CN2519325Y - Improved thin radiator - Google Patents

Abstract

The utility model relates to an improvement type slim radiator, it mainly by a heat pipe, plural number fin superposes in the radiator of this heat pipe and a base that connects this heat pipe and be used for pasting and locate central processing unit constitutes, wherein because this heat pipe extends by this base side, and the several conducting strip transversely sets up on the heat pipe, for the high fever that increases the central processing unit that the base absorbed, specially by this base relative heat pipe position, and paste along each fin with one side and establish a U-shaped location conducting strip, in order to accelerate the heat conduction effect, hold each fin wherein simultaneously, combine in the steadiness of heat pipe with the enhancement fin.

Description

Improved thin radiator

technical field

The utility model relates to an improved thin radiator, especially a radiator fin structure with rapid heat conduction and high structural strength.

Background technique

At present, due to the upsurge of mobile data and mobile business, the sales performance of notebook computers is driven. Not only that, notebook computers also follow the high processing speed of desktop computers, and also use processors of the same level. However, due to the The host case of notebook computer is limited by its thinness and small size, so the heat dissipation space and heat dissipation performance of notebook computer are slightly inferior to those of desktop computer. higher temperature problem.

However, the heat sink generally arranged inside the notebook computer needs to cater to the design of its shell, and is constructed as a thin and planar structure, as shown in FIG. 7 , which is a conventional heat sink 50 structure. It is accommodated in a notebook computer, and it mainly uses several heat sinks 51 to form aligned perforations 511 to connect with the heat pipe 53, and then the other end of the heat pipe 53 is connected to the base 52, by virtue of this design That is, the heat pipe 53 can be used as a heat conduction bridge between the base 52 and the heat sink 51. It can be seen from the figure that although the structure of the heat sink 50 can be applied to a flat casing to achieve the effect of heat dissipation, there are A few disadvantages are mentioned:

1. The bonding strength between the heat sink and the heat pipe is not good, which may cause the heat sink to move out of position due to external force.

2. The heat dissipation speed is too slow. Due to the astonishing development of the speed of the processor, the high heat generated during operation is higher than that of the early processors. Therefore, it will be too late to rely on the heat pipe to dissipate the heat from the base. Can affect the normal working state of the central processing unit.

From the above, it can be known that applying such conventional heat sink structures to high-speed processors still cannot effectively eliminate the high heat generated by them. Therefore, how to enhance the heat dissipation capability of thin heat sinks currently used in notebook computers , will be a subject to be solved

Contents of the utility model

For this reason, the main purpose of the utility model is to provide a kind of heat sink that can lead the start-up high heat of the processor into the heat sink in a short time, and then the heat sink will radiate the heat out of the motherboard in good time by the heat sink, so that the high-speed processor can be used frequently. Instantaneous high heat generated during startup can maintain the normal operating temperature required by the processor.

The main technical means used to achieve the above-mentioned purpose is to make the above-mentioned radiator include:

a heat pipe;

A plurality of heat sinks, each of which forms a perforation, is inserted into the heat pipe and stacked side by side on the heat pipe;

A substrate, one end of which is connected to one end of the heat pipe, and the other end is bonded to the central processing unit;

The positioning guide is in the shape of a ㄇ, and is used to sleeve one end of the plurality of heat sinks in it, so as to fix the heat sink on the heat pipe;

For the above heat sink, each heat sink is initially fixed on the heat pipe by means of a perforated hole slightly smaller than the heat pipe, and then the positioning guide on the side of the substrate is used to strengthen the positioning effect, that is, Several cooling fins are completely concentrated in the two fins to completely limit the activity space of the cooling fins, and can be reliably combined in the heat pipe. In addition, since the positioning guide fins are large-area heat-conducting materials, the base The seat absorbs the heat of the central processing unit and conducts it to each heat sink, so that the heat of the central processing unit can be dissipated more quickly to ensure the normal operating temperature of the central processing unit.

Below in conjunction with accompanying drawing and embodiment the structure of the present utility model is further introduced:

Description of drawings

Fig. 1 is a three-dimensional appearance view of the first preferred embodiment of the present invention.

Fig. 2 is an exploded view of the second preferred embodiment of the present invention.

Fig. 3 is a three-dimensional appearance view of the second preferred embodiment of the present invention.

Fig. 4 is a sectional view of the first preferred embodiment of the present invention.

FIG. 5 is a cross-sectional view of a preferred embodiment of the heat sink of the present invention, which reveals that there are no outwardly protruding rings around the perforations of each heat sink.

FIG. 6 is a cross-sectional view of a preferred embodiment of the heat sink of the present invention, which reveals the invisible protruding fins on opposite sides of each heat sink.

Fig. 7 is an external view of a conventional radiator.

specific embodiment

The utility model is a radiator structure that can accelerate the high heat output of the central processing unit. First, please refer to FIG. 1, which is the first preferred embodiment of the utility model, which includes:

At least one heat pipe 11 is in the shape of a long rod;

A plurality of cooling fins 13, the middle position of each cooling fin 13 is to use a punching process to form a perforation 131, and form a ring piece 132 on the periphery of the perforation 131, wherein each cooling fin 13 is to utilize the perforation 131 to insert in the heat pipe 11, so as to Stacked side by side on the heat pipe 11;

A base plate 14, one end of which is connected to one end of the heat pipe 11, and the other end of which is bonded to the central processing unit (not shown in the figure);

A positioning guide fin 15 , the two sides of which are opposite to the plurality of cooling fins 13 arranged on the heat pipe 11 , downwardly form fins 151 , which is in the shape of a ㄇ.

Please refer to Fig. 2 and shown in Fig. 3, it is the second preferred embodiment of the present utility model, and most of its structures are the same as those shown in Fig. The guide fins 15a are connected to the substrate 14 as another heat conduction path to speed up the heat conduction speed of the substrate 14; .

Please also refer to Fig. 1 and shown in Fig. 4, because each cross-section is the radiating fin 13 of the shape, so when passing through the heat pipe 11 with the perforation 131, a gap can be formed between two adjacent radiating fins 13, and when All the cooling fins 13 are arranged on the heat pipe 11, and one side thereof can be accommodated in the two fins 151 of the positioning guide fins 15, and the positioning guide fins 15 limit the movable space of the cooling fins 13 to ensure heat dissipation. The bond strength that sheet 13 is connected on the heat pipe 11;

In addition, since the positioning guide 15 is connected with the base 14 and all the cooling fins 13, when the base 14 absorbs high heat not shown in the figure of the central processing unit, part of the heat can be penetrated by the positioning guide. 15 conduct to each heat sink 13, to accelerate the speed of heat dissipation.

Please refer to Figure 5, which is another embodiment of the heat sink 13a of the present invention, that is, the heat sink 13a only forms side fins 133a on opposite sides, that is, when several heat sinks 13a are arranged tightly, A gap is formed between two adjacent cooling fins 13a by means of the side fins 133a.

Please refer to FIG. 6 , which is a partial cross-sectional view of another embodiment of the heat sink of the present invention. Most of its structure is the same as that of the third figure, except that the peripheral edge of the perforation 131b of each heat sink 13b protrudes outwards to set a ring piece 132b , when stacked with adjacent cooling fins 13b, a gap can be separated for air heat exchange.

To sum up, the utility model mainly designs a ㄇ-shaped positioning guide fin, fixes each heat sink on the heat pipe, and conducts part of the heat absorbed by the base to each heat sink to achieve acceleration. The speed of heat dissipation, and this design can be used to instantly extract the high heat generated by the higher-end processor when it starts running, and then discharge it outside the board, so that the CPU can run smoothly at normal operating temperature .

Claims (4)

1. modified form thin heat radiation device, it includes:

At least one heat pipe;

Complex cooling fin, each heat radiator form a perforation, for plugging this heat pipe and the superimposed side by side usefulness on this heat pipe;

One substrate, one end connect an end of this radiating tube, and its other end conforms to central processing unit again;

One location guide card, its both sides relatively row are located at complex cooling fin on the heat pipe, form a ㄇ shape, in order to sheathed fixing aforementioned complex cooling fin in wherein.

2. modified form thin heat radiation device according to claim 1, it is characterized in that: an end of this location guide card is connected on this substrate.

3. modified form thin heat radiation device according to claim 1, it is characterized in that: this limit, heat radiator two opposite sides forms the flank limit in the same way, forms the gap of heat interchange in order to two heat radiator at interval.

4. as modified form thin heat radiation device as described in the claim 1,2 or 3, it is characterized in that: the perforation of this heat radiator is direct impact briquetting, and forms a ring plate that outwards is convexly equipped with naturally in the perforation periphery.

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