CN217607814U

CN217607814U - Optical module

Info

Publication number: CN217607814U
Application number: CN202221234616.1U
Authority: CN
Inventors: 张强; 赵其圣; 杨世海; 曲一帆
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-05-19
Filing date: 2022-05-19
Publication date: 2022-10-18
Anticipated expiration: 2032-05-19

Abstract

The application discloses optical module, including laser chip, optical detector, laser driver chip, first power chip and MCU. The laser chip comprises a light emitting area and a modulation area and is used for emitting data light and first monitoring light. And the optical detector is connected with the laser driving chip or the MCU and used for generating a first monitoring current. And the laser driving chip is respectively connected with the first pin of the MCU, the light emitting area and the anode of the modulation area. And the first power supply chip is respectively connected with the second pin of the MCU and the anode of the modulation region and is used for providing bias voltage for the modulation region. The MCU is used for calculating according to a first preset variable to obtain the calibration light power, the first preset variable comprises a first acquisition current and a bias voltage, the first acquisition current is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current. In the application, the MCU calculates to obtain the calibration optical power according to the first acquisition current and the bias voltage, and the accuracy of monitoring and calibrating the optical power is improved.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

The laser of the optical module comprises a directly modulated laser and an externally modulated laser. Since the directly Modulated Laser is not suitable for long-distance and high-speed communication transmission, an externally Modulated Laser, such as an Electro-absorption Modulated Laser (EML), is generally used for long-distance optical communication transmission or high-speed optical communication transmission.

In the existing Optical module, an MPD (Monitor Photo Detector) is usually placed on the back of the EML in the TOSA (Transmitter Optical Subassembly), that is, the emitted Optical power of the EML is monitored by collecting the MPD monitoring current. Wherein, the EML comprises LD and EA.

Because the mPD is located in the backlight direction of the LD, only the light-emitting condition of the LD can be monitored, and the absorption condition of the EA to the light emitted by the LD cannot be truly fed back. Although the laser has the TEC, the operating temperature is relatively stable, but the aging characteristics of the LD and EA regions may differ with the aging of the laser, and the change of the emitted light power caused by aging and other factors cannot be fed back only by using the method of collecting the MPD monitoring current, so that the monitored emitted light power of the EML is not accurate enough.

SUMMERY OF THE UTILITY MODEL

The application provides an optical module, improves the precision of control calibration luminous power.

A light module, comprising:

a circuit board;

the optical transceiving component is electrically connected with the circuit board and comprises a laser chip and an optical detector;

the circuit board is provided with a laser driving chip, a first power supply chip and an MCU;

a laser chip including a light emitting region and a modulation region for emitting data light and first monitoring light;

the optical detector is connected with the laser driving chip or the MCU and used for receiving the first monitoring light to generate a first monitoring current;

the laser driving chip is provided with a first pin connected with a first pin of the MCU, a second pin connected with the anode of the light emitting area, and a third pin connected with the anode of the modulation area;

the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin of the first power supply chip is connected with the anode of the modulation region and used for providing bias voltage for the modulation region;

and the MCU is used for calculating to obtain the calibration light power according to a first preset variable, wherein the first preset variable comprises a first acquisition current and a bias voltage, the first acquisition current is a first mirror current or a first monitoring current, and the mirror current corresponds to the first monitoring current.

A light module, comprising:

a circuit board;

the circuit board is provided with a laser driving chip and an MCU;

a laser chip including a light emitting region for emitting data light and first monitoring light;

the laser driving chip is provided with a first pin connected with a first pin of the MCU, and a second pin connected with the anode of the luminous zone;

and the MCU is used for calculating to obtain the calibration light power according to a first preset variable, wherein the first preset variable comprises a first acquisition current, and the first acquisition current is a first monitoring current.

A light module, comprising:

a circuit board;

the optical transceiving component is electrically connected with the circuit board and comprises a laser chip, an optical splitter and an optical detector;

a laser chip including a light emitting region and a modulation region for emitting data light;

the optical splitter is positioned between the laser chip and the optical detector and is used for splitting the data light into first data light and second monitoring light;

the light detector is positioned in front of the laser chip, cannot block the first data light, is connected with the MCU and is used for receiving the second monitoring light to generate a second monitoring current;

and the MCU is used for calculating to obtain the calibration light power according to a first preset variable, wherein the first preset variable comprises a second acquisition current and a bias voltage, the second acquisition current is a second mirror image current or a second monitoring current, and the second mirror image current corresponds to the second monitoring current.

A light module, comprising:

a circuit board;

the circuit board is provided with a laser driving chip and an MCU;

a laser chip including a light emitting region for emitting data light;

the laser driving chip is provided with a first pin connected with the first pin of the MCU, and a second pin connected with the anode of the light emitting area;

and the MCU is used for calculating to obtain the calibration light power according to a first preset variable, wherein the first preset variable comprises a second acquisition current, and the second acquisition current is a second monitoring current.

Has the beneficial effects that: the application provides an optical module, which comprises a circuit board and an optical transceiving component. And the optical transceiving component is electrically connected with the circuit board and comprises a laser chip and an optical detector. The circuit board is provided with a laser driving chip, a first power supply chip and an MCU. The laser chip includes a light emitting region and a modulation region for emitting data light and first monitoring light. And the optical detector is connected with the laser driving chip or the MCU and used for receiving the first monitoring light to generate a first monitoring current. And the first pin of the laser driving chip is connected with the first pin of the MCU, the second pin of the laser driving chip is connected with the anode of the luminous region, and the third pin of the laser driving chip is connected with the anode of the modulation region. And the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin of the first power supply chip is connected with the anode of the modulation region and used for providing bias voltage for the modulation region. The MCU is used for calculating according to a first preset variable to obtain the calibration light power, wherein the first preset variable comprises a first acquisition current and a bias voltage, the first acquisition current is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current. The MCU firstly collects a first preset variable, and calculates to obtain a first preset light power according to the first preset variable and a mapping relation between the preset light power and the first preset variable; and calculating according to the first preset optical power and the mapping relation between the preset optical power and the actual optical power to obtain the calibrated optical power. Because the first monitoring current is the current generated by the optical detector receiving the first monitoring light, and the first power supply chip provides bias voltage for the modulation region, the influence of the optical detector on the calibration optical power and the influence of the light emitting region on the calibration optical power are considered, and the accuracy of monitoring the calibration optical power is improved. In the application, the MCU calculates the calibration optical power according to the first acquisition current and the bias voltage, and the accuracy of monitoring and calibrating the optical power is improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

FIG. 5 is a block diagram of an optical transceiver component according to some embodiments;

FIG. 6 is an exploded view of an optical transceiver assembly according to some embodiments;

FIG. 7 is a first optical power monitoring schematic according to some embodiments;

FIG. 8 is a second optical power monitoring schematic according to some embodiments;

FIG. 9 is a third optical power monitoring schematic according to some embodiments;

FIG. 10 is a fourth optical power monitoring schematic according to some embodiments;

FIG. 11 is a fifth optical power monitoring schematic according to some embodiments;

FIG. 12 is a diagram of a sixth optical power monitoring concept according to some embodiments;

FIG. 13 is a diagram of a seventh optical power monitoring concept according to some embodiments;

FIG. 14 is an eighth optical power monitoring schematic according to some embodiments;

FIG. 15 is a diagram of a ninth optical power monitoring concept according to some embodiments;

FIG. 16 is a diagram of a tenth optical power monitoring concept according to some embodiments;

FIG. 17 is an eleventh optical power monitoring schematic according to some embodiments;

FIG. 18 is a diagram of a twelfth optical power monitoring concept according to some embodiments;

FIG. 19 is a diagram of a thirteenth optical power monitoring scheme according to some embodiments;

FIG. 20 is a diagram of a fourteenth optical power monitoring concept according to some embodiments;

fig. 21 is a fifteenth optical power monitoring schematic according to some embodiments.

Detailed Description

In the field of optical fiber communication technology, signals transmitted by information transmission devices such as optical fibers or optical waveguides are optical signals, and signals that can be recognized and processed by information processing devices such as computers are electrical signals, so that the optical signals and the electrical signals need to be converted into each other by using optical modules.

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, a bidirectional optical communication system is established between a remote server 1000 and a local information processing device 2000 through an optical fiber 101, an optical module 200, an optical network terminal 100, and a network cable 103.

One end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100.

The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

In the optical module 200, an optical port is configured to be connected with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be accessed into the optical network terminal 100, so that the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100.

The optical network terminal 100 is provided with an optical module interface 102 and a network cable interface 104. The optical module interface 102 is configured to access the optical module 200, so that the ont 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

Fig. 2 is a block diagram of an optical network terminal according to some embodiments, and as shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and the optical module 200 establishes a bidirectional electrical signal connection with the onu 100.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver module 400;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. Wherein, the opening 204 is an electric port, and the golden finger of the circuit board 300 extends out of the electric port 204 and is inserted into an upper computer; the opening 205 is an optical port configured to receive the external optical fiber 101 so that the optical fiber 101 is connected to the inside of the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In some embodiments, the upper housing 201 and the lower housing 202 are generally made of a metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further comprises an unlocking feature 203 located on an outer wall of its housing. When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is clamped in the cage of the upper computer by the clamping component of the unlocking component 203; when the unlocking member 203 is pulled, the engaging member of the unlocking member 203 moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engagement between the optical module 200 and the upper computer is released.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design.

The circuit board 300 is generally a rigid circuit board, which can also perform a bearing function due to its relatively rigid material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the upper computer cage.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The golden finger is configured to establish an electrical connection with the upper computer so as to realize power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, the flexible circuit board may be used with the circuit board 300 in some optical modules.

The optical transceiver module 400 is electrically connected to the circuit board 300.

Fig. 5 is a block diagram of an optical transceiver component according to some embodiments. Fig. 6 is an exploded view of an optical transceiver module according to an embodiment of the present application. As shown in fig. 5-6, in the embodiment of the present application, the optical transceiver module 400 includes a round-square tube 401, an optical transmitter 402, an optical receiver 403, an optical module 404, and a fiber adapter 405. In particular, the method comprises the following steps of,

the round and square tube 401 is provided with a first nozzle, a second nozzle and a third nozzle for carrying and fixing the optical transmitter 402, the optical receiver 403, the optical component 404 and the optical fiber adapter 405. Specifically, the light emitter 402 is embedded in the first pipe orifice, the light receiver 403 is embedded in the second pipe orifice, the optical component 404 is disposed in the inner cavity of the round and square pipe 401, and the optical fiber adapter 405 is embedded in the third pipe orifice.

Generally, the first nozzle and the second nozzle are respectively disposed on adjacent side walls of the round and square tube 401, the first nozzle and the third nozzle are respectively disposed on side walls of the round and square tube 401 in the length direction, and the second nozzle is disposed on side walls of the round and square tube 401 in the width direction.

The round and square tube 401 is generally made of metal material, which is beneficial to electromagnetic shielding and heat dissipation. Specifically, the light emitter 402 is in heat conduction contact with the round and square tube 401 through the first pipe opening, and the light receiver 403 is in heat conduction contact with the round and square tube 401 through the second pipe opening. The light emitter 402 and the light receiver 403 are directly press-fitted into the round and square tube body 401, and the round and square tube body 401 is in contact with the light emitter 402 and the light receiver 403, respectively, directly or through a heat transfer medium. The round and square tube 401 can be used for heat dissipation of the light emitter 402 and the light receiver 403, and heat dissipation effect of the light emitter 402 and the light receiver 403 is ensured.

The light emitter 402 is connected to the circuit board 300 through a flexible circuit board, and a laser chip is disposed therein for emitting data light. Specifically, the light emitter 402 includes a tube seat and a cap, the cap is disposed on the tube seat, and the cap and the tube seat enclose a cavity. The tube seat is provided with a laser chip and a first lens. The optical signal emitted by the laser chip is collimated by the first lens, then enters the optical component 404, and is coupled into the optical fiber adapter 405 after being converged by the optical component 404.

And the optical receiver 403 is connected with the circuit board 300 through a flexible circuit board, and is provided with an optical receiving chip inside for receiving optical signals. Specifically, the optical receiver 403 includes a tube seat and a tube cap, the tube cap is covered on the tube seat, and the tube cap and the tube seat enclose a cavity. The stem is provided with a light receiving chip and a second lens. The optical signal emitted by the optical fiber adapter 405 is reflected to the second lens in the optical receiver 403 through the optical component 404, and is converged to the optical receiving chip through the second lens.

The optical component 404 is disposed in the inner cavity of the round-square tube 401 and is used for adjusting the optical signal emitted by the optical transmitter 402 and adjusting the optical signal incident to the optical receiver 403.

A fiber optic adapter 405 for connecting optical fibers. Specifically, the optical transmitter 402 is embedded in a first pipe orifice of the round and square pipe body, the optical receiver 403 is embedded in a second pipe orifice of the round and square pipe body, the optical fiber adapter 405 is embedded in a third pipe orifice of the round and square pipe body, and the optical transmitter 402 and the optical receiver 403 are respectively connected with the optical fiber adapter 405 in an optical manner. The optical signal emitted by the optical transmitter 402 and the light received by the optical receiver 403 are transmitted through the same optical fiber in the optical fiber adapter 405, that is, the same optical fiber in the optical fiber adapter 405 is a transmission channel for the light to enter and exit the optical transceiver module, and the optical transceiver module realizes a single-fiber bidirectional optical transmission mode.

Fig. 7 is a first optical power monitoring schematic according to some embodiments. Fig. 8 is a second optical power monitoring schematic according to some embodiments. Fig. 9 is a third optical power monitoring schematic according to some embodiments. Fig. 10 is a fourth optical power monitoring schematic according to some embodiments. Fig. 11 is a fifth optical power monitoring schematic according to some embodiments. Fig. 12 is a sixth optical power monitoring schematic according to some embodiments. As can be seen from fig. 7 to 12, the optical transceiver module 400 includes a laser chip and a photodetector (MPD), and the circuit board 300 is provided with a laser driver chip, a first power chip and an MCU. In particular, the method comprises the following steps of,

a laser chip includes a light emitting region (LD) and a modulation region (EA) for emitting data light and first monitor light. Specifically, a TEC is arranged in a tube seat of the light emitter, a substrate is arranged on the TEC, and a laser chip is arranged on the substrate and comprises a light emitting area and a modulation area. The circuit board is provided with a TEC driving chip, the TEC driving chip is electrically connected with the TEC, and the TEC driving chip drives the TEC to work so as to stabilize the temperature of the laser chip. The anode of the light emitting area is connected with the laser driving chip, the cathode of the light emitting area is grounded, and the light emitting area emits light which does not carry data and first monitoring light under the action of first driving current. The anode of the modulation region is connected with the laser driving chip, the cathode of the modulation region is grounded, and the modulation region absorbs light which does not carry data under the action of modulation voltage and bias voltage to obtain data light.

The first driving current and the modulation voltage are both provided by the laser driving chip, and the bias voltage is provided by the first power supply chip.

And the optical detector is positioned on the back of the laser chip, is connected with the laser driving chip or the MCU and is used for receiving the first monitoring light to generate a first monitoring current. Specifically, the light detector receives first monitoring light emitted by the light emitting region to generate a first monitoring current.

The light detector is connected with the laser driving chip or the MCU. Specifically, as MPD needs reverse bias, the cathode of the optical detector is grounded, and the anode of the optical detector is connected with the laser driving chip or the MCU through a mirror current source. As shown in fig. 7-12.

Or, the cathode of the optical detector is directly connected with the laser driving chip or the MCU, and the anode of the optical detector is grounded. The connection relationship between the photodetector and other devices is different, and the rest is the same, so that the detailed description is omitted.

The anode of the light detector is connected with the laser driving chip or the MCU through a mirror current source. Specifically, a first input pin of the mirror current source is connected with the laser driving chip or the MCU, a second input pin of the mirror current source is connected with the anode of the light detector, and an output pin of the mirror current source is connected with a first preset voltage. The first preset voltage is provided by the third power supply chip and is a negative voltage. The third power supply chip is connected with the golden finger and converts the voltage provided by the golden finger into a first preset voltage.

Because the first input pin of the mirror current source is connected with the laser driving chip or the MCU, the second input pin of the mirror current source is connected with the anode of the optical detector, the output pin of the mirror current source is connected with a first preset voltage, and the first preset voltage is a negative voltage, then the first monitoring current of the optical detector and the first mirror current output by the laser driving chip or the MCU both flow to the first preset voltage, namely the first monitoring current corresponds to the first mirror current.

When a first resistor is arranged between the anode of the light detector and the mirror current source, a second resistor is arranged between the laser driving chip or the MCU and the mirror current source, and the first resistor and the second resistor are equal, the first monitoring current is equal to the first mirror current.

And the first pin of the laser driving chip is connected with the first pin of the MCU, the second pin of the laser driving chip is connected with the anode of the luminous area, and the third pin of the laser driving chip is connected with the anode of the modulation area. Specifically, the laser driving chip is connected with a first pin of the MCU. And the second pin of the laser driving chip is connected with the anode of the light emitting area and is used for providing a first driving current for the light emitting area so that the light emitting area emits light which does not carry data. And the third pin of the laser driving chip is connected with the anode of the modulation region and is used for providing modulation voltage for the modulation region.

And the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin of the first power supply chip is connected with the anode of the modulation region and used for providing bias voltage for the modulation region. Specifically, the first pin of the first power supply chip is connected with the second pin of the MCU through the IIC bus, so that the MCU can read the bias voltage provided by the first power supply chip to the modulation area. And the second pin of the first power supply chip is connected with the anode of the modulation region and is used for providing bias voltage for the modulation region so that the modulation region absorbs light which does not carry data to obtain data light.

The third pin of the first power supply chip is connected with the golden finger and used for converting the voltage provided by the golden finger into bias voltage.

And the MCU is used for calculating to obtain the calibration light power according to a first preset variable, wherein the first preset variable comprises a first acquisition current and a bias voltage, the first acquisition current is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current. In particular, the method comprises the following steps of,

the method comprises the following steps that an MCU firstly collects a first preset variable, and calculates to obtain first preset light power according to the first preset variable and a mapping relation between the preset light power and the first preset variable; and calculating according to the first preset optical power and the mapping relation between the preset optical power and the actual optical power to obtain the calibrated optical power.

As can be seen in fig. 7-9, the anode of the photodetector is connected to the laser driver chip via a mirror current source. The laser driving chip is characterized in that a first pin is connected with a first pin of the MCU, a second pin is connected with the anode of the light emitting area, a third pin is connected with the anode of the modulation area, and a fourth pin is connected with the anode of the light detector. If the circuit board is not provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip and connecting the second pin with the first pin of the first power supply chip; and if the circuit board is provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip, connecting the second pin with the first pin of the first power supply chip and connecting the third pin with the second power supply chip.

Because the first mirror current collected by the laser driving chip is the first mirror current of the analog quantity, in order to enable the MCU to read the first mirror current, an analog-to-digital converter is arranged in the laser driving chip. The analog-to-digital converter converts the first mirror current of the analog quantity into the first mirror current of the digital quantity. The MCU directly reads the first mirror current of the digital quantity in the laser chip.

As can be seen in fig. 10-12, the anode of the photodetector is connected to the MCU via a mirror current source. If the circuit board is not provided with a second power supply chip, the MCU is adopted, the first pin is connected with the first pin of the laser driving chip, the second pin is connected with the first pin of the first power supply chip, and the third pin is connected with the anode of the light detector through a mirror current source; if the circuit board is provided with a second power supply chip, the MCU is adopted, the first pin is connected with the first pin of the laser driving chip, the second pin is connected with the first pin of the first power supply chip, the third pin is connected with the second power supply chip, and the fourth pin is connected with the anode of the light detector through a mirror current source.

Because the first mirror current collected by the laser driving chip is the first mirror current of the analog quantity, in order to enable the MCU to read the first mirror current, an analog-to-digital converter is arranged in the MCU. The analog-to-digital converter converts the first mirror current of the analog quantity into the first mirror current of the digital quantity.

As can be seen from fig. 8-9 and 11-12, the optical module includes an optical transceiver module and a circuit board, the optical transceiver module includes a laser chip and a photodetector, and the circuit board is provided with a laser driver chip, a first power supply chip and an MCU, and further includes an amplification functional component and a second power supply chip. Wherein the amplification function may be an amplifier (SOA), as shown in fig. 8 and 11; or an amplification area (SOA) as shown in fig. 9 and 12. In particular, the method comprises the following steps of,

and an amplifier not located in the laser chip, the cathode being grounded for amplifying the data light. Specifically, since the amplifier is not located in the laser chip, the amplifier is not located on the TEC.

And the first pin of the second power supply chip is connected with the third pin of the MCU, and the second pin of the second power supply chip is connected with the anode of the amplifier and used for providing driving current for the amplifier. In particular, the method comprises the following steps of,

and the first pin of the second power supply chip is connected with the third pin of the MCU through an IIC bus, so that the MCU can read the second driving current of the second power supply chip conveniently. And a second power supply chip having a second pin connected to the anode of the amplifier for supplying a second driving current to the amplifier to amplify the data light.

And the third pin of the second power supply chip is connected with the golden finger and is used for converting the voltage of the golden finger into a second driving current.

And the MCU is used for calculating to obtain the calibration light power according to a second preset variable, wherein the second preset variable comprises a first acquisition current, a bias voltage and a second driving current, the first acquisition is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current. In particular, the method comprises the following steps of,

the MCU firstly acquires a second preset variable, and calculates to obtain second preset light power according to the second preset variable and the mapping relation between the preset light power and the second preset variable; and calculating to obtain the calibration optical power according to the second preset optical power and the mapping relation between the preset optical power and the actual optical power.

And an amplification region disposed in the laser chip, the cathode being grounded for amplifying the data light. Specifically, since the amplification region is arranged in the laser chip, the amplification region is also arranged on the TEC.

And the first pin of the second power supply chip is connected with the third pin of the MCU, and the second pin of the second power supply chip is connected with the anode of the amplification area and used for providing a second driving current for the amplification area. In particular, the method comprises the following steps of,

and the first pin of the second power supply chip is connected with the third pin of the MCU through an IIC bus, so that the MCU can read the second driving current of the second power supply chip conveniently. And the second pin of the second power supply chip is connected with the anode of the amplification chip and is used for providing a second driving current for the amplification chip so as to amplify the data light.

And the MCU is used for calculating to obtain the calibration light power according to a second preset variable, wherein the second preset variable comprises a first acquisition current, a bias voltage and a second driving current, the first acquisition current is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current.

The preset mapping relation between the optical power and the first acquisition current, the bias voltage and the second driving current is as follows: n (X) ₁ ,Y,Z)＝AX ₁ -BY+CZ，

Wherein N is a predetermined optical power, X ₁ Is a first collecting current, Y is a bias voltage, Z is a second driving current, A, B and C are constants, N, X ₁ Y and Z are analog quantities.

A is determined by adjusting the first drive current of LD by fixing the bias voltage of EA and the second drive current of SOA ₁ The relation with the preset optical power is obtained. Specifically, a plurality of sets (X) are collected ₁ Y, Z), wherein Y and Z are unchanged, to give (X) ₁ Y, Z) and a preset optical power to obtain a.

B is obtained by fixing the first drive current of the LD and the second drive current of the SOA and adjusting the bias voltage of the EA to determine the relation between Y and the preset optical power. Specifically, multiple sets (X) are collected ₁ Y, Z), wherein X ₁ And Z is unchanged to obtain (X) ₁ Y, Z) and a preset optical power to obtain B.

And C, determining the relation between Z and the preset optical power by fixing the first driving current of the LD and the bias voltage of the EA and adjusting the second current of the SOA. Specifically, collect a plurality of groups ofX ₁ Y, Z), wherein X ₁ And Y is unchanged to give (X) ₁ Y, Z) is fitted to a preset optical power curve, thereby obtaining C.

Since the second preset variable includes the first collecting current, the bias voltage and the second driving current, the mapping relationship between the preset optical power and the second preset variable is the mapping relationship between the preset optical power and the first collecting current, the bias voltage and the second driving current, that is, the mapping relationship between the preset optical power and the second preset variable is N (X) ₁ ,Y,Z)＝AX ₁ -BY+CZ。

When C is equal to zero, the relation among the preset light power, the first acquisition current and the bias voltage is as follows: n (X) ₁ ,Y,Z)＝AX ₁ -BY。

Since the first preset variable includes the first collection current and the bias voltage, the mapping relationship between the preset optical power and the first preset variable is the mapping relationship between the preset optical power and the first collection current and the bias voltage, that is, the mapping relationship between the preset optical power and the first preset variable is N (X) ₁ ,Y,Z)＝AX ₁ -BY。

The MCU can obtain a first preset light power according to the first preset variable and the mapping relation between the preset light power and the first preset variable.

Mapping relation M (mW) → N (X) of preset optical power and actual optical power ₁ ,Y,Z)，

Where M (mW) is the actual optical power of the digital quantity.

The process of obtaining the mapping relation between the preset optical power and the actual optical power is as follows: according to multiple groups of N (X) ₁ Y, Z) and the corresponding M (mW) fitted curve.

And the MCU obtains a calibration optical power according to the first preset optical power and the mapping relation between the preset optical power and the actual optical power, and stores the calibration optical power in the MCU for the upper computer to read. Wherein, the first preset optical power and the calibration optical power are both emitted optical powers.

The method for calculating the calibration optical power by using the first preset variable and the second preset variable is not limited to the above-mentioned type of optical module, but may also be applied to other types of optical modules, specifically, refer to the following optical power monitoring schematic diagram.

Fig. 13 is a diagram of a seventh optical power monitoring scheme according to some embodiments. Fig. 14 is an eighth optical power monitoring schematic according to some embodiments. Fig. 15 is a diagram of a ninth optical power monitoring schematic according to some embodiments. Fig. 16 is a diagram of a tenth optical power monitoring concept according to some embodiments. As can be seen from fig. 13 to 16, the optical transceiver module 400 includes a laser chip and a photodetector, and the circuit board 300 is provided with a laser driver chip and an MCU. In particular, the method comprises the following steps of,

the laser chip includes only a light emitting region for emitting the data light and the first monitor light. Specifically, the light emitting region emits light not carrying data and first monitor light under the action of a first driving current, and modulates the light not carrying data into data light under the action of a modulation current. The first driving current and the modulation current are both provided by the laser driving chip.

And the optical detector is positioned on the back of the laser chip, is connected with the laser driving chip or the MCU and is used for receiving the first monitoring light to generate a first monitoring current.

The light detector is connected with the laser driving chip or the MCU. Specifically, as MPD needs reverse bias, the cathode of the optical detector is directly connected with the MCU or the laser driving chip, and the anode is grounded. As shown in fig. 13-16.

Or, the cathode of the light detector is connected with the anode of the light emitting area, and the anode is directly connected with the MCU or the laser driving chip. The connection relationship between the photodetector and other devices is different, and the rest is the same, so that the detailed description is omitted.

And the first pin of the laser driving chip is connected with the first pin of the MCU, and the second pin of the laser driving chip is connected with the anode of the luminous zone. Specifically, the laser driving chip is connected with a first pin of the MCU. And the second pin of the laser driving chip is connected with the anode of the light emitting area and used for providing a first driving current and a modulation current for the light emitting area so as to enable the light emitting area to emit data light.

As can be seen in fig. 13-14, the cathode of the photodetector is connected to the laser driver chip. Namely a laser driving chip, a first pin is connected with a first pin of the MCU, a second pin is connected with the anode of a luminous zone, and a third pin is connected with the cathode of the light detector. If the circuit board is not provided with a second power supply chip, the MCU is adopted, and the first pin is connected with the first pin of the laser driving chip; and if the circuit board is provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip and connecting the second pin with the second power supply chip.

As can be seen in fig. 15-16, the cathode of the photodetector is connected to the MCU. If the circuit board is not provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip and connecting the second pin with the cathode of the optical detector; and if the circuit board is provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip, connecting the second pin with the second power supply chip and directly connecting the third pin with the cathode of the optical detector.

As can be seen from fig. 14 and 16, the optical module includes an optical transceiver module and a circuit board, the optical transceiver module includes a laser chip and an optical detector, and the circuit board is provided with a laser driver chip, a first power chip and an MCU, and further includes an amplification functional component and a second power chip. Wherein the amplifying function is an amplifier. In particular, the method comprises the following steps of,

and an amplifier not located in the laser chip, the cathode being grounded for amplifying the data light.

And the first pin of the second power supply chip is connected with the third pin of the MCU, and the second pin of the second power supply chip is connected with the anode of the amplifier and used for providing a second driving current for the amplifier.

And the MCU is used for calculating to obtain the calibration light power according to a second preset variable, wherein the second preset variable comprises a first acquisition current and a second driving current, and the first acquisition current is a first monitoring current.

Since the second preset variable includes the first collecting current and the second driving current, the mapping relationship between the preset optical power of the optical module and the second preset variable is as follows: n (X) ₁ ,Y,Z)＝AX ₁ +CZ，Wherein N is a predetermined optical power, X ₁ Is the first collecting current, Z is the second driving current, A and C are constants, N and X ₁ And Z are both analog quantities.

The mapping relation between the preset optical power of the optical module and the first preset variable is N (X) ₁ ,Y,Z)＝AX ₁ 。

Fig. 17 is an eleventh optical power monitoring schematic according to some embodiments. Fig. 18 is a diagram of a twelfth optical power monitoring concept according to some embodiments. Fig. 19 is a thirteenth optical power monitoring principle according to some embodiments. As can be seen from fig. 17 to 19, the optical transceiver module 400 includes a laser chip, an optical splitter and an optical detector, and the circuit board is provided with a laser driver chip, a first power chip and an MCU. In particular, the method comprises the following steps of,

the laser chip comprises a light emitting area and a modulation area and is used for emitting data light.

And the optical splitter is positioned between the laser chip and the optical detector and is used for splitting the data light into first data light and second monitoring light. Specifically, the optical splitter splits the data light into a first data light and a second monitoring light, and the first data light: the second monitoring light is 1: 99.

And the light detector is positioned in front of the laser chip, cannot block the first data light, is connected with the MCU and is used for receiving the second monitoring light to generate a second monitoring current.

The light detector is connected with the MCU. Specifically, because MPD needs reverse bias, the light detector and the cathode are grounded, and the anode is connected with the laser driving chip or the MCU through a mirror current source. As shown in fig. 17-19.

Or, the cathode of the optical detector is directly connected with the laser driving chip or the MCU, and the anode of the optical detector is grounded. Since the connection relationship between the photodetector and other devices is slightly different, the rest are the same, and the description is omitted here.

And the first pin of the laser driving chip is connected with the first pin of the MCU, the second pin of the laser driving chip is connected with the anode of the luminous area, and the third pin of the laser driving chip is connected with the anode of the modulation area.

And the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin of the first power supply chip is connected with the anode of the modulation region and used for providing bias voltage for the modulation region.

As can be seen in fig. 18-19, the anode of the photodetector is connected to the MCU via a mirror current source. If the circuit board is not provided with a second power supply chip, the MCU is adopted, the first pin is connected with the first pin of the laser driving chip, the second pin is connected with the first pin of the first power supply chip, and the third pin is connected with the anode of the light detector through a mirror current source; if the circuit board is provided with a second power supply chip, the MCU is adopted, the first pin is connected with the first pin of the laser driving chip, the second pin is connected with the first pin of the first power supply chip, the third pin is connected with the second power supply chip, and the fourth pin is connected with the anode of the light detector through a mirror current source.

As can be seen from fig. 18 to 19, the optical transceiver module 400 includes an amplification functional element and a second power supply chip, in addition to the laser chip, the optical splitter and the optical detector, and the laser driver chip, the first power supply chip and the MCU are disposed on the circuit board. Wherein the amplification function may be an amplifier, as shown in fig. 18; or may be an enlarged region as shown in fig. 19. In particular, the method comprises the following steps of,

And the MCU is used for calculating to obtain the calibration light power according to a second preset variable, wherein the second preset variable comprises a second acquisition current, a bias voltage and a second driving current, the second acquisition current is a second mirror image current or a second monitoring current, and the second mirror image current corresponds to the second monitoring current.

And an amplification region disposed in the laser chip, the cathode being grounded for amplifying the data light.

And the first pin of the second power supply chip is connected with the third pin of the MCU, and the second pin of the second power supply chip is connected with the anode of the amplification area and used for providing a second driving current for the amplification area.

Since the second preset variable includes the second acquisition current, the bias voltage and the second driving current, the mapping relationship between the preset optical power of the optical module and the second preset variable is as follows: n (X) ₂ ,Y,Z)＝AX ₂ BY + CZ, where N is the predetermined optical power, X ₂ Is the second acquisition current, Y is the bias voltage, Z is the second drive current, A, B and C are constants, N, X ₄ Y and Z are analog quantities.

The mapping relation between the preset optical power of the optical module and the first preset variable is N (X) ₂ Y,Z)＝AX ₂ -BY。

Fig. 20 is a diagram of a fourteenth optical power monitoring principle according to some embodiments. Fig. 21 is a fifteenth optical power monitoring schematic according to some embodiments. As can be seen from fig. 20 to 21, the optical transceiver module 400 includes a laser chip, an optical splitter and an optical detector, and the circuit board is provided with a laser driver chip and an MCU. In particular, the method comprises the following steps of,

the laser chip includes a light emitting region for emitting data light.

And the optical detector is positioned in front of the laser chip, cannot block the first data light, is connected with the laser driving chip or the MCU, and is used for receiving the second monitoring light to generate a second monitoring current.

The light detector is connected with the laser driving chip or the MCU. Specifically, as MPD needs reverse bias, the cathode of the photodetector is directly connected with the MCU, and the anode is grounded. As shown in fig. 20-21.

Or, the cathode of the light detector is connected with the anode of the light emitting area, and the anode is directly connected with the MCU or the laser driving chip. However, the connection of the photodetector disposed in front of the laser chip to the light emitting region is difficult, and the connection relationship between the photodetector and other devices is the same except for a slight difference, and this case is not considered here.

And the first pin of the laser driving chip is connected with the first pin of the MCU, and the second pin of the laser driving chip is connected with the anode of the luminous zone.

As can be seen from fig. 20-21, if the circuit board is not provided with the second power supply chip, the MCU has a first pin connected to the first pin of the laser driver chip and a second pin connected to the cathode of the photodetector; and if the circuit board is provided with a second power supply chip, the MCU is used for connecting the first pin with the first pin of the laser driving chip, connecting the second pin with the second power supply chip and directly connecting the third pin with the cathode of the optical detector.

As can be seen from fig. 21, the optical transceiver module 400 includes a laser chip, an optical splitter, and an optical detector, and the circuit board is provided with a laser driving chip, a first power chip, and an MCU, and further includes an amplifying function component and a second power chip. Wherein the amplifying function is an amplifier. In particular, the method comprises the following steps of,

And the MCU is used for calculating to obtain the calibration light power according to a second preset variable, wherein the second preset variable comprises a second acquisition current and a second driving current, and the second acquisition current is a second monitoring current.

Since the second preset variable includes the second acquisition current and the second driving current, the mapping relationship between the preset optical power of the optical module and the second preset variable is as follows: n (X) ₂ ,Y,Z)＝AX ₂ + CZ, where N is the predetermined optical power, X ₂ Is the second acquisition current, Z is the second drive current, A and C are constants, N, X ₂ And Z are both analog quantities.

The mapping relation between the preset optical power of the optical module and the first preset variable is N (X) ₂ ,Y,Z)＝AX ₂ -BY。

The application provides an optical module, which comprises a circuit board and an optical transceiving component. And the optical transceiving component is electrically connected with the circuit board and comprises a laser chip and an optical detector. The circuit board is provided with a laser driving chip, a first power supply chip and an MCU. The laser chip comprises a light emitting area and a modulation area and is used for emitting data light and first monitoring light. And the optical detector is connected with the laser driving chip or the MCU and is used for receiving the first monitoring light to generate a first monitoring current. And the first pin of the laser driving chip is connected with the first pin of the MCU, the second pin of the laser driving chip is connected with the anode of the luminous region, and the third pin of the laser driving chip is connected with the anode of the modulation region. And the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin of the first power supply chip is connected with the anode of the modulation region and used for providing bias voltage for the modulation region. The MCU is used for calculating according to a first preset variable to obtain the calibration light power, wherein the first preset variable comprises a first acquisition current and a bias voltage, the first acquisition current is a first mirror image current or a first monitoring current, and the first mirror image current corresponds to the first monitoring current. The MCU firstly collects a first preset variable, and calculates to obtain a first preset light power according to the first preset variable and a mapping relation between the preset light power and the first preset variable; and calculating according to the first preset optical power and the mapping relation between the preset optical power and the actual optical power to obtain the calibrated optical power. Because the first monitoring current is the current generated by the optical detector receiving the first monitoring light, and the first power supply chip provides bias voltage for the modulation region, the influence of the optical detector on the calibration optical power and the influence of the light emitting region on the calibration optical power are considered, and the accuracy of monitoring the calibration optical power is improved. In the application, the MCU calculates to obtain the calibration optical power according to the first acquisition current and the bias voltage, and the accuracy of monitoring and calibrating the optical power is improved.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solutions of the present disclosure, not to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present disclosure.

Claims

1. A light module, comprising:

a circuit board;

the laser chip comprises a light emitting area and a modulation area and is used for emitting data light and first monitoring light;

in the laser driving chip, a first pin is connected with a first pin of the MCU, a second pin is connected with the anode of the light emitting area, and a third pin is connected with the anode of the modulation area;

the first pin of the first power supply chip is connected with the second pin of the MCU, and the second pin is connected with the anode of the modulation region and used for providing bias voltage for the modulation region;

the MCU is used for calculating to obtain the calibrated optical power according to a first preset variable, wherein the first preset variable comprises a first acquisition current and the bias voltage, the first acquisition current is a first mirror current or a first monitoring current, and the first mirror current corresponds to the first monitoring current.

2. The optical module of claim 1, further comprising an amplifier and a second power supply chip;

the amplifier is not positioned in the laser chip, and the cathode of the amplifier is grounded and is used for amplifying the data light;

in the second power supply chip, the first pin is connected with the third pin of the MCU, and the second pin is connected with the anode of the amplifier and used for providing a second driving current for the amplifier;

the MCU is used for obtaining the calibration light power according to a second preset variable, wherein the second preset variable comprises the first acquisition current, the bias voltage and the second driving current.

3. The optical module of claim 1, further comprising an amplification section and a second power supply chip;

the amplification area is positioned in the laser chip, and the cathode of the amplification area is grounded and is used for amplifying the data light;

in the second power supply chip, the first pin is connected with the third pin of the MCU, and the second pin is connected with the anode of the amplification area and used for providing a second driving current for the amplification area;

4. The optical module of claim 1, wherein the photodetector, the cathode is grounded, and the anode is connected to the laser driver chip or the MCU through a mirror current source.

5. The optical module of claim 1, wherein the photodetector, the cathode is directly connected to the laser driver chip or the MCU, and the anode is grounded.

6. A light module, comprising:

a circuit board;

the circuit board is provided with a laser driving chip and an MCU;

the laser chip comprises a light emitting area, a first light source and a second light source, wherein the light emitting area is used for emitting data light and first monitoring light;

the first pin of the laser driving chip is connected with the first pin of the MCU, and the second pin of the laser driving chip is connected with the anode of the light emitting area;

the MCU is used for calculating according to a first preset variable to obtain the calibrated light power, wherein the first preset variable comprises a first acquisition current, and the first acquisition current is a first monitoring current.

7. A light module, comprising:

a circuit board;

the laser chip comprises a light emitting area and a modulation area and is used for emitting data light;

the light detector is positioned in front of the laser chip, cannot block the first data light, is connected with the MCU, and is used for receiving the second monitoring light to generate a second monitoring current;

in the first power supply chip, a first pin is connected with a second pin of the MCU, and the second pin is connected with the anode of the modulation region and is used for providing bias voltage for the modulation region;

the MCU is used for calculating to obtain the calibration optical power according to a first preset variable, wherein the first preset variable comprises a second acquisition current and the bias voltage, the second acquisition current is a second monitoring current or a second mirror current, and the second mirror current corresponds to the second monitoring current.

8. The optical module of claim 7, further comprising an amplifier and a second power chip;

the amplifier is not positioned in the laser chip, and the cathode is grounded and is used for amplifying the data light;

the first pin of the second power supply chip is connected with the third pin of the MCU, and the second pin of the second power supply chip is connected with the anode of the amplifier and used for providing a second driving current for the amplifier;

the MCU is used for obtaining the calibrated light power according to a second preset variable, wherein the second preset variable comprises the second acquisition current, the bias voltage and the second driving current.

9. The optical module of claim 7, further comprising an amplification section and a second power supply chip;

10. A light module, comprising:

a circuit board;

the circuit board is provided with a laser driving chip and an MCU;

the laser chip comprises a light emitting area for emitting data light;

and the MCU is used for calculating to obtain the calibrated optical power according to a first preset variable, wherein the first preset variable comprises a second acquisition current, and the second acquisition current is the second monitoring current.