CN201436701U - Dual inline element PCB package improvement - Google Patents
Dual inline element PCB package improvement Download PDFInfo
- Publication number
- CN201436701U CN201436701U CN2009200715329U CN200920071532U CN201436701U CN 201436701 U CN201436701 U CN 201436701U CN 2009200715329 U CN2009200715329 U CN 2009200715329U CN 200920071532 U CN200920071532 U CN 200920071532U CN 201436701 U CN201436701 U CN 201436701U
- Authority
- CN
- China
- Prior art keywords
- pcb
- hole
- pad
- row
- pins
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000009977 dual effect Effects 0.000 title abstract 2
- 238000005538 encapsulation Methods 0.000 claims description 14
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 10
- 238000012423 maintenance Methods 0.000 abstract description 3
- 238000007747 plating Methods 0.000 abstract 2
- 238000005516 engineering process Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011469 building brick Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Images
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The utility model discloses a dual inline element PCB package improvement. A PCB package comprises two rows of pins, one row is signal pins, the other row is high pressure pins, the PCB package is characterized in that the signal pins are made into a single-surface bonding pad of a through hole, the center point of the bonding pad is used as reference, double-surface plating through holes with external diameter of 30mil-50mil and internal diameter of 18mil-30mil are respectively arranged at a position 1.5 mm-5mm far away from the left end and the right end, and the center point of the bonding pad and the two plating through holes are connected by wire of 20mil-40mil. After improved, the PCB package is more convenient, saves time and increases maintenance efficiency when the element is maintained and dismounted.
Description
Technical field
The utility model relates to a kind of electricity component PCB and encapsulates improved technical field, and particularly a kind of dual-in-line element PCB encapsulation improves.
Background technology
Element has plug-in mounting and mounts two kinds, and the encapsulation of element is meant the outward appearance indicated when actual part is welded to circuit board and the position of solder joint, is pure concept of space.
PCB is exactly a printed circuit board (PCB), and Printed circuit board is equipped with the thin plate of integrated circuit and other electronic building bricks exactly, and tow sides are arranged, and as supporting various components and parts, and can realize being electrically connected or electric insulation between them.
The PCB encapsulation of element comprises two row's pins, one row is a signal pins, another row is the high pressure pin, two row's pins all are two-sided plated-through-holes, existing PCB encapsulation technology is to enlarge PCB to go up plated-through-hole, can improve the facility when removing element a little, can not strengthen but PCB goes up the internal diameter of pin bores, if add large diameter, then need add the large bonding pad external diameter, be not being met with regard to meaning electric minimum spacing, when the dismounting element and add the large bonding pad external diameter, during with the tin in the tin rifle taking-up hole, be easy to cause the damage of pad and plated-through-hole, cause scrapping of PCB, and remove an element and need remove the interior scolding tin of a lot of via holes, time spent is very long, causes efficient low.
Summary of the invention
For solving the problems of the technologies described above, the utility model provides a kind of dual-in-line element PCB encapsulation to improve, and when element needed repairing, tearing element open did not need to take out scolding tin in the PCB hole, saves time, and raises the efficiency, and has stopped the possibility that PCB scraps.
The utility model is to realize by following technical scheme:
A kind of dual-in-line element PCB encapsulation improves, the PCB encapsulation comprises two row's pins, one row is a signal pins, another row is the high pressure pin, signal pins is made the single face pad of through hole, is benchmark with the central point of pad, and all stamping external diameter respectively apart from each 1.5mm of two ends, the left and right sides～5mm place is 30mil～50mil, internal diameter is the two-sided plated-through-hole of 18mil～30mil, and the central point of pad and two plated-through-holes line with 20mil～40mil is linked up.
There is not scolding tin in the described through hole.
The beneficial effects of the utility model are: owing to adopt the single face pad, no scolding tin in the through hole when the element maintenance is removed, does not need to take out the scolding tin in the PCB through hole, has reduced by a main operation, saves time, and has improved efficient, has prevented scrapping of PCB.
Description of drawings
Fig. 1 is a front schematic view before the PCB encapsulation improves
Fig. 2 is a reverse side schematic diagram before the PCB encapsulation improves
Fig. 3 is that the PCB encapsulation improves the back front schematic view
Fig. 4 is that the PCB encapsulation improves back reverse side schematic diagram
Embodiment
Before the improvement: as shown in Figure 1, the positive signal pins 1 of PCB, high pressure pin 2 all are that existing pad has plated-through-hole again.As shown in Figure 2, PCB reverse side signal pins 1, high pressure pin 2 all are that existing pad has plated-through-hole again.
Improve the back: as shown in Figure 3, the positive signal pins 1 existing pad of PCB has plated-through-hole again, and high pressure pin 2 promptly has pad that through hole is arranged again.As shown in Figure 4, PCB reverse side signal pins 1 does not have pad but through hole is arranged, and high pressure pin 2 existing pads have plated-through-hole again.The single face pad is made in signal pins PCB front after promptly improving, and does not have scolding tin in the through hole, accomplishes that through hole is non-metallic, does not need the scolding tin in the through hole is taken out when maintenance is removed, and therefore can not destroy pad and PCB.Central point with pad is a benchmark, all stamping external diameter respectively apart from each 1.5mm of two ends, the left and right sides～5mm place is 30mil～50mil, internal diameter is the two-sided plated-through-hole of 18mil～30mil, the central point of pad and two plated-through-holes line with 20mil～40mil is linked up, so just can solve the weakness of the fixing deficiency of single face pad, make element combine closelyr with PCB.
Claims (2)
1. a dual-in-line element PCB encapsulation improves, the PCB encapsulation comprises two row's pins, one row is a signal pins, another row is the high pressure pin, signal pins is made the single face pad of through hole, is benchmark with the central point of pad, and all stamping external diameter respectively apart from each 1.5mm of two ends, the left and right sides～5mm place is 30mil～50mil, internal diameter is the two-sided plated-through-hole of 18mil～30mil, and the central point of pad and two plated-through-holes line with 20mil～40mil is linked up.
2. dual-in-line element PCB encapsulation as claimed in claim 1 improves, and does not have scolding tin in the described through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200715329U CN201436701U (en) | 2009-05-04 | 2009-05-04 | Dual inline element PCB package improvement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009200715329U CN201436701U (en) | 2009-05-04 | 2009-05-04 | Dual inline element PCB package improvement |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201436701U true CN201436701U (en) | 2010-04-07 |
Family
ID=42373148
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009200715329U Expired - Fee Related CN201436701U (en) | 2009-05-04 | 2009-05-04 | Dual inline element PCB package improvement |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201436701U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102105018A (en) * | 2010-12-31 | 2011-06-22 | 深圳市金宏威实业发展有限公司 | Multilayer circuit board |
-
2009
- 2009-05-04 CN CN2009200715329U patent/CN201436701U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102105018A (en) * | 2010-12-31 | 2011-06-22 | 深圳市金宏威实业发展有限公司 | Multilayer circuit board |
| CN102105018B (en) * | 2010-12-31 | 2013-10-23 | 深圳市金宏威技术股份有限公司 | Multilayer circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: ZHEJIANG HULONG MOTOR CO., LTD. Free format text: FORMER OWNER: SHANGHAI JIZHI ELECTRONIC TECHNOLOGY CO., LTD. Effective date: 20120206 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201206 PUDONG NEW AREA, SHANGHAI TO: 317604 TAIZHOU, ZHEJIANG PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120206 Address after: Yuhuan County Damaiyu Street Park Village in Taizhou City, Zhejiang province 317604 Patentee after: Zhejiang Hulong Motor Co., Ltd. Address before: 201206, No. 2, building A, block 501, Jingang Road, Shanghai, Pudong New Area Patentee before: Shanghai Jizhi Electronic Technology Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100407 Termination date: 20140504 |