CN203300811U - Electrical connection structure and signal transmission structure - Google Patents

Abstract

The utility model provides an electric connection structure and signal transmission structure, this electric connection structure include a main printed circuit board, a sub-printed circuit board and a plurality of solder. The main printed circuit board has an upper surface, a first embedding portion and a plurality of first pads disposed on the upper surface. The sub-printed circuit board has a side surface, a second embedding portion and a plurality of second pads disposed on the side surface. The second embedding part is embedded in the first embedding part, and the second connecting pad is adjacent to the first connecting pad. The solder is respectively arranged between the first connecting pad and the second connecting pad. The second pads are electrically connected with the first pads through solders respectively.

Description

Electrical connection structure and signal transmission structure

technical field

The utility model relates to an electrical connection structure and a signal transmission structure, and in particular to an electrical connection structure and a signal transmission structure which can be used by high-frequency components.

Background technique

As the operation speed of electronic components is getting faster and faster, it is becoming more and more difficult to control the signal quality in system design, and the pin density of electronic components is getting higher and higher, which also drives the use of printed circuit boards on systems towards high-density connection substrates ( High Density Interconnect, HDI) development.

Common components and printed circuit boards or printed circuit boards are mostly electrically connected by means of connectors or connecting wires. However, a connector or a connection wire has a certain connection length. However, for high-frequency signals, the longer the length of the connector or connecting wire, the more noise will be generated. Therefore, how to solve the above problems has become an urgent task to be overcome.

Utility model content

The utility model provides an electrical connection structure and a signal transmission structure with better signal transmission quality.

The electrical connection structure of the utility model includes a main printed circuit board, a sub printed circuit board and a plurality of solders. The main printed circuit board has an upper surface, a first interlocking portion and a plurality of first pads arranged on the upper surface. The sub-printed circuit board has a side surface, a second embedding portion and a plurality of second pads arranged on the side surface, wherein the second embedding portion is embedding the first embedding portion, and the second pad is adjacent to the first embedding portion. One pad. Solder is disposed between the first pad and the second pad respectively, wherein the second pad is electrically connected to the first pad via solder.

The main printed circuit board has a first extending direction, the sub printed circuit board has a second extending direction, and the included angle between the first extending direction and the second extending direction is greater than 0 degree.

The first fitting part is a protrusion, and the second fitting part is a groove.

The first fitting part is a groove, and the second fitting part is a protrusion.

The signal transmission structure of the utility model includes an electrical connection structure and a high frequency component. The electrical connection structure includes a main printed circuit board, a sub printed circuit board and a plurality of solders. The main printed circuit board has an upper surface, a first interlocking portion and a plurality of first pads arranged on the upper surface. The sub-printed circuit board has a side surface, a second embedding portion and a plurality of second pads arranged on the side surface, wherein the second embedding portion is embedding the first embedding portion, and the second pad is adjacent to the first embedding portion. One pad. Solder is disposed between the first pad and the second pad respectively, wherein the second pad is electrically connected to the first pad via solder. The high-frequency element is arranged on the electrical connection structure and is electrically connected to the electrical connection structure, wherein the high-frequency element transmits a signal to the main printed circuit board through the sub-printed circuit board.

The sub-printed circuit board has at least one positioning hole, the high-frequency component has at least one positioning portion, the positioning portion is inserted into the positioning hole, and the positioning portion of the high-frequency component is inserted into the sub-printed circuit board The positioning hole is electrically connected to the electrical connection structure.

The main printed circuit board has a first extending direction, the sub printed circuit board has a second extending direction, and the included angle between the first extending direction and the second extending direction is greater than 0 degree.

At least one of the first fitting portion and the second fitting portion is a groove.

At least one of the first fitting portion and the second fitting portion is a protrusion.

Based on the above, in the electrical connection structure of the present invention, the sub printed circuit board is embedded with the main printed circuit board, and the pads on the sub printed circuit board are electrically connected to the pads on the main printed circuit board through solder. In this way, the length of the connection interface between the two printed circuit boards can be shortened. Therefore, when the high-frequency components are arranged on the electrical connection structure, compared with conventional connectors or connecting wires, the signal transmission structure of the present invention can have better signal transmission quality.

In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail together with the accompanying drawings.

Description of drawings

Fig. 1 is a three-dimensional schematic diagram of an electrical connection structure according to an embodiment of the present invention;

FIG. 2 is a three-dimensional schematic diagram of a signal transmission structure according to an embodiment of the present invention.

Explanation of reference signs:

100: electrical connection structure;

110: main printed circuit board;

112: upper surface;

114: the first fitting part;

116: the first pad;

120: sub-printed circuit board;

122: side surface;

124: the second fitting part;

126: the second pad;

128: positioning hole;

130: solder;

200: signal transmission structure;

300: high frequency components;

310: positioning department;

D1: first extension direction;

D2: Second extension direction.

Detailed ways

FIG. 1 is a three-dimensional schematic diagram of an electrical connection structure according to an embodiment of the present invention. Please refer to FIG. 1 , in this embodiment, the electrical connection structure 100 includes a main printed circuit board 110 , a sub printed circuit board 120 and a plurality of solders 130 .

In detail, the main printed circuit board 110 has an upper surface 112 , a first embedding portion 114 and a plurality of first pads 116 disposed on the upper surface 112 . The sub-printed circuit board 120 has a side surface 122 , a second interlocking portion 124 and a plurality of second pads 126 disposed on the side surface 122 . Wherein, the second pad 126 of the sub printed circuit board 120 is adjacent to the first pad 116 of the main printed circuit board 110 . The solder 130 is disposed between the first pad 116 of the main printed circuit board 110 and the second pad 126 of the sub-printed circuit board 120, wherein the second pad 126 is electrically connected to the first pad 116 via the solder 130 . It should be noted here that the sub-PCB 120 in this embodiment is, for example, a part cut from the main PCB 110 , and the sub-PCB 120 can be regarded as an impedance-controlled component here.

In this embodiment, the main printed circuit board 110 has a first extending direction D1, and the sub-printed circuit board 120 has a second extending direction D2, wherein the included angle between the first extending direction D1 and the second extending direction D2 is greater than 0. Spend. In particular, the second fitting portion 124 of the sub printed circuit board 120 of this embodiment is suitable for fitting into the first fitting portion 114 of the main printed circuit board 110, so that the side surface 122 of the sub printed circuit board 120 is in contact with the main The upper surface 112 of the printed circuit board 110 has an included angle α greater than 0 degrees. As shown in FIG. 1 , the included angle α is, for example, 90 degrees, but it is not limited thereto.

It is worth mentioning that, in this embodiment, the first fitting portion 114 is, for example, a groove, and the second fitting portion 124 is, for example, a protrusion. However, the present invention does not limit the forms of the first fitting portion 114 and the second fitting portion 124 . In other unshown embodiments, it is also possible that the first fitting portion 114 is, for example, a protrusion, and the second fitting portion 124 is, for example, a groove, which still belongs to the technical solution that can be adopted in the present invention, and does not Break away from the intended protection scope of the utility model.

Since the electrical connection structure 100 of this embodiment fits the first fitting portion 114 of the main printed circuit board 110 through the second fitting portion 124 of the sub-printed circuit board 120 , and electrically connects the sub-printed circuit board through the solder 130 The second pad 126 on 120 is connected to the first pad 116 on the main printed circuit board 110 . In this way, the length of the connection interface between the main printed circuit board 110 and the sub printed circuit board 120 can be shortened.

It must be noted here that the following embodiments use the component numbers and part of the content of the previous embodiments, wherein the same numbers are used to denote the same or similar components, and descriptions of the same technical content are omitted. For the description of omitted parts, reference may be made to the foregoing embodiments, and the following embodiments will not be repeated.

FIG. 2 is a three-dimensional schematic diagram of a signal transmission structure according to an embodiment of the present invention. Please refer to FIG. 2 , in this embodiment, the signal transmission structure 200 includes the electrical connection structure 100 and a high-frequency element 300 of the above-mentioned embodiment, wherein the high-frequency element 300 is disposed on the electrical connection structure 100 and is electrically connected to The structure 100 is electrically connected, and the high-frequency component 300 is, for example, a signal transmitting optocoupler, a signal receiving optocoupler or a signal receiving and transmitting optocoupler with high frequency response.

In detail, the sub-printed circuit board 120 has at least one positioning hole 128, and the high-frequency component 300 has at least one positioning portion 310, wherein the positioning portion 310 of the high-frequency component 300 is inserted into the positioning hole 128 of the sub-printed circuit board 120 , and is electrically connected to the electrical connection structure 100 when the positioning portion 310 of the high frequency component 300 is inserted into the positioning hole 128 of the sub printed circuit board 120 . That is to say, the high frequency component 300 can transmit a signal to the main printed circuit board 110 through the sub printed circuit board 120 . Of course, as shown in FIG. 2 , the high-frequency component 300 can also directly transmit another part of the signal to the main printed circuit board 110 .

Since the electrical connection structure 100 of this embodiment fits the first fitting portion 114 of the main printed circuit board 110 through the second fitting portion 124 of the sub-printed circuit board 120 , and electrically connects the sub-printed circuit board through the solder 130 The second pad 126 on 120 is connected to the first pad 116 on the main printed circuit board 110 . In this way, the length of the connection interface between the main printed circuit board 110 and the sub printed circuit board 120 can be shortened. Therefore, when the high-frequency component 300 is plugged into the sub-PCB 120 , the design of the electrical connection structure 100 can make the signal transmission structure 200 have better signal transmission quality.

To sum up, in the electrical connection structure of the present invention, the sub printed circuit board is embedded with the main printed circuit board, and the pads on the sub printed circuit board are electrically connected to the pads on the main printed circuit board through solder. In this way, the length of the connection interface between the two printed circuit boards can be shortened. Compared with the prior art using connection wires and connectors, the signal transmission structure adopting the electrical connection structure of the present invention can have good signal transmission quality.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present utility model, and are not intended to limit it; although the present utility model has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand : It is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements to some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions depart from the various embodiments of the present invention Scope of technical solutions.

Claims (9)

1. an electric connection structure, is characterized in that, comprising:

One main printed circuit board, have a upper surface, one first fitting portion and a plurality of the first connection pad that is disposed on this upper surface;

One daughter board, have a side surface, one second fitting portion and a plurality of the second connection pad that is disposed on this side surface, contiguous those first connection pads of wherein chimeric this first fitting portion of this second fitting portion, and those second connection pads; And

A plurality of scolders, be disposed at respectively between those first connection pads and those the second connection pads, and wherein those second connection pads are electrically connected via those scolders and those the first connection pads respectively.

2. electric connection structure according to claim 1, is characterized in that, this main printed circuit board has one first bearing of trend, and this daughter board has one second bearing of trend, and the angle of this first bearing of trend and this second bearing of trend is greater than 0 degree.

3. electric connection structure according to claim 1, is characterized in that, this first fitting portion is a projection, and this second fitting portion is a groove.

4. electric connection structure according to claim 1, is characterized in that, this first fitting portion is a groove, and this second fitting portion is a projection.

5. a signal transmission structure, is characterized in that, comprising:

One electric connection structure comprises:

One main printed circuit board, have a upper surface, one first fitting portion and a plurality of the first connection pad that is disposed on this upper surface;

One daughter board, have a side surface, one second fitting portion and a plurality of the second connection pad that is disposed on this side surface, contiguous those first connection pads of wherein chimeric this first fitting portion of this second fitting portion, and those second connection pads; And

A plurality of scolders, be disposed at respectively between those first connection pads and those the second connection pads, and wherein those second connection pads are electrically connected via those scolders and those the first connection pads respectively; And

One high-frequency component, be disposed on this electric connection structure and be electrically connected to this electric connection structure, and wherein this high-frequency component transfers to a signal on this main printed circuit board by this daughter board.

6. signal transmission structure according to claim 5, it is characterized in that, has at least one location hole on this daughter board, this high-frequency component has at least one location division, this location division is inserted in this location hole, and this location division of this high-frequency component is electrically connected to this electric connection structure while being inserted in this location hole of this daughter board.

7. signal transmission structure according to claim 5, is characterized in that, this main printed circuit board has one first bearing of trend, and this daughter board has one second bearing of trend, and the angle of this first bearing of trend and this second bearing of trend is greater than 0 degree.

8. signal transmission structure according to claim 5, is characterized in that, this first fitting portion and wherein at least one of this second fitting portion are a groove.

9. signal transmission structure according to claim 8, is characterized in that, this first fitting portion and wherein at least one of this second fitting portion are a projection.

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