于还具有至少一个散热片,散热片与电路基板上连接发光二极管及其它发热元件的线路具有热接触的关系,或与使用导热金属材料基板导热体相接触,发光二极管及其它元件在工作时产生的热量可通过焊盘及电路连线传导到散热片,并通过散热片向外散发掉,从而保护发热元件的温升不会过高,以保障其性能的发挥,延长使用寿命。散热片可以使用导热性能好的材料制成,如铜、铝等,也可以为非金属材料。The utility model is also characterized in that it also has at least one heat sink, and the heat sink has a thermal contact relationship with the circuit connecting the light-emitting diode and other heating elements on the circuit substrate, or is in contact with the heat conductor of the substrate using a heat-conducting metal material, and the light-emitting diode and The heat generated by other components during operation can be conducted to the heat sink through the pad and circuit connection, and dissipated outward through the heat sink, so as to protect the temperature rise of the heating element from being too high, so as to ensure its performance and prolong the life of the heat sink. service life. The heat sink can be made of materials with good thermal conductivity, such as copper, aluminum, etc., or non-metallic materials.
本实用新型的特征还在于,所述散热片可以是具有一个较大中心孔的结构,也可以是一个在中心分布有多个小孔的结构,其上还可以有多个用于安装电源引线的工艺孔。所述散热片的内外缘尺寸可以与导光体的外边缘尺寸、形状相同,也可以不相同,其内孔可以较电路基板的内孔小;其内边缘可以是平滑的,也可以具有锯齿状等有利于增大散热面积的结构。散热片可以利用外露表面散热,此表面可以为外缘表面、内缘表面,或同时为多个表面。The utility model is also characterized in that the heat sink can be a structure with a larger central hole, or a structure with a plurality of small holes distributed in the center, and there can also be a plurality of holes on it for installing power lead wires. process holes. The size and shape of the inner and outer edges of the heat sink can be the same as or different from the size and shape of the outer edge of the light guide, and its inner hole can be smaller than that of the circuit substrate; its inner edge can be smooth or serrated Shape, etc. are conducive to increasing the structure of the heat dissipation area. The heat sink can use the exposed surface to dissipate heat, and this surface can be an outer edge surface, an inner edge surface, or multiple surfaces at the same time.
本实用新型的特征还在于,所述发光单元的散热片与电路基板及导光体为紧密安装的状态,除电源连接点外,为全密封状态。The utility model is also characterized in that the heat sink of the light-emitting unit is tightly installed with the circuit substrate and the light guide, and is fully sealed except for the power connection point.
使用本实用新型的发光单元多个层叠,可形成中空的散热通道,其电源输入端并联,并与电源转换电路、保护电路、结构件、灯头、风扇等配合,可方便的构成可通过其中空结构或外表散热,结构紧凑、制造简单、安全可靠、成本低廉、兼容性好、使用方便的装饰发光管、护栏灯、高亮度发光二极管(LED)灯。A plurality of light-emitting units of the utility model are stacked to form a hollow heat dissipation channel, and its power input terminals are connected in parallel, and cooperate with power conversion circuits, protection circuits, structural parts, lamp holders, fans, etc., and can be conveniently formed through the hollow Structure or appearance heat dissipation, compact structure, simple manufacture, safe and reliable, low cost, good compatibility, easy to use decorative luminescent tubes, guardrail lights, and high-brightness light-emitting diode (LED) lights.
附图说明Description of drawings
以下结合示意图对本实用新型及实施方式进行进一步的说明。The utility model and its implementation will be further described below in conjunction with the schematic diagrams.
图1为所述集成发光单元的基本结构的示意图。Fig. 1 is a schematic diagram of the basic structure of the integrated light emitting unit.
图2-1所述集成发光单元的基本结构全剖面的示意图。The schematic diagram of the full section of the basic structure of the integrated light-emitting unit described in Fig. 2-1.
图2-2为所述集成发光单元的散热片小于导光体的剖面示意图。。Fig. 2-2 is a schematic cross-sectional view of the integrated light emitting unit in which the heat sink is smaller than the light guide. .
图3为发光二极管排列关系示意图。FIG. 3 is a schematic diagram of the arrangement relationship of light emitting diodes.
图4为恒流电路与发光二极管的连接关系示意图。Fig. 4 is a schematic diagram of the connection relationship between the constant current circuit and the light emitting diode.
图5为散热片内孔呈锯齿形的示意图。FIG. 5 is a schematic diagram of a sawtooth-shaped inner hole of the heat sink.
图6为散热片开有为多个内孔的示意图。Fig. 6 is a schematic diagram of a plurality of inner holes in the heat sink.
图7为所述发光单元层叠使用、电源并联连接、利用内外表面散热的示意图。Fig. 7 is a schematic diagram of the stacked use of the light-emitting units, the parallel connection of power supplies, and the use of internal and external surfaces for heat dissipation.
图8为所述发光单元层叠使用、电源并联连接、利用内孔散热的示意图。Fig. 8 is a schematic diagram of the stacked use of the light-emitting units, the parallel connection of power supplies, and the use of inner holes for heat dissipation.
具体实施方式Detailed ways
图1为所述集成发光单元基本结构的示意图,图中1为LED发光二极管(芯),封装在导光体2内部,其输入引线通过引脚6引出,并连接到电路基板4上的焊盘上,并通过电路布线与电路基板4上的其它元件相连接。电路基板4与散热片3保持热接触。电源引线7焊接于电路基板上的电源输入端5上,通过电路基板上的恒流驱动电路为发光二极管组提供所需电源。Fig. 1 is a schematic diagram of the basic structure of the integrated light-emitting unit. In the figure, 1 is an LED light-emitting diode (core), which is packaged inside the
图2-1为所述集成发光单元基本结构的截面示意图。导光体2、电路基板4、散热片3紧密安装在一起。发光二极管1及其它元件工作时产生的热量通过电路基板4及其上面的焊盘传导到散热片3上,并通过其外露表面6和7散发到环境介质中。Fig. 2-1 is a schematic cross-sectional view of the basic structure of the integrated light emitting unit. The
图2-2所述集成发光单元基本散热片较小的示意图,发光二极管1发出的光线在导光体2内部经所示路径传播,并从较大的外表面5射出。导光体2外径大于散热片的外径,并将散热片3部分包裹,工作时利用与环境介质相接触的内孔表面6散热。Figure 2-2 is a schematic diagram of a small basic heat sink of the integrated light emitting unit. The light emitted by the light emitting diode 1 propagates through the path shown in the
图3为发光二极管在导光体内排列分布的示意图。Fig. 3 is a schematic diagram of the arrangement and distribution of light emitting diodes in the light guide.
图4为发光二极管单元电路连接关系的示意图。在每个所述集成发光单元的导光体上按此连接方法连接的电路可以有一组,也可以为多组。FIG. 4 is a schematic diagram of the circuit connection relationship of the light emitting diode unit. There can be one set or multiple sets of circuits connected by this connection method on the light guide of each integrated light-emitting unit.
图5为内孔为锯齿形的散热片的示意图。其内孔为折线和曲线形,有利于增大散热片外露表面的散热面积,提高散热性能。FIG. 5 is a schematic diagram of a heat sink with a zigzag inner hole. The inner hole is in the shape of a broken line and a curve, which is beneficial to increasing the heat dissipation area of the exposed surface of the heat sink and improving the heat dissipation performance.
图6为散热片开有多个内孔的示意图。内孔为多个小孔,有利于增大散热面积,也具有防止异物进入的作用。Fig. 6 is a schematic diagram showing a plurality of inner holes in the heat sink. The inner hole is a plurality of small holes, which is beneficial to increase the heat dissipation area and also has the effect of preventing foreign matter from entering.
图7为图2-1所示的发光单元多个层叠使用的示意图,其中1为电源输入线,连通各单元的电路基板,其发光表面3为非连续表面,依其应用结构,可利用外表面2散热,也可在内外表面同时散热,其使用的单元数为任意多个,Fig. 7 is a schematic diagram of multiple stacked use of the light-emitting units shown in Fig. 2-1, wherein 1 is a power input line, which is connected to the circuit substrate of each unit, and its light-emitting
图8为图2-1所示的单元多个层叠使用的示意图,各单元电源输入端通过导线1并联,并连接到电源,其发光表面2为光滑的均匀连续发光表面,所形成的中心孔通道为散热通道,各单元依靠内表面3向环境介质中散热。Figure 8 is a schematic diagram of multiple stacked units shown in Figure 2-1. The power input ends of each unit are connected in parallel through wire 1 and connected to the power supply. The light-emitting
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834175A (en) * | 2010-05-13 | 2010-09-15 | 江西省晶和照明有限公司 | LED lighting COB (Chip on Board) packaging structure and bubble sphere |
| WO2011116531A1 (en) * | 2010-03-26 | 2011-09-29 | 青岛海信电器股份有限公司 | Shading plate, light shaping device and electronic apparatus with the light shaping device |
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2005
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011116531A1 (en) * | 2010-03-26 | 2011-09-29 | 青岛海信电器股份有限公司 | Shading plate, light shaping device and electronic apparatus with the light shaping device |
| CN102713422A (en) * | 2010-03-26 | 2012-10-03 | 青岛海信电器股份有限公司 | Shading plate, light shaping device and electronic apparatus with the light shaping device |
| CN101834175A (en) * | 2010-05-13 | 2010-09-15 | 江西省晶和照明有限公司 | LED lighting COB (Chip on Board) packaging structure and bubble sphere |
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