CN203534296U - Novel LED sunflower radiator - Google Patents
Novel LED sunflower radiator Download PDFInfo
- Publication number
- CN203534296U CN203534296U CN201320496280.0U CN201320496280U CN203534296U CN 203534296 U CN203534296 U CN 203534296U CN 201320496280 U CN201320496280 U CN 201320496280U CN 203534296 U CN203534296 U CN 203534296U
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- cavity
- novel led
- top cover
- sunflower radiator
- heat
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a novel LED sunflower radiator. The novel LED sunflower radiator comprises a body with a cavity inside. The cavity is internally provided with working media capable of carrying out phase change heat transferring, a plurality of heat dissipating fins are distributed on the periphery of the body, a top cover and a bottom cover cover the two ends, corresponding to the cavity, of the body respectively, the body, the top cover and the bottom cover are respectively of an integrally formed casting structure, and the surface of the inner side of the bottom cover is provided with a microneedle array formed by a plurality of protruding columns. The body of the novel LED sunflower radiator is made of aluminum alloy extrusion profiles and comprises an integrally extruded cavity structure, heat transferring is carried out through the phase change technology, the manufacturing technology is simplified, the novel LED sunflower radiator is lightened, the heat dissipating capability is improved, and the service life of the whole lamp is prolonged.
Description
Technical field
The utility model relates to LED heat sink technology field, especially relates to a kind of New LED heronsbill radiator.
Background technology
Hot pipe technique is the heat transfer element of a kind of being called " heat pipe " of George Ge Luofo (George Grover) invention of U.S. Los Alamos (Los Alamos) National Laboratory in 1963, it takes full advantage of the Rapid Thermal hereditary property of heat-conduction principle and refrigeration filling, see through heat pipe the heat of thermal objects is delivered to rapidly outside thermal source, its capacity of heat transmission surpasses the capacity of heat transmission of any known metal.
Heat pipe is widely used in radiator manufacturing at present, for example on market, the stem stem of emerging high-power LED phase-change radiator just adopts gravity assisted heat pipe technology, gravity assisted heat pipe outer wall is in conjunction with radial fin, be commonly called as " heronsbill radiator ", the application for a patent for invention that can be CN103196116A referring to notification number open " for the modified gravity force heat pipe radiator of great power LED ".
Existing phase-change heat sink technology is mainly copper or the phase transformation of aluminothermy pipe and microflute faciation and becomes.Heat pipe is mainly to form capillary structure at the congruent metal dust of the inner surperficial coating sintering of metal tube, is conducive to liquid backflow; When hot junction liquid evaporation, steam is condensed into after liquid at cold junction, by capillary structure, is back to hot junction to supplement, and heat exchange function has moved in circles.Microflute group is mainly the some microflutes of machining process on flat board, utilizes the compound phase transformation strengthening heat transfer mechanism of the heat sink high strength of micro-scale groove group structure to carry out heat exchange.Because needing complicated technique, realizes copper heat pipe sintering, Master Cost, and processing charges is very high, and metal dust stirs simultaneously needs complicated organic solvent.Microflute group Technology Need carries out machining by the mode of cutting, and processing charges is high, and productivity ratio is low, and exchange capability of heat is limited.
Summary of the invention
The deficiency existing for above-mentioned prior art, the purpose of this utility model is to provide a kind of New LED heronsbill radiator, its main body adopts aluminum alloy extrusion section bar, the cavity body structure that comprises integrated extruding, adopt phase change technique to conduct heat, simplified manufacturing process, alleviated product weight, improve heat-sinking capability, extended the whole lamp life-span.
To achieve these goals, the technical scheme that the utility model adopts is:
A kind of New LED heronsbill radiator, comprise that inside is provided with the body of cavity, in described cavity, be provided with the working medium that can carry out phase-change heat transfer, the surrounding of body is laid with some radiating fins, on body, the two ends of corresponding described cavity are covered with respectively top cover and bottom, body, top cover and bottom are respectively integrated die cast structure, and the inner surface of described bottom is provided with the microneedle array that some projections form.
Wherein, described projection is column, halfpace shape or cone-shaped.
Wherein, the outer surface of described bottom is provided with integrated wire lead slot, and the outer end of described wire lead slot is provided with bent radial portion.
Wherein, the outer surface of described top cover and described bottom is respectively equipped with integrated installing hole.
Adopt after technique scheme, the advantage that compared to the prior art the utility model had is:
New LED heronsbill radiator described in the utility model, its main body adopts aluminum alloy extrusion section bar, the cavity body structure that comprises integrated extruding, adopt phase change technique to conduct heat, by the inner surface die cast microneedle array at bottom, increase the heat transfer problem that working medium heat exchange area solves high heat flux, adopt extrusion process, one-shot forming, solid-liquid heat exchange side surface area is improved to several times, exchange capability of heat is greatly improved, can meet present stage great power LED cooling demand, cost significantly reduces simultaneously; Adopt in addition die cast, can make complicated fabrication hole, such as through wires hole, screw hole etc.
Accompanying drawing explanation
Below in conjunction with drawings and Examples, the utility model is further illustrated:
Fig. 1: perspective view of the present utility model.
Fig. 2: the perspective view of another angle of the utility model.
Fig. 3: the structural representation of bottom lateral surface described in the utility model.
Fig. 4: the structural representation of bottom medial surface described in the utility model.
Fig. 5: the sectional structure schematic diagram of bottom described in the utility model.
In figure, 1: body; 2: radiating fin; 3: top cover; 4: bottom; 5: installing hole; 6: wire lead slot; 7: kink; 8: microneedle array.
The specific embodiment
The following stated is only preferred embodiment of the present utility model, does not therefore limit protection domain of the present utility model.
Embodiment, is shown in shown in Fig. 1 to Fig. 5.
A kind of New LED heronsbill radiator, comprise that inside is provided with the body 1 of cavity, in cavity, be provided with the working medium that can carry out phase-change heat transfer, the surrounding of body 1 is laid with some radiating fins 2, on body 1, the two ends of corresponding described cavity are covered with respectively top cover 3 and bottom 4, body 1, top cover 3 and bottom 4 are respectively integrated die cast structure, and the inner surface of described bottom 4 is provided with the microneedle array 8 that some projections form.
In the present embodiment, projection is column, can certainly be halfpace shape or cone-shaped.During use, the outer surface of bottom 4 contacts with LED thermal source, and the effect of microneedle array 8 arrays is to increase the heat exchange area of working medium and bottom 4, to improve radiating efficiency and performance.
The outer surface of bottom 4 is provided with integrated wire lead slot 6, and the outer end of wire lead slot 6 is provided with bent radial portion 7.Bent radial portion 7 length of wire lead slot 6 are greater than the width of 2 of radiating fins, therefore, when bottom 4 welds with body 1, can make bent radial portion 7 have the position corresponding with radiating fin 2 gaps and be used for boring fairlead.The outer surface of top cover 3 and bottom 4 is respectively equipped with integrated installing hole 5, installing hole 5 be distributed in equably bottom 4 and periphery, easy for installation.
Claims (4)
1. a New LED heronsbill radiator, comprise that inside is provided with the body of cavity (1), in described cavity, be provided with the working medium that can carry out phase-change heat transfer, the surrounding of body (1) is laid with some radiating fins (2), the two ends of the upper corresponding described cavity of body (1) are covered with respectively top cover (3) and bottom (4), it is characterized in that: body (1), top cover (3) and bottom (4) are respectively integrated die cast structure, the inner surface of described bottom (4) is provided with the microneedle array (8) that some projections form.
2. New LED heronsbill radiator according to claim 1, is characterized in that: described projection is column, halfpace shape or cone-shaped.
3. New LED heronsbill radiator according to claim 1, is characterized in that: the outer surface of described bottom (4) is provided with integrated wire lead slot (6), and the outer end of described wire lead slot (6) is provided with bent radial portion (7).
4. New LED heronsbill radiator according to claim 1, is characterized in that: the outer surface of described top cover (3) and described bottom (4) is respectively equipped with integrated installing hole (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320496280.0U CN203534296U (en) | 2013-08-14 | 2013-08-14 | Novel LED sunflower radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320496280.0U CN203534296U (en) | 2013-08-14 | 2013-08-14 | Novel LED sunflower radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203534296U true CN203534296U (en) | 2014-04-09 |
Family
ID=50420493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320496280.0U Expired - Fee Related CN203534296U (en) | 2013-08-14 | 2013-08-14 | Novel LED sunflower radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203534296U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104668922A (en) * | 2015-03-05 | 2015-06-03 | 奉化市阳海光电科技有限公司 | Manufacturing method of vacuum phase-change radiator |
| CN105546499A (en) * | 2016-02-25 | 2016-05-04 | 深圳市格天光电有限公司 | Radiator and flip-chip mining lamp |
| CN107624152A (en) * | 2015-03-20 | 2018-01-23 | 沙特基础工业全球技术公司 | Plastic tank radiators for luminaire |
| CN109982550A (en) * | 2019-04-01 | 2019-07-05 | Oppo广东移动通信有限公司 | The manufacturing method of heat sink, radiating subassembly, electronic device and heat sink |
-
2013
- 2013-08-14 CN CN201320496280.0U patent/CN203534296U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104668922A (en) * | 2015-03-05 | 2015-06-03 | 奉化市阳海光电科技有限公司 | Manufacturing method of vacuum phase-change radiator |
| CN104668922B (en) * | 2015-03-05 | 2017-07-25 | 宁波力品格相变照明有限公司 | A kind of change-vacuum-phase change radiator manufacture method |
| CN107624152A (en) * | 2015-03-20 | 2018-01-23 | 沙特基础工业全球技术公司 | Plastic tank radiators for luminaire |
| US10480768B2 (en) | 2015-03-20 | 2019-11-19 | Sabic Global Technologies B.V. | Plastic heat sink for luminaires |
| CN105546499A (en) * | 2016-02-25 | 2016-05-04 | 深圳市格天光电有限公司 | Radiator and flip-chip mining lamp |
| CN109982550A (en) * | 2019-04-01 | 2019-07-05 | Oppo广东移动通信有限公司 | The manufacturing method of heat sink, radiating subassembly, electronic device and heat sink |
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Effective date of registration: 20140811 Granted publication date: 20140409 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20150211 Granted publication date: 20140409 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20150815 Granted publication date: 20140409 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
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Effective date of registration: 20151111 Granted publication date: 20140409 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| PD01 | Discharge of preservation of patent |
Date of cancellation: 20160511 Granted publication date: 20140409 |
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| RINS | Preservation of patent right or utility model and its discharge | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140409 Termination date: 20150814 |
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| EXPY | Termination of patent right or utility model |