CN210926005U - Integrated antenna packaging structure - Google Patents

Abstract

The utility model discloses an integrated antenna packaging structure, comprising a packaging body, an RDL metal layer, a conductive connection part, a bare chip and a conductive structure, wherein the RDL metal layer, the conductive connection part, the bare chip and the conductive structure are located in the packaging body; the conductive The structure includes a first surface and a second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the package body or protrudes from the package body; there are multiple conductive connection parts, conductive One end of the connecting part is electrically connected to the RDL metal layer, and the other end is electrically connected to the bare chip or the conductive structure; the RDL metal layer has an antenna structure. The packaged antenna of the utility model has excellent performance, greatly reduced volume and low package cost.

Description

Integrated Antenna Package Structure

technical field

The utility model relates to the technical field of semiconductor packaging, in particular to an integrated antenna packaging structure.

Background technique

With the large-scale promotion of IoT technology, 2.4G, BLE, WIFI and other technologies have occupied the main market in IoT applications, and at the same time, the demand for miniaturization, light weight, high integration and low cost of wireless systems is constantly increasing. The application of antenna-in-package (AIP) technology to the 2.4G frequency band has been further strengthened. This technology can not only reduce the technical development threshold of solution companies, but also reduce the volume and cost, providing a good solution for the further integration of 2.4G wireless systems. solution. However, due to the relatively long wavelength of the 2.4G frequency band, it is difficult to integrate the antenna into the package, even if it is integrated, it either sacrifices performance, sacrifices volume, or increases the packaging cost.

Utility model content

Purpose of the utility model: In order to solve the problem that the antenna is difficult to integrate into the package in the prior art, the utility model provides an integrated antenna package structure.

Technical solution: an integrated antenna package structure, comprising a package body, an RDL metal layer, a conductive connection part, a bare chip and a conductive structure, wherein the RDL metal layer, the conductive connection part, the bare chip and the conductive structure are located in the package body; the conductive structure includes The first surface and the second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the package body or protrudes from the package body; there are multiple conductive connection parts, and the conductive connection part One end is connected to the RDL metal layer, and the other end is connected to a bare chip or a conductive structure; the RDL metal layer has an antenna structure.

Further, the conductive connection part includes at least a first conductive connection part and a second conductive connection part, the first conductive connection part is used to connect the RDL metal layer and the radio frequency signal interface of the bare chip; the second conductive connection part is used to connect the RDL Metal layers and conductive structures.

Further, the antenna structure on the RDL metal layer adopts an IFA antenna.

Further, the antenna structure includes an antenna feeding part, an antenna grounding part and an antenna radiating arm. One end of the antenna feeding part is connected to the first conductive connection part, the other end is connected to one end of the antenna grounding part, and the other end of the antenna grounding part is connected to the first conductive connecting part. the second conductive connecting part; the antenna radiating arm is drawn out from the connection between the antenna feeding part and the antenna grounding part; the antenna radiating arm includes a tail part and a plurality of bending parts, the multiple bending parts are connected end to end, and the tail part is connected at the end of the bending part and perpendicular to the antenna feeder.

Further, the antenna structure on the RDL metal layer is fed in a coplanar waveguide manner.

Further, the antenna structure includes a center conductor strip, a first metal patch, a second metal patch, a third metal patch and a fourth metal patch; a center conductor strip, a first metal patch, and a second metal patch There is no conductive contact between the sheet, the third metal patch and the fourth metal patch; the first metal patch and the second metal patch are symmetrically distributed on both sides of the center conductor strip, the first metal patch, the second metal patch The metal patches are respectively connected with a second conductive connection part; one end of the central conductor strip is connected with the first conductive connection part; the third metal patch is located outside the other end of the central conductor strip; the fourth metal patch is located in the third metal patch On the periphery of the patch, rectangular grooves are arranged between the fourth metal patch and the first metal patch, and between the fourth metal patch and the second metal patch; the first metal patch, the second metal patch and the The four metal patches are provided with slits; the antenna structure is square, and a pair of corners of the square are chamfered corners.

Further, the slits on the first metal patch and the second metal patch include several branches, and the several branches are distributed in a divergent manner.

Further, the slits on the first metal patch and the second metal patch are cross-shaped slits, and each branch is of equal length and equal width.

Further, the slot on the fourth metal patch includes a U-shaped slot, and the U-shaped slot accommodates the third metal patch in the U-shaped opening of the U-shaped slot.

Further, the conductive connection part is made by a bump process, or a metallized through hole; the conductive structure includes one or more of a base island, a substrate, and a pad.

Compared with the prior art, the integrated antenna packaging structure provided by the present invention has the following advantages:

1. The existing chip internal packaging structure layer and packaging materials are used, which greatly reduces the packaging structure and material costs;

2. The low profile and size of the antenna can be achieved by connecting the antenna with the radio frequency signal and the ground layer by using the conductive connection part;

3. The coplanar waveguide feeding method can realize the antenna design with only one layer of RDL metal layer, which simplifies the internal stacking structure of the package, and can flexibly achieve 50 ohm impedance matching and flexibly adjust the connection with the grounding metal patch during design. Slot distance to adjust the impedance bandwidth and antenna gain of the antenna;

4. Using the excitation method of coplanar waveguide and grounded metal patch slot coupling, the integration of low-frequency antennas can be realized in a small area; the IFA antenna is used to achieve the integration of low-frequency antennas by lengthening and increasing the number of bent parts; It is suitable for antennas of ≥2.4G frequency band, and the AIP size of 2.4G frequency band can be 6mm*6mm;

5. Epoxy resin is used as the medium, which is the material used in conventional chip packaging. The cost is low, and the dielectric constant and loss tangent are relatively stable in high and low temperature environments. Adjusting the height of the epoxy resin can fine-tune the bandwidth and resonant frequency of the antenna. point.

Description of drawings

1 is a schematic structural diagram of an integrated antenna package according to Embodiment 1;

FIG. 2 is a schematic structural diagram of the RDL metal layer according to the first embodiment;

FIG. 3 is a schematic structural diagram of the RDL metal layer according to the second embodiment.

Detailed ways

The present utility model will be further explained below with reference to the accompanying drawings and specific embodiments.

Example 1:

As shown in FIG. 1, an integrated antenna package structure includes a package body 6, an RDL metal layer 1, a conductive connection part, a bare chip 3 and a conductive structure 4, an RDL metal layer 1, a conductive connection part, a bare chip 3 and a conductive structure 4 is located in the package body 6, the package body 6 is made of epoxy resin, and the package body 6 is evenly filled around the RDL metal layer 1, the conductive connection part, and the bare chip 3; the conductive structure 4 includes a first surface and The second surface, the first surface of the conductive structure 4 is electrically connected to the die 3, the second surface of the conductive structure 4 is flush with the surface of the package body 6, and can also extend out of the package body 6; the RDL metal layer 1 has an antenna structure. In this embodiment, there are two conductive connection parts, including a first conductive connection part 2 and a second conductive connection part 5, and the first conductive connection part 2 is used to electrically connect the RDL metal layer 1 and the radio frequency signal interface of the bare chip 3; The second conductive connection parts 5 are used to electrically connect the RDL metal layer 1 and the conductive structure 4 , and the conductive connection parts can also be provided in other numbers according to the needs of the antenna. The conductive structure 4 in this embodiment is a pad, and may also be other conductive structures, which can realize electrical connection with the outside world.

The conductive connection part is made by a bump process, or can be made by a metallized through hole or other processes that can realize conductive connection; the conductive structure can be a base island, a substrate, or a pad.

As shown in FIG. 2 , the antenna structure on the RDL metal layer 1 adopts an IFA antenna, including an antenna feeding part 11 , an antenna grounding part 12 and an antenna radiating arm 13 , and one end of the antenna feeding part 11 is connected to the first conductive connecting part 2. The other end is connected to one end of the antenna grounding portion 12, and the other end of the antenna grounding portion 12 is connected to the second conductive connecting portion 5; The tail portion is connected to a plurality of bending portions, the plurality of bending portions are connected end to end, and the tail portion is connected to the end of the bending portion and is perpendicular to the antenna feeding portion 11 .

The first conductive connection part 2 connects the antenna feeding part 11 with the radio frequency signal interface of the bare chip 3 to complete the feed excitation; the second conductive connection part 5 connects the antenna grounding part 12 and the ground of the bare chip 3 .

The epoxy resin is uniformly filled under the RDL metal layer 1 , and the bandwidth and resonance frequency of the antenna can be adjusted by adjusting the height of the package body 6 . Using the length and width of the RDL metal layer, the width of the antenna radiating arm 13 and the number of bent parts are sufficiently increased to achieve the desired resonance frequency and radiation gain, and the linear polarization of the antenna can be realized.

Embodiment 2:

An integrated antenna package structure includes a package body 6 , an RDL metal layer 1 , a conductive connection portion, a bare chip 3 and a conductive structure 4 , and the RDL metal layer 1 , the conductive connection portion, the bare chip 3 and the conductive structure 4 are located in the package body 6 . , the package body 6 is made of epoxy resin, and the package body 6 is evenly filled around the RDL metal layer 1, the conductive connection part, and the bare chip 3; the conductive structure 4 includes a first surface and a second surface, and the conductive structure The first surface of 4 is electrically connected to the bare chip 3, and the second surface of the conductive structure 4 is flush with the surface of the package body 6, and can also extend out of the package body 6; the RDL metal layer 1 has an antenna structure. In this embodiment, there is a first conductive connection part 2 and two second conductive connection parts 5, the first conductive connection part 2 is used to electrically connect the RDL metal layer 1 and the radio frequency signal interface of the bare chip 3; the second conductive connection The part 5 is used to electrically connect the RDL metal layer 1 and the conductive structure 4, and the conductive connection parts can also be provided in other numbers according to the needs of the antenna. The conductive structure 4 in this embodiment is a pad, and may also be other conductive structures, which can realize electrical connection with the outside world.

The conductive connection part is made by a bump process, or can be made by a metallized through hole or other processes that can realize conductive connection; the conductive structure can be a base island, a substrate, or a pad.

As shown in FIG. 3 , the antenna structure on the RDL metal layer 1 of this embodiment is fed by a coplanar waveguide, including a central conductor strip 21 , a first metal patch 22 , a second metal patch 23 , and a third metal patch sheet 24 and fourth metal patch 25; there is no conductive contact between the center conductor strip 21, the first metal patch 22, the second metal patch 23, the third metal patch 24 and the fourth metal patch 25 ; The first metal patch 22 and the second metal patch 23 are symmetrically distributed on both sides of the center conductor strip 21, and the first metal patch 22 and the second metal patch 23 are respectively connected with a second conductive connection part 5; the center One end of the conductor strip 21 is connected to the first conductive connection part 2; the third metal patch 24 is located outside the other end of the central conductor strip 21; the fourth metal patch 25 is located at the periphery of the third metal patch 24, and the fourth metal patch 25 and the first metal patch 22 and between the fourth metal patch 25 and the second metal patch 23 are provided with rectangular grooves 26; the first metal patch 22, the second metal patch 23 and the fourth metal patch 26 The patch 25 is provided with a slot; the antenna structure is square, and one pair of corners of the square is a chamfered corner 27, and the rectangular slot 26 and the chamfered corner 27 are used to realize circular polarization of the antenna.

The slits on the first metal patch 22 and the second metal patch 23 include several branches in a divergent distribution. In this embodiment, the gaps on the first metal patch 22 and the second metal patch 23 are cross-shaped gaps 28, and the branches of the cross-shaped are of equal length and width. .

The gap on the fourth metal patch 25 is a U-shaped slot 29. The U-shaped slot 29 accommodates the third metal patch 24 in the U-shaped opening of the U-shaped slot 29. Other gaps can also be added on the basis of the U-shaped slot. structure, but the U-shaped slit 29 is easier to debug.

The Coplanar Waveguide (CPW) structure is connected to the RF signal transmission interface of the bare chip through the first conductive connection part 2 to complete the feeding of the antenna; if the dielectric material and the thickness of the dielectric are fixed, the width and The width of the gap with the ground metal patch can adjust the impedance and the strength of the gap energy coupling.

On the one hand, the U-shaped slot 29 can increase the current cross section to realize the resonance of the low-frequency antenna in a small area, and on the other hand, a multi-tuning circuit can be formed to reduce the Q value to increase the radiation bandwidth; the cross-shaped slot 28 can be adjusted by adjusting the length of the cross slot and The width parameter adjusts the resonant frequency of the antenna, and reduces the resonant frequency of the antenna without affecting the performance of the antenna, thereby further reducing the size of the antenna. Therefore, the main function of the cross-shaped slot and the U-shaped slot is to realize a low-frequency antenna on a smaller metal patch, that is, to reduce the resonant frequency of the antenna.

The feeding plane on the RDL metal layer 1 is fed by a coplanar waveguide method, which requires only one RDL metal layer, which greatly reduces the packaging cost, and can realize linear polarization, circular polarization and multi-band antennas. It is also better than the first embodiment. The antenna structure on the RDL metal layer 1 adopts multiple metal patches, and multiple slot couplings are formed between the metal patches and between the metal patches and the center conductor strip, which can greatly reduce the size of the antenna. The epoxy resin is uniformly filled under the RDL metal layer 1 , and the bandwidth and resonance frequency of the antenna can be adjusted by adjusting the height of the package body 6 .

Claims (10)

1. an integrated antenna package structure, is characterized in that, comprises package body, RDL metal layer, conductive connection part, bare chip and conductive structure, RDL metal layer, conductive connection part, bare chip and conductive structure are located in the package body; Described The conductive structure includes a first surface and a second surface, the first surface of the conductive structure is electrically connected to the bare chip, and the second surface of the conductive structure is flush with the surface of the package body or protrudes from the package body; there are multiple conductive connection parts, One end of the conductive connection part is connected to the RDL metal layer, and the other end is connected to the bare chip or the conductive structure; the RDL metal layer has an antenna structure. 2 . The integrated antenna package structure according to claim 1 , wherein the conductive connection part comprises at least a first conductive connection part and a second conductive connection part, and the first conductive connection part is used for connecting the RDL metal layer and the bare metal layer. 3 . The radio frequency signal interface of the chip; the second conductive connection part is used to connect the RDL metal layer and the conductive structure. 3 . The integrated antenna package structure according to claim 2 , wherein the antenna structure on the RDL metal layer adopts an IFA antenna. 4 . 4 . The integrated antenna package structure according to claim 3 , wherein the antenna structure comprises an antenna feeding part, an antenna grounding part and an antenna radiating arm, and one end of the antenna feeding part is connected to the first conductive connecting part. 5 . , the other end is connected to one end of the antenna grounding part, and the other end of the antenna grounding part is connected to the second conductive connecting part; the antenna radiating arm is drawn out from the connection between the antenna feeding part and the antenna grounding part; the antenna radiating arm includes a tail part and a plurality of bending parts, The plurality of bending parts are connected end to end, and the tail parts are connected at the end of the bending part and are perpendicular to the antenna feeding part. 5 . The integrated antenna package structure according to claim 2 , wherein the antenna structure on the RDL metal layer is fed by a coplanar waveguide. 6 . 6. The integrated antenna package structure according to claim 5, wherein the antenna structure comprises a center conductor strip, a first metal patch, a second metal patch, a third metal patch and a fourth metal patch ; There is no conductive contact between the center conductor strip, the first metal patch, the second metal patch, the third metal patch and the fourth metal patch; the first metal patch and the second metal patch are symmetrically distributed On both sides of the center conductor strip, the first metal patch and the second metal patch are connected to a second conductive connection part respectively; one end of the center conductor strip is connected to the first conductive connection part; the third metal patch is located on the center conductor Outside the other end of the belt; the fourth metal patch is located on the periphery of the third metal patch, and a rectangle is provided between the fourth metal patch and the first metal patch, and between the fourth metal patch and the second metal patch a slot; the first metal patch, the second metal patch and the fourth metal patch are provided with slits; the antenna structure is square, and a pair of corners of the square are chamfered corners. 7 . The integrated antenna package structure according to claim 6 , wherein the slits on the first metal patch and the second metal patch comprise several branches, and the several branches are distributed in a divergent manner. 8 . 8 . The integrated antenna package structure according to claim 7 , wherein the slits on the first metal patch and the second metal patch are cross-shaped slits, and each branch is of equal length and equal width. 9 . 9. The integrated antenna package structure according to any one of claims 6 to 8, wherein the slot on the fourth metal patch comprises a U-shaped slot, and the U-shaped slot accommodates the third metal patch in a space of the U-shaped slot. U-shaped opening. 10. The integrated antenna package structure according to any one of claims 1-8, wherein the conductive connection portion is made by a bump process or a metallized through hole; the conductive structure comprises a base island, a lining One or more of bottom and pad.

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