CN203286520U - Heat radiation structure - Google Patents
Heat radiation structure Download PDFInfo
- Publication number
- CN203286520U CN203286520U CN2013201231358U CN201320123135U CN203286520U CN 203286520 U CN203286520 U CN 203286520U CN 2013201231358 U CN2013201231358 U CN 2013201231358U CN 201320123135 U CN201320123135 U CN 201320123135U CN 203286520 U CN203286520 U CN 203286520U
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- Prior art keywords
- base
- heat
- conductive body
- hot conductive
- radiator structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 230000005855 radiation Effects 0.000 title abstract description 14
- 238000010438 heat treatment Methods 0.000 claims abstract description 23
- 230000017525 heat dissipation Effects 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000012634 fragment Substances 0.000 claims description 3
- 108010025899 gelatin film Proteins 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract 1
- 230000003287 optical effect Effects 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to a heat radiation structure which comprises a heat radiation base and a containing unit for containing a heating module. A heat radiation unit is further arranged between the heat radiation base and the containing unit, the heat radiation unit comprises a base fixed on the heat radiation base, a heat conducting main body which can be arranged on the base in a vertically floating mode, and a heat conducting element arranged on the bottom face of the heat conducting main body. At least one part of the heat conducting main body is located in the containing unit, and the base is provided with a position avoiding structure for the heat conducting element to pass through. A telescopic connection method of the heat conducting main body of the heat radiation unit and the base enables the heating block to be conveniently and fast pulled out and inserted, good contact can still be ensured after the heating module is inserted and pulled out multiple times, and contact thermal resistance also cannot be increased. After the heating module is inserted, the heat conducting main body is in thermal connection with the heat radiation base, and therefore the heat radiation area is greatly increased.
Description
Technical field
The utility model relates to a kind of radiator structure.
Background technology
Modern electronic equipment requires further to improve to reliability requirement, performance indications, power density etc., and the thermal design of electronic equipment is also more and more important.Power device is the Primary Component in most electronic equipments, and especially the optical module product requires highly to heat radiation, and the quality of its duty directly affects whole aircraft reliability, security and service life.Power device only depends on the package casing heat radiation can't meet the heat radiation requirement, needs reasonable, the effective radiator of configuration to dispel the heat.
At present, optical module radiator generally adopts the mode of conventional aluminum extrusion section bar processing, and traditional aluminium extruded removing from mould radiator is because structure space limits, the gear piece quantity of radiator and highly limited, and the radiator heat-dissipation area is significantly affected.Optical module radiator is normally with the optical module shell---" mouse cage " is fixing, optical module is positioned at " mouse cage ", be fixed with radiator on " mouse cage ", " mouse cage " belongs to interference engagement with contacting of optical module, optical module contacts heat radiation after being inserted in " mouse cage " with radiator, after optical module repeatedly plugs, the interference size can be more and more little, the contact area that is to say optical module and radiator is more and more less, thereby cause heat to form very large thermal resistance from the heat flow path that optical module is transmitted to radiator, thereby have a strong impact on heat-transfer effect.
The utility model content
The technical problems to be solved in the utility model is, the above-mentioned defect for prior art, provide a kind of radiator structure.
The technical scheme that its technical problem that solves the utility model adopts is: construct a kind of radiator structure, comprise heat dissipation base and the accommodating unit that is used for accommodating heating module, also be provided with heat-sink unit between described heat dissipation base and described accommodating unit, described heat-sink unit comprises the base that is fixed on described heat dissipation base, can be arranged on the hot conductive body on described base with fluctuating and be arranged on heat conducting element on described hot conductive body bottom surface with respect to described base; Described hot conductive body has at least a part to be positioned at described accommodating unit, and described base is provided with for the bit architecture of keeping away by described heat conducting element;
Described heating module inserts described accommodating unit and makes the described heat conducting element that is positioned at described hot conductive body bottom surface contact with described heat dissipation base through the described bit architecture of keeping away, thereby the heat that described heating module sends is conducted on described heat dissipation base.
Radiator structure described in the utility model, wherein, described base two ends are provided with guide pillar, and described base is provided with flexible member, the two ends of described hot conductive body are provided with pilot hole, and described hot conductive body is arranged on described base with the telescopically that coordinates of described guide pillar by pilot hole.
Radiator structure described in the utility model, wherein, described flexible member comprises shell fragment.
Radiator structure described in the utility model, wherein, described base two ends are equipped with guide pillar, and described guide pillar is provided with flexible member, the two ends of described hot conductive body are provided with pilot hole, and described hot conductive body is arranged on described base with the telescopically that coordinates of described guide pillar by pilot hole.
Radiator structure described in the utility model, wherein, described flexible member comprises spring.
Radiator structure described in the utility model, wherein, described hot conductive body comprises the heat conduction plane and is arranged on heat conduction projection on described heat conduction plane, offers porosely on described accommodating unit, described heat conduction projection extend in described accommodating unit from described hole.
Radiator structure described in the utility model, wherein, the described bit architecture of keeping away comprises and keeps away a hole.
Radiator structure described in the utility model, wherein, the bottom surface of described hot conductive body also is provided with boss, and described heat conducting element is located on described boss.
Radiator structure described in the utility model, wherein, described heat conducting element comprises soft Heat Conduction Material.
Radiator structure described in the utility model, wherein, described soft Heat Conduction Material comprises the heat conductive silica gel film.
Implement radiator structure of the present utility model, has following beneficial effect: the hot conductive body of heat-sink unit and the flexible connected mode of base, make heating module more convenient when plug, and repeatedly can guarantee that still contact is good after plug, thermal contact resistance also can not increase.After heating module inserted, hot conductive body can be connected with heat dissipation base heat conduction, and area of dissipation increases greatly.
Description of drawings
The utility model is described in further detail below in conjunction with drawings and Examples, in accompanying drawing:
Fig. 1 is the structural representation of a kind of radiator structure preferred embodiment of the utility model;
Fig. 2 is the structural representation of heat-sink unit in a kind of radiator structure preferred embodiment of the utility model.
The specific embodiment
As shown in Figure 1, in preferred embodiment of the present utility model, this radiator structure comprises heat dissipation base 100 and the accommodating unit 200 that is used for accommodating heating module 201, also is provided with heat-sink unit 300 between heat dissipation base 100 and accommodating unit 200.As shown in Figure 2, heat-sink unit 200 comprises the base 301 that is fixed on heat dissipation base 100, the heat conducting element 303 that can be arranged on the hot conductive body 302 on base 301 with fluctuating and be arranged on hot conductive body 302 bottom surfaces with respect to base 301.Wherein, hot conductive body 302 has at least a part to be positioned at accommodating unit 200, and base 301 is provided with for by heat conducting element 303, keeping away bit architecture (figure does not illustrate with label).
because heating module 201 is inserted in accommodating unit 200, increase along with the plug number of times, accommodating unit 200 can become loose with contacting of heating module 201, namely intervene area can reduce gradually, thereby affect heat dispersion, but the utility model has also been set up heat-sink unit 300 between accommodating unit 200 and heat dissipation base 100, the hot conductive body 302 of heat-sink unit 300 has at least a part to be positioned at accommodating unit 200, hot conductive body 302 can be arranged on base 301 with respect to base 301 again with fluctuating simultaneously, therefore be inserted into accommodating unit 200 when interior when heating module 201, the part that hot conductive body 302 is positioned at accommodating unit 200 can contact with heating module 201, heating module 201 can be with hot conductive body 302 toward pressing down simultaneously, heat conducting element 303 contacts with heat dissipation base 100 through keeping away bit architecture, thereby the heat that heating module 201 sends is conducted on heat dissipation base 100.Thus,, no matter whether heating module 201 reduces with the intervene area of accommodating unit 200, can both heat be dispersed on heat dissipation base 100 in time by heat-sink unit 300, further improve radiating efficiency.And can guarantee that still contact is good after more than 201 plug of heating module, thermal contact resistance can not increase.
Preferably, in preferred embodiment of the present utility model, what adopt being connected of hot conductive body 302 and base 301 is following mode: base 301 two ends are provided with guide pillar 304, base 301 is provided with flexible member 306, the two ends of hot conductive body 302 are provided with pilot hole (with label, not illustrating in figure), and hot conductive body 302 is arranged on base 301 with the telescopically that coordinates of guide pillar 304 by pilot hole.Therefore, hot conductive body 302 can fluctuate along the length direction of guide pillar 304, it should be noted that the top of guide pillar 304 should arrange suitable position limiting structure, to prevent hot conductive body 302, deviates from.The preferred shell fragment that uses of flexible member 306.
Can extend to another connected mode thus: still at base 301 two ends, guide pillar is set all, different from a upper embodiment is, in this mode, flexible member is located on guide pillar, the two ends of hot conductive body 302 are provided with pilot hole equally, and hot conductive body 302 is arranged on base 301 with the telescopically that coordinates of guide pillar by pilot hole.In this embodiment, flexible member preferably uses spring.
Based on above two examples, can know that hot conductive body 302 is connected modes of a kind of " floating " with base 301,, by the connected mode of this " floating ", can realize the timely conduction of heating module 201 heat after being inserted into accommodating unit 200.Therefore, hot conductive body 302 all belongs to the claimed scope of the utility model with the connection similar, that principle is identical of base 301.
Further, hot conductive body 302 can also have structure more specifically.In the present embodiment, hot conductive body 302 comprises heat conduction plane 305 and is arranged on the lip-deep heat conduction projection 307 in heat conduction plane 305, offer the hole passed through for heat conduction projection 307 (in figure not label illustrate) on accommodating unit 200, heat conduction projection 307 extend in accommodating unit 200 from hole.Further, the present embodiment also is provided with boss 308 in the bottom surface of hot conductive body 302, and heat conducting element 303 just is arranged on this boss 308, correspondingly, on base 301 what keep away that bit architecture adopts is to keep away a hole, heat conducting element 303 is kept away a hole by this and is contacted with heat dissipation base 100.
On the basis of the various embodiments described above, what the heat conducting element 303 in the utility model adopted is soft Heat Conduction Material.Can guarantee that by soft Heat Conduction Material hot conductive body 302 is still contacting well after plug repeatedly with heating module 201.Soft Heat Conduction Material can have a lot,, such as heat conductive silica gel film etc., at this, does not exemplify one by one.
Above embodiment only is explanation technical conceive of the present utility model and characteristics, and its purpose is to allow the person skilled in the art can understand content of the present utility model and implement accordingly, can not limit protection domain of the present utility model.All equalizations of doing with the utility model claim scope change and modify, and all should belong to the covering scope of the utility model claim.
Claims (10)
1. radiator structure, comprise heat dissipation base (100), and the accommodating unit (200) that is used for accommodating heating module (201), it is characterized in that, also be provided with heat-sink unit (300) between described heat dissipation base (100) and described accommodating unit (200), described heat-sink unit (300) comprises the base (301) that is fixed on described heat dissipation base (100), can be arranged on hot conductive body (302) on described base (301) with respect to described base (301) with fluctuating, and the heat conducting element (303) that is arranged on described hot conductive body (302) bottom surface, described hot conductive body (302) has at least a part to be positioned at described accommodating unit (200), and described base (301) is provided with for the bit architecture of keeping away by described heat conducting element (303),
Described heating module (201) inserts described accommodating unit (200) and makes the described heat conducting element (303) that is positioned at described hot conductive body (302) bottom surface contact with described heat dissipation base (100) through the described bit architecture of keeping away, thereby the heat that described heating module (201) sends is conducted on described heat dissipation base (100).
2. radiator structure according to claim 1, it is characterized in that, described base (301) two ends are provided with guide pillar (304), described base (301) is provided with flexible member (306), the two ends of described hot conductive body (302) are provided with pilot hole, and described hot conductive body (302) is arranged on described base (301) with the telescopically that coordinates of described guide pillar (304) by pilot hole.
3. radiator structure according to claim 2, is characterized in that, described flexible member (306) comprises shell fragment.
4. radiator structure according to claim 1, it is characterized in that, described base (301) two ends are equipped with guide pillar, described guide pillar is provided with flexible member, the two ends of described hot conductive body (302) are provided with pilot hole, and described hot conductive body (302) is arranged on described base (301) with the telescopically that coordinates of described guide pillar by pilot hole.
5. radiator structure according to claim 4, is characterized in that, described flexible member comprises spring.
6. radiator structure according to claim 1, it is characterized in that, described hot conductive body (302) comprises heat conduction plane (305) and is arranged on the lip-deep heat conduction projection in described heat conduction plane (305) (307), offer porosely on described accommodating unit (200), described heat conduction projection (307) extend in described accommodating unit (200) from described hole.
7. radiator structure according to claim 1, is characterized in that, the described bit architecture of keeping away comprises and keeps away a hole.
8. according to claim 1-7 described radiator structures of any one, is characterized in that, the bottom surface of described hot conductive body (302) also is provided with boss (308), and described heat conducting element (303) is located on described boss (308).
9. radiator structure according to claim 8, is characterized in that, described heat conducting element (303) comprises soft Heat Conduction Material.
10. radiator structure according to claim 9, is characterized in that, described soft Heat Conduction Material comprises the heat conductive silica gel film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201231358U CN203286520U (en) | 2013-03-18 | 2013-03-18 | Heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013201231358U CN203286520U (en) | 2013-03-18 | 2013-03-18 | Heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203286520U true CN203286520U (en) | 2013-11-13 |
Family
ID=49542881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013201231358U Expired - Fee Related CN203286520U (en) | 2013-03-18 | 2013-03-18 | Heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203286520U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191816A (en) * | 2017-05-17 | 2017-09-22 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| US12510940B2 (en) | 2021-03-22 | 2025-12-30 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and communication device |
-
2013
- 2013-03-18 CN CN2013201231358U patent/CN203286520U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107191816A (en) * | 2017-05-17 | 2017-09-22 | 华为技术有限公司 | A kind of optical module radiator structure and wireless telecommunications system |
| CN107191816B (en) * | 2017-05-17 | 2019-02-19 | 华为技术有限公司 | An optical module heat dissipation structure and wireless communication equipment |
| US12510940B2 (en) | 2021-03-22 | 2025-12-30 | Huawei Technologies Co., Ltd. | Heat dissipation apparatus and communication device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHENZHEN ZETA ELECTRONIC CO., LTD. Free format text: FORMER OWNER: WANG XIAOGUANG Effective date: 20150212 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20150212 Address after: Baoan District City, Guangdong province Shenzhen Guanlan street 518000 No. 334 Fu Keng community Yuelu Guangxi Zhong Xing Fu with rich plant No. 16 (i.e. Yuelu Guanlan GUI Silicon Valley power automotive electronic industrial park building A17) Patentee after: Shenzhen Zhitong Electronics Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Guanlan GUI Yuelu Silicon Valley power automotive electronics business park building A17 Patentee before: Wang Xiaoguang |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131113 Termination date: 20200318 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |