CN203288576U - System with power semiconductor module and driving device - Google Patents

Abstract

The utility model discloses a system with a power semiconductor module, a drive device and an electronic printed circuit board. The drive device has a first electronic printed circuit board in a casing with a first lower part and a first upper part. The first electronic printed circuit board rests on the first support element of the first lower part, wherein elastic positioning elements protrude from the first lower part, said positioning elements place the electronic printed circuit by means of elastic force A plate is fixed on said support element. In addition, an additional device with its own housing can be arranged on the drive. The housing likewise has a second lower part, in which a second electronic printed circuit board is arranged, the second electronic printed circuit board being situated on a second carrier element of the second lower part superior. Elastic positioning elements protrude from the second lower part, and the positioning elements fix the second electronic printed circuit board on the second support element by means of elastic force.

Description

System with power semiconductor modules and drives

technical field

The invention relates to a system with power semiconductor modules and a drive device with a first electronic printed circuit board (Elektronikplatine) in a housing, wherein the housing has a first lower part (housing frame ) and the first upper part (housing cover). An additional device is preferably arranged on the drive device, which has a second lower part and a second upper part connected to the second lower part, wherein a second electronic printed circuit board is arranged in the auxiliary device. Such a circuit system is known from DE 10 2011 004 491 A1, which is not previously published. the

Background technique

Another system with power semiconductor modules is known from DE 10 2008 057 831 A1. In this known electrical system, the drive circuit board is arranged in a housing so that it can move laterally by means of a number of fastening elements. The fastening element is formed by a fastening bolt. If such a known circuit system is to be combined with at least one fiberglass cable, for example, an additional device can be fastened on the housing cover, wherein the fastening bolt must be lengthened in order to make the additional device and the housing Body cap screwed on. the

If an associated electronic printed circuit board is to be installed inside such a drive and preferably additionally in an additional device, then technically a snap-in locking connection (Schnapp-Rast-Verbindung) is usually provided for this purpose, possibly combined The subsequently provided, corresponding electronic printed circuit board is screwed to the drive and, if necessary, to the additional device, preferably the associated lower part. During mounting of electronic printed circuit boards, momentarily acting forces due to snap-in-position connections can lead to damage to components arranged on the electronic printed circuit board or, worse, to prior damage not directly identifiable

Contents of the invention

In view of these facts, the object of the present invention is to realize a system of the type mentioned at the outset, in which the corresponding electronic printed circuit board is fixed mechanically and without transiently occurring forces during installation act on it. the

According to the invention, this object is achieved by a system having the characteristics described below. Preferred embodiments will be described separately below. the

The invention proposes a system with power semiconductor modules and a drive having a first electronic printed circuit board in a housing with a first lower part and a first upper part, the first electronic printed circuit board The circuit board is located on the first supporting element of the first lower part, wherein elastic positioning elements protrude from the first lower part, and the positioning elements fix the electronic printed circuit board on the on the support element. the

Furthermore, the invention proposes a system with a power semiconductor module and a drive device having a first electronic printed circuit board in a housing with a first lower part and a first upper part, wherein in the Arranged on the drive is an additional device with its own housing, which has a second lower part and a second upper part, the second upper part being connected to the second lower part, wherein in the A second electronic printed circuit board is arranged in said additional device, said second electronic printed circuit board rests on a second support element of said second lower part, and wherein protruding from said second lower part is a An elastic second positioning element, the second positioning element fixes the second electronic printed circuit board on the second supporting element by means of elastic force. the

In a first embodiment, the system according to the invention has at least one power semiconductor module, but it can also preferably have a plurality of power semiconductor modules arranged side by side or grouped in another way. A drive is assigned to the at least one power semiconductor module and is preferably arranged on the upper side of the power semiconductor module. The drive device has a housing with a first lower part and a first upper part. In principle, in every housing described here and mentioned below, the lower part and the upper part can be formed in one piece. A first electronic printed circuit board is arranged in the housing of the drive unit. This first electronic printed circuit board is technically usually used for supplying control signals to the power semiconductor modules and usually also has other functionalities, in particular monitoring functionalities. the

In this case, the first electronic printed circuit board rests on the first carrier element of the first lower part and is preferably surrounded on all sides by the housing of the drive, except for the side facing the power semiconductor modules. Furthermore, the first lower part has an elastic positioning element which emerges from the first lower part and thus protrudes out of the first lower part. By means of the spring force exerted by the positioning element, the electronic printed circuit board is fixed on the support element. In this case, it is important that according to the invention it is not a snap-fit connection of the first electronic printed circuit board to the first lower part but a clamping or clamping connection, which in this case does not exist Jamming in the technically common sense. the

It may be preferred or necessary that the first electronic circuit board can also be additionally fastened by means of at least one screw connection. This additional fastening cannot replace the actual clamping, which exerts the necessary holding force, especially when installing the system. the

In a second embodiment, the system according to the invention likewise has a power semiconductor module or a plurality of power semiconductor modules and a driver circuit. In addition, this embodiment has an additional device which has a housing consisting of a second lower part and a second upper part connected to the second lower part. Arranged in the additional device is a second electronic printed circuit board, which, similar to the first embodiment, rests on the second carrier element of the second lower part, and wherein, from the first The second lower part protrudes from a second elastic positioning element, which fixes the second electronic printed circuit board on the second supporting element by means of the elastic force generated thereby. the

In both mentioned configurations, it is advantageous if at least one pair of positioning elements is provided, which are arranged on opposite sides of the associated electronic circuit board and whose spring force thus acts on the associated the opposite side of the electronic printed circuit board. the

It is also advantageous in each case that the positioning element has a planar section parallel to the normal of the associated electronic printed circuit board and facing the associated electronic printed circuit board, so that the spring force of the positioning element is only related to The normal of the associated electronic circuit board acts orthogonally to the electronic circuit board. the

Furthermore, for both embodiments it may be advantageous if the positioning element protrudes from the associated lower part in the direction of the normal to the associated electronics printed circuit board. The positioning elements can advantageously each have a chamfer on their side facing the associated electronic printed circuit board, wherein the chamfer is generally technically only used for mounting and no clamping is exerted here. force. Alternatively or additionally, the positioning elements each have a recess on their side facing the associated electronic circuit board. the

In a second embodiment of the system, the second electronic circuit board preferably has a connection arrangement for at least one fiberglass cable and a circuit arrangement for converting the optical light signal into an electrical signal. The circuit arrangement has, for example, a receiver for optical light signals, which are then converted into electrical signals. the

At least one output connection arrangement for electrical signals is preferably mounted on the second electronic circuit board provided in the auxiliary device. The at least one output connector arrangement is coupled to a second electronic printed circuit board provided in the housing of the drive arrangement. For this purpose, the attachment device can have at least one recess in which one or more connection devices are arranged. the

The system according to the invention has the advantage that it protects the corresponding electronic printed circuit board against transiently acting forces during installation and also protects the corresponding electronic printed circuit board against shock loads and vibrations during operation load impact. the

Description of drawings

A detailed explanation, advantageous details and features of the invention can be obtained from the following description of the exemplary embodiment of the system according to the invention or parts thereof shown in FIGS. 1 to 3 . the

1 shows a perspective view of a system according to the invention with an additional device, three power semiconductor modules arranged side by side and a common drive. the

Figure 2 shows a cross-section of a system according to the invention. the

FIG. 3 shows a sectional view of the attachment without the second upper part. the

Detailed ways

FIG. 1 shows a perspective view of a system 10 according to the invention with an additional device 16 , three power semiconductor modules 12 arranged next to each other and a common drive 14 . In this case, the power semiconductor module 12 has a load connection arrangement 128 for external electrical connections on its narrow side. the

The common drive 14 has a two-part housing 18 with a first lower part 40 and a first upper part 50 . On its upper side, the first upper part 50 has a first connection device 56 for connection to the attachment device 16 , which has a second connection device 66 for this purpose. It is customary in the art for these connections 56 , 66 to be designed as snap-in connections. the

Here, only the second lower part 60 of the housing 38 in the attachment device 16 is shown, with the second electronics printed circuit board 22 arranged therein. Connector devices 220 , 222 , 224 are arranged on second electronic circuit board 22 in addition to typical electronic components (not shown). In this case, it is the output connection arrangement 220 for connection to the first electronic printed circuit board 20 (see FIG. 2 ) of the driver circuit 14 . Furthermore, input connection arrangement 224 for optical signals and also input connection arrangement 222 for electrical signals are arranged on second electronic circuit board 22 . the

FIG. 2 shows a section through the system 10 according to the invention, as it can be designed, for example, along the section A-A according to FIG. 1 . In this system, two embodiments according to the invention are shown simultaneously. the

A power semiconductor module 12 is shown having a substrate 120 and a power semiconductor component 122 arranged thereon. The power semiconductor components are connected to each other or to the conductor tracks of the substrate 120 in a suitable circuit form by means of internal connections 124 (technically, generally designed as bonding connections). For the external load connection, the power semiconductor module has a load connection arrangement 128 which leads outwards from the base 120 . the

For control connections or for monitoring functions such as temperature monitoring, for example, technically common contact springs 126 are likewise shown, which protrude from the power semiconductor module 12 starting from the conductor tracks of the base 120 and are used for the connection to drive unit 14. the

Such a drive 14 is arranged above the power semiconductor modules 12 . The drive device 14 has a housing 18 consisting of a first lower part 40 and a first upper part 50 . The first lower part 40 also has a first carrier element 42 on which the first electronic printed circuit board 20 is arranged. To fix the first electronic circuit board 20 in this position, a first elastically configured positioning element 44 is provided. The positioning element is part of the first lower part 40 , emerges from the first lower part and protrudes out of the first lower part 40 in the direction of the first electronic circuit board 20 . the

The first positioning element 44 exerts a lateral clamping force on the first electronic printed circuit board 20 . The clamping force thus acts on the first electronic circuit board 20 perpendicularly to the normal N1 of the first electronic circuit board 20 . When mounting the first electronic printed circuit board 20 , the first positioning element 44 is pushed out laterally and, when it reaches the end position, rests laterally with the contact surface on the first electronic printed circuit board 20 . In this case, it is important not to achieve a detent, such as a detent connection according to the prior art, but to achieve a clamping. The clamping has the advantage, in particular during installation, that no momentary impact loads on the first electronic circuit board 20 occur, which could lead to damage to the first electronic circuit board 20 . The power semiconductor device 200 on 20 is damaged or damaged first. the

An optional additional device 16 is also provided here on the drive 14 , which can be used, for example, to expand the functionality of the drive 14 . It is known that the control signals for the drive device 14 or its first electronic printed circuit board 20 are embodied as electrical signals. By means of the add-on device 16 it is possible, for example, to retrofit the functionality of the optical interface. In principle, various expansions are of course also conceivable here. the

The additional device 16 itself again has a housing 38 and a second electronic circuit board 22 arranged in the housing. The housing 38 here consists of a second lower part 60 and a second upper part 70 . The second electronic printed circuit board 22 is arranged in and surrounded by the second lower part 60 . For fastening the second electronic circuit board, the second lower part 60 has a second carrier element 62 and a second positioning element 64 , which are each functionally designed in the same way as those of the drive device 14 . the

The second electronic printed circuit board 22 basically has the same components as were mentioned for the second electronic printed circuit board 22 there in accordance with FIG. 1 . For external connection of said terminal arrangement, for example for external connection of the output terminal arrangement 220 for connecting the second electronic printed circuit board 22 to the first electronic printed circuit board 20 of the drive device 14, the housing 38 is mounted on its second The upper part 70 has a recess 72 therein through which the outlet connection device 220 protrudes at least partially. the

FIG. 3 shows a sectional view of the attachment device 16 , wherein the housing 38 is shown with only the second lower part 60 and no second upper part. The second lower part 60 has a plurality of second bearing elements 62 . In this case, some of the second carrier elements 62 serve to additionally secure the second printed circuit board 22 by means of screw connections. For this purpose, the second electronic circuit board has holes 24 which are arranged in alignment with associated blind holes of the second carrier element 62 . the

The primary clamping force for fastening the second electronic printed circuit board 22 on the second carrier element 62 is formed by the second positioning elements 64, which here are paired with respect to the second electronic printed circuit The plates 22 are arranged opposite each other. The second positioning elements 64 are here also formed in one piece like the second bearing element 62 with the second lower part 60 of the housing 38 of the attachment device 16 . the

The second positioning elements 64 each have an elastic section 644, a planar section 640 for contacting the edge of the second electronic printed circuit board 22 and preferably each have a chamfer 642. The chamfer 642 serves to easily deflect the second positioning element 64 out of its rest position during the mounting of the second electronic printed circuit board 22 in the second lower part 60 . the

After this deflection, the planar section 642 presses against the edge of the second electronics printed wiring board 22 and pushes the second electronics The printed circuit board is clamped in place. In this case, the chamfer 642 of the second positioning element 64 is not in contact with the second electronic printed circuit board 22 . Unlike a snap-in position connection, no momentary forces occur on the second electronics printed circuit board 22 during this mounting. the

The clamping force acts on the second electronic circuit board 22 perpendicularly to the plane normal N2 of the second electronic circuit board 22 due to the described embodiment of the second positioning element 64 . the

The functionality described here in FIG. 3 and the advantages described also apply, of course, to the drive embodied according to the invention. the

Claims (15)

1. A system (10) with a power semiconductor module (12) and a drive (14) in a housing (18) with a first lower part (40) and a first upper part (50) There is a first electronic printed wiring board (20) on the first support element (42) of the first lower part (40), wherein, from the first lower The part (40) protrudes from an elastic positioning element (44), which fixes the electronic printed circuit board (20) on the support element (42) by means of elastic force. 2. The system as claimed in claim 1, wherein at least one pair of positioning elements (44, 64) is provided, which are arranged on opposite sides of the associated electronic printed circuit board (20, 22) and thus Their spring force acts on opposite sides of the associated electronic printed circuit board ( 20 , 22 ). 3. The system according to claim 1, wherein the positioning element (44, 64) has a normal (N1, N2) parallel to the associated electronic printed circuit board (20, 22) and faces the associated the planar section (640) of the electronic printed circuit board, and thus the spring force of the positioning element (44, 64) is only in relation to the normal (N1, N2) of the associated electronic printed circuit board (20, 22) ) acts orthogonally to the electronic printed circuit board ( 20 , 22 ). 4. System according to one of claims 1 to 3, wherein the positioning element (44, 64) extends from the associated lower part in the direction of the normal (N1, N2) of the associated electronic printed circuit board (40, 60) out. 5 . The system as claimed in claim 4 , wherein the positioning elements ( 44 , 64 ) each have a chamfer ( 642 ) on their side facing the associated electronic circuit board ( 20 , 22 ). 6 . The system as claimed in claim 4 , wherein the positioning elements ( 44 , 64 ) each have a recess on their side facing the associated electronic circuit board ( 20 , 22 ). 7. A system having a power semiconductor module (12) and a drive (14) having a first lower part (40) and a first upper part (50) in a housing (18) having a first An electronic printed circuit board (20), wherein an additional device (16) with its own housing (38) having a second lower part ( 60) and a second upper part (70), the second upper part (70) is connected to the second lower part (60), wherein a second electronic printed a circuit board (22), said second electronic printed circuit board on a second support element (62) of said second lower part (60), and wherein protruding from said second lower part (60) A second elastic positioning element (64), the second positioning element fixes the second electronic printed circuit board (22) on the second supporting element (62) by means of elastic force. 8. System according to claim 7, wherein at least one pair of positioning elements (44, 64) is provided, which are arranged on opposite sides of the associated electronic printed circuit board (20, 22) and thus Their spring force acts on opposite sides of the associated electronic printed circuit board ( 20 , 22 ). 9. System according to claim 7, wherein the positioning element (44, 64) has a normal (N1, N2) parallel to the associated electronic printed circuit board (20, 22) and faces towards the associated the planar section (640) of the electronic printed circuit board, and thus the spring force of the positioning element (44, 64) is only in relation to the normal (N1, N2) of the associated electronic printed circuit board (20, 22) ) acts orthogonally to the electronic printed circuit board ( 20 , 22 ). 10. The system as claimed in one of claims 7 to 9, wherein the positioning element (44, 64) extends from the associated lower part in the direction of the normal (N1, N2) of the associated electronic printed circuit board (40, 60) out. 11. The system as claimed in claim 10, wherein the positioning elements (44, 64) each have a chamfer (642) on their side facing the associated electronic circuit board (20, 22). 12 . The system as claimed in claim 10 , wherein the positioning elements ( 44 , 64 ) each have a recess on their side facing the associated electronic circuit board ( 20 , 22 ). 13 . 13. The system according to claim 7, wherein said second electronic printed wiring board (22) has input connector means (224) for at least one fiberglass cable and for converting optical light signals into Circuit devices for electrical signals. 14. The system according to claim 7, wherein the second electronic printed wiring board (22) has output connector means (220) for electrical signals for connecting the second electronic printed wiring A board (22) is connected to said first electronic printed wiring board (20). 15. The system according to claim 13 or 14, wherein the additional device (16) has in its second upper part (70) at least one input connection device (222) and/or output connection device ( 220) gap (72).

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