CN203810164U - Thermal-conductive LED light emitting body and LED lighting lamp - Google Patents
Thermal-conductive LED light emitting body and LED lighting lamp Download PDFInfo
- Publication number
- CN203810164U CN203810164U CN201420113650.2U CN201420113650U CN203810164U CN 203810164 U CN203810164 U CN 203810164U CN 201420113650 U CN201420113650 U CN 201420113650U CN 203810164 U CN203810164 U CN 203810164U
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- Prior art keywords
- led
- thermal
- thermal conductivity
- conducting substrate
- substrate
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- 239000000758 substrate Substances 0.000 claims abstract description 67
- 239000000843 powder Substances 0.000 claims abstract description 16
- 238000004020 luminiscence type Methods 0.000 claims description 28
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical group [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 230000000694 effects Effects 0.000 abstract description 4
- 230000004907 flux Effects 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 239000001307 helium Substances 0.000 description 5
- 229910052734 helium Inorganic materials 0.000 description 5
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical group [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical class [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000005491 wire drawing Methods 0.000 description 1
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Led Device Packages (AREA)
Abstract
The utility model discloses a thermal-conductive LED light emitting body and an LED lighting lamp. The thermal-conductive LED light emitting body comprises an elongated thermal-conductive substrate, LED light emitting units are arranged on the surface of the thermal-conductive substrate, and a fluorescent powder layer is coated on the long surface of the thermal-conductive substrate. The thermal-conductive substrate is adopted, the fluorescent powder layer only wraps the surface, where the LED light emitting units are arranged, of the thermal-conductive substrate, and other surfaces are not wrapped by the fluorescent powder layer which is low in thermal conductivity, so that the other surfaces can directly contact with outside radiating gas to realize heat exchange. In addition, a rough-grain porous structure or a fin-shaped structure is arranged on the surface, opposite to the LED light emitting units, of the thermal-conductive substrate, so that good radiating effect is realized; due to high radiating performance, the LED units can be driven by higher current to acquire higher luminous flux or lumen value, so that cost of per unit lumen is greatly lowered.
Description
Technical field
The utility model relates to lighting technical field, relates in particular to a kind of thermal conductivity LED illuminator.The utility model also relates to a kind of LED illuminating lamp of this thermal conductivity LED illuminator as light emitting source that use.
Background technology
Light emitting diode (LED) is a kind of semiconductor light sources, and compared with conventional incandescent lamp source, LED has the features such as high light efficiency, long-life, and LED is as light source of new generation replace incandescent and day by day go deep into people's life gradually.But, the packing forms of LED is generally placed on blue-light LED chip in the support bowl cup being made up of the metal material such as copper, aluminium injection moulding PPA at present, then apply fluorescent material and then obtain white light, because support itself is not had a light transmission, so the LED encapsulating products obtaining, as 2835 etc., is generally spot light transmitting, and Integral luminous angle is less than normal, generally within 180 ° of scopes.So, in order to make LED there is large lighting angle and high luminous efficiency, there is on the market at present a kind of linear LED packing forms or be called LED filament, it adopts linear transparent material as substrate, LED chip seals whole linear substrate after die bond, bonding wire on this substrate with fluorescent material glue-line mould, obtain the luminous LED encapsulating products of a kind of linearity.This product has 360 ° of luminous features, is assembled in the illumination effect that can obtain a kind of approximate incandescent lamp in bulb lamp or candle lamp.But, due to filament in encapsulation process phosphor gel by the whole area of substrate or most area covering, completely cut off the heat dissipation channel of substrate, thus at present this LED filament product on the market exist without efficiently radiates heat, can not large driven current density, high in cost of production series of problems.
Utility model content
Based on the problems referred to above, the utility model provides a kind of thermal conductivity LED illuminator.
The technical solution of the utility model is as follows:
A kind of thermal conductivity LED illuminator that the utility model provides, comprise the heat-conducting substrate of strip, on a surface of described heat-conducting substrate long axis direction, be provided with LED luminescence unit, on the described heat-conducting substrate surface at described LED luminescence unit place, be coated with phosphor powder layer, described phosphor powder layer covers described LED luminescence unit.
Further, LED luminescence unit is electrically connected with the electrode pin of the both ends or one end that are arranged on heat-conducting substrate long axis direction; Wherein, when the quantity of LED luminescence unit exceedes more than two, between each LED luminescence unit, be connected in series successively linearly or U-shaped shape setting on heat-conducting substrate by plain conductor; When being connected in series, multiple LED luminescence units form U-shaped shape while arranging, electrode pin is arranged on one end of heat-conducting substrate long axis direction, otherwise multiple LED luminescence units are connected in series and form linearity while arranging, electrode pin is arranged on the two ends of heat-conducting substrate long axis direction.
Further, described LED luminescence unit is to be chosen as a kind of or its any combination in blue-light LED chip, red LED chip, green light LED chip, yellow light LED chip, purple LED chip;
Further, described heat-conducting substrate can be chosen as the material that thermal conductivity factor is greater than 50W/mK, as, aluminum substrate, copper substrate, silicon substrate or aluminum nitride ceramic substrate etc.
Further, the heat-conducting substrate of described strip, its length is 1cm～20cm, and width is 0.3mm～5mm, and thickness is 0.1mm～5mm; Preferred, its length is 2cm～10cm, and width is 0.5mm～2mm, and thickness is 0.3mm～4mm;
Further, be rectangle, square, trapezoidal or convex at the cross section of the described heat-conducting substrate short-axis direction at described LED luminescence unit place.
Further, arrange at the rule of surface of described heat-conducting substrate long axis direction the some through holes or the groove that offer laterally or longitudinally arrange; In through hole or groove, fill and process with transparent resin, the area of through hole or groove accounts for 40%～80% of whole substrate area, and LED luminescence unit is just arranged on the junction between through hole or between groove.
Further, on the surface of the opposing described heat-conducting substrate of described LED luminescence unit, be provided with rough grain, loose structure or fin-shaped radiator structure.
Further, described fluorescence coating covers heat-conducting substrate and is provided with the surface of LED luminescence unit completely, and the cross-sectional profiles of fluorescence coating can be semicircle, half elliptic, rectangle or other arbitrary shapes;
Further, described fluorescent adhesive layer forms by a mode of glue wire drawing or mould envelope mode;
Further, the material of fluorescent material is selected from the combination of YAG series bloom, yellowish green powder or silicate series bloom, yellowish green powder, orange powder or nitride, nitrous oxides series rouge and powder or various different series fluorescent material.
The utility model also provides a kind of LED illuminating lamp, comprise the printing opacity cell-shell body of a sealing, be arranged on the light emitting source in described printing opacity cell-shell body, and be filled with high-termal conductivity gas medium in described printing opacity cell-shell body, described light emitting source adopts above-mentioned thermal conductivity LED illuminator.
In LED illuminating lamp, described high-termal conductivity gas medium is helium, hydrogen or the two mist, and in mist, the volume ratio of helium and hydrogen is arbitrary proportion, and preferably the volume ratio of helium and hydrogen is 95: 5.
The thermal conductivity LED illuminator that the utility model provides, it adopts heat-conducting substrate, and the surface of only wrapping up heat-conducting substrate and be provided with LED luminescence unit due to phosphor powder layer, other surface is not wrapped up by the phosphor powder layer of poor heat conduction, and other surface can directly contact and realize heat exchange with extraneous heat radiation gas.And, on the surface of the opposing heat-conducting substrate of LED luminescence unit, be provided with rough grain, loose structure or fin-shaped radiator structure, thereby reach good radiating effect; Because thermal diffusivity is good, LED luminescence unit can be obtained higher luminous flux or lumen value by higher current drives, thereby the cost of per unit lumen is reduced greatly.
Brief description of the drawings
Fig. 1 is the cross sectional representation of the long axis direction of thermal conductivity LED illuminator of the present utility model;
Fig. 2 is the structural representation of thermal conductivity LED illuminator of the present utility model.
Detailed description of the invention
Below in conjunction with accompanying drawing, preferred embodiment of the present utility model is described in further detail.
Embodiment 1
As illustrated in fig. 1 and 2, the utility model provides a kind of thermal conductivity LED illuminator, comprise strip heat-conducting substrate 1, be fixed on heat-conducting substrate long axis direction a lip-deep LED luminescence unit 2, be coated on the phosphor powder layer 3 of heat-conducting substrate 1 surface periphery at LED luminescence unit 2 places.
In the present embodiment, described heat-conducting substrate 1 adopts aluminum substrate, can certainly adopt the heat-conducting substrates such as copper substrate, silicon substrate or aluminum nitride ceramic substrate.The cross section of described heat-conducting substrate short-axis direction is rectangle, can certainly be square, trapezoidal or protruding " shape.Aluminum substrate 1 length is 3cm, and width is 1mm, and thickness is 0.4mm.LED luminescence unit 2 quantity are 6, and 6 LEDs luminescence units are all arranged on a surface of aluminum substrate 1 long axis direction; Certainly, the quantity of LED luminescence unit 2 also can arrange 1 as required, or comprise 6 can be at interior many.In the present embodiment, 6 LEDs luminescence units 2 are arranged and are electrically connected in series successively for linearly on the linearly surface that is arranged in aluminum substrate 1 long axis direction.In the present embodiment, LED luminescence unit 2 is chosen as blue-light LED chip, can certainly select as required a kind of or its any combination in green light LED chip, yellow light LED chip, purple LED chip, is not limited at this.Blue-light LED chip is formed and is electrically connected with the electrode pin 4 that is arranged on heat-conducting substrate 1 two ends by plain conductor.
In the present embodiment, on aluminum substrate 1 and the surface that is provided with blue-light LED chip 2 be coated with phosphor powder layer 3, and the cross-sectional profiles of phosphor powder layer 3 is semicircle.Absorption portion blue light is sent the longer gold-tinted of wavelength by phosphor powder layer 3, mixes by a certain percentage rear synthetic different-colour, the aobvious white light referring to remaining blue light.Fluorescent material in fluorescent glue bisque 3 is YAG bloom.
Further, for improving the area of dissipation of aluminum substrate 1, on the surface of the opposing aluminium base 1 of LED luminescence unit 2, be provided with rough grain 5; In other embodiments, can be set to loose structure or fin-shaped radiator structure in side or the bottom surface of heat-conducting substrate.
In another embodiment, in order further to improve the lighting angle of LED illuminator, on the surface of aluminum substrate 1 long axis direction, offer some through holes 6 of laterally arranging regularly arrangedly; Through hole 6 is filled and is processed with transparent resin, and through hole 6 areas account for 50% of whole aluminum substrate 1 area, and blue-light LED chip 2 is just arranged on the junction between through hole 6.In other embodiments, through hole 6 can replace with groove, its can longitudinal arrangement on the surface of heat-conducting substrate long axis direction.
The LED illuminating lamp of preparing based on the above-mentioned thermal conductivity LED illuminator providing, comprises and is arranged on the printing opacity cell-shell body (preferred glass housing) of a sealing light emitting source in glass shell, and in glass shell, is filled with the helium of high-termal conductivity; Wherein, light emitting source adopts the above-mentioned thermal conductivity LED illuminator that makes.
The profile structure of LED illuminating lamp can be arranged to bulb lamp, candle lamp, fluorescent tube etc.By the good thermal conduction characteristic of aluminum substrate 1 on thermal conductivity LED illuminator, directly contact and realize heat exchange with the helium in glass shell, thereby reach good radiating effect, improve the reliability of LED illuminating lamp, make LED chip be obtained higher luminous flux or lumen value by higher current drives, thereby the cost of per unit lumen is reduced greatly.
Should be understood that, the above-mentioned statement for the utility model preferred embodiment is comparatively detailed, can not therefore think the restriction to the utility model scope of patent protection, and scope of patent protection of the present utility model should be as the criterion with claims.
Claims (9)
1. a thermal conductivity LED illuminator, it is characterized in that, comprise the heat-conducting substrate of strip, heat-conducting substrate is provided with LED luminescence unit on a surface of described heat-conducting substrate long axis direction, on the described heat-conducting substrate surface at described LED luminescence unit place, is coated with phosphor powder layer.
2. thermal conductivity LED illuminator according to claim 1, is characterized in that, described LED luminescence unit is at least one in blue-light LED chip, red LED chip, green light LED chip, yellow light LED chip and purple LED chip.
3. thermal conductivity LED illuminator according to claim 1, is characterized in that, described heat-conducting substrate is aluminum substrate, copper substrate, silicon substrate or aluminum nitride ceramic substrate.
4. thermal conductivity LED illuminator according to claim 1, is characterized in that, arranges the some through holes or the groove that offer laterally or longitudinally arrange at the rule of surface of described heat-conducting substrate long axis direction.
5. thermal conductivity LED illuminator according to claim 1, is characterized in that, is provided with rough grain, loose structure or fin-shaped radiator structure on the surface of the opposing described heat-conducting substrate of described LED luminescence unit.
6. thermal conductivity LED illuminator according to claim 1, is characterized in that, is rectangle, square, trapezoidal or convex at the cross section of described heat-conducting substrate short-axis direction.
7. thermal conductivity LED illuminator according to claim 1, is characterized in that, described heat-conducting substrate, and its length is 1cm～20cm, and width is 0.3mm～5mm, and thickness is 0.1mm～5mm.
8. thermal conductivity LED illuminator according to claim 7, is characterized in that, described heat-conducting substrate, and its length is 2cm～10cm, and width is 0.5mm～2mm, and thickness is 0.3mm～4mm.
9. a LED illuminating lamp, the printing opacity cell-shell body that comprises a sealing, is arranged on the light emitting source in described clear lamp housing, and is filled with high-termal conductivity gas medium in described clear lamp housing, it is characterized in that, described light emitting source adopts thermal conductivity LED illuminator as claimed in claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420113650.2U CN203810164U (en) | 2014-03-13 | 2014-03-13 | Thermal-conductive LED light emitting body and LED lighting lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420113650.2U CN203810164U (en) | 2014-03-13 | 2014-03-13 | Thermal-conductive LED light emitting body and LED lighting lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203810164U true CN203810164U (en) | 2014-09-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420113650.2U Expired - Fee Related CN203810164U (en) | 2014-03-13 | 2014-03-13 | Thermal-conductive LED light emitting body and LED lighting lamp |
Country Status (1)
| Country | Link |
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| CN (1) | CN203810164U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3179163A1 (en) * | 2015-12-10 | 2017-06-14 | Shandong Prosperous Star Optoelectronics Co., Ltd | A parallel-connected led illuminant and a led lighting lamp |
| CN108071962A (en) * | 2017-06-13 | 2018-05-25 | 马文波 | A kind of method for strengthening LED light bar heat dissipation |
| EP3336411A4 (en) * | 2015-08-14 | 2018-12-26 | Chi Keung Yeung | Substrate for led packaging, led package, and led bulb |
| US11326746B2 (en) | 2018-12-13 | 2022-05-10 | Signify Holding B.V. | Lighting device with light-emitting filaments |
| US11466847B2 (en) | 2018-10-29 | 2022-10-11 | Signify Holding B.V. | Led filament arrangement with heat sink structure |
-
2014
- 2014-03-13 CN CN201420113650.2U patent/CN203810164U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3336411A4 (en) * | 2015-08-14 | 2018-12-26 | Chi Keung Yeung | Substrate for led packaging, led package, and led bulb |
| EP3179163A1 (en) * | 2015-12-10 | 2017-06-14 | Shandong Prosperous Star Optoelectronics Co., Ltd | A parallel-connected led illuminant and a led lighting lamp |
| CN108071962A (en) * | 2017-06-13 | 2018-05-25 | 马文波 | A kind of method for strengthening LED light bar heat dissipation |
| US11466847B2 (en) | 2018-10-29 | 2022-10-11 | Signify Holding B.V. | Led filament arrangement with heat sink structure |
| US11326746B2 (en) | 2018-12-13 | 2022-05-10 | Signify Holding B.V. | Lighting device with light-emitting filaments |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: SHENZHEN WISDOW REACHES INDUSTRY CO., LTD. Assignor: Liang Qian Contract record no.: 2015370000177 Denomination of utility model: Thermal-conductive LED light emitting body and LED lighting lamp Granted publication date: 20140903 License type: Common License Record date: 20151026 |
|
| LICC | Enforcement, change and cancellation of record of contracts on the licence for exploitation of a patent or utility model | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140903 Termination date: 20190313 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |