CN203574934U - PCB board - Google Patents
PCB board Download PDFInfo
- Publication number
- CN203574934U CN203574934U CN201320716458.8U CN201320716458U CN203574934U CN 203574934 U CN203574934 U CN 203574934U CN 201320716458 U CN201320716458 U CN 201320716458U CN 203574934 U CN203574934 U CN 203574934U
- Authority
- CN
- China
- Prior art keywords
- pcb board
- layer
- signal transmssion
- ground plane
- transmssion line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012774 insulation material Substances 0.000 claims description 24
- 230000008054 signal transmission Effects 0.000 abstract description 10
- 239000011810 insulating material Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 abstract 8
- 230000005540 biological transmission Effects 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 3
- 239000002344 surface layer Substances 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 4
- 239000012141 concentrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to a PCB board, which comprises a transmission conductor layer, an isolating layer (3), a first insulating material layer (2) and a PCB board surface layer (1), wherein the transmission conductor layer comprises a plurality of signal transmission lines (4). The PCB board is characterized in that: the isolating layer (3) is coated on the surface of each signal transmission line (4) in a closed manner; the first insulating material layer (2) is pressed on the transmission conductor layer; and the PCB board surface layer (1) is pressed on the first insulating material layer (2). The PCB board designed by the utility model coats the signal transmission lines by adopting a closed manner for shielding, greatly enhances the anti-interference capability among signals, and improves the signal transmission efficiency.
Description
technical field
The utility model relates to a kind of pcb board.
Background technology
PCB(Printed Circuit Board), Chinese is printed circuit board, claims again printed circuit board (PCB), printed substrate, is important electronic unit, is the supporter of electronic devices and components, is the supplier of electronic devices and components electrical connection.In prior art, PCB plate is widely used, and conventional pcb board comprises lamina, doubling plate and multi-layer sheet, is first single sided board, and on the most basic PCB, part concentrates on wherein one side, and wire concentrates on another side.Because wire only appears at wherein one side, so just claim this PCB to be called one-sided circuit board.Single sided board is made simple conventionally, and cost is low, but shortcoming is cannot be applied on too complicated product.
Double sided board is the extension of single sided board, when individual layer wiring can not meet the needs of electronic product, will use double sided board.Two-sided have the copper of covering, and has cabling, and can carry out the circuit of conducting between two-layer by via hole, makes it to form needed network and connect.
Multi-layer sheet refers to that having three layers of above conductive pattern layer forms with the lamination of being separated by with insulating material therebetween, and the printed board that conductive pattern interconnects on request therebetween.Multilayer circuit board is that electronic information technology is to the product of high-speed, multi-functional, large capacity, small size, slimming, lightweight future development.
In lamina or doubling plate, earth connection, power line and signal transmssion line layout, at same layer, in multi-layer sheet, select one or more layers as ground plane, select one or more layers as bus plane, by the mode of via hole, set up contact between layers.Layer in pcb board in currently available technology remains based on two-dimension plane structure, and the limitation of planar structure is, ground wire or stratum are not spatially completely closed, be difficult to meet the demand to pcb board ground connection, between the ground wire of cutting apart or stratum, inevitably there is stray inductance and coupling capacitance, to cause each signal cannot obtain on all four reference potential, power line and bus plane have same problem.Planar structure is also difficult to the problem that interferes with each other between erasure signal, also cannot shield from outside high-frequency interferencing signal.
Utility model content
For above-mentioned technical problem, technical problem to be solved in the utility model is to provide a kind of for signal transmssion line on pcb board, adopts the mode of closed type parcel, the pcb board effectively disturbing between Inhibitory signal.
The utility model is in order to solve the problems of the technologies described above by the following technical solutions: the utility model has designed a kind of pcb board, comprises transfer wire layer, separator, the first insulation material layer and pcb board top layer; Wherein, transfer wire layer comprises several signal transmssion lines, is wrapped in to described separator closed type on the surface of described each root signal transmssion line; The first insulation material layer is compressed on transfer wire layer top; Pcb board top layer is compressed on insulation material layer top.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane being arranged in described separator, ground plane closed type surround described each root signal transmssion line, and do not contact each other between ground plane and each root signal transmssion line.
As a kind of optimal technical scheme of the present utility model: also comprise the bus plane being arranged in described separator, bus plane closed type surround described each root signal transmssion line, and do not contact each other between bus plane and each root signal transmssion line.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane being arranged in described separator, ground plane closed type surround described bus plane; Ground plane, bus plane and signal transmssion line, three does not contact each other mutually.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane being arranged in described separator, between bus plane and signal transmssion line, wherein, ground plane closed type surround described each root signal transmssion line, described bus plane closed type surround ground plane; Ground plane, bus plane and signal transmssion line, three does not contact each other mutually.
As a kind of optimal technical scheme of the present utility model: also comprise the second insulation material layer that is compressed on transfer wire layer below, described the first insulation material layer and the second insulation material layer wrap up described transfer wire layer.
A kind of pcb board described in the utility model adopts above technical scheme compared with prior art, has following technique effect:
(1) pcb board of the utility model design, adopts closed mode to wrap up signal transmssion line, forms shielding action, has greatly improved the antijamming capability between signal, has improved the efficiency of transmission of signal;
(2) in the pcb board of the utility model design, for separator, ground plane or bus plane have been designed, the electronic devices and components that are conducive to for being arranged on this pcb board provide more stable reference level and the signal circuit of low inductance, make all signal transmssion lines (4) there is definite resistance value, improved greatly the reliability of signal transmission;
(3) in the pcb board of the utility model design, also designed the first insulation material layer and the second insulation material layer, acting in conjunction, wraps up transfer wire layer, has further improved the reliability of signal transmission on pcb board.
Accompanying drawing explanation
Fig. 1 is the structural representation of the pcb board of the utility model design;
Fig. 2 is the use schematic diagram of the pcb board of the utility model design.
Wherein, 1. pcb board top layer, 2. the first insulation material layer, 3. separator, 4. signal transmssion line, 5. the second insulation material layer, 6. the first pin, 7. the second pin, 8. ground plane, 9. bus plane.
Embodiment
Below in conjunction with Figure of description, embodiment of the present utility model is described in further detail.
As shown in Figure 1, the utility model has designed a kind of pcb board, comprises transfer wire layer, separator 3, the first insulation material layer 2 and pcb board top layer 1; Wherein, transfer wire layer comprises several signal transmssion lines 4, is wrapped in to described separator 3 closed types on the surface of described each root signal transmssion line 4; The first insulation material layer 2 is compressed on transfer wire layer top; Pcb board top layer 1 is compressed on insulation material layer 2 tops.
The pcb board of the utility model design, adopts closed mode to wrap up signal transmssion line 4, forms shielding action, has greatly improved the antijamming capability between signal, has improved the efficiency of transmission of signal.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane 8 being arranged in described separator 3, ground plane 8 closed types surround described each root signal transmssion line 4, and do not contact each other between ground plane 8 and each root signal transmssion line 4.
As a kind of optimal technical scheme of the present utility model: also comprise the bus plane 9 being arranged in described separator 3, bus plane 9 closed types surround described each root signal transmssion line 4, and do not contact each other between bus plane 9 and each root signal transmssion line 4.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane 8 being arranged in described separator 3, ground plane 8 closed types surround described bus plane 9; Ground plane 8, bus plane 9 and signal transmssion line 4, three does not contact each other mutually.
As a kind of optimal technical scheme of the present utility model: also comprise the ground plane 8 being arranged in described separator 3, between bus plane 9 and signal transmssion line 4, wherein, ground plane 8 closed types surround described each root signal transmssion line 4, described bus plane 9 closed types surround ground plane 8; Ground plane 8, bus plane 9 and signal transmssion line 4, three does not contact each other mutually.
In the pcb board of the utility model design, for separator 3, ground plane 8 or bus plane 9 have been designed, the electronic devices and components that are conducive to for being arranged on this pcb board provide more stable reference level and the signal circuit of low inductance, make all signal transmssion lines 4 there is definite resistance value, improved greatly the reliability of signal transmission.
As a kind of optimal technical scheme of the present utility model: also comprise the second insulation material layer 5 that is compressed on transfer wire layer below, 5 pairs of described transfer wire layers of described the first insulation material layer 2 and the second insulation material layer wrap up.
In the pcb board of the utility model design, also designed the first insulation material layer 2 and the second insulation material layer 5, acting in conjunction, wraps up transfer wire layer, has further improved the reliability of signal transmission on pcb board.
Based on above technical scheme, between each layer of pcb board of the utility model design, by the via hole being arranged on each layer, connect; The pcb board of the utility model design is in actual application, as depicted in figs. 1 and 2, components and parts are arranged on the pcb board of the utility model design, and these electronic devices and components comprise two pins, and the first pin 6 has been realized and being connected with the ground plane 8 in separator 3 by via hole; The second pin 7 is connected with signal transmssion line 4 by via hole.
By reference to the accompanying drawings execution mode of the present utility model is explained in detail above, but the utility model is not limited to above-mentioned execution mode, in the ken possessing those of ordinary skills, can also under the prerequisite that does not depart from the utility model aim, make a variety of changes.
Claims (6)
1. a pcb board, comprises transfer wire layer, separator (3), the first insulation material layer (2) and pcb board top layer (1); Wherein, transfer wire layer comprises several signal transmssion lines (4), it is characterized in that: be wrapped in to described separator (3) closed type on the surface of described each root signal transmssion line (4); The first insulation material layer (2) is compressed on transfer wire layer top; Pcb board top layer (1) is compressed on insulation material layer (2) top.
2. a kind of pcb board according to claim 1, it is characterized in that: also comprise the ground plane (8) being arranged in described separator (3), ground plane (8) closed type surround described each root signal transmssion line (4), and do not contact each other between ground plane (8) and each root signal transmssion line (4).
3. a kind of pcb board according to claim 1, it is characterized in that: also comprise the bus plane (9) being arranged in described separator (3), bus plane (9) closed type surround described each root signal transmssion line (4), and do not contact each other between bus plane (9) and each root signal transmssion line (4).
4. a kind of pcb board according to claim 3, is characterized in that: also comprise the ground plane (8) being arranged in described separator (3), ground plane (8) closed type surround described bus plane (9); Ground plane (8), bus plane (9) and signal transmssion line (4), three does not contact each other mutually.
5. a kind of pcb board according to claim 3, it is characterized in that: also comprise being arranged in described separator (3), being positioned at the ground plane (8) between bus plane (9) and signal transmssion line (4), wherein, ground plane (8) closed type surround described each root signal transmssion line (4), described bus plane (9) closed type surround ground plane (8); Ground plane (8), bus plane (9) and signal transmssion line (4), three does not contact each other mutually.
6. according to a kind of pcb board described in any one in claim 1 to 5, it is characterized in that: also comprise the second insulation material layer (5) that is compressed on transfer wire layer below, described the first insulation material layer (2) wraps up described transfer wire layer with the second insulation material layer (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320716458.8U CN203574934U (en) | 2013-11-13 | 2013-11-13 | PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320716458.8U CN203574934U (en) | 2013-11-13 | 2013-11-13 | PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203574934U true CN203574934U (en) | 2014-04-30 |
Family
ID=50542640
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320716458.8U Expired - Fee Related CN203574934U (en) | 2013-11-13 | 2013-11-13 | PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203574934U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105578733A (en) * | 2016-02-26 | 2016-05-11 | 青岛海信移动通信技术股份有限公司 | PCB and manufacturing method thereof |
| CN106817836A (en) * | 2015-12-02 | 2017-06-09 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN109348614A (en) * | 2018-10-29 | 2019-02-15 | 苏州福莱盈电子有限公司 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
-
2013
- 2013-11-13 CN CN201320716458.8U patent/CN203574934U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817836A (en) * | 2015-12-02 | 2017-06-09 | 富葵精密组件(深圳)有限公司 | Circuit board and preparation method thereof |
| CN105578733A (en) * | 2016-02-26 | 2016-05-11 | 青岛海信移动通信技术股份有限公司 | PCB and manufacturing method thereof |
| CN109348614A (en) * | 2018-10-29 | 2019-02-15 | 苏州福莱盈电子有限公司 | A kind of circuit board structure and preparation method thereof for preventing high-frequency signal from revealing |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101370351B (en) | Flexible circuit board | |
| CN101562939B (en) | Flexible circuit board | |
| US8929062B2 (en) | Wireless terminal device | |
| CN103579857B (en) | High-frequency signal double-layer flat cable adapter card | |
| TW202215709A (en) | Transparent Antenna and Display Module | |
| CN115455703B (en) | High-speed cable design methods, FPC cabling, cable cabling, servers | |
| CN203574934U (en) | PCB board | |
| CN105578749B (en) | Circuit board connection component and mobile terminal | |
| US20120152607A1 (en) | Printed circuit board | |
| CN203368912U (en) | Flexible differential impedance board | |
| WO2021052327A1 (en) | Circuit board | |
| CN202998663U (en) | Printed circuit board with two blind holes | |
| CN206585832U (en) | Pcb board | |
| CN106604520B (en) | Printed circuit board structure | |
| CN205845027U (en) | Mobile terminal and touch screen thereof | |
| CN203167416U (en) | Multi-layer PCB board | |
| TWI599125B (en) | High-frequency signal double cable adapter | |
| CN202998643U (en) | Printed circuit board with a plurality of blind holes and two buried holes | |
| CN110677990B (en) | Storage structure based on double-sided blind hole printed board process | |
| CN202998662U (en) | Printed circuit board with blind holes and buried hole | |
| CN211087227U (en) | Card computer and mainboard thereof | |
| TWI812331B (en) | Circuit board structure to enhance the pdn for mobile pci express module | |
| CN202998660U (en) | Printed circuit board with crossed blind and buried structures | |
| CN206923141U (en) | Circuit board and mobile terminal | |
| CN205921814U (en) | Circuit board apparatus and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140430 Termination date: 20141113 |
|
| EXPY | Termination of patent right or utility model |