CN2650210Y - computer cooling device - Google Patents

Abstract

A heat radiator for computer is composed of a pipe with inlet at one end and outlet at another end, several heat radiating fins arranged in the pipe, and two fans respectively installed to the inlet and outlet of the radiator and facing the air inlet and outlet of computer casing.

Description

computer cooling device

technical field

The utility model relates to a heat dissipation device, in particular to a computer heat dissipation device, which allows the main heat source bodies on computer motherboards such as a central processing unit, a chip group and other chips to share a heat sink, and ensures that the wind blowing to the heat sink must be Cold air, while hot air is completely exhausted outside the case, which greatly improves the heat dissipation efficiency, and at the same time avoids the side effect of inhaling dust due to the existence of the cooling fan.

Background technique

Use heat dissipation devices to remove heat to prevent machinery, devices, and appliances from overheating and damage. It is used in many industrial products, such as engines, computers, and other important equipment. The heat dissipation used by the brain of the personal computer - the central processing unit (CPU) The device is an example, as shown in Figure 1, this cooling device mainly is made up of a radiator 60 and fan 61, and wherein radiator 60 contacts central processing unit (not shown) with its bottom usually, fan 61 is fixed on radiator 60 on. Therefore, the heat generated by the work of the central processing unit will be dissipated in the radiator 60 through heat conduction on the one hand, and at the same time, the rotation of the fan 61 will generate a powerful air flow to blow to the radiator 60, which can be continuously discharged from the radiator 60. Heat, to avoid overheating of the central processing unit and reduce work performance and life, and even damage and bring disaster to other parts of the computer.

However, when the traditional cooling device blows air against the radiator 60 against the fan 61, most of the hot air emitted from the radiator 60 escapes in the casing 62, and these hot air flow due to the rotation of the fan, and cause a stream of heat. The hot air is blown to the radiator 60, and then used to disperse the heat emitted by the central processing unit to the radiator 60, and then becomes hot air to dissipate in the casing 62. As a result of such a vicious circle, the temperature inside the casing 62 increases. If the temperature is higher, the heat dissipation effect will be greatly reduced.

In particular, the heat dissipation fan has the side effect of inhaling dust. More dust not only pollutes computer parts, but also affects the heat dissipation of computer parts, and even causes electrostatic hazards.

On the other hand, the motherboard (Main Board/Mother Board) 63 in the personal computer, except that the central processing unit (CPU) inserted in the top is the most important part, generally also has one to two chips at least to be responsible for the central processing unit. (CPU) communicates with peripheral devices such as memory, AGP display card, and PCI add-in card. These two chips are traditionally called South Bridge Chip (South Bridge Chip) 64 and North Bridge Chip (North Bridge Chip) 65 . Because the function of a motherboard is generally composed of these two chips 64, 65, it is usually called a chipset (Chipset). Of course, there are also manufacturers who design a single chip to have the functions of the south bridge chip 64 and the north bridge chip 65 .

Since the chipset is the control center of the computer, it has the function of connecting the central processing unit and the interface device, and keeps up with the generational development of the central processing unit (CPU), as well as the changes in technical specifications such as memory technology and AGP display card, so the chip set works The heat generated during the operation is the same as that of the central processing unit (CPU) used. Once the heat dissipation is not good, it will generate extremely high temperatures, which will greatly reduce the working performance and service life. Therefore, not only the central processing unit (CPU), but also the south bridge chip 64 and the north bridge chip 65 also need heat dissipation. As for the heat generated by the chipset, because it is less than that of the central processing unit (CPU), the temperature is also lower, so at present the south bridge chip 64 and the north bridge chip 65 usually use a radiator 66, 67 to dissipate heat respectively, and There is no fan to remove the heat, but the heat dissipated from the chipset to the heat sink is not forced out of the casing 62, and most of the hot air remains in the casing 62, causing the internal temperature of the casing 62 to become higher and higher , It is not conducive to heat dissipation, and even endangers the working performance and life of the computer.

Contents of the invention

The purpose of this utility model is: provide a kind of computer cooling device, this cooling device allows the main heat source body on the computer motherboard, as central processing unit, chip group and other chip etc. The wind must be cold wind, so that the heat dissipation efficiency can be greatly improved.

Another object of the present utility model is to provide a computer cooling device, which can force the heat from the main heat source body on the computer motherboard to the radiator to be discharged out of the casing to avoid escaping into the casing. It can reduce the temperature inside the case.

Another object of the present utility model is to provide a computer cooling device, which can avoid the side effects of inhaling dust while using the fan to force air convection, including polluting computer parts, affecting the heat dissipation of computer parts, and even causing static electricity. harm.

The technical solution of the utility model: a computer cooling device, mainly comprising: a radiator and an air inlet and an air outlet on the casing; it is characterized in that:

The heat sink has a pipe portion, one end of the pipe portion is an air inlet, and the other end is an air outlet, and several cooling fins are arranged in the pipe portion. Central processing unit, south bridge chip, north bridge chip and other chips;

The air inlet is arranged on the computer case and connected with the inlet of the radiator;

The exhaust port is arranged on the computer casing and connected with the outlet of the radiator.

Wherein: a first fan is arranged between the inlet of the radiator and the air inlet of the casing; a second fan is arranged between the outlet of the radiator and the exhaust of the casing; the radiator A fan is respectively arranged between the inlet and outlet of the radiator and the inlet and outlet of the casing; the first fan is arranged between the inlet and the outlet of the radiator; the second fan is arranged between the radiator Between the inlet and the outlet of the radiator; the radiator is provided with at least one fitting groove between the inlet and the outlet to inlay the third fan; the first fan is installed on the outside of the casing, facing To the air inlet; the second fan is installed on the outside of the casing and faces the exhaust port; the first fan is installed on the outside of the casing and faces the air inlet; the second fan is installed on the casing and facing the exhaust port; the inlet of the radiator is connected with the air inlet of the casing with a first windshield; the outlet of the radiator is connected with the exhaust port of the casing Connected with a second windshield; the inlet and outlet of the radiator are connected with the air inlet and exhaust port of the casing respectively with a windshield; the first fan is connected with the air inlet of the casing A first windshield is connected between them; a second windshield is connected between the second fan and the exhaust port of the casing; a first fan is connected with the air inlet of the casing. The air cover is connected, and the second fan is connected with the exhaust port of the casing with a second air cover; the inlet and outlet of the radiator are not in a straight line; the pipe part of the radiator is provided with a The hole that communicates inside and outside; the radiator is formed by combining two symmetrical groove-shaped heat sinks; the heat sink is composed of a groove-shaped heat sink and a sealing cover for covering the notch; the fan is embedded in Radiator; the position of the windshield can be reversed with that of the fan, and is arranged between the radiator and the fan.

The beneficial effects of the utility model are:

1. In this computer cooling device, because the main heat source body on the motherboard shares a heat sink with a closed periphery and two ends open, the two ends of the heat sink are opened and a fan is installed respectively, and the two fans face the sides of the computer case respectively. The air inlet and the exhaust port enable the first fan to suck the cold air outside the casing through the air inlet, and cause a strong cold wind, which is all blown to the radiator to disperse the central processing unit, south The heat dissipated from heat sources such as the bridge chip, north bridge chip and other chips to the radiator, and then use the second or/and third fan to force the hot air out of the case, thus greatly improving its heat dissipation efficiency.

2. The computer cooling device can dissipate the heat from the main heat source on the computer motherboard to the heat sink and force it out of the casing to prevent it from escaping into the casing. Therefore, it helps to reduce the temperature inside the casing.

3. The computer heat dissipation device ensures that the fan is used to forcibly remove the heat emitted by heat sources such as the central processing unit, south bridge chip, north bridge chip and other chips to the radiator, and at the same time, dust will not be sucked into the casing, polluting computer parts, Affect the heat dissipation of computer parts, and even cause static electricity hazards.

Description of drawings

FIG. 1 is a three-dimensional schematic diagram of a conventional computer cooling device.

Fig. 2 is a perspective view of the first preferred embodiment of the utility model.

Fig. 3 is an axial sectional view of the radiator of the first preferred embodiment of the present invention.

Fig. 4 is a perspective view of a second preferred embodiment of the present invention.

Fig. 5 is an axial sectional view of the radiator of the second preferred embodiment of the present invention.

Fig. 6 is a perspective view of a third preferred embodiment of the present invention.

Fig. 7 is an axial sectional view of the radiator of the third preferred embodiment of the present invention.

Fig. 8 is a perspective view of a fourth preferred embodiment of the present invention.

Fig. 9 is an axial sectional view of the radiator of the fourth preferred embodiment of the present invention.

Fig. 10 is a perspective view of a fifth preferred embodiment of the present invention.

Fig. 11 is an axial sectional view of the radiator of the fifth preferred embodiment of the present invention.

Fig. 12 is an axial sectional view of the radiator of the sixth preferred embodiment of the present invention.

Fig. 13 is an axial sectional view of the radiator of the seventh preferred embodiment of the present invention.

Fig. 14 is a perspective view of an eighth preferred embodiment of the present invention.

Detailed ways

In order to have a further specific understanding and understanding of the utility model, hereby give some preferred embodiments, and in conjunction with the accompanying drawings, describe in detail as follows:

Referring to Figs. 2 and 3, the first preferred embodiment of the present invention is a computer cooling device, which is mainly provided with a heat sink 10, the heat sink 10 has a pipe portion 11, and one end of the pipe portion is a cold air inlet 12 , the other end is the hot air outlet 13, several heat dissipation fins 14 are arranged in the tube portion 11, the length of the tube portion 11 allows its bottom 15 to be connected with the main heat source body on the computer main board 40 simultaneously, such as: central processing unit 41 , South Bridge chip 42, North Bridge chip 43 and other chips etc. contact (press, South and North Bridge chip 42,43 are collectively referred to as chip group sometimes herein) so that the heat energy produced by the above-mentioned heat source body can be conducted to radiator 10 for dissipating . It should be noted that in this embodiment, although the cross section of the heat sink 10 is a quadrangle, and the fins 14 are arranged in strips in parallel, it should be understood that such an embodiment is only intended for illustration and description, and is not intended to limit any specific configuration, such as As shown in Figures 4 and 5, the cross-sectional shape of the radiator 10 of the second preferred embodiment of the present invention is circular, and the arrangement of its fins 14 is radial, etc., which should also be included in the spirit and scope of the present invention. . Of course, the radiator 10 can also be a single component that can be integrally formed. As shown in Figures 6 and 7, the radiator 10 of the third preferred embodiment of the present invention is composed of two symmetrical groove-shaped cooling fins 17. Forming: or as shown in Figures 8 and 9, the radiator 10 of the fourth preferred embodiment of the utility model is composed of a groove-shaped heat sink 18 and a sealing cover 19 embedded in the notch. In a word, various forms All radiators 10 should be closed around and open at both ends.

2 and 3, the radiator 10 of the first preferred embodiment is combined between the air inlet 21 and the exhaust port 22 of the computer casing 20, and the air inlet 21 and the inlet 12 of the radiator 10 Connected, the exhaust port 22 is connected with the outlet 13 of the radiator 10 . Thereby, the heat that central processing unit 41, south bridge chip 42, north bridge chip 43 and other chips etc. work produces will dissipate there, and by air natural convection phenomenon, each heat source body is dissipated to the heat on radiator 10 Take out the computer case 20 .

There are three ways of heat transfer: heat conduction, heat convection, and heat radiation. Generally speaking, the amount of heat radiated out is so small that it can basically be ignored. Therefore, as far as the radiator is concerned, the most important heat transfer methods are heat conduction and heat convection. In the cooling device of a general computer, the importance of heat conduction is no less than that of heat convection, because this is an important factor in whether the heat generated by the central processing unit, south bridge chip, north bridge chip, and other chips can be conducted to the radiator. However, if you want to effectively reduce the temperature, heat convection is a big factor. Because the heat is mainly taken away by the convection phenomenon of the air (whether it is forced convection or natural convection).

Referring to Fig. 4, 5, therefore, in the second preferred embodiment of the present utility model, heat dissipation device is provided with two fans 30, 31, and its first fan 30 is contained in the inlet 12 of radiator 10 and the inlet of casing 20. Between the air ports 21 , the second fan 31 is disposed between the outlet of the radiator 10 and the exhaust port 22 . According to this, on the one hand, the first fan 30 can suck the cold air outside the casing 20 through the air inlet 21, and cause a strong cold wind, and all blow to the radiator 10 to disperse the central processing unit 41, The heat source bodies such as the south bridge chip 42 , the north bridge chip 43 and other chips dissipate the heat on the radiator 10 , and at the same time, the second fan 31 then forces the hot air generated by the heat exchange out of the casing 20 .

Since the first fan 30 is used to directly blow the low-temperature air outside the casing 20 to the high-temperature radiator 10, the heat dissipation effect of the radiator 10 can be enhanced, and the heat dissipation efficiency can be greatly improved. In addition, the hot air generated due to the heat exchange between the low-temperature air and the high-temperature radiator 10 is forced out of the casing 20 by the second fan 31, which speeds up the heat exchange and improves the heat dissipation efficiency without causing any heat loss. The hot air escapes into the enclosure 20 , helping to reduce the temperature inside the computer enclosure 20 . Especially, because the heat sink 10 is a closed around, two open configurations, while utilizing the fan 30 to blow the cold air to the heat sink 10, while using the fan 31 to extract the hot air in the heat sink 10, it will not be blown Dust is inhaled into the casing 20, contaminates computer parts, affects the heat dissipation of computer parts, and even generates static electricity to endanger the performance of the computer.

In addition, due to the action of the fans 30 and 31, the air velocity inside the radiator 10 is much faster than that outside, so a partial vacuum will be formed inside the radiator 10, causing a pressure difference between the inside and outside of the radiator 10. 10 and 11, therefore, in the fifth preferred embodiment of the present invention, the radiator 10 is provided with a hole 25 that can communicate with the inside and outside on the tube portion 11 other than the bottom 15, so that the heat in the casing 20 Air is sucked into the radiator 10 through the hole 25, and then forced out of the casing 20 by the fans 30, 31 to accelerate air convection inside and outside the casing 20 and reduce the temperature inside the casing 20. As for the fans 30 and 31, in addition to being exposed to the radiator 10, they can also be embedded in the radiator 10 and hidden in the radiator 10, as shown in Figures 4 and 5, the second preferred embodiment of the present invention. The fans 30 and 31 of the cooling device 10 are respectively installed between the openings at both ends of the radiator 10 and the casing 20 : that is to say, the fans 30 and 31 are located in the casing 20 . But in fact, when the inlet 12 and the outlet 13 of the radiator 10 are respectively connected with the inlet 21 and the outlet 22 of the casing 20 (the first preferred embodiment shown in Figures 2 and 3) , Fans 30, 31 can also be installed outside the casing 20, as shown in Figures 6 and 7, the third preferred embodiment can avoid the inconvenience of disassembling the casing 20.

Furthermore, if the length of the radiator 10 is not too long, it is more than enough to use a fan. As for the direction of gas flow, the method of extracting gas has a better heat dissipation effect than the method of feeding gas, and blowing low-temperature air directly to the high-temperature radiator can enhance the heat dissipation effect of the radiator. That is to say, it is better that the first fan 30 for sucking cold air is closer to the CPU 41 . Conversely, if the length of the radiator 10 is too long, in order to speed up the speed of air convection, in the fourth preferred embodiment as shown in Figures 8 and 9, the radiator 10 at least includes one that is arranged on the inlet 12 and the airflow The assembly groove 16 between the outlets 13 is used to install the third fan 32, and the third fan 32 is used to accelerate the flow of air and improve the heat dissipation efficiency. The existence of the fitting groove 16 does not interrupt the bottom 15 of the heat sink 10 , that is, the bottom 15 of the heat sink 10 is still continuous. Of course, the heat sink 10 can also be shown in Figures 10 and 11. In the fifth preferred embodiment, the heat sink 10 is divided into two parts, one of which is shorter in length and is responsible for the heat dissipation of the central processing unit 41, and the other length is relatively longer. , for the heat dissipation of the south bridge chip 42, the north bridge chip 43 and other chips, and the third fan 32 connects the two radiators 10 in between.

On the premise that the length of the heat sink 10 is fixed, when the heat sink 10 is installed on the motherboard 40, the inlet 12 and the outlet 13 of the radiator 10 may not coincide with the air inlet 21 and the air outlet 22 of the casing 20 respectively. . That is to say, there is still a gap between the inlet 12 and the outlet I3 of the radiator 10 and the air inlet 21 and the exhaust outlet 22 of the casing 20. At this time, the sixth preferred embodiment can be shown in FIG. 12 , Between the inlet 12 and the outlet 13 of the radiator 10 and the inlet 21 and the outlet 22 of the casing 20, a windshield 34, 35 is installed respectively. Or, after the fans 30, 31 are respectively installed on the inlet 12 and the outlet 13 of the radiator 10, there is still a certain distance between the fans 30, 31 and the air inlet 21 and the air outlet 22 of the casing 20. Under the circumstances, the seventh preferred embodiment as shown in Figure 13 can be installed a wind cover 34,35 respectively between the air inlet 21 and the exhaust port 22 of the fan 30,31 and the casing 20 to solve the problem of the heat sink. 10 The problem of insufficient length. Of course, the windshields 34, 35, like the fans 30, 31, are not necessarily installed on both ends of the radiator 10 at the same time, but can be installed on one end of the radiator 10, such as the inlet 12 or the outlet 13, as required.

In addition, the central processing unit 41, the south bridge chip 42, the north bridge chip 43 and other chips on the computer motherboard 40 are not necessarily arranged in a straight line, and may be arranged in an L shape due to the layout of the motherboard 40. or other shapes. Therefore, the heat sink 10 is not necessarily straight, but may also be L-shaped or other suitable shapes in the eighth preferred embodiment as shown in FIG. 14 . That is to say, the inlet 12 and the outlet I3 of the radiator 10 are not on a straight line, and the inlet 21 and the outlet 22 of the casing 20 are not arranged face to face. According to this example, the cold air may flow into the radiator 10 through the air inlet 21 on the side of the casing 20 , and the hot air generated after heat exchange is discharged from the exhaust outlet 22 on the back, front or bottom of the casing 20 .

The above descriptions are only a few preferred embodiments of the present utility model, and are not intended to limit the scope of implementation of the present utility model. For example, any changes and modifications made without violating the spirit and principles of the present utility model should be Covered within the scope of patent protection defined by the claims of the utility model.

Claims (22)

1. A cooling device for a computer, mainly comprising: a heat sink and an air inlet and an exhaust port on the casing; it is characterized in that: The heat sink has a pipe portion, one end of the pipe portion is an air inlet, and the other end is an air outlet, and several cooling fins are arranged in the pipe portion. Central processing unit, south bridge chip, north bridge chip and other chips; The air inlet is arranged on the computer case and connected with the inlet of the radiator; The exhaust port is arranged on the computer casing and connected with the outlet of the radiator. 2. The computer cooling device according to claim 1, wherein a first fan is arranged between the inlet of the radiator and the inlet of the casing. 3. The computer cooling device according to claim 1, wherein a second fan is arranged between the outlet of the radiator and the exhaust outlet of the casing. 4. The computer cooling device according to claim 1, wherein a fan is arranged between the inlet and outlet of the radiator and the inlet and outlet of the casing. 5. The computer cooling device according to claim 2, wherein the first fan is arranged between the inlet and outlet of the radiator. 6. The computer cooling device according to claim 3, wherein the second fan is arranged between the inlet and outlet of the radiator. 7. The computer cooling device according to claim 4, wherein the heat sink is provided with at least one fitting groove between the inlet and the outlet for mounting the third fan. 8. The computer cooling device according to claim 2, wherein the first fan is installed outside the casing and faces the air inlet. 9. The computer cooling device according to claim 3, wherein the second fan is installed outside the casing and faces the exhaust port. 10. The computer cooling device according to claim 4, characterized in that: the first fan is installed on the outside of the casing and faces the air inlet; the second fan is installed on the outside of the casing and faces the row breath. 11. The computer cooling device according to claim 1, characterized in that: the inlet of the radiator is connected with the air inlet of the casing by a first windshield. 12. The computer cooling device according to claim 1, wherein a second windshield is connected between the outlet of the radiator and the exhaust outlet of the casing. 13. The computer cooling device according to claim 1, characterized in that: the inlet and outlet of the radiator are respectively connected with the inlet and outlet of the casing by a windshield. 14. The computer cooling device according to claim 2, wherein a first windshield is connected between the first fan and the air inlet of the casing. 15. The computer heat dissipation device according to claim 3, wherein a second windshield is connected between the second fan and the exhaust port of the casing. 16. The computer cooling device according to claim 4, characterized in that: the first fan is connected to the air inlet of the casing with a first windshield, and the second fan is connected to the exhaust port of the casing. The space is connected by a second windshield. 17. The computer cooling device according to any one of claims 1 to 16, wherein the inlet and outlet of the radiator are not on a straight line. 18. The computer cooling device according to any one of claims 1 to 16, characterized in that: the tube part of the radiator is provided with a hole that can communicate with the inside and outside. 19. The computer cooling device according to any one of claims 1 to 16, wherein the heat sink is formed by joining two symmetrical groove-shaped cooling fins. 20. The computer cooling device according to any one of claims 1 to 16, wherein the heat sink is composed of a slot-shaped cooling fin and a sealing cover for covering the slot. 21. The computer cooling device according to any one of claims 2-6, 14-16, wherein the fan is embedded in the radiator. 22. The computer cooling device according to any one of claims 14 to 16, characterized in that: the position of the windshield can be reversed with that of the fan, and it is arranged between the radiator and the fan.

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