CN201262369Y - light emitting device - Google Patents

Abstract

The utility model relates to a light-emitting device, which includes a substrate, at least one light-emitting diode and a plurality of electrical connection elements. The substrate is provided with a plurality of guide holes, and a conductive layer is provided around each guide hole; the at least one light-emitting diode is arranged on the substrate, and the at least one light-emitting diode is provided with a plurality of guide pins, and each guide pin is provided with a through hole, and the through hole of each guide pin corresponds to the guide hole on the substrate; each electrical connection element is arranged between the conductive layer of each guide hole on the substrate and each guide pin of the light-emitting diode, so that each electrical connection element is heated to form an electrical connection part, and each electrical connection part is adhered to the conductive layer and the guide pin around the guide hole; thereby, the substrate and the light-emitting diode are accurately aligned and combined, the connection strength is strengthened, and the overall thickness is reduced.

Description

light emitting device

technical field

The utility model relates to a light-emitting device, in particular to a combination design of a substrate, at least one light-emitting diode and a plurality of electrical connection elements, and each electrical connection part covers the inner wall of the conductive layer and the conductive layer of each guide hole of the substrate. The perforated inner walls of the guide pins of the LEDs are suitable for the assembly of various LEDs and substrates or similar structures.

Background technique

Generally, the light-emitting device of the existing light-emitting diode is to weld the light-emitting diode on the circuit board to form a light-emitting device or lighting device, so that it can be used in electronic products. Because the interior space of precision electronic products is very narrow, there are considerable requirements for the accuracy of the light-emitting device. When the existing light-emitting diodes are connected to the circuit board, the lead pins of the light-emitting diodes and the circuit board are often due to the soldering process. In this way, the light emitting diode deviates from the original fixed position, which reduces the overall accuracy and cannot be used in precision electronic products.

In addition, when the light-emitting diode is connected to the circuit board, a tin furnace is often used to heat it to generate high temperature for welding. In mass production, the amount of solder used is often difficult to control. Excessive solder will cause the light-emitting diode to float high, and too little solder will cause Due to the phenomenon of empty soldering or false soldering, the defect rate is also greatly increased, so it is not easy to mass-produce, and it is also impossible to make the light-emitting device light, thin and short. Therefore, it is necessary to find a solution to improve this problem.

Contents of the invention

The main purpose of the utility model is to overcome the deficiencies and defects of the prior art, and propose a light-emitting device, through a combined design of a substrate, at least one light-emitting diode and a plurality of electrical connection elements, the substrate is provided with a plurality of guide holes , and each guide pin of at least one light emitting diode is provided with a perforation, and each electrical connection element is heated to form an electrical connection part, and each electrical connection part can pull each guide pin of at least one light emitting diode to correspond to each guide hole of the substrate , so that the substrate and the light-emitting diodes are precisely aligned and combined, thereby increasing the practicability of the utility model.

The second purpose of the present utility model is to propose a light emitting device, through the combined design of a substrate, at least one light emitting diode and a plurality of electrical connection elements, the substrate is provided with a plurality of guide holes, and the at least one light emitting diode Each guide pin is provided with a perforation, and each electrical connection element is heated to form an electrical connection portion, so that the connection thickness between the substrate and at least one light-emitting diode is reduced, making the whole light, thin and short, and increasing the convenience of the utility model.

Another object of the present utility model is to propose a light emitting device, through the combined design of a substrate, at least one light emitting diode and a plurality of electrical connection elements, the substrate is provided with a plurality of guide holes, and the at least one light emitting diode Each guide pin is provided with a perforation, and each electrical connection part is adhered to the conductive layer around each guide hole and each guide pin of at least one light-emitting diode, so that the substrate and at least one light-emitting diode can strengthen the connection strength, and increase the practicality of the utility model. sex.

In order to achieve the above purpose, the utility model provides a light emitting device, comprising: a substrate, a plurality of guide holes are provided on the substrate, and a conductive layer is provided on the periphery of each guide hole; at least one light emitting diode, the at least one light emitting diode is provided On the substrate, the at least one light-emitting diode is provided with a plurality of guide pins, each guide pin is provided with a perforation, and the perforation of each guide pin corresponds to the guide hole on the substrate; and a plurality of electrical connection elements, each electrically connected The components are arranged between the conductive layers of the guide holes on the substrate and the guide pins of the light-emitting diodes, so that the electrical connection components can be heated to form electrical connection parts, and the electrical connection parts are adhered to the conductive layer and the conductive layer around the guide holes. Guide feet.

The utility model has the following beneficial technical effects:

1. The utility model is designed through a combination of a substrate, at least one light-emitting diode and a plurality of electrical connection elements. The substrate is provided with a plurality of guide holes, and each guide pin of at least one light-emitting diode is provided with perforations. The connecting element is heated to form an electrical connection part, and each electrical connection part can pull each guide pin of at least one light-emitting diode to correspond to each guide hole of the substrate, so that the substrate and the light-emitting diode are precisely aligned and combined, and the utility model practicality.

2. The utility model is designed through a combination of a substrate, at least one light-emitting diode and a plurality of electrical connection elements. The substrate is provided with a plurality of guide holes, and each guide pin of at least one light-emitting diode is provided with perforations. The electric connecting part is formed by heating the connecting element, so that the connecting thickness between the base plate and at least one light-emitting diode is reduced, so that the whole is light, thin and short, and the convenience of the utility model is increased.

3. The utility model is designed through a combination of a substrate, at least one light-emitting diode and a plurality of electrical connection elements. The substrate is provided with a plurality of guide holes, and at least one guide pin of the light-emitting diode is provided with perforations. The connection part is adhered to the conductive layer around each guide hole and each guide pin of the at least one LED, so that the connection strength between the substrate and the at least one LED is strengthened, and the practicability of the present invention is increased.

Other features and specific embodiments of the utility model can be further understood in the following detailed description with accompanying drawings.

Description of drawings

Fig. 1 is the perspective view of the utility model embodiment;

Fig. 2 is an exploded view of the components of the utility model embodiment;

Fig. 3 is the schematic cross-sectional view of the utility model embodiment;

Fig. 4 is the use schematic diagram of the utility model embodiment;

Fig. 5 is a perspective view of another embodiment of the utility model;

Fig. 6 is an exploded view of components of another embodiment of the present invention;

Fig. 7 is a schematic cross-sectional view of another embodiment of the present invention.

Explanation of symbols in the figure

10 Substrate

11 guide hole

12 Conductive layer

13 slotting

20 LEDs

21 guide pin

22 perforations

30 Electrical connection components

31 Electrical connection part

Detailed ways

Please refer to Figures 1-3. The utility model provides a light emitting device, which includes:

A substrate 10, the substrate 10 is a printed circuit board, and can also be implemented as any one of ceramic substrates, silicon substrates, aluminum substrates, flexible circuit boards, etc. (not shown in the figure), the substrate 10 is provided with multiple guide holes 11, and each guide hole 11 is a through hole penetrating the substrate 10, the periphery of the guide hole 11 is provided with a conductive layer 12, and the conductive layer 12 is arranged on the inner wall of each guide hole 11 and the outer edge of the upper and lower apertures. Although the guide hole 11 of the embodiment is a through hole penetrating the substrate 10, the guide hole 11 can also be implemented as a blind hole that does not penetrate the substrate 10, so that the conductive layer 12 is arranged on the inner wall of each guide hole 11 and the outer edge of the upper aperture. (not shown).

At least one light-emitting diode 20 (can be implemented as a light-emitting diode 20, or a plurality of light-emitting diodes 20 as in this embodiment), the at least one light-emitting diode 20 is arranged on the substrate 10, and the at least one light-emitting diode 20 is provided with multiple Each guide pin 21 is provided with a through hole 22 , and the through hole 22 of each guide pin 21 is set corresponding to the guide hole 11 on the substrate 10 .

A plurality of electrical connection elements 30, the electrical connection elements 30 are solder (any one of tin, silver, copper, gold, and nickel alloy can also be implemented), and each electrical connection element 30 is arranged on the substrate 10 Between the conductive layer 12 of the guide hole 11 and each guide pin 21 of the light emitting diode 20, each electrical connection element 30 is heated to form an electrical connection part 31, wherein each electrical connection part 31 is diffusely adhered to the guide hole of the substrate 10 11 in the conductive layer 12, and cover the inner wall of the through hole 22 of the guide pin 21 of the light emitting diode 20, so as to be firmly combined.

Please refer to FIGS. 3-4, which are embodiments of the present invention. The through holes 22 of the guide pins 21 of the at least one LED 20 are placed corresponding to the guide holes 11 of the substrate 10. Each of the electrical connection elements 30 is in a molten state, and the molten electrical connection elements 30 flow into the guide holes 11 of the substrate 10 by gravity or diffusion, and at the same time, each of the electrical connection elements 30 and the light emitting diodes 20 The viscous force between the inner walls of the perforations of the guide pins 21 makes the LED 20 flow-drawn by the electrical connecting element 30 and moves close to the substrate 10, and at the same time, the electrical connecting element 30 covers and adheres to the inner wall of the perforation 22 of the guide pins 21. After the temperature of the connecting element 30 is lowered and solidified, the electrical connection part 31 is formed. Each electrical connection part 31 increases the contact area between the light emitting diode 20 and the substrate 10, and firmly combines the light emitting diode 20 and the substrate 10. At the same time, each of the light emitting diodes 20 Because the guide pin 21 is provided with the through hole 22 corresponding to the guide hole 11 of the substrate 10, it forms a precise alignment combination, so that it can automatically adjust the offset caused by the inaccurate placement of the light emitting diode 20 during processing, and make the substrate 10 and the LED 20 are connected in a reduced thickness.

Please refer to Figures 5-7, which are another embodiment of the present utility model, wherein at least one slot 13 is provided on one side of the substrate 10 (in this embodiment, a plurality of slots 13 are provided corresponding to the light-emitting diode 20), and the at least one light-emitting diode 20 is arranged in the corresponding slot 13 on one side of the substrate 10, the plurality of guide holes 11 of the substrate 10 are arranged on two sides of the corresponding slot 13, and each guide pin 21 of at least one LED 20 is arranged across the two sides of the slot 13. On each guide hole 11 on the side, when the electrical connection element 30 is heated, each electrical connection element 30 is melted during the high temperature process, and the molten electrical connection element 30 makes use of gravity or diffusion to move toward the substrate 10 At the same time, due to the viscous force between the electrical connection element 30 and the inner wall of the lead pin 21 of the light emitting diode 20, the light emitting diode 20 is drawn by the flow of the electrical connection element 30 and is close to the substrate 10, and at the same time The electrical connection elements 30 cover the inner walls of the through holes 22 of the adhesive pins 21, and each electrical connection element 30 is cooled and solidified to form an electrical connection portion 31, and each electrical connection portion 31 makes the light emitting diode 20 and the substrate 10 contact the area Increase, firmly connect the light-emitting diode 20 to the substrate 10, and at the same time, each guide pin 21 of the light-emitting diode 20 is provided with a through hole 22 corresponding to the guide hole 11 of the substrate 10 to form a precise alignment combination, so that it can automatically adjust the light-emitting diode 20 The offset caused by inaccurate placement during processing reduces the thickness of the overall light-emitting device.

Please refer to Figs. 1 to 7, the feature of the light-emitting device of the present invention is: through the combined design of a substrate 10, at least one light-emitting diode 20 and a plurality of electrical connection elements 30, each guide hole 11 of the substrate 10 is provided with a There is a conductive layer 12, and the at least one LED 20 is disposed on the substrate 10, and the through holes 22 of the guide pins 21 of the at least one LED 20 correspond to the guide holes 11 on the substrate 10, and the electrical connection elements 30 are heated An electrical connection portion 31 is formed, and each electrical connection element 30 can flow and pull each guide pin 21 of at least one LED 20 to correspond to each guide hole 11 of the substrate 10, and each electrical connection portion 31 is diffusely adhered to the substrate 10 The conductive layer 12 at the periphery of the guide hole 11 covers and adheres the inner wall of the through hole 22 of each guide pin 21 of at least one light emitting diode 20, thereby making the substrate 10 and the light emitting diode 20 precisely aligned and combined, and reducing the contact between the substrate 10 and the light emitting diode 20. The thickness of the connection of the light emitting diodes 20 also enhances the connection strength between the substrate 10 and at least one light emitting diode 20, thereby increasing the practicability and convenience of the present invention.

The above descriptions are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. All changes and modifications that can be made by those skilled in the art should be considered as not departing from the present invention. new substance.

Claims (7)

1. a light-emitting device is characterized in that, this light-emitting device comprises:

One substrate, this substrate is provided with a plurality of guide holes, and each guide hole periphery is provided with conductive layer;

At least one light emitting diode, this at least one light emitting diode is arranged on the substrate, and this at least one light emitting diode is provided with many lead foots, each lead foot is provided with perforation, and the guide hole on the perforation counterpart substrate of each lead foot; And

A plurality of electrically connect elements, each electrically connect element is located between each lead foot of the conductive layer of each guide hole on the substrate and light emitting diode, be subjected to the thermosetting electrical junction for each electrically connect element, and each electrical junction is attached to the conductive layer and the lead foot of guide hole periphery.

2. light-emitting device as claimed in claim 1 is characterized in that, this substrate is the wherein arbitrary of printed circuit board (PCB), ceramic substrate, silicon substrate, aluminium base, flexible circuit board.

3. light-emitting device as claimed in claim 1 is characterized in that, this electrically connect element is the wherein arbitrary of scolding tin, tin, silver, copper, gold, nickel alloy.

4. light-emitting device as claimed in claim 1, it is characterized in that, this substrate one side is provided with at least one fluting, this at least one light emitting diode is arranged in the fluting of substrate one side correspondence, a plurality of guide holes of this substrate are located at corresponding fluting two sides, and each lead foot of at least one light emitting diode is striden on each guide hole of being located at fluting two sides.

5. light-emitting device as claimed in claim 1 is characterized in that, each electrical junction diffusion is attached to the hole of substrate and leads the conductive layer of periphery, and coats the perforation inwall of the lead foot of adhesive light-emitting diode.

6. light-emitting device as claimed in claim 1 is characterized in that, this guide hole is the through hole that runs through substrate, and conductive layer is located at the inwall of guide hole and outer rim place, aperture up and down.

7. light-emitting device as claimed in claim 1 is characterized in that, this guide hole is the blind hole that does not run through substrate, and conductive layer is located at the inwall of guide hole and is gone up outer rim place, aperture.

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