CN204005868U - LED radiator - Google Patents
LED radiator Download PDFInfo
- Publication number
- CN204005868U CN204005868U CN201420476058.9U CN201420476058U CN204005868U CN 204005868 U CN204005868 U CN 204005868U CN 201420476058 U CN201420476058 U CN 201420476058U CN 204005868 U CN204005868 U CN 204005868U
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- China
- Prior art keywords
- heat sink
- metal substrate
- sink strip
- radiator
- heat
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- Expired - Fee Related
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- 239000000758 substrate Substances 0.000 claims abstract description 58
- 229910052751 metal Inorganic materials 0.000 claims abstract description 55
- 239000002184 metal Substances 0.000 claims abstract description 55
- 230000017525 heat dissipation Effects 0.000 claims abstract description 8
- 239000004411 aluminium Substances 0.000 claims description 15
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 230000001154 acute effect Effects 0.000 claims description 5
- 239000000919 ceramic Substances 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 7
- 230000005855 radiation Effects 0.000 description 10
- 238000004512 die casting Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000005482 strain hardening Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The application discloses LED radiator.One detailed description of the invention of described radiator comprises metal substrate, multiple heat sink strips, printed circuit; Described heat sink strip is the bar that one end is arranged at metal substrate side, and wherein, described multiple heat sink strips are arranged at respectively on two parallel sides of described metal substrate, is positioned at multiple heat sink strips on same side and is formed for the heat dissipation channel of circulation of air; Described printed circuit is covered on the surface of described metal substrate.This embodiment has been realized and under less area of dissipation, has been met required radiating effect, need not pcb board be additionally installed again, and heatsink weight is light, thin thickness, can make thinner light fixture, effectively reduce light fixture side front face area, improve light fixture reliability, extended lamp life.
Description
Technical field
The application relates to LED technical field, is specifically related to LED lighting technical field, relates in particular to LED radiator.
Background technology
LED light source only has 30%～40% electric energy conversion to become luminous energy in when work, remaining electric energy conversion has become heat energy, the accumulation of heat can cause LED junction temperature to raise, cause the decline of LED luminous efficiency, life-span to decline, in LED use procedure, conduct heat, the quality of heat radiation, directly affect the quality of LED illuminating product.
At present, in illumination market, common radiator heat-dissipation mode mainly contains active heat removal and passive heat radiation.Active heat removal is to strengthen Air Flow by fan, utilizes the air of rapid flow that a large amount of heats is taken away, thereby reaches the object of heat radiation.Active heat removal has certain market in indoor lamp, but because outdoor environment is comparatively severe, the problem such as exist fan easily to damage, cost is higher, and therefore, the method is applied less in outdoor lamp.Passive heat radiation is to utilize air natural to flow, and the heat on fin is taken away, and reaches the object of heat radiation, and conventional passive heat radiation device mainly contains 3 kinds at present, and one is to utilize aluminium extruded or extrusion process to form radiating fin, and air carries out heat exchange along radiating fin.This passive heat radiation device is owing to not staying the upper lower channel of circulation of air between radiating fin, air circulation is very poor, need to reduce radiator temperature rise by increasing area of dissipation, and radiator is heavier, the hot and cold cross-ventilation at radiator middle part is seriously obstructed, and has the problem of heat skewness.And the radiator thermal conductivity factor of die casting is not high, also existing problems of heat conduction.Another kind is heat-pipe radiator, utilizes and dispels the heat away from fin and the air heat exchange in hot junction.The radiator of this kind utilizes the phase transformation of heat pipe medium, take heat to cold junction from hot junction fast, thermal conductivity factor is high, the heat conducting problem effectively solving, the fin of cold junction is penetrating up and down, be conducive to circulation of air, but heat-pipe radiator cost is higher, technique is more complicated, have the problems such as the reliability that heat pipe is connected with fin.Also having a kind of is reinforcement heat loss through convection, leaves the passage that guarantee air circulates up and down when Al squeezing material is carried out to post-production or die casting, reaches the object that improves air velocity, accelerates heat exchange.This radiator leaves the passage of circulation of air when Al squeezing material is carried out to post-production or die casting, fast compared with the air velocity of the first passive heat radiation device, convection coefficient is high, good heat dissipation effect.But Al squeezing material post-production has increased cost, also there is the problems such as thermal conductivity factor is low in the mode of die casting.
And, the no matter radiator of above-mentioned which kind of radiating mode, LED light source all will first be welded on pcb board, and then bonding pcb board or spiral shell are contained on radiator.The heat of LED light source in the time of work first passes on pcb board by heat sink, then passed on radiator through the mode of heat-conducting medium or directly contact conduction by pcb board.This connected mode, causes the approach of heat transmission long, more through medium, larger from the heat sink thermal resistance to radiator of light source, is unfavorable for heat radiation, once spreading medium is uneven or connection is not tight, easily causes the concentrated phenomenon of heat.
Utility model content
The application provides a kind of LED radiator, comprises metal substrate, multiple heat sink strips, printed circuit;
Described heat sink strip is the bar that one end is arranged at metal substrate side, and wherein, described multiple heat sink strips are arranged at respectively on two parallel sides of described metal substrate, is positioned at multiple heat sink strips on same side and is formed for the heat dissipation channel of circulation of air;
Described printed circuit is covered on the surface of described metal substrate.
In some embodiments, described metal substrate is aluminium base.
In some embodiments, described heat sink strip is aluminium base heat sink strip.
In some embodiments, the aluminium that the material of described aluminium base is high heat conduction.
In some embodiments, described metal substrate and described heat sink strip are structure as a whole.
In some embodiments, described multiple heat sink strips comprise multiple the first heat sink strips and multiple the second heat sink strip, and the axial direction of described the first heat sink strip is parallel mutually, and is all parallel to the plane at described metallic substrate surfaces place; The axial direction of multiple the second heat sink strips that is positioned at the same side of metal substrate is parallel mutually, and to point to the direction of the described second heat sink strip other end be acute angle with the angle forming to the direction of extending outside radiator perpendicular to described side in one end that is arranged at described side of described the second heat sink strip; Between every two adjacent the first heat sink strips, second heat sink strip is set.
In some embodiments, described printed circuit comprises the pad for welding LED.
In some embodiments, described printed circuit comprises heat conductive insulating layer, circuit layer, solder mask and silk-screen layer;
Described heat conductive insulating layer is attached on the surface of described metal substrate, and described circuit layer is positioned on described heat conductive insulating layer, and described solder mask covers the region that there is no pad on described circuit layer, and described silk-screen layer is positioned on described solder mask.
In some preferred embodiment, described heat conductive insulating layer is the polymer that ceramic powder filled forms.
The LED radiator that the application provides, by directly make heat sink strip on metal substrate, make heat sink strip and aluminium base integrated, and printed circuit is directly printed on the surface of metal substrate, thereby avoid the unreliability of mechanical connection, and, due to the good heat dissipation effect of metal substrate both sides heat sink strip, can realize and under less area of dissipation, meet required radiating effect, pcb board need not be additionally installed again, heatsink weight is light, thin thickness, can make thinner light fixture, effectively reduce light fixture side front face area, improve light fixture reliability, extend lamp life.
Brief description of the drawings
By reading the detailed description that non-limiting example is done of doing with reference to the following drawings, it is more obvious that the application's other features, objects and advantages will become:
Fig. 1 is the radiator surface structure schematic diagram of an embodiment of the application LED radiator;
Fig. 2 is the radiator surface structure schematic diagram of an embodiment of the application LED radiator;
Fig. 3 is the structural representation of the heat sink strip of the application LED radiator;
Fig. 4 is the radiator 3D structural representation of another embodiment of the application LED radiator;
Fig. 5 is the radiator cross-sectional structure schematic diagram of another embodiment of the application LED radiator;
Fig. 6 is the structural representation of heat conductive insulating layer and circuit layer in the printed circuit of another embodiment of the application LED radiator;
Fig. 7 is the structural representation of solder mask and silk-screen layer in the printed circuit of another embodiment of the application LED radiator.
Detailed description of the invention
Below in conjunction with drawings and Examples, the application is described in further detail.Be understandable that, specific embodiment described herein is only for explaining relevant utility model, but not restriction to this utility model.It also should be noted that, for convenience of description, in accompanying drawing, only show with about the relevant part of utility model.
It should be noted that, in the situation that not conflicting, the feature in embodiment and embodiment in the application can combine mutually.Describe below with reference to the accompanying drawings and in conjunction with the embodiments the application in detail.
Please refer to Fig. 1, it shows structural representation Figure 100 of an embodiment of LED radiator.Described LED radiator, comprises metal substrate 1, multiple heat sink strips 2, printed circuit 3; Heat sink strip 2 is arranged at the bar of metal substrate side for one end, and wherein, multiple heat sink strips are arranged at respectively on two parallel sides of metal substrate 1, is positioned at multiple heat sink strips on same side and is formed for the heat dissipation channel of circulation of air; Printed circuit 3 is covered on the surface of described metal substrate.Printed circuit 3 comprises the pad 4 for welding LED.
In the present embodiment, heat sink strip 2 is bar, and the cross section of heat sink strip can be rectangle, can be also circular, can also be other polygons, and the application does not limit the specific nature of heat sink strip.
In the present embodiment, on two parallel sides of metal substrate 1, be provided with multiple heat sink strips, one end of each heat sink strip is arranged on the side of metal substrate 1, and the other end extends to the direction outside radiator.Between adjacent heat sink strip, be not arranged together closely, but reserve certain space.Heat sink strip 2 can form comb teeth-shaped in the both sides of metal substrate 1, and heat sink strip 2 also can form an angle with the side shape of the surface of metal substrate 1 or metal substrate 1, specifically how to arrange for heat sink strip, forms which kind of shape, and the application does not limit this.
In the present embodiment, printed circuit 3 is directly printed on the surface of metal substrate, printed circuit 3 comprises the pad 4 for welding LED, therefore, LED directly can be welded on metal substrate radiator, and do not need first LED to be welded on pcb board, and then pcb board is fixed on radiator.
The LED radiator that the application provides, by directly make heat sink strip on metal substrate, make heat sink strip and aluminium base integrated, and printed circuit is directly printed on the surface of metal substrate, thereby avoid the unreliability of mechanical connection, and, due to the good heat dissipation effect of metal substrate both sides heat sink strip, can realize and under less area of dissipation, meet required radiating effect, pcb board need not be additionally installed again, heatsink weight is light, thin thickness, can make thinner light fixture, effectively reduce light fixture side front face area, improve light fixture reliability, extend lamp life.
In some optional embodiments, metal substrate is aluminium base, and heat sink strip is aluminium base heat sink strip.In the present embodiment, adopt the aluminium of high heat conduction, carry out cold working and make radiator, the lighter weight of aluminium, and there is high-termal conductivity, thermal conductivity factor, higher than Al squeezing material radiator and pack alloy radiator, makes radiator uniform temperature better.Certainly, which kind of material metal substrate is specially, and the application does not limit this.
In some optional embodiments, metal substrate and heat sink strip are structure as a whole.Particularly, heat sink strip is on metal substrate, to carry out the machinings such as punching press, forging and stamping by cold worked mode, directly on metal substrate, make, heat sink strip and metal substrate are one, metal substrate and heat sink strip integrated make radiator simple in structure, reliability is high.
In some optional embodiments, heat sink strip is axially to the direction of extending outside radiator and the side of the metal substrate perpendicular to heat sink strip place and parallel to the direction of extending outside radiator, or the angle forming is acute angle.Wherein, as shown in Figure 2, direction 201 and direction 202 are the side perpendicular to the metal substrate at heat sink strip place, and to the direction of extending outside radiator.The length axle that heat sink strip is axially heat sink strip to the direction of extending outside radiator points to the direction beyond metal substrate, and as shown in Figure 3, direction 301 is for heat sink strip is axially to the direction of extending outside radiator.Preferably, heat sink strip is axially more than or equal to 0 ° to the direction of extending outside radiator and the angle that side the outward extending direction of the metal substrate perpendicular to heat sink strip place form, and is less than or equal to 60 °.The application does not limit the axial outward extending concrete direction of heat sink strip.
In some optional embodiments, multiple heat sink strips comprise multiple the first heat sink strips and multiple the second heat sink strip, and the axial direction of described the first heat sink strip is parallel mutually, and is all parallel to the plane at described metallic substrate surfaces place; The axial direction of multiple the second heat sink strips that is positioned at the same side of metal substrate is parallel mutually, and to point to the direction of the described second heat sink strip other end be acute angle with the angle forming to the direction of extending outside radiator perpendicular to described side in one end that is arranged at described side of described the second heat sink strip; Between every two adjacent the first heat sink strips, second heat sink strip is set.
In the present embodiment, the heat sink strip that is positioned at the same side of metal substrate can be divided into two parts, a part is the first heat sink strip, the length axial direction of all the first heat sink strips that are positioned at metal substrate same side is all parallel to the surface of metal substrate, as shown in Figure 4,5,401,501 is the first heat sink strip.Another part is the second heat sink strip, the length axial direction of all the second heat sink strips that are positioned at metal substrate same side is parallel to each other, and with the angle forming to the direction of extending outside radiator perpendicular to side be acute angle, as shown in Figure 4,5,402,502 is the second heat sink strip.The first heat sink strip is equidistantly spaced, and the second heat sink strip is positioned at the position that the first heat sink strip is adjacent, between every two adjacent the first heat sink strips, second heat sink strip is set, and between every two adjacent the second heat sink strips, first heat sink strip is set.
It should be noted that, can be by the angle between width, the first heat sink strip and second heat sink strip of change heat sink strip, the shape of heat sink strip, the length of heat sink strip, adjust the radiating effect of radiator, thereby meet the demand of different LED lighting heat radiation, therefore, what angle between width, the first heat sink strip and second heat sink strip of heat sink strip, the shape of heat sink strip, the length of heat sink strip is specially, and the application does not limit this.
In some optional embodiments, printed circuit 3 comprises heat conductive insulating layer, circuit layer, solder mask and silk-screen layer; Heat conductive insulating layer is attached on the surface of metal substrate, and circuit layer is positioned on heat conductive insulating layer, and solder mask covers the region that there is no pad on circuit layer, and silk-screen layer is positioned on solder mask.
In the present embodiment, as shown in Figure 6,601 is heat conductive insulating layer, and 602 is circuit layer.Heat conductive insulating layer 601 is directly attached on metal substrate, and circuit layer 602 is positioned on heat conductive insulating layer 601.Wherein, heat conductive insulating layer 601 is that the polymer being formed by ceramic powder filled forms, and circuit layer is made up of Copper Foil, and preferably, the thickness of Copper Foil is 35 μ m.As shown in Figure 7,701 is solder mask, and 702 is silk-screen layer.Solder mask 701 is covered on circuit layer, reserves the pad of welding device, and silk-screen layer 702 is positioned on solder mask 701.Wherein, solder mask preferably adopts white welding resistance ink, and silk-screen layer preferably adopts black ink.Pad is directly used in welding LED.
More than describing is only the application's preferred embodiment and the explanation to institute's application technology principle.Those skilled in the art are to be understood that, related utility model scope in the application, be not limited to the technical scheme that the particular combinations of above-mentioned technical characterictic forms, also should be encompassed in the situation that does not depart from described utility model design simultaneously, be combined and other technical scheme of forming by above-mentioned technical characterictic or its equivalent feature.The technical characterictic that for example, in above-mentioned feature and the application disclosed (but being not limited to) has a similar functions is replaced mutually and the technical scheme that forms.
Claims (9)
1. a LED radiator, is characterized in that, comprises metal substrate, multiple heat sink strips, printed circuit;
Described heat sink strip is the bar that one end is arranged at metal substrate side, and wherein, described multiple heat sink strips are arranged at respectively on two parallel sides of described metal substrate, is positioned at multiple heat sink strips on same side and is formed for the heat dissipation channel of circulation of air;
Described printed circuit is covered on the surface of described metal substrate.
2. radiator according to claim 1, is characterized in that, described metal substrate is aluminium base.
3. according to the radiator described in any one in claim 1 or 2, it is characterized in that, described heat sink strip is aluminium base heat sink strip.
4. radiator according to claim 2, is characterized in that, the aluminium that the material of described aluminium base is high heat conduction.
5. radiator according to claim 1, is characterized in that, described metal substrate and described heat sink strip are structure as a whole.
6. radiator according to claim 1, it is characterized in that, described multiple heat sink strip comprises multiple the first heat sink strips and multiple the second heat sink strip, and the axial direction of described the first heat sink strip is parallel mutually, and is all parallel to the plane at described metallic substrate surfaces place; The axial direction of multiple the second heat sink strips that is positioned at the same side of metal substrate is parallel mutually, and to point to the direction of the described second heat sink strip other end be acute angle with the angle forming to the direction of extending outside radiator perpendicular to described side in one end that is arranged at described side of described the second heat sink strip; Between every two adjacent the first heat sink strips, second heat sink strip is set.
7. radiator according to claim 1, is characterized in that, described printed circuit comprises the pad for welding LED.
8. radiator according to claim 7, is characterized in that, described printed circuit comprises heat conductive insulating layer, circuit layer, solder mask and silk-screen layer;
Described heat conductive insulating layer is attached on the surface of described metal substrate, and described circuit layer is positioned on described heat conductive insulating layer, and described solder mask covers the region that there is no pad on described circuit layer, and described silk-screen layer is positioned on described solder mask.
9. radiator according to claim 8, is characterized in that, described heat conductive insulating layer is the polymer that ceramic powder filled forms.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420476058.9U CN204005868U (en) | 2014-08-21 | 2014-08-21 | LED radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420476058.9U CN204005868U (en) | 2014-08-21 | 2014-08-21 | LED radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204005868U true CN204005868U (en) | 2014-12-10 |
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ID=52045866
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420476058.9U Expired - Fee Related CN204005868U (en) | 2014-08-21 | 2014-08-21 | LED radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204005868U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287325A (en) * | 2015-05-29 | 2017-01-04 | 广州武宏科技股份有限公司 | A kind of heat-radiating integrated LED lamp |
| CN109519788A (en) * | 2018-12-14 | 2019-03-26 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
-
2014
- 2014-08-21 CN CN201420476058.9U patent/CN204005868U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106287325A (en) * | 2015-05-29 | 2017-01-04 | 广州武宏科技股份有限公司 | A kind of heat-radiating integrated LED lamp |
| CN109519788A (en) * | 2018-12-14 | 2019-03-26 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
| CN109519788B (en) * | 2018-12-14 | 2024-05-03 | 众普森科技（株洲）有限公司 | Aluminum substrate lamp body, aluminum substrate lamp body forming method and floodlight |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 Termination date: 20170821 |
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| CF01 | Termination of patent right due to non-payment of annual fee |