CN2478157Y - Heat sink construction combined with high thermal conductivity material - Google Patents
Heat sink construction combined with high thermal conductivity material Download PDFInfo
- Publication number
- CN2478157Y CN2478157Y CN 01200672 CN01200672U CN2478157Y CN 2478157 Y CN2478157 Y CN 2478157Y CN 01200672 CN01200672 CN 01200672 CN 01200672 U CN01200672 U CN 01200672U CN 2478157 Y CN2478157 Y CN 2478157Y
- Authority
- CN
- China
- Prior art keywords
- plate body
- heat sink
- heat
- high thermal
- heat conduction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000000463 material Substances 0.000 title claims abstract description 11
- 238000010276 construction Methods 0.000 title 1
- 238000005242 forging Methods 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 238000001125 extrusion Methods 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000002470 thermal conductor Substances 0.000 claims 1
- 230000005855 radiation Effects 0.000 description 22
- 238000005516 engineering process Methods 0.000 description 6
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000017525 heat dissipation Effects 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 238000012827 research and development Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat sink structure combined with high heat conduction material is prepared as setting multiple dovetail wedging grooves on plate body, setting high heat conduction plate body on base seat of heat sink body, pressing surface of base seat by forging forming process to form wedge block for wedging with wedging hole, making heat sink by pressing said heat sink to form dovetail groove for mutual slide-in embedding, combining high heat conduction plate body with heat sink body into one body, contacting high heat conduction plate body with CPU processor, conducting heat generated by CPU when CPU is running and dissipating heat quickly and raising heat conduction efficiency.
Description
The structure of the relevant a kind of heat radiator of the utility model, refer in particular to a kind of in conjunction with high thermal conducting material on the heat radiation lamellar body and improve the Structure of radiating fin of heat conduction efficiency.
The speed of computer CPU processor is more and more faster at present, influencing speed very huge on execution efficient is exactly heat dissipation problem, therefore in order to strengthen the heat dissipation problem of CPU processor, normally solve heat dissipation problem in assembly heat radiator mode, yet, more the CPU processor of high-order more can be because of temperature rise influences execution efficient, so need are with the appropriate radiating treatment in addition of its base body.Heat radiator with present stage, it is a kind of heat radiation body of aluminium material, can't satisfy the heat dissipation problem of CPU processor when total power operates of high-order, so when full load computing, easily cause the situation of deadlock, it is the bottleneck that present heat radiator faces, so, how to improve the heat exchanger effectiveness of heat radiator, become the fundamental purpose of industry research and development up till now.
The utility model applicant is based on the radiating requirements of CPU processor, technological means when preliminary research and development, be to utilize a kind of copper, silver or beryllium copper ... the material of contour thermal conduction characteristic is incorporated on the aluminium heat radiation lamellar body, to improve the mode of radiating efficiency, and will how this high heat conducting material be incorporated on the heat radiator, be the important topic of research and development of the present utility model.Adopt the solid welding mode to reach as if being incorporated into high heat conduction alloy on the aluminium heat radiation lamellar body, this kind mode two kinds of alloys in conjunction with aspect, need with a kind of solder flux as the centre in conjunction with interface so that cohesive bond mutually between it, yet, this combination can be because of two kinds of alloy expansion coefficient differences, when high-temperature heating, can expand and squeeze the situation of peeling off mutually, and the bond flux interface not only increases the manufacturing cost of secondary processing in the middle of this kind mode, also can the remote effect heat conduction efficiency, so its versatility haves much room for improvement.
Fundamental purpose of the present utility model provides a kind of Structure of radiating fin in conjunction with high heat conducting material, utilize at that time and forge, extrude or casting forming technology is incorporated in the lump on the high thermal conductance plate body heat radiation lamellar body can be shaped the time and is in one, the also desirable heat radiator that extrudes type or other forming technologies is produced and is slipped into chimeric mutually corresponding to dovetail groove, therefore two kinds of alloys can not be subjected to the yet firmly combination of influence of expansion coefficient, high thermal conductance plate body like this is located at heat radiation lamellar body bottom and is contacted with the CPU processor, the rapid heat loss through conduction of heat energy that is produced in the time of the CPU processor can being carried out running significantly improves heat conducting efficient.
Fundamental purpose of the present utility model is achieved in that a kind of Structure of radiating fin in conjunction with high heat conducting material, include a high heat conduction plate body and heat radiation lamellar body, it is characterized in that: this high heat conduction plate body is by the made plate body of the high material of pyroconductivity, it is provided with a plurality of dovetail wedgings hole on plate body, and high heat conduction plate body is located on the base portion of heat radiation lamellar body, can make the surface of this base portion be subjected to extrusion to forge wedge joint piece by forging and forming technology, for with the mutual wedging in wedging hole, the heat radiator of also desirable crowded type or other forming technologies is produced and is slipped into chimeric mutually corresponding to dovetail groove, high heat conduction plate body can be mutually combined with the heat radiation lamellar body to be integral, so that high thermal conductance body contacts with the CPU processor, the rapid heat loss through conduction of heat energy that is produced in the time of the CPU processor can being carried out running, and then significantly improve heat conduction efficiency.
Wherein high heat conduction plate body is the plate body of being made by the high material formed thereby of copper, silver or beryllium copper class pyroconductivity.
Describe structure of the present utility model, feature and effect thereof in detail below in conjunction with accompanying drawing:
Fig. 1 is a stereo appearance figure of the present utility model.
Fig. 2 is the utility model dovetail wedging hole and the auxiliary synoptic diagram of the corresponding relation of wedge joint piece.
Fig. 3 by the utility model dovetail wedging hole correspondence forge the diagrammatic cross-section of wedge joint piece.
Fig. 4 by the utility model in dovetail wedging hole correspondence forge view after wedge joint piece is shaped.
Fig. 5 is the decomposing schematic representation of another specific embodiment of the utility model.
See also shown in Figure 1, the utility model includes a high heat conduction plate body 1 and a heat radiation lamellar body 2 in conjunction with the Structure of radiating fin of high heat conduction alloy, wherein high heat conduction plate body 1 is (as copper, silver or beryllium copper by the high material of pyroconductivity ... Deng) made plate body, this high heat conduction plate body 1 can have identical sectional area with heat radiation lamellar body 2, and 11 (as shown in Figure 2) of a plurality of dovetail wedgings hole are set on plate body.
Moreover, above-mentioned heat radiation lamellar body 2 is an aluminium alloy extrusions plate body, therefore can high heat conduction plate body 1 be located on the base portion 21 of heat radiation lamellar body 2 by forging and forming technology, make the surface of this base portion 21 be subjected to extrusion to forge wedge joint piece 211 (as shown in Figure 3), for with the wedging hole 1 mutual wedging (as shown in Figure 4) of high heat conduction plate body 1, high heat conduction plate body 1 can be mutually combined with heat radiation lamellar body 2 to be integral, and satin when causing shape this heat radiation lamellar body 2 can upwards forge simultaneously and mold a plurality of radiating fins 22, enter for air-flow the heat energy of radiating fin conduction taken away.
Hence one can see that, the utility model is on concrete enforcement, when heat radiation lamellar body 2 forging and moldings, forge base portion 21 wedgings in the lump and on high heat transfer plate body 1, be in one, therefore two kinds of also firmly combinations of plate body expansion coefficient difference, be not subjected to its combination of temperatures involved, the centre need not be by the welding interface, on manufacture process, can save the cost of secondary processing, so high thermal conductance plate body 1 is located at the bottom of heat radiation lamellar body 2 and is contacted with the CPU processor, utilize high heat transfer plate body 1 to have the high cooling efficiency effect, the rapid heat loss through conduction of heat energy that is produced in the time of the CPU processor can being carried out running has the function that significantly improves heat conduction efficiency.
In addition, being illustrated in figure 5 as high thermal conductance plate body 1 of the utility model and heat radiation lamellar body 2 can further use another kind and extrude forming technology and make, this high thermal conductance plate body 1 and heat radiation lamellar body 2 are formed separately out the pull design of kenel of dovetail button, this high thermal conductance plate body 1 dovetails 12 that is shaped, and the base portion 21 of this heat radiation lamellar body 2 is corresponding to wedge joint piece 12 dovetail groove 212 that is shaped, therefore high heat conduction plate body 1 and heat radiation lamellar body 2 snapping mutually are combined into one, the bottom that same high thermal conductance plate body 1 is located at heat radiation lamellar body 2 directly contacts with the CPU processor, utilize high pass hot body 1 to have the high cooling efficiency effect, the rapid heat loss through conduction of heat energy that is produced in the time of the CPU processor can being carried out running significantly improves hot transfer efficiency.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01200672 CN2478157Y (en) | 2001-01-02 | 2001-01-02 | Heat sink construction combined with high thermal conductivity material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 01200672 CN2478157Y (en) | 2001-01-02 | 2001-01-02 | Heat sink construction combined with high thermal conductivity material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2478157Y true CN2478157Y (en) | 2002-02-20 |
Family
ID=33622895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 01200672 Expired - Fee Related CN2478157Y (en) | 2001-01-02 | 2001-01-02 | Heat sink construction combined with high thermal conductivity material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2478157Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025119A (en) * | 2011-09-22 | 2013-04-03 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN107957764A (en) * | 2017-12-04 | 2018-04-24 | 四川省守望信息科技有限责任公司 | A kind of cooling system for computer |
-
2001
- 2001-01-02 CN CN 01200672 patent/CN2478157Y/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103025119A (en) * | 2011-09-22 | 2013-04-03 | 富瑞精密组件（昆山）有限公司 | Heat dissipation device |
| CN107957764A (en) * | 2017-12-04 | 2018-04-24 | 四川省守望信息科技有限责任公司 | A kind of cooling system for computer |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |