CN201817544U - Movable magnetic control device of sputtering equipment - Google Patents

Abstract

A movable magnetic control device of sputtering equipment comprises a substrate and a magnetic control unit arranged on the substrate, wherein the magnetic control unit comprises two first magnetic pieces at intervals, a second magnetic piece which is positioned between the first magnetic pieces and has the same polarity, at least one third magnetic piece which is positioned between the second magnetic piece and the first magnetic piece at intervals and has opposite polarity, and a plurality of arc magnetic pieces which are connected with the first magnetic pieces and the second magnetic pieces, wherein the width between the first magnetic pieces and the third magnetic pieces is smaller than the width between the second magnetic pieces and the third magnetic pieces. The utility model discloses a novel structure is not only established to the design of this magnetic control device, can also improve the magnetic line of force intensity that the magnetic control device is close to the border position, borrows this to improve the magnetic control device reciprocating motion and treat the not good shortcoming of short produced sputtering degree of consistency of border position corresponding time of sputter thing.

Description

Mobile magnetron device for sputtering equipment

technical field

The utility model relates to a magnetron device, in particular to a movable magnetron device of the sputtering device which is installed on the sputtering device and can be moved back and forth.

Background technique

Sputtering equipment is a special device that uses plasma to bombard the target with ions, so that the atoms on the surface of the target can be knocked out, and finally deposited on the object to be sputtered to form a thin film. According to the different ways of exciting the plasma, the existing sputtering equipment has many different forms. Among them, the magnetron sputtering equipment installs a magnetron device near the target, and uses the electromagnetic effect between the magnetic field and the electric field. The generated electromagnetic force affects the movement of electrons in the plasma, so that the electrons can move in a spiral manner, thereby increasing the number of collisions between electrons and gas molecules, so as to increase the chance of ionization of gas molecules. In order to improve the utilization rate of the target, the magnetron device of some sputtering equipment is designed to be mobile.

Referring to Fig. 1 and Fig. 2, the existing sputtering equipment usually installs a target material 91 in a chamber seat not shown in the figure, and through the bombardment of plasma, the atoms on the surface of the target material 91 are blasted out, and finally deposited On a spaced object to be sputtered 92, in order to improve the sputtering reaction rate, the sputtering equipment also includes a magnetron device 1 close to the target material 91, and the above-mentioned magnetron device 1 can be driven along a The length direction 93 of the sputter 92 moves back and forth, and it includes a rectangular substrate 11, the substrate 11 has two long sides 111 at intervals, and two short sides 112 vertically connected to the opposite sides of the long sides 111 The magnetron device 1 also includes a magnetron unit 12 installed on the substrate 11, the magnetron unit 12 includes two first magnets 121 extending along the length direction 93 and respectively close to a long side 111, A second magnet 122 parallel to the center of the first magnet 121, two third magnets 123 parallel between the first magnet 121 and the second magnet 122, and several close One of the short sides 112 is a vertical magnetic piece 124 . Above-mentioned first magnetic piece 121, second magnetic piece 122 and third magnetic piece 123 are all formed by parallel connection of several magnets 120, wherein the poles of first magnetic piece 121, second magnetic piece 122 and vertical magnetic piece 124 The polarities are the same, for example, they are all N poles, and the polarities of the third magnetic member 123 are opposite, for example, S poles. The width W between the adjacent first magnetic pieces 121 and the third magnetic pieces 123 and between the adjacent second magnetic pieces 122 and the third magnetic pieces 123 is the same.

When the existing sputtering equipment is performing sputtering, inert gas is usually introduced into the vacuum chamber, and a power supply is passed between the target material 91 and the object to be sputtered 92. At this time, the generated plasma will be absorbed by the target. The atoms knocked away from the target 91 will be attracted by the object 92 to be sputtered and deposited on the surface of the object 92 to be sputtered, and the magnetron device 1 will be driven along the length direction 93 Reciprocating movement, thereby increasing the reaction rate during sputtering. Since how the magnetic control device 1 moves and how to increase the reaction rate is the prior art, it will not be described again.

The existing magnetic control device 1 will reciprocate along the length direction 93 when in use, as illustrated in the direction of Figure 2, when the magnetic control device 1 moves to the left side of Figure 2 and reaches the end point, it will immediately move to the right , and then move to the left when reaching the end point on the right side, therefore, the time of the magnetron device 1 corresponding to each position of the object to be sputtered 92 is not the same, that is to say, the magnetron device 1 corresponds to the object to be sputtered The time on both sides of 92 is shorter than the time corresponding to the middle part of object 92 to be sputtered. And the width W between each magnetic piece 121,122,123 of existing magnetron device 1 is identical, and the intensity of the magnetic force line that produces is roughly the same, therefore, when magnetron device 1 corresponds to the time on both sides of object 92 to be sputtered is shorter , the time for the target 91 to be impacted and deposited on the surface of the object 92 to be sputtered is relatively short, resulting in poor sputtering uniformity. On the other hand, the vertical magnetic piece 124 and the third magnetic piece 123 with opposite polarity are vertically arranged, because the distance between some parts (such as diagonal positions) between the vertical magnetic piece 124 and the third magnetic piece 123 is relatively long. , and weaken the strength of the magnetic field lines.

Contents of the invention

The purpose of the utility model is to provide a mobile magnetron device of sputtering equipment which can improve sputtering uniformity.

The utility model mobile magnetic control device comprises a substrate, and a magnetic control unit installed on the substrate, the magnetic control unit includes two first magnetic parts spaced apart from each other, a magnetic control unit located between the first magnetic parts and A second magnetic piece with the same polarity, at least one third magnetic piece with opposite polarity between the second magnetic piece and the first magnetic piece, and several connected between the first magnetic piece and the second magnetic piece The arc-connected magnetic parts, the width between the third magnetic part and the adjacent first magnetic part is smaller than the width between the third magnetic part and the second magnetic part.

The number of the third magnetic parts of the magnetic control unit of the utility model is two, which are respectively located on opposite sides of the second magnetic parts.

The arc connecting magnetic parts of the utility model all have a flat connecting section vertically connected to the first magnetic part, and an arc connecting section connected between the flat connecting section and the second magnetic part.

The substrate of the utility model includes two long sides parallel to each other and respectively close to one of the first magnetic parts, and the first magnetic part, the second magnetic part and the third magnetic part are arranged at intervals and parallel to the long sides .

The substrate of the present invention also includes two short sides vertically connected between the long sides, and the arc-connected magnetic part is symmetrically close to one of the short sides.

The beneficial effects of the utility model are: by changing the width between adjacent magnetic parts, the magnetron device can improve the poor sputtering uniformity that may occur due to the different time between the reciprocating movement and the corresponding parts of the object to be sputtered. Shortcomings.

Description of drawings

Fig. 1 is a front view schematic diagram of a magnetron device of a kind of existing sputtering equipment;

Fig. 2 is a reference diagram of a state of use of the existing magnetic control device;

Fig. 3 is a perspective view of a preferred embodiment of the utility model magnetic control device;

Fig. 4 is a schematic front view of the preferred embodiment;

Fig. 5 is a reference diagram of a usage state of the preferred embodiment.

Detailed ways

Below in conjunction with accompanying drawing and embodiment the utility model is described in detail.

Referring to Fig. 3, 4, 5, a preferred embodiment of the utility model mobile magnetron device is installed on a cavity seat (not shown) of a sputtering equipment, and above-mentioned sputtering equipment has a target material 2, by The generated plasma strikes the surface of the target 2, and the atoms that are bombarded off the target 2 will finally deposit on the surface of an object to be sputtered 3 and form a thin film, because how the atoms on the target 2 are bombarded off and deposited It is a prior art on the object to be sputtered 3 and will not be described in detail.

The magnetron device of the present embodiment is close to the target material 2, and is respectively located on the opposite side of the target material 2 with the object to be sputtered 3. The magnetron device comprises: a substrate 4, and a substrate mounted on the substrate 4 Magnetic control unit 5. The base plate 4 is a rectangular board, so it has two parallel long sides 41 and two short sides 42 vertically connected to opposite sides of the long sides 41 .

The magnetic control unit 5 of this embodiment includes: two first magnetic pieces 51 close to one of the long sides 41 respectively, a second magnetic piece 52 located in the center of the first magnetic piece 51, two parallel and spaced The third magnetic piece 53 between the adjacent first magnetic piece 51 and the second magnetic piece 52 , and several arc-connected magnetic pieces 54 close to one of the short sides 42 of the substrate 4 . Wherein, the third magnetic parts 53 are respectively located on opposite sides of the second magnetic part 52 , and the arc-connected magnetic parts 54 are symmetrically close to one of the short sides 42 of the substrate 4 . The first magnetic part 51, the second magnetic part 52, the third magnetic part 53 and the arc connecting magnetic part 54 are all formed by butt joints of several magnetic magnets 50. The first magnetic part 51, the second magnetic part Both the part 52 and the arc connecting magnetic part 54 have a first polarity, which is N pole in this embodiment, and the third magnetic part 53 has a second polarity opposite to the first polarity, In this embodiment, the second polarity is S pole. In the magnetic control device of this embodiment, the first magnetic part 51, the second magnetic part 52 and the third magnetic part 53 are arranged at intervals and parallel to the long side 41; the third magnetic part 53 and the adjacent There is a first width W1 between the first magnetic parts 51 , and a second width W2 between the third magnetic part 53 and the second magnetic part 52 , and the first width W1 is smaller than the second width W2 . The arc connecting magnetic parts 54 in this embodiment have a flat connecting segment 541 vertically connected to one of the first magnetic parts 51, and an arc extending from the flat connecting segment 541 to the direction of the second magnetic part 52. Combination 542.

It can be seen from the above that the magnetic control unit 5 of the present invention includes: two first magnetic parts 51 spaced apart from each other, a second magnetic part 52 located between the first magnetic parts 51 and having the same polarity, and At least one third magnetic piece 53 with opposite polarity between the second magnetic piece 52 and the first magnetic piece 51, and several arc-connected magnetic pieces connected between the first magnetic piece 51 and the second magnetic piece 52 piece 54.

When the magnetron device of this embodiment is in use, it also moves back and forth along a length direction 30 of the object to be sputtered 3. When the magnetron device moves close to one of the sides of the object to be sputtered 3, due to The first width W1 between the first magnetic part 51 and the third magnetic part 53 of the magnetic control device is smaller than the second width W2 between the second magnetic part 52 and the third magnetic part 53, therefore, in the first magnetic part 51 and the third magnetic member 53 can generate strong magnetic strength, so as to improve the shortcoming of poor sputtering uniformity derived from the relatively short time for the magnetron to move on both sides of the object to be sputtered 3 . On the other hand, the design of the arc-connecting magnetic part 54 in this embodiment can shorten the distance between the arc-connecting magnetic part 54 and the third magnetic part 53 , thereby increasing the magnetic strength on both sides of the magnetic control device. Therefore, the design of the mobile magnetron device of the present invention not only has a novel structure, but also has the effect of improving the uniformity of sputtering.

Claims (5)

1. the portable magnetic control means of a sputtering equipment, comprise: a substrate, and magnetic control unit that is installed on this substrate, the first magnetic spare, one that this magnetic control unit comprises two each intervals is between the described first magnetic spare and the second identical magnetic spare of polarity, and at least one is between the second magnetic spare and the first magnetic spare and opposite polarity the 3rd magnetic spare; It is characterized in that: this magnetic control unit comprises that also several arcs that are connected between the first magnetic spare and the second magnetic spare connect magnetic spare, and the width between above-mentioned the 3rd magnetic spare and the adjacent first magnetic spare is less than the width between above-mentioned the 3rd magnetic spare and the second magnetic spare.

2. the portable magnetic control means of sputtering equipment according to claim 1, it is characterized in that: the quantity of unitary the 3rd magnetic spare of this magnetic control is two, lays respectively at the opposition side of this second magnetic spare.

3. the portable magnetic control means of sputtering equipment according to claim 1 and 2 is characterized in that: described arc magnetic spare all has one and flatly connects section with the first magnetic spare is connected vertically, and one is connected this flat arc that connects between the section and the second magnetic spare and connects section.

4. the portable magnetic control means of sputtering equipment according to claim 3, it is characterized in that: this substrate comprise two parallel to each other and respectively near the long limit of one of them first magnetic spare, and the described first magnetic spare, the second magnetic spare and the 3rd magnetic spare are provided with at interval, and parallel with described long limit.

5. the portable magnetic control means of sputtering equipment according to claim 4, it is characterized in that: this substrate also comprises two minor faces that are vertically connected between the described long limit, and described arc connects magnetic spare left and right symmetrically near one of them minor face.

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