CN201126826Y - Bidirectional light-emitting heat-radiating light-emitting diode - Google Patents

Abstract

The utility model relates to a Light Emitting Diode (LED) technical field, promptly: the LED with bidirectional light emission and heat dissipation is characterized in that the positive electrode and the negative electrode on the LED wafer are respectively led out by leads and connected with leads extending out of the lens cover, the lens cover can cover the wafer, at least one wafer is fixed in the through hole on the substrate, a transparent and heat-insulating medium can be arranged on the outer surface of the wafer, and a layer of fluorescent powder is arranged on the outer surface of the medium or the lens cover, so that the LED has the advantages that: the wafer of the invention can emit light bidirectionally, so that the light efficiency of the LED lamp is improved by 16-36%, the white LED lamp separates the fluorescent powder from the wafer, the fluorescent powder is not easy to be aged and carbonized to blacken due to heating, the color temperature and the luminous intensity are stable, the luminous flux of the product is still more than 90% of the initial luminous flux after 5000 hours of aging test, and the product can be used for manufacturing various luminous LED lamps.

Description

Two-way light emitting diode

Technical field:

The utility model relates to the technical field of light-emitting diodes (LEDs), in particular to a light-emitting diode with bidirectional light emission and heat dissipation.

Background technique:

Light-emitting diode (LED) is a semiconductor solid light-emitting device. It uses a solid semiconductor wafer as a light-emitting material. When a forward voltage is applied to both ends, the carriers in the semiconductor recombine to cause photon emission to generate light. It is the most The popular light source technology, the characteristics of LED light source are: energy saving: energy consumption is reduced by 80% compared with incandescent lamps with the same light effect; using low voltage power supply (between 6-24V), good safety; small size, can be prepared into various Shaped devices; long life; fast response time: the response time of incandescent lamps is milliseconds, and the response time of LED lamps is nanoseconds; no harmful metal mercury pollution to the environment, etc., with the development and application of high-power LED lamps, LED lights have developed from point light sources to functional lighting, and the development prospects are extremely broad.

However, from the application practice, it is found that the LED lamps produced at home and abroad, especially the white LED lamps, have their obvious shortcomings:

1. The utilization rate of the light emitted by the chip is low: see Figure 1-2: chip 03 or chip 4 emits light on one side, and chip 03 or chip 4 does not emit light on the side of the bowl, but can only pass through the bowl 3 in the form of heat Transfer out, one is to cause the increase of heat, the other is to cause the waste of energy or the reduction of luminous flux.

2. The color temperature stability of the white light diode is poor, and the service life of the product is low: see Figure 1, the LED lamp is composed of a two-legged lead bracket 01, a chip 02 placed in a bracket bowl, and phosphor powder covering the chip 02 03 and the epoxy resin 04 that encapsulates the chip 02. Its disadvantage is that the chip 02 and the phosphor powder 03 are seamlessly covered when the epoxy resin 04 is packaged, and the light and heat emitted by the chip 02 accelerate the aging of the phosphor powder 03. The thick encapsulation of the resin makes the heat dissipation effect of the LED worse, and the heat dissipation capacity of the two-legged lead frame 01 is insufficient, which leads to the reduction of the light efficiency and life of the LED; 2) A beneficial improvement has been made to the LED lamp. The LED product is provided with a bowl cup 3 on a columnar substrate 2, a wafer 4 is arranged inside the bowl cup 3, and a layer of phosphor powder 5 is coated on the outer surface of the wafer 4. The substrate 2. Seal it with an anti-ultraviolet hollow lens cover 7, and fill the cavity of the lens cover 7 with an inert gas 8. The positive and negative electrodes of the wafer 4 are respectively drawn out with lead wires 6 and connected to the guide pins extending outside the lens cover 7. 1 connection, this structure reduces the temperature around the chip 4 due to the thermal conductivity of the columnar substrate 2, the guide pin 1 and the inert gas 8. However, it is found through research that due to the direct contact between the chip 4 and the phosphor powder 5, the fluorescent The powder 5 is directly heated, causing the phosphor powder 5 to be easily aged rapidly and carbonized and blackened, so that the white light generated by the combination of the blue light emitted by the blue light chip and the phosphor powder 5 will reduce the luminous flux in a short time, greatly reduce the light attenuation, and change the color temperature until Dead light means that the LED lamp is scrapped; therefore, only by reducing the ambient temperature of the phosphor powder can the aging and carbonization of the phosphor powder be prevented, the color temperature will not change, the working life of the LED lamp will be further extended, and the light efficiency of the LED lamp will be improved.

Utility model content:

The purpose of the utility model is to provide a bidirectional light-emitting and heat-dissipating light-emitting diode that can improve the utilization rate of the light emitted by the chip, reduce the ambient temperature of the fluorescent powder, and prolong the working life of the LED lamp.

The utility model is realized in the following way: the light-emitting diode of bidirectional light emission and heat dissipation is that the positive and negative electrodes on the light-emitting diode chip 20 are respectively drawn out with lead wires 21 and connected with the guide pins 22 extending outside the lens cover 40, 41, and the lens Covers 40, 41 can cover the wafer 20, and are characterized in that at least one through hole 15 is provided on the substrate 10, and the upper and lower ends of the through hole 15 are two outwardly expanding cup-shaped bottomless grooves 11, 12 , at least one chip 20 is fixed in the middle of the through hole 15 .

The above-mentioned wafer 20 is a wafer of red light, yellow light, blue light, green light or orange light.

The above-mentioned substrate (10) is made of PCB-based or copper-based or aluminum-based or iron-based materials.

A cavity (32) can be provided between the above-mentioned lens cover (40, 41) and the medium (30), and the cavity (32) is filled with one of nitrogen, helium, neon, argon, and xenon. gas.

Above-mentioned lens cover (40,41) is to make with anti-ultraviolet optical glass or optical plastics or resin or silica gel or epoxy resin or pottery material, and the profile of lens cover (40,41) is circular or oval or semi-circular. Round or flat or square or honeycomb hexagonal.

The outer surface of the blue light chip in the above-mentioned wafer (20) is provided with a light-transmitting, heat-insulating medium (30), and a layer of phosphor powder ( 31).

The medium (30) is made of heat-insulating, light-transmitting, UV-resistant silica gel or epoxy resin or ceramics or optical plastics or optical glass materials.

The phosphor (31) being arranged on the lens cover (40, 41) refers to being arranged in the interlayer of the lens cover (40, 41) or the inner surface of the lens cover or the outer surface of the lens cover or mixed in the lens cover (40, 41). (40, 41) within the material.

Compared with the prior art, the outstanding advantages of the utility model are:

1. High luminous efficiency of LED lights: Since the utility model can make both sides of the LED chip 20 emit light, it has been verified by experiments that the utility model improves the luminous efficiency by 36% respectively compared with the prior art 1 and the prior art 2 with the same power and 16%.

2. The luminous intensity of the LED lamp is stable: because the utility model moves the position of the fluorescent powder 31 from the periphery of the wafer 20, and uses the medium 30 to isolate the fluorescent powder 31 from the wafer 20, due to the heat insulation of the medium 30, the wafer 20. Most of the heat excited by the light emission is taken away by the metal substrate 10, and a small part is taken away by the light, forming a good ambient temperature around the phosphor powder 31. The phosphor powder is not suitable for aging and carbonization and blackening, and the color temperature remains unchanged. , to stabilize the luminous intensity of the LED lamp.

3. The service life of the utility model is extended: since the fluorescent powder of the utility model does not directly contact with the chip, the ambient temperature of the fluorescent powder becomes better, and it is not easy to cause the fluorescent powder 5 to be heated to cause rapid aging and carbonization and blackening, thus prolonging the life of the LED chip. The working life of the lamp is verified by experiments. After the LED lamp is aged for 5000 hours, the luminous flux of the prior art 1 is only 10% of the initial luminous flux, and the luminous flux of the prior art 2 is 85% of the initial luminous flux, while the luminous flux of the utility model It is more than 90% of the initial luminous flux, which greatly prolongs the working life of the LED lamp.

Description of drawings:

Fig. 1 is the structural representation of prior art 1;

Fig. 2 is a structural schematic diagram of prior art 2;

3 is a schematic cross-sectional view of the substrate in Embodiment 1-4 of the present invention;

Fig. 4 is the structural representation of the utility model embodiment 1;

Fig. 5 is the structural representation of the utility model embodiment 2;

Fig. 6 is the structural representation of the utility model embodiment 3;

Fig. 7 is a schematic top view of Embodiment 4 of the utility model;

Fig. 8 is a sectional view taken along line A-A of Fig. 7 .

Detailed ways:

The utility model is described further below with specific embodiment:

Embodiment 1: Refer to Fig. 3-4: the light-emitting diode of two-way light emission and heat dissipation is that the positive and negative electrodes on the light-emitting diode chip 20 are respectively drawn out with lead wires 21 and connected with the lead pins 22 extending outside the lens covers 40 and 41 , the lens cover 40 can cover the wafer 20, at least one through hole 15 is arranged on the substrate 10, the upper and lower ends of the through hole 15 are two cup-shaped bottomless grooves 11, 12 expanding outwards, At least one wafer 20 is fixed in the middle of the hole 15 .

The above-mentioned wafer 20 is a wafer of red light, yellow light, blue light, green light or orange light.

The above-mentioned substrate 10 is made of PCB-based or copper-based or aluminum-based or iron-based materials.

A cavity 32 may be provided between the lens cover 40 and the medium 30, and the cavity 32 is filled with an inert gas of nitrogen, helium, neon, argon, or xenon.

Above-mentioned lens cover 40 is to make with anti-ultraviolet optical glass or optical plastics or resin or silica gel or epoxy resin or ceramic material, and the profile of lens cover 40 is circular or oval or semicircle or planar or square or Honeycomb hexagon.

Embodiment 2: referring to Fig. 5: the basic structure is basically the same as that of Embodiment 1, but when the chip 20 is a blue light chip, a light-transmitting, heat-insulating medium 30 is arranged on the outer surface of the blue light chip, and a medium 30 is arranged on the outer surface of the medium 30 Layer Phosphor 31.

The above medium 30 is made of heat-insulating, light-transmitting, UV-resistant silica gel or epoxy resin or ceramics or optical plastics or optical glass materials.

Embodiment 3: Referring to Fig. 6: the basic structure is basically the same as that of Embodiment 2, except that the above-mentioned one layer of fluorescent powder 31 is arranged on the lens cover 40, that is, arranged in the interlayer of the lens cover 40, of course, the above-mentioned fluorescent powder 31 can also be arranged in the interlayer of the lens cover 40 or the inner surface of the lens cover 40 or the outer surface of the lens cover 40 or mixed in the material for making the lens cover 40 .

Embodiment 4: Refer to Figure 7-8: The substrate, wafer, bowl-shaped concave cup, medium, inert gas, lead wire and guide pin are basically the same as those in Embodiment 2 or Embodiment 3, except that multiple LED lamp assemblies are installed In a metal box body 50, the upper and lower parts of the box body 50 are made into upper and lower plane lens covers 41 with anti-ultraviolet optical glass or optical plastics or resin or silica gel or epoxy resin or ceramic materials. 41 interlayers are respectively provided with a layer of phosphor powder 31, certainly, phosphor powder 31 can also be arranged on the inner surface of the lens cover 41 or the outer surface of the lens cover 41 or mixed in the material of making the lens cover 41, also can be implemented as As in Example 2, the phosphor powder 31 is arranged on the outer surface of the medium 30, and the positive and negative electrodes of the chip are respectively drawn out with lead wires and then connected in parallel with the lead pins respectively. The number of LEDs can be designed according to the requirements of the light intensity. 31 is insulated by the medium 30 and the heat dissipation space is enlarged, and the heat dissipation effect of the metal box body 50 is good, so that the stability of the LED is improved, the luminous efficiency is increased, and the life is increased. The test proves that the lower the ambient temperature of the phosphor 31, the lower the temperature. The better the working environment, the greater the light effect and the longer the life.

A series of LED lighting lamps, LED signal lamps, LED indicator lights, LED decorative lamps, LED light strips, LED lamp cups, LED energy-saving lamps, LED underground lamps, and LED outline lamps can be produced by using the above-mentioned bidirectional light-emitting and heat-dissipating light-emitting diodes. , LED floodlights and other light-emitting lamps to meet the different needs of people, so as to achieve real energy saving and consumption reduction.

Claims (8)

1, the light-emitting diode of two-way luminous heat radiation, be the positive and negative electrode on the LED wafer (20) is drawn with lead-in wire (21) respectively and to be connected with lead foot (22) outside extending to lens cap (40,41), lens cap (40,41) can cover wafer (20), it is characterized in that substrate (10) is provided with at least one through hole (15), the upper and lower side of this through hole (15) is the groove (11,12) at the no end of two cup-shapeds that expand outwardly, and is fixed with at least one wafer (20) at the middle part of through hole (15).

2, the light-emitting diode of two-way luminous heat radiation according to claim 1 is characterized in that the wafer of described wafer (20) for ruddiness or gold-tinted or blue light or green glow or orange light.

3, the light-emitting diode of two-way luminous heat radiation according to claim 1 is characterized in that described substrate (10) makes with PCB base or copper base or aluminium base or iron.

4, the light-emitting diode of two-way luminous heat radiation according to claim 1, it is characterized in that to be provided with cavity (32) between described lens cap (40,41) and the medium (30), in cavity (32), be filled with the inert gas of one of nitrogen, helium, neon, argon gas, xenon.

5, the light-emitting diode of two-way luminous heat radiation according to claim 1, it is characterized in that described lens cap (40,41) is that the profile of lens cap (40,41) is circle or ellipse or semicircle or planar shaped or square or honeycomb hexagon with anti-ultraviolet optical glass or optical plastic or resin or silica gel or epoxy resin or ceramic material.

6, the light-emitting diode of two-way luminous heat radiation according to claim 1 and 2, the outer surface that it is characterized in that the blue light wafer in described wafer (20) is provided with printing opacity, heat insulation medium (30), and the outer surface of medium (30) or lens cap (40,41) are provided with layer of fluorescent powder (31).

7, the light-emitting diode of two-way luminous heat radiation according to claim 6 is characterized in that described medium (30) is to make of heat insulation, printing opacity, anti-ultraviolet silica gel or epoxy resin or pottery or optical plastic or optical glass material.

8, the light-emitting diode of two-way luminous heat radiation according to claim 6 is characterized in that described fluorescent material (31) is arranged on to be meant in the interlayer that is arranged on lens cap (40,41) on the lens cap (40,41) or the outer surface of the inner surface of lens cap or lens cap or be blended in the material of making lens cap (40,41).

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