CN217543461U

CN217543461U - Optical module

Info

Publication number: CN217543461U
Application number: CN202220740523.XU
Authority: CN
Inventors: 吴涛; 慕建伟
Original assignee: Hisense Broadband Multimedia Technology Co Ltd
Current assignee: Hisense Broadband Multimedia Technology Co Ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2022-10-04
Anticipated expiration: 2032-03-30

Abstract

The optical module comprises a circuit board with a jack and an optical emission assembly, wherein the optical emission assembly comprises a second emission shell, a laser, a second optical path translation prism and an optical collimator, and a clamping groove is formed in the outer side of the second emission shell and inserted into the jack through the clamping groove; the second emission shell comprises a mounting groove, the mounting groove comprises a fourth mounting surface, a fifth mounting surface and a sixth mounting surface, the fourth mounting surface is provided with a sunken seventh mounting surface, the fourth mounting surface and the seventh mounting surface are positioned on the back side of the circuit board, and the fifth mounting surface and the sixth mounting surface are positioned on the front side of the circuit board; one end of the mounting groove is provided with a notch communicated with the fourth mounting surface, and the circuit board on one side of the jack extends into the notch; the laser is arranged on the seventh mounting surface; the second light path translation prism is arranged on the fifth mounting surface and used for moving the laser beam positioned on the front surface of the circuit board upwards; one end of the optical collimator is inserted into the mounting groove, and the other end of the optical collimator is hermetically connected with the optical fiber. This application has realized the totally enclosed encapsulation to the light path through the structure of unique transmission casing.

Description

Optical module

Technical Field

The application relates to the technical field of optical fiber communication, in particular to an optical module.

Background

With the development of new services and application modes such as cloud computing, mobile internet, video and the like, the development and progress of the optical communication technology becomes more and more important. In the optical communication technology, an optical module is a tool for realizing the interconversion of optical signals, and is one of the key components in optical communication equipment, and the transmission rate of the optical module is continuously increased along with the development requirement of the optical communication technology.

With the increase of communication rate, although the power consumption of unit bandwidth is decreasing, the overall power consumption of the optical module is still further increasing, the heat dissipation mode adopted in the client device is mostly air cooling, and the heat dissipation capability of the high-speed transmission system reaches the limit. In order to get rid of the dilemma of air refrigeration, people begin to research various liquid cooling modes, one of the liquid cooling methods is to immerse the exchanger in a refrigerant liquid, such as a fluorinated liquid (FC-40).

However, due to the requirement of low cost, the optical module deployed in the data center mostly adopts a non-sealed design structure for the light emitting and receiving components, and the key optical paths are all in an open state, and when the optical module enters the refrigerant liquid along with the switch, the key optical paths and the components can also enter the refrigerant liquid, so that the change of an optical mechanism and the pollution of an optical surface are caused, and the normal operation of the optical module is seriously influenced.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides an optical module to realize the complete airtight packaging of an optical light path in the optical module, further realize the long-term and reliable work of the optical module in a liquid cooling environment, and improve the heat dissipation effect of the optical module.

The application provides an optical module, includes:

the circuit board is provided with a jack, and one side of the jack is provided with an opening;

the light emitting component is electrically connected with the circuit board and is used for emitting a light signal;

wherein the light emitting assembly includes:

a card slot is arranged on the outer side wall of the second transmitting shell and inserted into the jack through the opening, the upper side of the card slot is positioned on the front side of the circuit board, and the lower side of the card slot is positioned on the back side of the circuit board; the mounting groove comprises a fourth mounting surface, a fifth mounting surface and a sixth mounting surface, wherein a sunken seventh mounting surface is arranged on the fourth mounting surface, and the fourth mounting surface and the seventh mounting surface are both positioned on the back side of the circuit board; the fourth mounting surface is recessed in the fifth mounting surface, the fifth mounting surface is recessed in the sixth mounting surface, and the fifth mounting surface and the sixth mounting surface are both positioned on the front side of the circuit board; a notch is formed in one end of the mounting groove, the notch is communicated with the fourth mounting surface, and the circuit board on one side of the jack extends into the notch;

the upper cover plate covers the opening side of the top surface of the mounting groove;

the laser is arranged on the seventh mounting surface, is electrically connected with the circuit board extending into the notch and is used for emitting laser beams;

the second optical path translation prism is arranged on the fifth mounting surface and used for moving the laser beam positioned on the front surface of the circuit board upwards;

one end of the optical collimator is inserted into the mounting groove, and the other end of the optical collimator is hermetically connected with the optical fiber; and the outer side wall of the second transmitting shell is connected with the outer side wall in a sealing mode.

The optical module comprises a circuit board and a light emitting assembly electrically connected with the circuit board, wherein the circuit board is provided with a jack, and one side of the jack is provided with an opening; the light emitting component comprises a second emitting shell, an upper cover plate, a laser, a second light path translation prism and a light collimator, wherein a clamping groove is arranged on the outer side wall of the second emitting shell, the clamping groove is inserted into the jack through an opening, the upper side and the lower side of the clamping groove are positioned on the front side and the back side of the circuit board, and the second emitting shell is clamped on the circuit board through the clamping groove; the second emission shell comprises a mounting groove, the upper cover plate covers the opening side of the top surface of the mounting groove, the mounting groove comprises a fourth mounting surface, a fifth mounting surface and a sixth mounting surface, the fourth mounting surface is provided with a sunken seventh mounting surface, and the fourth mounting surface and the seventh mounting surface are both positioned on the back side of the circuit board; the fourth mounting surface is recessed in the fifth mounting surface, the fifth mounting surface is recessed in the sixth mounting surface, the fifth mounting surface and the sixth mounting surface are both positioned on the front side of the circuit board, and thus the mounting groove in the second emission shell forms a step surface; a notch is formed in one end of the mounting groove, the notch is communicated with the fourth mounting surface, the circuit board on one side of the jack extends into the notch, when the second transmitting shell is clamped into the jack, the circuit board on one side of the jack extends into the notch of the second transmitting shell, and the circuit board and the second transmitting shell jointly form a part of a closed shell; the laser is arranged on the seventh mounting surface and is electrically connected with the circuit board extending into the notch, so that the height of the routing surface of the laser is the same as the front surface of the circuit board during assembly, and the connection routing of the laser and the circuit board is shortest; the second light path translation prism is arranged on the fifth mounting surface and used for moving the laser beam positioned on the front surface of the circuit board upwards so that part of optical devices, particularly the optical collimator and the optical fiber, are moved upwards above the circuit board, thus the area of the jacks on the circuit board can be reduced, the jacks are formed into a rectangular shape, and the gluing and sealing treatment can be conveniently carried out at the contact position of the second emission shell and the circuit board; one end of the optical collimator is inserted into the mounting groove of the second transmitting shell, the other end of the optical collimator is connected with the optical fiber in a sealing mode, the optical collimator is connected with the outer side wall of the second transmitting shell in a sealing mode, and therefore the sealing performance of the inner cavity of the second transmitting shell can be achieved through the optical collimator. So, the light emission subassembly comprises light emission device, upper cover plate, second transmission casing, optical collimator and optic fibre, and the one end of second transmission casing is equipped with the breach, and the circuit board stretches into in this breach, and circuit board, second transmission casing and upper cover plate constitute a part of sealed casing jointly, cooperate the optical collimator to form complete closed cavity structure again. This application can realize the totally enclosed encapsulation of free optical path in the optical module through the structural design of unique transmission casing, and then can realize long-term and reliable work of optical module in the liquid cooling environment, greatly improves the radiating effect of optical module.

Drawings

In order to more clearly illustrate the technical solutions of the present disclosure, the drawings required to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to these drawings. Furthermore, the drawings in the following description may be considered as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a connection diagram of an optical communication system according to some embodiments;

FIG. 2 is a block diagram of an optical network terminal according to some embodiments;

FIG. 3 is a block diagram of a light module according to some embodiments;

FIG. 4 is an exploded view of a light module according to some embodiments;

fig. 5 is an assembly diagram of a light emitting module, a light receiving module, a circuit board and an optical fiber in an optical module according to an embodiment of the present disclosure;

fig. 6 is a schematic structural diagram of a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 7 is a schematic partial assembly diagram of a light emitting module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 8 is a schematic diagram of an inverted structure of a light emitting module in an optical module according to an embodiment of the present disclosure;

fig. 9 is a schematic view illustrating partial assembly of a light emitting module and a circuit board at another angle in an optical module according to an embodiment of the present disclosure;

fig. 10 is a schematic structural diagram of a transmitting housing in an optical module according to an embodiment of the present application;

fig. 11 is another schematic angular structure diagram of a transmitting housing in an optical module according to an embodiment of the present application;

fig. 12 is a partial assembly cross-sectional view of a light emitting module and a circuit board in a light module according to an embodiment of the present disclosure;

fig. 13 is another schematic partial assembly diagram of a light emitting module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 14 is a schematic diagram of an inverted structure of a light receiving element in an optical module according to an embodiment of the present disclosure;

fig. 15 is a schematic view of another angular structure of a light receiving element in an optical module according to an embodiment of the present disclosure;

fig. 16 is a partial assembly cross-sectional view of a light receiving module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 17 is an assembly diagram of another optical transmitter module, an optical receiver module, a circuit board and an optical fiber in an optical module according to an embodiment of the present disclosure;

fig. 18 is a schematic partial assembly diagram of another light emitting module and a circuit board in an optical module according to an embodiment of the present disclosure;

fig. 19 is a schematic structural diagram of another circuit board in an optical module according to an embodiment of the present disclosure;

fig. 20 is an optical module provided in an embodiment of the present application a schematic structural diagram of another light emitting module;

fig. 21 is a schematic structural diagram of another emission housing in an optical module according to an embodiment of the present disclosure;

fig. 22 is a schematic view of another angular structure of another emission housing in an optical module according to an embodiment of the present disclosure;

fig. 23 is an exploded schematic structural diagram of another light emitting module in an optical module according to an embodiment of the present disclosure;

fig. 24 is a third angular structural diagram of another emission housing in an optical module according to an embodiment of the present disclosure;

fig. 25 is a fourth angular structural schematic diagram of another emission housing in an optical module according to an embodiment of the present application;

fig. 26 is a partial schematic structural diagram of another light emitting module in a light module according to an embodiment of the present disclosure;

fig. 27 is a cross-sectional view of another light emitting assembly in a light module according to an embodiment of the present application;

fig. 28 is a partial assembly cross-sectional view of another light emitting module and a circuit board in a light module according to an embodiment of the present disclosure;

fig. 29 is an optical module provided in an embodiment of the present application another assembly diagram of the circuit board and the light receiving component;

fig. 30 is a schematic partial assembly diagram of an optical fiber and a housing in an optical module according to an embodiment of the present disclosure.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the description and the claims, the term "comprise" and its other forms, such as the third person's singular form "comprising" and the present participle form "comprising" are to be interpreted in an open, inclusive sense, i.e. as "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "example", "specific example" or "some examples" and the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "at least one of A, B or C" and includes the following combinations of A, B and C: a alone, B alone, C alone, a combination of A and B, A and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

The use of "adapted to" or "configured to" herein is meant to be an open and inclusive language that does not exclude devices adapted to or configured to perform additional tasks or steps.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

In the optical communication technology, light is used to carry information to be transmitted, and an optical signal carrying the information is transmitted to information processing equipment such as a computer through information transmission equipment such as an optical fiber or an optical waveguide, so as to complete information transmission. Because the optical signal has the passive transmission characteristic when being transmitted through the optical fiber or the optical waveguide, the information transmission with low cost and low loss can be realized. Since a signal transmitted by an information transmission device such as an optical fiber or an optical waveguide is an optical signal and a signal that can be recognized and processed by an information processing device such as a computer is an electrical signal, it is necessary to perform interconversion between the electrical signal and the optical signal in order to establish information connection between the information transmission device such as an optical fiber or an optical waveguide and the information processing device such as a computer.

The optical module realizes the function of interconversion between the optical signal and the electrical signal in the technical field of optical fiber communication. The optical module comprises an optical port and an electrical port, the optical module realizes optical communication with information transmission equipment such as optical fibers or optical waveguides and the like through the optical port, realizes electrical connection with an optical network terminal (such as an optical modem) through the electrical port, and the electrical connection is mainly used for realizing power supply, I2C signal transmission, data signal transmission, grounding and the like; the optical network terminal transmits the electric signal to the computer and other information processing equipment through a network cable or a wireless fidelity (Wi-Fi).

Fig. 1 is a connection diagram of an optical communication system according to some embodiments. As shown in fig. 1, the optical communication system mainly includes a remote server 1000, a local information processing device 2000, an optical network terminal 100, an optical module 200, an optical fiber 101, and a network cable 103;

one end of the optical fiber 101 is connected to the remote server 1000, and the other end is connected to the optical network terminal 100 through the optical module 200. The optical fiber itself can support long-distance signal transmission, for example, signal transmission of thousands of meters (6 kilometers to 8 kilometers), on which basis if a repeater is used, ultra-long-distance transmission can be theoretically achieved. Therefore, in a typical optical communication system, the distance between the remote server 1000 and the optical network terminal 100 may be several kilometers, tens of kilometers, or hundreds of kilometers.

One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the optical network terminal 100. The local information processing apparatus 2000 may be any one or several of the following apparatuses: router, switch, computer, cell-phone, panel computer, TV set etc..

The physical distance between the remote server 1000 and the optical network terminal 100 is greater than the physical distance between the local information processing apparatus 2000 and the optical network terminal 100. The connection between the local information processing device 2000 and the remote server 1000 is completed by the optical fiber 101 and the network cable 103; and the connection between the optical fiber 101 and the network cable 103 is completed by the optical module 200 and the optical network terminal 100.

The optical module 200 includes an optical port and an electrical port. The optical port is configured to connect with the optical fiber 101, so that the optical module 200 establishes a bidirectional optical signal connection with the optical fiber 101; the electrical port is configured to be plugged into the optical network terminal 100 so that the optical module 200 establishes a bi-directional electrical signal connection with the optical network terminal 100. The optical module 200 converts an optical signal and an electrical signal to each other, so that a connection is established between the optical fiber 101 and the optical network terminal 100. For example, an optical signal from the optical fiber 101 is converted into an electrical signal by the optical module 200 and then input to the optical network terminal 100, and an electrical signal from the optical network terminal 100 is converted into an optical signal by the optical module 200 and input to the optical fiber 101.

The optical network terminal 100 includes a housing (housing) having a substantially rectangular parallelepiped shape, and an optical module interface 102 and a network cable interface 104 provided on the housing. The optical module interface 102 is configured to access the optical module 200, so that the optical network terminal 100 establishes a bidirectional electrical signal connection with the optical module 200; the network cable interface 104 is configured to access the network cable 103 such that the optical network terminal 100 establishes a bi-directional electrical signal connection with the network cable 103. The optical module 200 is connected to the network cable 103 via the optical network terminal 100. For example, the optical network terminal 100 transmits an electrical signal from the optical module 200 to the network cable 103, and transmits a signal from the network cable 103 to the optical module 200, so that the optical network terminal 100 can monitor the operation of the optical module 200 as an upper computer of the optical module 200. The upper computer of the Optical module 200 may include an Optical Line Terminal (OLT) and the like in addition to the Optical network Terminal 100.

The remote server 1000 establishes a bidirectional signal transmission channel with the local information processing device 2000 through the optical fiber 101, the optical module 200, the optical network terminal 100, and the network cable 103.

Fig. 2 is a structural diagram of an optical network terminal according to some embodiments, and fig. 2 only shows a structure of the optical module 100 related to the optical module 200 in order to clearly show a connection relationship between the optical module 200 and the optical network terminal 100. As shown in fig. 2, the optical network terminal 100 further includes a PCB circuit board 105 disposed in the housing, a cage 106 disposed on a surface of the PCB circuit board 105, and an electrical connector disposed inside the cage 106. The electrical connector is configured to access an electrical port of the optical module 200; the heat sink 107 has a projection such as a fin that increases a heat radiation area.

The optical module 200 is inserted into a cage 106 of the optical network terminal 100, the cage 106 holds the optical module 200, and heat generated by the optical module 200 is conducted to the cage 106 and then diffused by a heat sink 107. After the optical module 200 is inserted into the cage 106, an electrical port of the optical module 200 is connected to an electrical connector inside the cage 106, and thus the optical module 200 establishes a bidirectional electrical signal connection with the optical network terminal 100. Further, an optical port of the optical module 200 is connected to the optical fiber 101, and the optical module 200 establishes bidirectional electrical signal connection with the optical fiber 101.

Fig. 3 is a block diagram of a light module according to some embodiments, and fig. 4 is an exploded view of a light module according to some embodiments. As shown in fig. 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed in the housing, and an optical transceiver;

the shell comprises an upper shell 201 and a lower shell 202, wherein the upper shell 201 is covered on the lower shell 202 to form the shell with two

openings

204 and 205; the outer contour of the housing generally appears square.

In some embodiments of the present disclosure, the lower housing 202 includes a bottom plate and two lower side plates located at two sides of the bottom plate and disposed perpendicular to the bottom plate; the upper housing 201 includes a cover plate, and two upper side plates disposed on two sides of the cover plate and perpendicular to the cover plate, and is combined with the two side plates by two side walls to cover the upper housing 201 on the lower housing 202.

The direction of the connecting line of the two

openings

204 and 205 may be the same as the length direction of the optical module 200, or may not be the same as the length direction of the optical module 200. For example, the opening 204 is located at an end (right end in fig. 3) of the optical module 200, and the opening 205 is also located at an end (left end in fig. 3) of the optical module 200. Alternatively, the opening 204 is located at an end of the optical module 200, and the opening 205 is located at a side of the optical module 200. Wherein, the opening 204 is an electrical port, and the gold finger of the circuit board 300 extends out of the electrical port 204 and is inserted into an upper computer (such as the optical network terminal 100); the opening 205 is an optical port configured to receive an external optical fiber 101 so that the optical fiber 101 is connected to an optical transceiver inside the optical module 200.

The upper shell 201 and the lower shell 202 are combined in an assembly mode, so that devices such as the circuit board 300 and the optical transceiver can be conveniently installed in the shells, and the upper shell 201 and the lower shell 202 can form packaging protection for the devices. In addition, when the devices such as the circuit board 300 are assembled, the positioning components, the heat dissipation components and the electromagnetic shielding components of the devices are convenient to arrange, and the automatic implementation production is facilitated.

In some embodiments, the upper housing 201 and the lower housing 202 are generally made of a metal material, which is beneficial to achieve electromagnetic shielding and heat dissipation.

In some embodiments, the optical module 200 further includes an unlocking component located on an outer wall of a housing thereof, and the unlocking component is configured to realize a fixed connection between the optical module 200 and an upper computer or release the fixed connection between the optical module 200 and the upper computer.

Illustratively, the unlocking members are located on the outer walls of the two lower side plates of the lower housing 202, and include snap-fit members that mate with the cage of the upper computer (e.g., the cage 106 of the optical network terminal 100). When the optical module 200 is inserted into the cage of the upper computer, the optical module 200 is fixed in the cage of the upper computer by the engaging member of the unlocking member; when the unlocking member is pulled, the engaging member of the unlocking member moves along with the unlocking member, and the connection relationship between the engaging member and the upper computer is changed, so that the engaging relationship between the optical module 200 and the upper computer is released, and the optical module 200 can be drawn out from the cage of the upper computer.

The circuit board 300 includes circuit traces, electronic components, and chips, and the electronic components and the chips are connected together by the circuit traces according to a circuit design to implement functions of power supply, electrical signal transmission, grounding, and the like. The electronic components may include, for example, capacitors, resistors, transistors, metal-Oxide-Semiconductor Field-Effect transistors (MOSFETs). The chip may include, for example, a Micro Controller Unit (MCU), a Transimpedance Amplifier (TIA), a Clock and Data Recovery (CDR), a power management chip, and a Digital Signal Processing (DSP) chip.

The circuit board 300 is generally a rigid circuit board, which can also realize a bearing effect due to its relatively hard material, for example, the rigid circuit board can stably bear a chip; the rigid circuit board can also be inserted into an electric connector in the cage of the upper computer.

The circuit board 300 further includes a gold finger formed on an end surface thereof, the gold finger being composed of a plurality of pins independent of each other. The circuit board 300 is inserted into the cage 106 and electrically connected to the electrical connector in the cage 106 by gold fingers. The gold fingers may be disposed on only one side surface (e.g., the upper surface shown in fig. 4) of the circuit board 300, or may be disposed on both upper and lower surfaces of the circuit board 300, so as to adapt to the situation where the requirement of the number of pins is large. The golden finger is configured to establish an electrical connection with the upper computer to realize power supply, grounding, I2C signal transmission, data signal transmission and the like. Of course, a flexible circuit board is also used in some optical modules. Flexible circuit boards are commonly used in conjunction with rigid circuit boards to supplement the rigid circuit boards.

The optical transceiver includes an optical transmitter module 400 and an optical receiver module 500, which are respectively used for transmitting and receiving optical signals. The light emitting assembly 400 generally includes a light emitter, a lens and a light detector, wherein the lens and the light detector are respectively located on different sides of the light emitter, the front side and the back side of the light emitter respectively emit light beams, and the lens is used for converging the light beams emitted from the front side of the light emitter, so that the light beams emitted from the light emitter become parallel light or converging light to be conveniently coupled to an external optical fiber through a suitable step and manner.

The light receiving assembly 500 generally includes a receiving chip and a transimpedance amplifier, the receiving chip is configured to convert a received external light signal into an electrical signal, the electrical signal is amplified by the transimpedance amplifier and then transmitted to the gold finger on the circuit board 300, and the electrical signal is transmitted to the host computer by the gold finger.

Due to the requirement of low cost, the optical modules deployed in the data center mostly adopt non-sealed structure design for the light emitting module 400 and the light receiving module 500, and their key optical paths are all in an open state. When the optical module enters the refrigerant liquid along with the switch, these key optical paths and components also dip into the refrigerant liquid, thereby causing changes in the optical mechanism and contamination of the optical surface, and seriously affecting the normal operation of the optical module.

In order to solve the above problems, an embodiment of the present application provides an optical module, which adopts an innovative structural design, and realizes all hermetic packages of all optical paths inside the optical module, thereby realizing long-term and reliable operation of the optical module in a liquid cooling environment, and greatly improving the heat dissipation effects of the optical transmitter module 400 and the optical receiver module 500 in the optical module.

Fig. 5 is an assembly schematic diagram of a circuit board, a light emitting module, a light receiving module, and an optical fiber in an optical module provided in the embodiment of the present application. As shown in fig. 5, the optical module provided in the embodiment of the present application includes a light emitting assembly 400, a light receiving assembly 500, and an optical fiber 600, where the light emitting assembly 400 adopts a light emitter structure with an upward bottom surface (flip), so that the bottom surface of the light emitting assembly 400 is in contact with the upper housing 201, which greatly improves heat dissipation of the light emitting assembly 400; a bundle of optical fibers 600 is connected to the light emitting assembly 400, and the emitted light beam emitted from the light emitting assembly 400 is transmitted through the optical fibers 600 to realize the emission of light.

The light receiving module 500 and the light emitting module 400 may be disposed on the same side of the circuit board 300, another bundle of optical fibers 600 is connected to the light receiving module 500, and an external optical signal is transmitted to the light receiving module 500 through the optical fibers 600, and is photoelectrically converted by the light receiving module 500 to achieve light reception.

In a general design, a main optical path of the light emitting module 400 is located on a single plane, so that the circuit board 300 needs to be dug to have a large area to avoid the position where the light emitting module 400 and the optical fiber need to be located, which causes a large hole to be dug in the circuit board 300, and the shape of the hole is complex, which not only greatly reduces the arrangement space of electronic components, but also causes difficulty in glue sealing.

This application digs the hole on circuit board 300, sets up the laser instrument among the optical emission subassembly 400 at the dorsal side of circuit board 300, increases a light path translation prism in the light-emitting direction of laser instrument for whole light path moves to the positive side of circuit board, so can reduce the hole area of digging on the circuit board 300, also is convenient for seal optical emission subassembly 400 at the back of circuit board 300.

Fig. 6 is a schematic structural diagram of a circuit board in an optical module provided in an embodiment of the present application, and fig. 7 is a schematic partial assembly diagram of a circuit board and a light emitting assembly in an optical module provided in the embodiment of the present application. As shown in fig. 6 and 7, the circuit board 300 is provided with a mounting through hole 320, the laser assembly of the light emitting assembly 400 is embedded in the mounting through hole 320, so as to approach the laser assembly to the lower surface (back surface) of the circuit board 300, and the light emitting assembly 400 is reversely assembled on the circuit board 300, so that the height of the routing surface of the laser assembly is the same as that of the back surface of the circuit board 300 during assembly, thereby the connection routing between the back surface of the circuit board 300 and the laser assembly is shortest, and excellent high-frequency transmission performance is ensured.

The light emitting module 400 may include a first emitting housing 401 and an emitting cover 402, the laser module is disposed in the first emitting housing 401, and the first emitting housing 401 covers the front side of the circuit board 300 and is hermetically connected to the front side of the circuit board 300; the emission cover 402 is disposed on the back side of the circuit board 300, and the emission cover 402 covers the mounting through hole 320 and is hermetically connected to the back side of the circuit board 300, such that the first emission housing 401, the circuit board 300 and the emission cover 402 form a sandwich structure.

Fig. 8 is a schematic diagram of an inverted structure of a light emitting module in an optical module according to an embodiment of the present application, and fig. 9 is a schematic diagram of a partial assembly of a circuit board and the light emitting module at another angle in the optical module according to the embodiment of the present application. As shown in fig. 8 and 9, the light emitting assembly 400 may include a first emitting housing 401, and a laser 410, a collimating lens 420, a first optical path translation prism 430, an optical isolator 450 and an optical collimator 460 which are disposed in the first emitting housing 401, wherein a bottom surface (a surface facing away from the front surface of the circuit board 300) of the first emitting housing 401 faces the upper housing 201, the first emitting housing 401 includes a mounting cavity, the laser 410, the collimating lens 420, the first optical path translation prism 430, the optical isolator 450 and the optical collimator 460 are all mounted in the mounting cavity in the first emitting housing 401, and the mounting heights of the laser 410, the collimating lens 420 and the first optical path translation prism 430 are higher than those of the optical isolator 450 and the optical collimator 460, so that the laser 410, the collimating lens 420 and the first optical path translation prism 430 are located on the back side of the circuit board 300 through the mounting through hole 320 on the circuit board 300, and the optical isolator 450 and the optical collimator 460 are located on the front side of the circuit board 300.

In some embodiments, an opening is disposed at an end of the mounting cavity in the first housing 401 facing the front side of the circuit board, the mounting cavity is communicated with the mounting through hole 320 on the circuit board 300 through the opening, and the laser 410 disposed in the mounting cavity can be inserted into the mounting through hole 320 through the opening, so that the bonding height of the laser 410 is the same as the back side of the circuit board 300.

One path of laser beam emitted by the laser 410 is converted into a collimated beam through the collimating lens 420, the collimated beam reflects the collimated beam on the back side of the circuit board 300 to the front side of the circuit board 300 through the first optical path translation prism 430, the laser beam reflected by the first optical path translation prism 430 directly penetrates through the optical isolator 450 to enter the optical collimator 460, enters the optical fiber 600 through the optical collimator 460, and is transmitted to the optical fiber adapter 700 through the optical fiber 600, so that one path of optical signal is emitted.

In some embodiments, the area of the cut-out of the circuit board 300 can be reduced by adding an optical path translation prism behind the collimating lens 420 to move the entire optical path to the front side of the circuit board 300, which also facilitates sealing the light emitting assembly 400 at the back side of the circuit board 300.

For an optical module with a high transmission rate, such as 400G, to realize the transmission rate of the 400G optical module, 4 optical transmitters and 4 optical receivers need to be integrated, so that the optical transmission assembly 400 includes 4 optical transmitters to realize the emission of 4 emitted optical beams; the light receiving module 500 includes 4 light receivers to realize the reception of 4 received light beams.

Based on this, the light emitting module 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, a first light path translation prism 430, an optical combiner 440, an optical isolator 450 and a light collimator 460 which are disposed in the first emitting housing 401, the plurality of lasers 410, the plurality of collimating lenses 420, the first light path translation prism 430, the optical combiner 440, the optical isolator 450 and the light collimator 460 are all installed in the installation cavity of the first emitting housing 401, and the installation heights of the lasers 410, the collimating lenses 420 and the first light path translation prism 430 are higher than the installation heights of the optical combiner 440 and the optical isolator 450.

The plurality of lasers 410 and the plurality of collimating lenses 420 are located on the back side of the circuit board 300 through the mounting through-holes 320, one end of the first optical path translation prism 430 is located on the back side of the circuit board 300 through the mounting through-holes 320, the other end is located on the front side of the circuit board 300, and the optical combiner 440, the optical isolator 450 and the optical collimator 460 are all located on the front side of the circuit board 300.

The plurality of lasers 410 respectively emit laser beams parallel to the back surface of the circuit board 300; the plurality of collimating lenses 420 converts the laser beam emitted from the laser 410 into a collimated beam, the plurality of collimated beams are transmitted to the first optical path translation prism 430, and the first optical path translation prism 430 reflects the laser beam located at the back side of the circuit board 300 to the front side of the circuit board 300.

The first optical path shift prism 430 functions to shift the multiple light beams upward by a distance such that all subsequent optical device positions are located on the front side of the circuit board 300 and maintain a proper gap with the circuit board 300. Thus, the position conflict between the optical device and the circuit board 300 is avoided, so that the hole digging area of the circuit board 300 can be reduced as much as possible, the arrangement area of the electronic devices on the circuit board 300 is increased, and the wiring of the circuit board 300 is easier.

The right side of the optical multiplexer 440 may include four light inlets for inputting signal light of multiple wavelengths, each light inlet being for inputting signal light of one wavelength; the left side of the optical combiner 440 includes a light outlet for emitting light. Taking 4 wavelengths of λ 1, λ 2, λ 3, and λ 4 incident on the optical multiplexer 440 as an example, λ 1 signal light enters the optical multiplexer 440 through the first light inlet, and reaches the light outlet after six different reflections at six different positions in the optical multiplexer 440; the λ 2 signal light enters the optical combiner 440 through the second light inlet, and is reflected to the light outlet four times differently by four different positions in the optical combiner 440; the λ 3 signal light enters the optical combiner 440 through the third light inlet, and is reflected twice differently by two different positions in the optical combiner 440 to reach the light outlet; the λ 4 signal light enters the optical combiner 440 through the fourth light-in port, and is directly transmitted to the light-out port. Thus, the optical multiplexer 440 realizes that the signal lights with different wavelengths are input through different light inlets and output through the same light outlet, thereby realizing the light combination of the signal lights with different wavelengths.

One end of the light collimator 460 is inserted into the mounting cavity of the first emission housing 401, and the other end is hermetically connected with the optical fiber 600, that is, one end of the optical fiber 600 is inserted into the light collimator 460, and the optical fiber 600 is hermetically connected with the light collimator 460 through glue. Thus, the composite light beam output by the optical combiner 440 is coupled into the optical fiber 600 via the optical collimator 460, and the emission of one light beam is realized.

In some embodiments, there is a gap between the optical combiner 440 and the light incident surface of the optical collimator 460, and when the composite light beam output by the optical combiner 440 is transmitted to the light incident surface of the optical collimator 460, the composite light beam is reflected due to propagation of light at an interface of different media, and is transmitted to the light incident surface of the optical collimator 460, and the reflected light beam may return to the laser 410 as it is, which affects the high-frequency performance of the laser 410.

To avoid this problem, an optical isolator 450 is disposed between the optical combiner 440 and the light collimator 460, and when the composite light beam emitted from the optical combiner 440 is reflected at the light incident surface of the light collimator 460, the optical isolator 450 is used to isolate the reflected light beam and prevent the reflected light beam from returning to the laser 410.

The optical collimator 460 may include a sleeve, a focusing lens, and a single-mode fiber flange, the sleeve is sleeved outside the focusing lens and the single-mode fiber flange, the optical fiber 600 is inserted into the single-mode fiber flange, the light incident surface of the focusing lens faces the optical isolator, the light emergent surface faces the single-mode fiber flange, the composite light beam output by the optical multiplexer is transmitted to the focusing lens through the optical isolator, and the focusing lens converges the composite light beam to the optical fiber 600 in the single-mode fiber flange.

The focusing lens can be a cylindrical lens, and the outer diameter of the cylindrical lens and the single-mode fiber flange can be slightly smaller than the inner diameter of the sleeve so as to ensure the coupling degree of the focusing lens and the single-mode fiber flange. When the focusing lens and the single-mode optical fiber flange are inserted into the sleeve, the focusing lens and the single-mode optical fiber flange can only be moved axially in order to improve the coupling degree of the focusing lens and the single-mode optical fiber flange.

In order to facilitate the composite light beam penetrating through the optical isolator 450 to enter the focusing lens, the focusing lens protrudes out of the sleeve, so that the distance between the light entering surface of the focusing lens and the light exiting surface of the optical isolator 450 is reduced, and the structure is more compact.

In other embodiments, the cylindrical lens may be placed separately from the flange of the single-mode fiber, where the cylindrical lens is replaced by a rectangular lens for easy installation, and the position of the lens needs to be individually adjusted for coupling.

In some embodiments, the light emitting assembly 400 includes 4 lasers, 4 collimating lenses and an optical path translation prism, the lasers 410 and the collimating lenses 420 are arranged in a one-to-one correspondence, each laser 410 emits one laser beam, each collimating lens 420 converts one laser beam into a collimated beam, the collimated beam emitted by each collimating lens 420 is transmitted to the first optical path translation prism 430, and the first optical path translation prism 430 reflects the collimated beam to change the transmission direction and position of the laser beam.

After the multiple laser beams on the back side of the circuit board 300 are reflected to the front side of the circuit board 300 by the first optical path translation prism 430, the multiple laser beams are combined into one composite beam by the optical combiner 440, and the composite beam is coupled to the optical fiber adapter 700 by the optical collimator 460 and the optical fiber 600, so that the emission of multiple optical signals is realized.

Fig. 10 is a schematic structural diagram of a first emission housing in an optical module provided in the embodiment of the present application, and fig. 11 is a schematic structural diagram of another angle of the first emission housing in the optical module provided in the embodiment of the present application. As shown in fig. 10 and 11, in order to support and fix the laser 410, the collimating lens 420, the first optical path translation prism 430, the optical combiner 440, and the optical isolator 450, the first emitting housing 401 includes a first contact surface 4011, and the first contact surface 4011 is hermetically connected to the front surface of the circuit board 300, so as to implement the hermetic connection between the first emitting housing 401 and the front surface of the circuit board 300; a mounting inner cavity is formed in a direction from the first contact surface 4011 to the upper housing 201, and comprises a first mounting surface 4110, a second mounting surface 4120 and a third mounting surface 4130, the third mounting surface 4130 is recessed in the second mounting surface 4120, the second mounting surface 4120 is recessed in the first mounting surface 4110, and the first mounting surface 4110 is recessed in the first contact surface 4011. That is, the distance between the third mounting surface 4130 and the front surface of the circuit board 300 is greater than the distance between the second mounting surface 4120 and the front surface of the circuit board 300, the distance between the second mounting surface 4120 and the front surface of the circuit board 300 is greater than the distance between the first mounting surface 4110 and the front surface of the circuit board 300, and the first mounting surface 4110 does not contact with the front surface of the circuit board 300, so that the first mounting surface 4110, the second mounting surface 4120, the third mounting surface 4130 and the first contact surface 4011 form stepped surfaces.

In some embodiments, only one end of the mounting cavity forming the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 facing the front side of the circuit board 300 is provided with an opening, and the first mounting surface 4110 is provided with a semiconductor cooler 470, and the semiconductor cooler 470 is inserted into the mounting through hole 320 of the circuit board 300 through the opening. Each laser 410 is disposed on a laser substrate, each laser substrate and the collimating lens 420 are disposed on the cooling surface of the semiconductor cooler 470, and the collimating lens 420 is disposed in the light-emitting direction of the laser 410, so that the laser 410 and the collimating lens 420 are both located on the back side of the circuit board 300 through the mounting through hole 320.

The first optical path shift prism 430 is disposed on the second mounting surface 4120 recessed in the first mounting surface 4110, the first optical path shift prism 430 is perpendicularly fixed to the second mounting surface 4120, that is, one end of the first optical path shift prism 430 is fixed to the second mounting surface 4120, and the other end is located at the back side of the circuit board 300, so that the laser beam located at the back side of the circuit board 300 is reflected to the front side of the circuit board 300 by the first optical path shift prism 430.

The optical combiner 440 is disposed on the second mounting surface 4120, and the optical combiner 440 is located in the exit direction of the reflected light of the first light path shifting prism 430, so that the multiple laser beams reflected by the first light path shifting prism 430 are emitted into the optical combiner 440.

The optical isolator 450 is disposed on the third mounting surface 4130 recessed in the second mounting surface 4120, and the optical isolator 450 is located in the light outgoing direction of the optical combiner 440, so that the composite light beam output from the optical combiner 440 is transmitted through the optical isolator 450.

A through hole 4140 is formed at an end of the first emission housing 401 facing away from the laser 410, the through hole 4140 is communicated with the installation cavity of the first emission housing 401, so that the light collimator 460 is inserted into the installation cavity of the first emission housing 401 through the through hole 4140, and the light incident surface of the light collimator 460 is disposed corresponding to the light emitting surface of the optical isolator 450, so that the composite light beam passing through the optical isolator 450 is incident into the light collimator 460, so as to emit the composite light beam into the optical fiber 600.

In some embodiments, when the light collimator 460 is inserted into the mounting cavity of the first emission housing 401 through the through hole 4140, the light collimator 460 is hermetically connected to the outer sidewall of the first emission housing 401, so that the light collimator 460 is hermetically connected to the through hole 4140, and thus, after the first emission housing 401 is covered and fastened on the front surface of the circuit board 300, the light collimator 460 is matched to achieve the sealing performance of the mounting cavity in the first emission housing 401.

In some embodiments, the UV curing glue and the structural curing glue used for bonding and sealing are epoxy resin glue, and the glue has good fluidity and high reliability and can meet the requirement of stable work in fluorinated liquid for a long time.

In some embodiments, the semiconductor cooler, the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical combiner 440 and the optical isolator 450 are fixed on the mounting surface of the inner cavity of the first transmitting housing 401 by the first mounting surface 4110, the second mounting surface 4120 and the third mounting surface 4130 which are arranged in steps to form a mounting height difference between the laser 410, the collimating lens 420, the first optical path translating prism 430, the optical combiner 440 and the optical isolator 450, the laser 410 and the collimating lens 420 which are relatively high in mounting height are arranged on the back side of the circuit board 300 through the mounting through hole 320 on the circuit board 300, and the first optical path translating prism 430, the optical combiner 440 and the optical isolator 450 which are relatively low in mounting height are arranged on the front side of the circuit board 300, so that an overlapping area of the optical transmitting assembly 400 and the circuit board 300 in space can be reduced.

In some embodiments, the first emission housing 401 further includes a first top surface 4014 disposed opposite to the first contact surface 4011, the first top surface 4014 faces the upper housing 201, the first top surface 4014 is provided with a first air release hole 4013 extending to the first contact surface 4011, the first air release hole 4013 is communicated with the third mounting surface 4130 in the first emission housing 401, and the first air release hole 4013 is a tapered hole, and a diameter of the tapered hole gradually decreases from the first top surface 4014 to the third mounting surface 4130, so that the first emission housing 401 can communicate with the outside through the first air release hole 4013.

Fig. 12 is a partial assembly cross-sectional view of a light emitting module and a circuit board in an optical module provided in an embodiment of the present application. As shown in fig. 12, semiconductor cooler 470 is fixed on first mounting surface 4110 of first emission housing 401 such that the cooling surface of semiconductor cooler 470 faces away from first mounting surface 4110, then the laser substrate on which laser 410 is mounted is disposed on the cooling surface of semiconductor cooler 470, then collimating lens 420 is disposed on the cooling surface of semiconductor cooler 470, and collimating lens 420 is located in the light-emitting direction of laser 410; then, the first optical path translation prism 430 is fixed on the second mounting surface 4120, so that one end of the first optical path translation prism 430 is disposed in the light outgoing direction of the laser 410; then, the optical multiplexer 440 is fixed on the second mounting surface 4120, so that the laser beam reflected by the first optical path translation prism 430 is incident into the optical multiplexer 440; then, the optical isolator 450 is fixed to the third mounting surface 4130, the light incident surface of the optical isolator 450 is disposed to correspond to the light emitting surface of the optical combiner 440, and the light emitting surface of the optical isolator 450 is disposed to correspond to the light incident surface of the optical collimator 460.

Then the first emitting housing 401 is turned over, the laser 410 on the first mounting surface 4110, the collimating lens 420 and the first optical path translation prism 430 on the second mounting surface 4120 are embedded into the mounting through hole 320 on the circuit board 300, so that the height of the wire bonding surface of the laser 410 is the same as that of the back surface of the circuit board 300, and then the first contact surface 4011 of the first emitting housing 401 is bonded to the front surface of the circuit board 300, so that the optical combiner 440 on the second mounting surface 4120 and the optical isolator 450 on the third mounting surface 4130 are located in the cavity formed by the first emitting housing 401 and the front surface of the circuit board 300.

Then, the inner cavity of the emission cover plate 402 is arranged corresponding to the mounting through hole 320, and the contact surface of the emission cover plate 402 facing the back surface of the circuit board 300 is adhered to the back surface of the circuit board 300, so that the laser 410, the collimating lens 420 and the first optical path translation prism 430 on the back surface of the circuit board 300 are placed in the cavity formed by the emission cover plate 402 and the back surface of the circuit board 300.

In some embodiments, the first contact surface 4011 is bonded to the front surface of the circuit board 300 by a UV curable adhesive and a structural curable adhesive to achieve a hermetic bonding of the first contact surface 4011 of the first emitter housing 401 to the front surface of the circuit board 300. The contact surface of the emission cover plate 402 facing the back surface of the circuit board 300 and the back surface of the circuit board 300 are bonded together by a UV curable adhesive and a structural curable adhesive to achieve the hermetic bonding of the emission cover plate 402 and the back surface of the circuit board 300. In this way, the first radiation housing 401 is bonded to the front surface of the circuit board 300, and the radiation cover plate 402 is bonded to the back surface of the circuit board 300, so that the first radiation housing 401, the circuit board 300 and the radiation cover plate 402 are hermetically assembled.

In some embodiments, the first emission housing 401 is a relatively complete housing structure that can accommodate all of the optical and electrical components and form a complete sealed cross-section. The transmitting cover plate 402 on the back side of the circuit board 300 is designed as a simple cavity structure and also forms a complete sealing section. During assembly, the first emission housing 401, the circuit board 300 and the emission cover plate 402 form a sandwich structure, the contact interface between the first emission housing 401 and the front side of the circuit board 300 is sealed by glue, the contact interface between the emission cover plate 402 and the back side of the circuit board 300 is sealed by glue, and then a complete sealed cavity structure is formed by matching with the light collimator 460.

The first emission housing 401, the circuit board 300 and the emission cover plate 402 form a sealed cavity, and the first air vent 4013 on the first emission housing 401 is sealed after all sealing operations are completed, so as to ensure that air leakage does not occur in all sealing areas due to air expansion in the sealing process of the first emission housing 401, the circuit board 300 and the emission cover plate 402.

After the first emitting housing 401, the circuit board 300, and the emitting cover plate 402 of the light emitting assembly 400 are sealed and assembled, the laser 410 emits a laser beam under the action of the driving current transmitted by the circuit board 300, the laser beam is converted into a collimated beam through the collimating lens 420, the collimated beam is reflected through the first light path translation prism 430, so that the collimated beam at the back side of the circuit board 300 is reflected to the front side of the circuit board 300, the reflected multiple paths of collimated beams are converted into one path of composite beam through the optical combiner 440, the composite beam directly penetrates through the optical isolator 450 to enter the optical collimator 460, and is transmitted into the optical fiber 600 through the optical collimator 460, thereby realizing the emission of light.

In some embodiments, a chip processing chip (DSP) 310 is disposed on the front surface of the circuit board 300, and the DSP chip 310 is used for processing the high frequency Signal and transmitting the high frequency Signal to the laser 410 to provide a Signal for the laser 410 to emit a laser beam, so that the laser 410 generates a Signal light.

Specifically, the front surface of the circuit board 300 is provided with a high-frequency signal connection line from the DSP chip 310 to a jack end reserved for the optical transmission module 400, so that a high-frequency signal transmitted from the gold finger end is processed by the DSP chip 310 and then transmitted to the optical transmission module 400 through the high-frequency signal line.

In order to transmit the high frequency signal of the DSP chip 310 to the laser 410, a high frequency signal via hole is disposed below the Tx output pad of the DSP chip 310, the high frequency signal via hole penetrates through the front and back surfaces of the circuit board 300, the upper end of the high frequency signal via hole is electrically connected to the Tx output pad of the DSP chip 310, the lower end of the high frequency signal via hole is electrically connected to a high frequency signal line disposed on the back surface of the circuit board 300, and the high frequency signal line is electrically connected to the laser 410 through a wire bonding. The DSP chip 310 thus located on the front side of the circuit board 300 transmits the high frequency signal on the circuit board 300 from the front side of the circuit board 300 to the back side of the circuit board 300 through the high frequency signal line connected to the Tx output pad thereof to transmit the high frequency signal to the laser 410 located on the back side of the circuit board 300 to achieve the high frequency signal connection of the optical transmission assembly 400 and the circuit board 300 so that the laser 410 emits the signal light.

In some embodiments, a plurality of high frequency signal vias are disposed on the circuit board 300, the plurality of high frequency signal vias are disposed on the right side of the mounting through hole 320, and each high frequency signal via is connected to the laser 410 in a one-to-one correspondence, such that a high frequency signal line connected to each high frequency signal via is connected to the laser 410 to transmit a high frequency signal transmitted by the circuit board 300 to the laser 410 to satisfy a high frequency signal required by the light emitting assembly 400.

In some embodiments, a dc signal line is further disposed on the back surface of the circuit board 300, and the dc signal line is electrically connected to the laser 410, so that the bias current transmitted through the dc signal line drives the laser 410 to emit light. The direct current signal line for transmitting the bias current can be led from the right side of the installation through hole 320 on the circuit board 300 in a routing mode, the laser 410 can emit light after receiving the bias current transmitted by the direct current signal line, and after the high-frequency signal line is transmitted to the laser 410, the laser 410 modulates the high-frequency signal into a light beam, so that the laser 410 generates signal light.

The dc signal line for transmitting the bias current may also be connected to the laser 410 from the upper side and the lower side of the mounting through hole 320, that is, the dc signal line for connecting the laser 410 and the high frequency signal line are located at different sides of the mounting through hole 320, which not only avoids the interference between the high frequency signal and the dc signal, but also makes the routing of the dc signal shorter and avoids the overcrowding of the wiring in the circuit board 300.

Fig. 13 is another schematic partial assembly diagram of a light emitting assembly and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in fig. 13, the first optical path translation prism 430 includes a first reflector 4310 and a second reflector 4320, the first reflector 4310 is located in the light emitting direction of the laser 410, the collimated light beam output by the collimating lens 420 is emitted to the first reflector 4310, the collimated light beam is reflected at the first reflector 4310, the reflected collimated light beam is reflected again at the second reflector 4320, and the reflected collimated light beam is located on the front side of the circuit board 300.

The laser 410 emits laser signals under the driving of bias current and high-frequency signals transmitted by the circuit board 300, in order to detect the emission power of the laser 410, the back surface of the circuit board 300 is provided with the optical detector 330, the optical detector 330 is arranged on the left edge of the installation through hole 320 on the circuit board 300, and the photosensitive surface of the optical detector 330 faces the light emitting direction of the laser 410, and is used for collecting forward light emitted by the laser 410 and sending collected data to related devices on the circuit board 300, so as to monitor the forward emission power of the laser 410.

In some embodiments, the light detector 330 is positioned within the interior cavity of the emission cover plate 402 such that the light detector 330 is positioned within the sealed cavity formed by the emission cover plate 402 and the back side of the circuit board 300 to ensure the hermeticity of the light emitting assembly 400.

In some embodiments, the light transmission characteristics of the reflective surface of the first reflector 4310 are used to allow a small portion of the collimated light beam to leak through the first reflector 4310 and enter the photosensitive surface of the light detector 330, so that the light detector 330 can receive a portion of the light beam, thereby obtaining the emitted optical power of the laser 410.

Specifically, the first reflecting mirror 4310 of the first light path translation prism 430 faces the light emitting direction of the laser 410 to divide the laser beam generated by the laser 410 into two beams, one beam (usually accounting for 95% of the total power) is reflected by the first reflecting mirror 4310 to the second reflecting mirror 4320 to reflect the laser beam from the back side of the circuit board 300 to the front side of the circuit board 300, and the other beam directly passes through the first reflecting mirror 4310 to enter the photosensitive surface of the light detector 330, and receives the laser beam emitted from the light emitting surface of the laser 410 through the photosensitive surface.

When the photo detector 330 is attached to the left side of the mounting through hole 320, the photo-sensitive surface of the photo detector 330 can be flush with the inner sidewall of the mounting through hole 320, so as to facilitate positioning of the photo detector 330.

When the light detector 330 is disposed on the back surface of the circuit board 300, the central axis of the photosensitive surface of the light detector 330 may coincide with the central axis of the laser 410, and the side of the light detector 330 facing the back surface of the circuit board 300 is mounted on the back surface of the circuit board 300 by a Surface Mount Technology (SMT), so that the light beam transmitted through the first reflector 4310 is incident into the light detector 330 as much as possible.

In some embodiments, 4 photodetectors 330 are disposed on the back surface of the circuit board 300, and each photodetector 330 is disposed corresponding to each laser 410, so that each photodetector 330 collects a portion of the laser beam emitted by each laser 410, which passes through the first reflector 4310, and measures the forward output optical power of the corresponding laser 410 through a device electrically connected to the photodetector 330.

Because the light detector 330 receives the parallel light with a certain area, the requirement on the precision of the assembling position of the light detector 330 is low, the assembling is easier, and the light transmitting range of the first reflector 4310 in the first light path translation prism 430 is only required to be aligned with the photosensitive surface of the light detector 330, so that the light detector 330 can collect the laser beam penetrating through the first reflector 4310.

When the optical detector 330 is fixed on the back surface of the circuit board 300, the side surface of the optical detector 330 connected with the back surface of the circuit board 300 is provided with an anode, and the anode can be directly welded or fixed on the grounding metal layer on the circuit board 300 by means of conductive adhesive and the like; the side of the light detector 330 opposite to the back of the circuit board 300 is provided with a cathode, and the cathode is electrically connected with the circuit board 300 through a routing, so that the light detector 330 is electrically connected with the circuit board 300.

After the light emitting module 400 is reversely mounted to the front surface of the circuit board 300, the first top surface 4014 of the first emission case 401 in the light emitting module 400 is in contact with the upper case 201; after the laser 410 in the optical transmission assembly 400 is signal-connected to the DSP chip 310 on the front side of the circuit board 300 through a high-frequency signal line, the laser 410 is driven by the direct current and high-frequency signal transmitted by the circuit board 300 to generate a laser beam, so that the laser 410 generates heat to raise the temperature, and the light emitting performance of the laser 410 is affected by the temperature, so that the laser 410 needs to operate in a certain fixed temperature range, and therefore the laser 410 needs to be placed on the semiconductor refrigerator 470 to ensure the operating temperature of the laser 410, and the semiconductor refrigerator 470 generates a large amount of heat during the refrigeration process, which needs to be radiated to ensure the refrigeration efficiency of the semiconductor refrigerator 470.

Since the laser 410 is fixed to the semiconductor cooler 470 on the first mounting surface 4110 of the first emission housing 401, heat generated by the laser 410 is transmitted to the first emission housing 401 through the semiconductor cooler 470 to maintain the temperature of the laser 410. In order to improve the heat dissipation performance of the optical module, the first emission housing 401 may be made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the first emission housing 401 and the area of the first top surface 4014 are properly increased, so that heat generated by the operation of the laser 410 and the semiconductor cooler 470 can be transmitted to the upper housing 201 through the first emission housing 401, thereby effectively improving the heat dissipation effect of the laser 410.

In some embodiments, the first emission housing 401 needs to be made of tungsten copper or other metal materials with good thermal conductivity, and the mass and the bottom surface area of the first emission housing 401 are properly increased, so as to increase the contact area between the first emission housing 401 and the upper housing 201, thereby improving the heat dissipation efficiency of the light emitting assembly 400.

In some embodiments, in order to facilitate the heat of the first transmitting housing 401 to be transmitted to the upper housing 201, a first heat conducting gasket may be disposed between the first top surface 4014 of the first transmitting housing 401 and the inner side surface of the upper housing 201, such that the heat of the first transmitting housing 401 is transmitted to the first heat conducting gasket, and the first heat conducting gasket transmits the heat to the upper housing 201, so as to effectively improve the heat dissipation effect.

In some embodiments, the first heat conductive pad may be a heat conductive adhesive, which can adhere the first top surface 4014 of the first emission housing 401 to the inner side surface of the upper housing 201 and can conduct heat of the first emission housing 401 to the upper housing 201.

In some embodiments, the most dominant heat source of the optical module is, in addition to the laser 410 and the semiconductor cooler 470, the DSP chip 310, and the side of the DSP chip 310 facing away from the circuit board 300 is in contact with the upper housing 201, so that heat generated by the DSP chip 310 during operation is transmitted to the upper housing 201, so as to transmit the heat generated by the DSP chip 310 to the outside of the optical module.

In order to facilitate the heat of the DSP chip 310 to be transmitted to the upper casing 201, a second heat-conducting gasket may be disposed between the DSP chip 310 and the inner side surface of the upper casing 201, so that the heat generated by the DSP chip 310 is transmitted to the second heat-conducting gasket, and the second heat-conducting gasket transmits the heat to the upper casing 201, thereby effectively improving the heat dissipation effect.

In some embodiments, the light receiving module 500 and the light emitting module 400 may be disposed side by side on the circuit board 300, and the light receiving module 500 and the circuit board 300 form a closed cavity structure to achieve a sealed assembly of the light receiving module 500.

Fig. 14 is a schematic diagram of an inverted structure of a light receiving element in an optical module provided in an embodiment of the present application, and fig. 15 is a schematic diagram of another angular structure of a light receiving element in an optical module provided in the embodiment of the present application. As shown in fig. 14 and 15, the light receiving module 500 provided in the embodiment of the present application includes a receiving housing 510, wherein the receiving housing 510 is covered and buckled on the front side of the circuit board 300 and is hermetically connected with the front side of the circuit board 300; the receiving housing 510 includes a second contact surface 5110 facing the circuit board 300 and a second top surface 5140 facing away from the circuit board 300, wherein the second contact surface 5110 is provided with a mounting groove 5120, an end of the mounting groove 5120 facing the front surface of the circuit board 300 is provided with an opening, and the mounting groove 5120 extends from the second contact surface 5110 to the second top surface 5140.

A wave splitter 520, a lens array 530, a reflection prism 540 and a receiving light collimator 550 are disposed in the mounting groove 5120 of the receiving housing 510, one end of the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 510, the other end is hermetically connected to the optical fiber 600, and the other end of the optical fiber 600 is connected to the optical fiber adapter 700, so that an external optical signal is injected into the optical fiber 600 through the optical fiber adapter 700, transmitted to the receiving light collimator 550 through the optical fiber 600, and transmitted into the mounting groove 5120 through the receiving light collimator 550.

In some embodiments, when the receiving light collimator 550 is inserted into the mounting groove 5120 of the receiving housing 510, the connection between the outer side surface of the receiving light collimator 550 and the outer side wall of the receiving housing 510 is sealed by a sealant to ensure the sealed connection of the receiving light collimator 550 and the receiving housing 510.

In the mounting groove 5120, the light-emitting surface of the receiving light collimator 550 corresponds to the light-entering surface of the wave splitter 520, the light-emitting surface of the wave splitter 520 corresponds to the light-entering surface of the lens array 530, and the light-emitting surface of the lens array 530 corresponds to the reflection prism 540. Thus, the received light transmitted to the receiving light collimator 550 through the optical fiber 600 is transmitted to the wave splitter 520, one path of the received light is demultiplexed into multiple paths of the sub-beams by the wave splitter 520, the multiple paths of the sub-beams are respectively emitted to the lens array 530, the multiple paths of the sub-beams are respectively transmitted to the reflection prism 540 by the lens array 530, and the reflection prism 540 reflects the multiple paths of the sub-beams onto the receiving chip on the circuit board 300, so as to achieve the receiving of the light.

In some embodiments, after the wave splitter 520, the lens array 530, the reflection prism 540 and the received light collimator 550 are respectively installed in the receiving housing 510, the second contact surface 5110 of the receiving housing 510 is adhesively fixed to the front surface of the circuit board 300. The second contact face 5110 is adhered to the front face of the circuit board 300 by the UV curable adhesive and the structural curable adhesive, so that the receiving housing 510 is hermetically assembled with the front face of the circuit board 300.

When the second contact face 5110 and the circuit board 300 are bonded, the receiving housing 510 positions the receiving chip, the transimpedance amplifier, and the security area required for wire bonding on the front face of the circuit board 300 in the mounting groove 5120 through the opening, and the receiving chip is positioned below the reflective prism 540, so that the beam splitter reflected by the reflective prism 540 is ensured to be emitted to the receiving chip, and the photoelectric conversion is realized.

In some embodiments, the second top surface 5140 of the receiving shell 510 faces the upper shell 201, the second top surface 5140 is provided with a second air release hole 5130 extending to the second contact surface 5110, the second air release hole 5130 is communicated with the mounting groove 5120 of the receiving shell 510, and the second air release hole 5130 is a tapered hole, the diameter of which is gradually reduced from the second top surface 5140 to the second contact surface 5110, so that the receiving shell 510 can be communicated with the outside through the second air release hole 5130.

Fig. 16 is a partial assembly cross-sectional view of a light receiving module and a circuit board in an optical module according to an embodiment of the present disclosure. As shown in fig. 16, the receiving light collimator 550 is inserted into the receiving housing 510, and then the wave splitter 520 is mounted in the mounting groove 5120 of the receiving housing 510, such that the light incident surface of the wave splitter 520 corresponds to the light emitting surface of the receiving light collimator 550; then, the lens array 530 is mounted in the mounting groove 5120 of the receiving housing 510, such that the light incident surface of the lens array 530 and the light emitting surface of the wave splitter 520 are disposed correspondingly; then, the reflection prism 540 is installed at the light emitting surface of the lens array 530; then, the receiving housing 510 is reversely mounted to the front surface of the circuit board 300, and the second contact surface 5110 of the receiving housing 510 is adhered to the front surface of the circuit board 300, so that the receiving housing 510 covers the receiving chip, TIA, on the circuit board 300, and the reflection prism 540 is located right above the receiving chip.

Therefore, the external optical signal transmitted by the optical fiber is transmitted to the receiving optical collimator 550, the optical signal is transmitted into the wave splitter 520 through the receiving optical collimator 550, one path of light beam is demultiplexed into multiple paths of light beams through the wave splitter 520, the multiple paths of light beams are converted into multiple paths of converged light beams through the lens array 530, the multiple paths of converged light beams are reflected through the reflecting prism 540, the reflected multiple paths of converged light beams are respectively transmitted into a receiving chip on the circuit board 300, the optical signal is converted into an electric signal through the receiving chip, the converted electric signal is amplified through the TIA, the amplified electric signal is transmitted into the DSP chip 310, the electric signal is processed through the DSP chip 310 and then transmitted to an upper computer through a golden finger, and light receiving is achieved.

In some embodiments, the sealing and packaging manner of the light emitting module 400 and the light receiving module 500 is not limited to the packaging manner described in the above embodiments, and the emitting housing of the light emitting module 400 may be formed as a separate housing, and the circuit board 300 is inserted into the gap of the emitting housing, so that the circuit board 300 and the light emitting module 400 together form a part of a closed housing.

Fig. 17 is an assembly schematic diagram of another light emitting module, a light receiving module, a circuit board and an optical fiber in the optical module provided in the embodiment of the present application, and fig. 18 is a partial assembly schematic diagram of another light emitting module and a circuit board in the optical module provided in the embodiment of the present application. As shown in fig. 17 and 18, the light emitting assembly 400 adopts a light emitter structure with an upward front surface (front installation) such that the front surface of the light emitting assembly 400 is in contact with the upper housing 201; a bundle of optical fibers 600 is connected to the light emitting assembly 400, and the emitted light beam emitted from the light emitting assembly 400 is transmitted through the optical fibers 600 to realize the emission of light.

The light receiving module 500 and the light emitting module 400 are disposed on the same side of the circuit board 300, another bundle of optical fibers 600 is connected to the light receiving module 500, and an external optical signal is transmitted to the light receiving module 500 through the optical fibers 600, and is photoelectrically converted by the light receiving module 500 to achieve light reception.

Fig. 19 is a schematic structural diagram of another circuit board in an optical module according to an embodiment of the present application. As shown in fig. 19, the present application digs a hole in the circuit board 300, inserts the light emitting module 400 into the hole in the circuit board 300, and extends the circuit board 300 into the notch of the light emitting module 400, wherein the circuit board 300 and the light emitting module 400 together form a part of a closed housing.

Specifically, the circuit board 300 is provided with an insertion hole 340, the insertion hole 340 penetrates through the circuit board 300, and one side (the upper side shown in fig. 19) of the insertion hole 340 is provided with an opening, so that the insertion hole 340 forms a U-shaped hole. The outer edge of the light emitting module 400 is provided with a locking groove, the light emitting module 400 is inserted into the insertion hole 340 through the locking groove, that is, the left edge of the insertion hole 340 extends into the left locking groove of the light emitting module 400, the right edge of the insertion hole 340 extends into the right locking groove of the light emitting module 400, the lower edge (shown in fig. 19) of the insertion hole 340 extends into the front locking groove (shown in fig. 18) of the light emitting module 400, and the rear side (shown in fig. 18) side wall of the light emitting module 400 can be seen when viewed from the upper side (shown in fig. 19) of the circuit board 300.

Fig. 20 is a schematic structural diagram of another light emitting module in the optical module according to the embodiment of the present application. As shown in fig. 20, the light emitting assembly 400 includes a second emission housing 404, the second emission housing 404 including a top surface 4041 facing the upper housing 201; the inner cavity of the second emission housing 404 includes a mounting groove, the top surface of the mounting groove is provided with an opening, and the top surface where the opening is located and the top surface 4041 of the second emission housing 404 are the same surface. That is, the top surface 4041 of the second casing 404 is provided with an opening, and the opening is communicated with the mounting groove of the inner cavity of the second casing 404.

The second emission housing 404 further includes an upper cover plate 403, and the upper cover plate 403 covers the opening side of the mounting groove, so that the upper cover plate 403 and the second emission housing 404 form a cavity structure. In some embodiments, when the upper cover plate 403 is covered on the second emission housing 404, the upper cover plate 403 and the second emission housing 404 may be sealed by using a UV curable adhesive and a structural curable adhesive.

A card slot 406 is further disposed on an outer sidewall of the second transmitting housing 404, the second transmitting housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the card slot 406, an upper side of the card slot 406 is located on a front side of the circuit board 300, and a lower side of the card slot 406 is located on a back side of the circuit board 300. In this way, the second casing 404 is fixed to the circuit board 300 through the card slot 406, so that the second casing 404 is fixed to the circuit board 300.

In some embodiments, the length dimension of the upper portion of the card slot 406 in the left-right direction is greater than the length dimension of the lower portion of the card slot 406 in the left-right direction, and the length dimension of the card slot 406 in the left-right direction may be equal to or less than the length dimension of the lower portion of the card slot 406 in the left-right direction, so that the second transmitting housing 404 is formed in a shape in which the middle portion is narrow and both side portions are wide, to facilitate insertion of the second transmitting housing 404 into the insertion hole 340.

In some embodiments, the second emission housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the card slot 406, the optical device of the light emission assembly 400 is disposed in the installation slot of the inner cavity of the second emission housing 404, and then the upper cover 403 is covered on the integrated structure, so that the upper cover 403, the second emission housing 404 and the circuit board 300 form a complete sealed cavity.

In some embodiments, a third air bleed hole 4031 is formed in the upper cover plate 403, and the third air bleed hole 4031 is in communication with the mounting slot of the second emitter housing 404. The third bleed hole 4031 is closed after all sealing operations are completed to ensure that no leakage holes occur in all sealing areas due to air expansion during the sealing process. The third bleed hole 4031 may be a tapered hole, and the diameter of the tapered hole gradually decreases from the top surface to the bottom surface of the upper cover 403, so that the second emitter case 404 can communicate with the outside through the third bleed hole 4031.

Fig. 21 is a schematic structural diagram of another emission housing in the optical module provided in the embodiment of the present application, and fig. 22 is a schematic structural diagram of another angle of another emission housing in the optical module provided in the embodiment of the present application. As shown in fig. 21 and 22, the outer sidewall of the lower side of the second emission case 404 includes a first side 4051, a second side 4052, a third side 4053, and a fourth side 4054, the first side 4051 is disposed opposite to the fourth side 4054, the second side 4052 is disposed opposite to the third side 4053, the first side 4051 is disposed corresponding to the lower side (the lower side shown in fig. 19) of the jack 340, the second side 4052 is disposed corresponding to the left side circuit board of the jack 340, the third side 4053 is disposed corresponding to the right side circuit board of the jack 340, and the fourth side 4054 is disposed corresponding to the opening of the jack 340.

In some embodiments, the card slot 406 includes a first groove 4061, a second groove 4062, and a third groove 4063, the first groove 4061 is disposed on the first side 4051, the second groove 4062 is disposed on the second side 4052, and the third groove 4063 is disposed on the third side 4053. First groove 4061, second groove 4062 and third groove 4063 all open towards the outside of second transmission housing 404, and the one end and the second groove 4062 intercommunication, the other end and the third groove 4063 of first groove 4061 are linked together. Thus, the locking groove 406 is a U-shaped groove formed by the first groove 4061, the second groove 4062 and the third groove 4063.

In some embodiments, when the second casing 404 is inserted into the socket 340 of the circuit board 300 through the card slot 406, three sides of the socket 340 are respectively inserted into the first, second and

third grooves

4061, 4062 and 4063, so as to support and fix the second casing 404 by the circuit board 300.

When the light emitting module 400 is inserted into the receptacle 340, the first side 4051 of the second emission case 404 is first faced to the opening of the receptacle 340, and then the second emission case 404 is moved inward so that the circuit board on the lower side of the receptacle 340 extends into the first groove 4061, the circuit board on the left side of the receptacle 340 extends into the second groove 4062, the circuit board on the right side of the receptacle 340 extends into the third groove 4063, and the fourth side 4054 is exposed through the upper opening of the receptacle 340.

In some embodiments, when the circuit board on the side of the receptacle 340 is inserted into the first, second, and

third grooves

4061, 4062, and 4063, the front surface of the circuit board 300 is adhered to the upper sidewalls of the first, second, and

third grooves

4061, 4062, and 4063, so as to fix the circuit board 300 to the second casing 404.

After the front surface of the circuit board 300 is adhered to the upper side walls of the first groove 4061, the second groove 4062 and the third groove 4063, the back surface of the circuit board 300 can be adhered to the lower side walls of the first groove 4061, the second groove 4062 and the third groove 4063, that is, the thickness of the circuit board 300 is consistent with the dimensions of the first groove 4061, the second groove 4062 and the third groove 4063 in the vertical direction, so as to ensure the installation sealing performance of the circuit board 300 and the second emission housing 404.

In some embodiments, a gap may also exist between the back surface of the circuit board 300 and the lower sidewalls of the first, second, and

third grooves

4061, 4062, 4063, but the gap is not communicated with the mounting groove in the second emission housing 404, which does not affect the mounting sealing performance of the circuit board 300 and the second emission housing 404.

Fig. 23 is an exploded schematic structural diagram of another light emitting module in the optical module according to the embodiment of the present application. As shown in fig. 23, one end of the mounting groove in the second emission housing 404 is provided with a notch 4042, the notch 4042 faces away from the optical fiber adapter 700, the circuit board 300 on the right side (shown in fig. 19) of the jack 340 extends into the notch 4042, and the circuit board 300 is hermetically connected with the notch 4042, so that the circuit board 300 is electrically connected with the light emitting device in the second emission housing 404.

Specifically, one end of the mounting groove, which is provided with the notch 4042, is provided with the semiconductor cooler 470, the refrigerating surface of the semiconductor cooler 470 is provided with the laser 410 and the collimating lens 420, the collimating lens 420 is arranged in the light emitting direction of the laser 410, the laser 410 is electrically connected with the circuit board 300 extending into the notch 4042 through a routing, the routing surface height of the laser 410 is at the same height as the front surface of the circuit board 300, and thus the connection routing of the circuit board 300 and the laser 410 is shortest, so that excellent high-frequency transmission performance is ensured.

In some embodiments, the light emitting height of the laser 410 is substantially the same as the front surface of the circuit board 300, and the laser beam can be moved upward above the circuit board 300 by the beam translation prism to reduce the hole-digging area on the circuit board 300 and make the hole-digging structure rectangular, which facilitates the glue-sealing process at the contact position between the light emitting module 400 and the circuit board 300.

Specifically, a second optical path translation prism 480 is further disposed in the mounting groove of the second emission housing 404, the second optical path translation prism 480 is disposed in the light emitting direction of the laser 410, a laser beam emitted by the laser 410 is converted into a collimated beam through the collimating lens 420, and the collimated beam reflects the collimated beam on the front surface of the circuit board 300 to the upper side of the front surface of the circuit board 300 through the second optical path translation prism 480.

The second optical path translation prism 480 is used to translate the laser beam upwards by a certain distance, so that all the following optical device positions are located on the upper side of the front surface of the circuit board 300 and keep a proper gap with the circuit board 300. Thus, the position conflict between the optical device and the circuit board 300 is avoided, so that the hole digging area of the circuit board 300 can be reduced as much as possible, the arrangement area of the electrical devices on the circuit board 300 is increased, and the wiring of the circuit board 300 is easier.

In some embodiments, the light emitting assembly 400 further includes a light collimator 460, and the light incident surface of the light collimator 460 is disposed corresponding to the light emitting surface of the second light path translating prism 480. One end of the optical collimator 460 is inserted into the mounting groove of the second emission housing 404, and the other end is hermetically connected with the optical fiber 600, so that the optical fiber 600 is hermetically connected with the second emission housing 404 through the optical collimator 460. Thus, the laser beam reflected upward by the second optical path shifting prism 480 is incident into the optical collimator 460, and is coupled into the optical fiber 600 through the optical collimator 460.

In some embodiments, the optical transmitter module 400 further includes an optical isolator 450, wherein an incident surface of the optical isolator 450 is disposed corresponding to an emergent surface of the second optical path translating prism 480, and an emergent surface of the optical isolator 450 is disposed corresponding to an incident surface of the optical collimator 460, so that the laser beam reflected upward by the second optical path translating prism 480 directly penetrates through the optical isolator 450 and enters the optical collimator 460; when the reflected laser beam is reflected at the light-in surface of the light collimator 460, the optical isolator 450 is used to isolate the reflected beam and prevent the reflected beam from returning to the laser 410.

In some embodiments, when the second transmitting housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the card slot 406, a portion of the mounting groove in the second transmitting housing 404 is located at the back side of the circuit board 300, and another portion of the mounting groove is located at the front side of the circuit board 300.

In some embodiments, to increase the transmission rate of the optical module, multiple optical transmitters need to be integrated, and thus the optical transmitter assembly 400 may include multiple lasers 410 to achieve the emission of multiple emitted optical beams. Based on this, the light emitting module 400 includes a plurality of lasers 410, a plurality of collimating lenses 420, an optical combiner 440, a second optical path translating prism 480, an optical isolator 450, and an optical collimator 460, which are disposed in the mounting groove, the plurality of lasers 410 and the plurality of collimating lenses 420 are mounted in the mounting groove located at the back side of the circuit board 300, and the optical combiner 440, the second optical path translating prism 480, and the optical isolator 450 are mounted in the mounting groove located at the front side of the circuit board 300 to shift up the laser beam located at the front side of the circuit board 300 through the second optical path translating prism 480.

Fig. 24 is a schematic structural diagram of another emission housing provided in the embodiment of the present application, and fig. 25 is a schematic structural diagram of another angle of another emission housing provided in the embodiment of the present application. As shown in fig. 24 and 25, in order to support and fix the laser 410, the collimating lens 420, the optical combiner 440, the second optical path translating prism 480 and the optical isolator 450, the mounting groove in the second transmitting housing 404 includes a fourth mounting surface 4045, a fifth mounting surface 4044 and a sixth mounting surface 4043, the fourth mounting surface 4045 is communicated with the notch 4042, the fourth mounting surface 4045 is recessed in the fifth mounting surface 4044, and the fifth mounting surface 4044 is recessed in the sixth mounting surface 4043, so that the fourth mounting surface 4045, the fifth mounting surface 4044 and the sixth mounting surface 4043 form a step surface.

In some embodiments, the fourth mounting surface 4045 is located on the back side of the circuit board 300, and the fifth mounting surface 4044 and the sixth mounting surface 4043 are both located on the front side of the circuit board 300.

In some embodiments, the lower sidewalls of the fourth mounting surface 4045 and the third groove 4063 may be the same plane, so that both sidewalls of the third groove 4063 are provided with a notch, through which the circuit board 300 extends into the mounting groove of the second emission housing 404.

In some embodiments, a through hole may be disposed on an upper sidewall of the third groove 4063, and the through hole is vertically communicated with the notch 4042, so that after the circuit board 300 extends into the notch 4042, the extended circuit board 300 can be exposed through the through hole, and an electrical device, a wire bonding, and the like are conveniently disposed on the exposed portion of the circuit board 300, so as to conveniently perform wire bonding connection between the circuit board 300 and the laser 410.

In some embodiments, the fourth mounting surface 4045 may be flush with the back surface of the circuit board 300, and when the circuit board 300 extends into the notch 4042, the fourth mounting surface 4045 may be fixedly bonded to the back surface of the circuit board 300; the fourth mounting surface 4045 may also be recessed in the back surface of the circuit board 300, so that a gap exists between the back surface of the circuit board 300 and the fourth mounting surface 4045.

A seventh mounting surface 4046 that is recessed downward is provided on the fourth mounting surface 4045, the seventh mounting surface 4046 is recessed in the direction of the lower case 202 by the fourth mounting surface 4045, and the dimension of the seventh mounting surface 4046 in the left-right direction is smaller than the dimension of the fourth mounting surface 4045 in the left-right direction, so that the seventh mounting surface 4046 is also positioned on the back side of the circuit board 300.

Semiconductor cooler 470 is disposed on seventh mounting surface 4046, and a side wall of semiconductor cooler 470 on the side facing notch 4042 may abut against a connection surface between fourth mounting surface 4045 and seventh mounting surface 4046 to reduce a distance between semiconductor cooler 470 and circuit board 300 protruding into notch 4042.

Laser 410 and collimating lens 420 are sequentially disposed on the cooling surface of semiconductor cooler 470, and since seventh mounting surface 4046 is recessed in fourth mounting surface 4045, semiconductor cooler 470, laser 410 and collimating lens 420 are disposed on seventh mounting surface 4046, so that the height of the wire bonding surface of laser 410 is the same as the front surface of circuit board 300.

The optical multiplexer 440 is disposed on the fifth mounting surface 4044, and the light incident surface of the optical multiplexer 440 corresponds to the light emitting surface of the collimating lens 420, so that the collimated light beam output by the collimating lens 420 can be emitted into the optical multiplexer 440, and thus the collimated light beam is subjected to multiplexing in the optical multiplexer 440.

One end of the second optical path translation prism 480 is disposed on the fifth mounting surface 4044, and the other end protrudes from the sixth mounting surface 4043, so that the composite light beam output by the optical combiner 440 is reflected upward by a reflector of the second optical path translation prism 480, and the reflected composite light beam is reflected leftward by another reflector, so that the composite light beam flush with the front surface of the circuit board 300 is reflected upward to the upper side of the front surface of the circuit board 300.

One end of the second emission casing 404 opposite to the notch 4042 is provided with a light hole 4047, the light incident surface of the light collimator 460 is inserted into the second emission casing 404 through the light hole 4047, and the installation height of the light collimator 460 is higher than the sixth installation surface 4043. The optical isolator 450 is disposed on the sixth mounting surface 4043 such that the reflected light beam output from the second optical path shift prism 480 is directly transmitted through the optical isolator 450 and enters the optical collimator 460.

In the first embodiment, after the light collimator 460 is inserted into the mounting groove of the second emission housing 404 through the light hole 4047, the light collimator 460 is connected to the outer sidewall of the second emission housing 404 in a sealing manner, so that the light collimator 460 can seal the mounting groove in the second emission housing 404.

Fig. 26 is a partial schematic structural view of another light emitting module in the optical module provided in the embodiment of the present application, and fig. 27 is a cross-sectional view of another light emitting module in the optical module provided in the embodiment of the present application. As shown in fig. 26 and 27, semiconductor cooler 470 is fixed on seventh mounting surface 4046 of second transmitting housing 404, and then the laser substrate with laser 410 mounted thereon is disposed on the cooling surface of semiconductor cooler 470, so that the height of the bonding surface of laser 410 is the same as the front surface of circuit board 300; then, the collimating lens 420 is arranged on the refrigerating surface of the semiconductor refrigerator 470, and the collimating lens 420 is located in the light-emitting direction of the laser 410; then, the optical multiplexer 440 is fixed on the fifth mounting surface 4044, so that the multiple paths of laser beams emitted by the multiple lasers 410 are multiplexed in the optical multiplexer 440; then, the second optical path translation prism 480 is fixed on the fifth mounting surface 4044, so that one end of the second optical path translation prism 480 is arranged in the light outgoing direction of the optical multiplexer 440; then, the optical isolator 450 is mounted on the sixth mounting surface 4043, so that the composite beam reflected by the other end of the second optical path translation prism 480 passes through the optical isolator 450, and the composite beam passing through the optical isolator 450 is incident into the optical fiber 600 through the optical collimator 460; and then, an upper cover plate 403 is adhered to and covers the opening side of the top surface of the installation groove in the second emission shell 404, so that the upper cover plate 403 and the second emission shell 404 jointly form a part of a closed shell.

Fig. 28 is a partial assembly cross-sectional view of another light emitting module and a circuit board in a light module provided in an embodiment of the present application. As shown in fig. 28, the second emission housing 404 is inserted into the insertion hole 340 of the circuit board 300 through the card slot 406, so that the circuit board on the left side of the insertion hole 340 (as shown in fig. 18) is inserted into the notch 4042 of the second emission housing 404, and the back surface of the circuit board 300 inserted into the notch 4042 may be flush with the fourth mounting surface 4045 of the second emission housing 404; the right and front sides of the jack 340 are inserted into the second and

first grooves

4062 and 4061 of the card slot 406, so that the circuit board 300 is fixedly connected to the second radiating housing 404 through the card slot 406.

After the second transmitting housing 404 is bonded and fixed to the circuit board 300 through the card slot 406, the semiconductor refrigerator 470 is fixed to the seventh mounting surface 4046, the laser 410 and the collimating lens 420 are fixed to the cooling surface of the semiconductor refrigerator 470, the optical combiner 440 and the second optical path translation prism 480 are fixed to the fifth mounting surface 4044, and then the optical isolator 450 is fixed to the sixth mounting surface 4043.

After the high-frequency signal transmitted from the golden finger end is processed by the DSP chip 310, the high-frequency signal is transmitted to the laser 410 through the high-frequency signal line and the routing arranged on the front surface of the circuit board 300, a plurality of lasers 410 are driven to emit a plurality of paths of laser beams, and the plurality of paths of laser beams are converted into a plurality of paths of collimated light beams through a plurality of collimating lenses 420; the multi-path collimated light beams are combined into one path of combined light beam through the light combiner 440, the combined light beam is reflected by the second light path translation prism 480 and moves upwards to the upper side of the front face of the circuit board 300, the reflected combined light beam directly penetrates through the optical isolator 450 to enter the optical collimator 460, and the combined light beam enters the optical fiber 600 through the optical collimator 460, so that the multi-path light beam is emitted through one optical fiber.

In some embodiments, the DSP chip 310 is disposed on the front side of the circuit board 300, and the height of the wire bonding surface of the laser 410 is the same as that of the front side of the circuit board 300, so that a high-frequency signal connection line is disposed from the DSP chip 310 to the insertion hole 340 on the front side of the circuit board 300, and the circuit design on this side is designed to transmit the high-frequency signal transmitted from the gold finger end to the laser 410 through the high-frequency signal line after being processed by the DSP chip 310.

The light emitting assembly 400 shown in the embodiment of the present application is composed of a light emitter assembly, an upper cover plate 403 and a second emitting housing 404, the upper cover plate 403 and the second emitting housing 404 jointly form a housing with a notch at one end, the circuit board 300 extends into the notch of the housing, so that the circuit board 300, the upper cover plate 403 and the second emitting housing 404 jointly form a part of a closed housing, and then a complete closed cavity structure is formed by matching with the light collimator 460.

In some embodiments, the top cover plate 403 and the second emission housing 404 are made of tungsten copper or other metal materials with good thermal conductivity, and the mass of the second emission housing 404 and the area of the top cover plate 403 are increased appropriately, so as to increase the contact area between the top cover plate 403 and the top housing 201, thereby improving the heat dissipation efficiency of the light emitting assembly 400.

In some embodiments, to facilitate the heat of the second transmitting casing 404 to be transmitted to the upper casing 201, a heat conducting gasket may be disposed between the top surface 4041 of the second transmitting casing 404, the top surface of the upper cover plate 403 and the inner side surface of the upper casing 201, so that the heat of the second transmitting casing 404 is transmitted to the heat conducting gasket, and the heat conducting gasket transmits the heat to the upper casing 201, so as to effectively improve the heat dissipation effect.

In some embodiments, the light receiving assembly 500 and the light emitting assembly 400 may be disposed side by side on the same side of the circuit board 300, i.e., the light receiving assembly 500 is disposed on the front side of the circuit board 300, on one side of the receptacle 340; the light receiving module 500 and the light emitting module 400 may also be disposed on different sides of the circuit board 300, i.e., the light receiving module 500 is disposed on the back side of the circuit board 300.

Fig. 29 is a schematic diagram of an inverted structure of another light receiving element in an optical module according to an embodiment of the present application. As shown in fig. 29, the light receiving module 500 includes a receiving housing, which covers the front side of the circuit board 300 and is hermetically connected to the front side of the circuit board 300; including the installation cavity in the receiving housing, be provided with the optical receiver subassembly in the installation cavity, and the installation cavity is provided with the opening towards the positive one end of circuit board 300, and light receiving device passes through this opening and circuit board 300's front intercommunication. Thus, a closed cavity structure is formed by the receiving housing and the circuit board 300, and the optical receiver assembly is disposed in the closed cavity structure.

In some embodiments, the receiving housing carries all passive optical components, including the light receiving collimator, the wave splitter, the focusing mirror, the corner prism, etc., while the receiving housing covers the detectors PD and TIA on the circuit board 300, and the safety area required for wire bonding. In this manner, the light receiver module is fixedly mounted in the inner cavity of the receiving housing, and then the receiving housing is flip-covered on the front surface of the circuit board 300 to achieve the hermetic assembly of the light receiver module 500.

The receiving shell is provided with an air vent on a surface back to the front surface of the circuit board 300, the air vent is communicated with an inner cavity of the receiving shell, and the air vent on the receiving shell is sealed after all sealing operations are finished so as to ensure that air leakage cannot occur in all sealing areas due to air expansion in the sealing process.

In the traditional optical module design, the external optical fiber is connected with the optical module by inserting the external optical fiber adapter into the optical adapter of the optical module to realize the butt joint of the optical fiber, and the optical fiber flange in the adapter is in end face physical contact with the optical fiber adapter. When the optical module enters the refrigerant liquid, the contact surface is polluted by the refrigerant liquid, and extra loss is caused. Also in this scenario, the contaminated endface cannot be cleaned, creating permanent damage.

Fig. 30 is a schematic partial assembly diagram of an optical fiber and a housing in an optical module according to an embodiment of the present disclosure. As shown in fig. 30, in order to avoid the optical module from entering the refrigerant fluid, the refrigerant fluid may contaminate the contact surface between the optical fiber and the optical fiber adapter, the optical fiber 600 is directly led out by using the connection manner of the optical fiber pigtail at the optical port 205 of the optical module, so that the optical fiber 600 passes through the optical port 205.

In some embodiments, in order to protect the optical fiber 600, an optical fiber protector 610 is disposed at the optical port 205, the optical fiber protector 610 is inserted into the optical port 205, and the optical fiber 600 is embedded in the optical fiber protector 610, so that the risk of port contamination when the optical fiber 600 is connected with an optical module can be eradicated, and the long-term stable operation of the optical module can be ensured.

The optical module provided by the embodiment of the application is applied to the structural design of a high-degree optical communication module, and comprises innovation considerations in the aspects of optics, structure, high-frequency signal transmission, heat dissipation and the like, and the light emitting component is designed into a completely closed structure, so that the problem of sealing of a light emitting path is solved; the light receiving component is designed into a completely closed structure, so that the problem of receiving light path sealing is solved; the optical interface adopts a tail fiber mode, the contact connection between the optical fiber adapter and the optical interface of the optical module and the optical adapter is cancelled, and the pollution and sealing problems at the optical interface are eliminated; the optical assembly and the sealing connection between the optical assembly and the circuit board are carried out by adopting epoxy glue, so that the structural connection and reinforcement functions are realized, the sealing function is also realized, and the cooling liquid is ensured not to permeate into the light emitting assembly and the light receiving assembly; the reasonable design of the bonding interface simplifies the gluing and bonding process, thereby solving the sealing problem of the assembly bonding position of the parts; the structure design is simple, and the device is suitable for batch production.

This application has realized the totally enclosed encapsulation to the free optics light path in the optical module through unique structural design and arrangement, and then has realized the long-term and reliable work of optical module in the liquid cooling environment, has greatly improved emission of light subassembly and light receiving assembly's radiating effect.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present application.

Claims

1. A light module, comprising:

wherein the light emitting assembly includes:

a card slot is arranged on the outer side wall of the second transmitting shell and inserted into the jack through the opening, the upper side of the card slot is positioned on the front side of the circuit board, and the lower side of the card slot is positioned on the back side of the circuit board; the mounting groove comprises a fourth mounting surface, a fifth mounting surface and a sixth mounting surface, wherein a sunken seventh mounting surface is arranged on the fourth mounting surface, and the fourth mounting surface and the seventh mounting surface are both positioned on the back side of the circuit board; the fourth mounting surface is recessed in the fifth mounting surface, the fifth mounting surface is recessed in the sixth mounting surface, and the fifth mounting surface and the sixth mounting surface are both positioned on the positive side of the circuit board; a notch is formed in one end of the mounting groove, the notch is communicated with the fourth mounting surface, and the circuit board on one side of the jack extends into the notch;

the second optical path translation prism is arranged on the fifth mounting surface and is used for moving the laser beam positioned on the front surface of the circuit board upwards;

one end of the optical collimator is inserted into the mounting groove, and the other end of the optical collimator is connected with the optical fiber in a sealing manner; and the outer side wall of the second transmitting shell is connected with the outer side wall in a sealing mode.

2. The light module of claim 1, wherein the outer sidewall of the second emission housing comprises a first side, a second side, a third side, and a fourth side, the first side disposed opposite the fourth side, the second side disposed opposite the third side;

the third side face and the notch are located on the same side, three side faces of the jack are respectively connected with the first side face, the second side face and the third side face in a sealing mode, and the fourth side face is exposed through the opening of the jack.

3. The optical module according to claim 2, wherein the card slot includes a first groove, a second groove, and a third groove, the first groove is disposed on the first side surface, the second groove is disposed on the second side surface, the third groove is disposed on the third side surface, and the third groove and the notch are located on the same side;

three sides of the jack are respectively inserted into the first groove, the second groove and the third groove.

4. The optical module according to claim 3, wherein the front surface of the circuit board is hermetically connected to the upper side walls of the first groove, the second groove and the third groove, and the back surface of the circuit board is hermetically connected to the lower side walls of the first groove, the second groove and the third groove.

5. The optical module according to claim 3, wherein the front surface of the circuit board is hermetically connected to the upper sidewalls of the first groove, the second groove and the third groove, and a gap is formed between the back surface of the circuit board and the lower sidewalls of the first groove, the second groove and the third groove, and the gap is not communicated with the mounting groove.

6. The optical module of claim 3, wherein the lower sidewall of the third groove is coplanar with the fourth mounting surface.

7. The optical module according to claim 3, wherein a through hole is formed in an upper sidewall of the third groove, and the through hole is vertically communicated with the notch.

8. The optical module according to claim 1, wherein a third air hole is disposed on a surface of the upper cover plate facing away from the circuit board, and the third air hole is communicated with the mounting groove.

9. The light module of claim 1, wherein the light emitting assembly further comprises:

the optical multiplexer is arranged on the fifth mounting surface and is used for combining the multiple paths of laser beams emitted by the lasers into a path of composite beam;

and the optical isolator is arranged on the sixth mounting surface, is positioned between the second light path translation prism and the optical collimator and is used for directly transmitting the composite light beam reflected by the second light path translation prism to the optical collimator.

10. The optical module of claim 1, wherein an end of the second emission housing facing away from the notch is provided with a light-transmissive hole, and the light collimator is inserted into the mounting groove through the light-transmissive hole.