CN203118999U - Light emitting diode module provided with heat radiation structure - Google Patents
Light emitting diode module provided with heat radiation structure Download PDFInfo
- Publication number
- CN203118999U CN203118999U CN 201320047420 CN201320047420U CN203118999U CN 203118999 U CN203118999 U CN 203118999U CN 201320047420 CN201320047420 CN 201320047420 CN 201320047420 U CN201320047420 U CN 201320047420U CN 203118999 U CN203118999 U CN 203118999U
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- Prior art keywords
- emitting diode
- metal heat
- led
- light
- lead
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- 230000005855 radiation Effects 0.000 title abstract description 3
- 239000002184 metal Substances 0.000 claims abstract description 41
- 229910052751 metal Inorganic materials 0.000 claims abstract description 41
- 239000000758 substrate Substances 0.000 claims abstract description 30
- 238000009413 insulation Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 230000000149 penetrating effect Effects 0.000 abstract 1
- 239000006185 dispersion Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The utility model discloses a light emitting diode module provided with a heat radiation structure. The light emitting diode module comprises a printed circuit board and an illuminating device disposed on the printed circuit board. The printed circuit board comprises a base substrate provided with an upper surface and a lower surface; a first lead electrode and a second lead electrode, which are disposed on the upper surface of the base substrate; a metal heat conductive layer disposed on the lower surface of the base substrate; a through hole penetrating the base substrate to connect with the first lead electrode and the metal heat conductive layer. The heat energy generated by the light emitting diode can be conducted by the first lead electrode, the through hole, and the metal heat conductive layer, therefore the heat dissipation performance of the light emitting diode module can be improved.
Description
Technical field
The utility model relates to a kind of light-emitting diode (LED) module, relates in particular to the light-emitting diode (LED) module with radiator structure.
Background technology
Light-emitting diode (LED) generally is installed in printed circuit board (PCB) (PCB) and upward uses as light-emitting diode (LED) module.Usually,, uses light-emitting diode the FR4 printed circuit board (PCB) for being installed.Because the FR4 printed circuit board (PCB) uses the basal substrate of glass epoxy resin, be restricted when therefore the heat that produces in light-emitting diode is discharged into the outside.
In order to improve heat dissipation characteristics, together use heat radiation adhesive tape or heating panel etc. with printed circuit board (PCB).But, because the low-thermal conductivity of printed circuit board (PCB) self, limited to the improvement of the heat dissipation characteristics of light-emitting diode (LED) module.
In addition, except the FR4 printed circuit board (PCB), can also use the operplate printing circuit board or the metal base printed circuit board (MCPCB) that utilize the metallic substrates substrate.But the printed circuit board (PCB) of these metal bottom is expensive, and the special measure of the short circuit of preventing need be arranged.
The utility model content
Problem to be solved in the utility model provides a kind of light-emitting diode (LED) module with heat dispersion of improvement.
Another problem to be solved in the utility model provides a kind of light-emitting diode (LED) module that can improve heat dispersion when preventing short circuit.
The light-emitting diode (LED) module of an embodiment of the present utility model comprises printed circuit board (PCB) and the luminescent device that is installed in described printed circuit board (PCB).And described printed circuit board (PCB) comprises basal substrate with upper surface and lower surface, be positioned at the first lead-in wire electrode and the second lead-in wire electrode of described basal substrate upper surface, be positioned at described basal substrate lower surface the metal heat-conducting layer, run through described basal substrate and be connected the via hole of the described first lead-in wire electrode and described metal heat-conducting layer.Therefore the heat that produces at described light-emitting diode can improve the heat dispersion of light-emitting diode (LED) module by the first lead-in wire electrode, via hole and the conduction of metal heat-conducting layer.
In addition, described metal heat-conducting layer can be positioned at below described luminescent device and described luminescent device position overlapped.But the utility model is not limited thereto, and described metal heat-conducting layer can be not overlapping with described luminescent device yet.
And described light-emitting diode (LED) module can comprise a plurality of metal heat-conducting layers that are spaced from each other setting.Accordingly, multiple heat conduction path can be formed, heat dispersion can be further improved.
In addition, described luminescent device can be electrically connected with the described first lead-in wire electrode and the second lead-in wire electrode.Described metal heat-conducting layer and the described second lead-in wire electrode insulation.
Described basal substrate can be by megohmite insulant, and for example glass epoxy resin forms.
And described light-emitting diode (LED) module can further comprise the soldering-resistance layer that covers described basal substrate lower surface.Described metal heat-conducting layer exposes from described soldering-resistance layer.
And described light-emitting diode (LED) module can further comprise the radiator of being combined with described metal heat-conducting layer and conducting heat.
According to embodiment of the present utility model, by being combined the metal heat-conducting layer that conducts heat with luminescent device in the lower surface setting of basal substrate, thereby can improve the heat dispersion of light-emitting diode (LED) module.Further, by utilizing the zone of soldering-resistance layer covering except the metal heat-conducting layer, can prevent short circuit.
Description of drawings
Fig. 1 is the summary section for the light-emitting diode (LED) module of an explanation embodiment of the present utility model.
Fig. 2 is the summary section that is installed in the light-emitting diode (LED) module on the radiator of an expression embodiment of the present utility model.
Embodiment
Below, describe embodiment of the present utility model in detail with reference to accompanying drawing.The embodiment that the following describes is the example that provides in order fully to pass on thought of the present utility model to those skilled in the art.Therefore, the utility model is limited by the embodiment that the following describes, and can launch with other forms.And for convenience of description, the width of inscape, length, thickness etc. may be exaggerated and illustrate in the accompanying drawing.Identical Reference numeral is represented identical inscape in whole specification.
Fig. 1 is the summary section for the light-emitting diode (LED) module of an explanation embodiment of the present utility model.
With reference to Fig. 1, described light-emitting diode (LED) module comprises printed circuit board (PCB) and luminescent device 31.Described printed circuit board (PCB) can comprise basal substrate 21, the first lead-in wire electrode 23a, the second lead-in wire electrode 23b, via hole 25 and metal heat-conducting layer 27, can also comprise soldering-resistance layer 29.
The described first lead-in wire electrode 23a and the second lead-in wire electrode 23b can be by after attaching the copper films at basal substrate 21, utilize etch process to form the copper Thinfilm pattern and form.The circuit pattern of the first lead-in wire electrode 23a and the second lead-in wire electrode 23b can also be formed on the lower surface of basal substrate 21 as described.
In addition, described metal heat-conducting layer 27 can be positioned in the bottom of luminescent device 31 and luminescent device 31 position overlapped.But the utility model is not limited thereto, and metal heat-conducting layer 27 can not overlap with luminescent device 31.And, though show a metal heat-conducting layer 27 at this, a plurality of metal heat-conducting layers 27 that are spaced from each other setting can also be set.Metal heat-conducting layer 27 can form by metallicses such as plating coating coppers.
Described via hole 25 connects first lead-in wire electrode 23a and the metal heat-conducting layer 27 by basal substrate 21.Via hole 25 can pass through the plating technology, together forms with metal heat-conducting layer 27.As shown in Figure 1, can connect first lead-in wire electrode 23a and the metal heat-conducting layer 27 by a plurality of via holes 25.The described second lead-in wire electrode 23b and 27 insulation of metal heat-conducting layer.
In addition, on the lower surface of basal substrate 21, soldering-resistance layer 29 can be set.Circuit pattern (not shown) on the lower surface of soldering-resistance layer 29 covering basal substrates 21 is to prevent the generation of short circuit.Described metal heat-conducting layer 27 by described soldering-resistance layer 29 to exposing outside.
On the upper surface of described basal substrate 21, also can form soldering-resistance layer (not shown), to cover the first lead-in wire electrode 23a and the second lead-in wire electrode 23b except the part that is used for welding luminescent device 31.
Described luminescent device 31 is electrically connected on the first lead-in wire electrode 23a and the second lead-in wire electrode 23b.Described luminescent device 31 can be light-emitting diode chip for backlight unit, as shown in the figure, can not use bonding wire and flip chip bonding is connected to the first lead-in wire electrode 23a and the second lead-in wire electrode 23b.Different therewith, also can utilize bonding wire that luminescent device 31 is electrically connected on the described first lead-in wire electrode 23a and the second lead-in wire electrode 23b.Further, described luminescent device 31 can also be LED package.
According to present embodiment, the heat that is produced by luminescent device 31 can be discharged into the outside by the first lead-in wire electrode 23a, via hole 25 and metal heat-conducting layer 27.Accordingly, the heat dispersion of light-emitting diode (LED) module can be improved, working life and the reliability of light-emitting diode (LED) module can be improved thereupon.
And, because the circuit pattern that when using described metal heat-conducting layer 27, utilizes soldering-resistance layer 29 to cover on basal substrates 21 lower surfaces, therefore can prevent from using the generation of the short circuit that metal heat-conducting layer 27 causes.
Fig. 2 is the summary section that is installed in the light-emitting diode (LED) module on the radiator of an expression embodiment of the present utility model.
With reference to Fig. 2, be installed in the light-emitting diode (LED) module that the front is illustrated with reference to Fig. 1 at radiator 41.Particularly, described metal heat-conducting layer 27 conducts heat with radiator 41 combinations.In order to make metal heat-conducting layer 27 contact radiator 41, the lower surface of described metal heat-conducting layer 27 flushes with the lower surface of soldering-resistance layer 27 or is more outstanding downwards than the lower surface of soldering-resistance layer 29.
As shown in Figure 2, described radiator 41 can have fin, but is not limited thereto, and can have multiple structure.
Claims (8)
1. the light-emitting diode (LED) module with radiator structure is characterized in that, comprises printed circuit board (PCB) and the luminescent device that is installed in described printed circuit board (PCB), and described printed circuit board (PCB) comprises:
Basal substrate with upper surface and lower surface;
Be positioned at the first lead-in wire electrode and the second lead-in wire electrode of described basal substrate upper surface;
Be positioned at the metal heat-conducting layer of described basal substrate lower surface;
Run through described basal substrate and connect the via hole of described first lead-in wire electrode and described metal heat-conducting layer.
2. light-emitting diode (LED) module according to claim 1 is characterized in that, described metal heat-conducting layer is positioned at below described luminescent device and described luminescent device position overlapped.
3. light-emitting diode (LED) module according to claim 1 is characterized in that, comprises a plurality of metal heat-conducting layers that are spaced from each other setting.
4. light-emitting diode (LED) module according to claim 1 is characterized in that, described luminescent device is electrically connected with the described first lead-in wire electrode and the second lead-in wire electrode.
5. light-emitting diode (LED) module according to claim 4 is characterized in that, described metal heat-conducting layer and the described second lead-in wire electrode insulation.
6. light-emitting diode (LED) module according to claim 1 is characterized in that, described basal substrate is formed by megohmite insulant.
7. light-emitting diode (LED) module according to claim 1 is characterized in that, further comprises the soldering-resistance layer that covers described basal substrate lower surface, and described metal heat-conducting layer exposes from described soldering-resistance layer.
8. light-emitting diode (LED) module according to claim 1 is characterized in that, further comprises the radiator of being combined with described metal heat-conducting layer and conducting heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047420 CN203118999U (en) | 2013-01-29 | 2013-01-29 | Light emitting diode module provided with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320047420 CN203118999U (en) | 2013-01-29 | 2013-01-29 | Light emitting diode module provided with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203118999U true CN203118999U (en) | 2013-08-07 |
Family
ID=48899318
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320047420 Expired - Fee Related CN203118999U (en) | 2013-01-29 | 2013-01-29 | Light emitting diode module provided with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203118999U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374915A (en) * | 2014-08-06 | 2016-03-02 | 首尔伟傲世有限公司 | High power light emitting device |
-
2013
- 2013-01-29 CN CN 201320047420 patent/CN203118999U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105374915A (en) * | 2014-08-06 | 2016-03-02 | 首尔伟傲世有限公司 | High power light emitting device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20130807 Termination date: 20170129 |