CN201383899Y - Circuit board and machine body applying same - Google Patents
Circuit board and machine body applying same Download PDFInfo
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- CN201383899Y CN201383899Y CN200920006848U CN200920006848U CN201383899Y CN 201383899 Y CN201383899 Y CN 201383899Y CN 200920006848 U CN200920006848 U CN 200920006848U CN 200920006848 U CN200920006848 U CN 200920006848U CN 201383899 Y CN201383899 Y CN 201383899Y
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- 239000000758 substrate Substances 0.000 claims description 16
- 239000010410 layer Substances 0.000 description 37
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 9
- 239000002184 metal Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011241 protective layer Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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Abstract
Description
技术领域 technical field
本实用新型涉及一种电路板及应用其的机体,且特别是涉及一种具接地路径的电路板及应用其的机体。The utility model relates to a circuit board and a body using the same, in particular to a circuit board with a grounding path and a body using the same.
背景技术 Background technique
随着电子产品的应用及发展,电路板的使用相当的广泛。一般来说,例如是电阻、电容或芯片的电子组件可组设在电路板上作整合。然而,电子组件间往往可能彼此电磁干扰,使得电子组件的功能受到影响而降低工作效率。因此,电路板上通常设置有接地路径,以减少电子组件间的干扰。With the application and development of electronic products, the use of circuit boards is quite extensive. In general, electronic components such as resistors, capacitors or chips can be assembled on a circuit board for integration. However, the electronic components may interfere with each other electromagnetically, so that the functions of the electronic components are affected and the working efficiency is reduced. Therefore, a ground path is usually provided on the circuit board to reduce interference between electronic components.
传统中,电路板具有一螺丝孔及一接地表面。接地表面环绕在螺丝孔的周围,且接地表面上焊有一锡层。当电路板与导电壳体欲由金属螺丝来相互固定时,金属螺丝的螺帽接触锡层来与接地表面电性耦接,且金属螺丝的螺柱穿越螺丝孔来锁固在导电壳体。如此一来,电路板与导电壳体间之间形成一接地路径。Traditionally, the circuit board has a screw hole and a ground surface. The ground surface surrounds the screw hole, and a tin layer is soldered on the ground surface. When the circuit board and the conductive shell are to be fixed to each other by metal screws, the nuts of the metal screws contact the tin layer to electrically couple with the ground surface, and the studs of the metal screws pass through the screw holes to be locked on the conductive shell. In this way, a ground path is formed between the circuit board and the conductive casing.
然而,在接地表面上焊上整面的锡层易有表面不平整的情况,使得金属螺丝的螺帽往往仅可点接触到锡层而缩小了接地面积。再者,虽然传统中另有提出在接地表面上焊有直线放射状的锡层来避免锡层的表面不平整的情况,然而,直线放射状的锡层的面积小,使得金属螺丝的螺帽与锡层间的接地面积亦对应地缩小。因此,如何设计出可有效地接地的电路板,乃为相关业者努力的课题之一。However, soldering the entire surface of the tin layer on the grounding surface tends to have an uneven surface, so that the nuts of the metal screws often only touch the tin layer at points, thereby reducing the grounding area. Furthermore, although it is traditionally proposed to weld a linear radial tin layer on the ground surface to avoid the uneven surface of the tin layer, the area of the linear radial tin layer is small, so that the nut of the metal screw is in contact with the tin layer. The grounding area between layers is correspondingly reduced. Therefore, how to design a circuit board that can be effectively grounded is one of the subjects that the relevant industry is striving for.
实用新型内容Utility model content
本实用新型所要解决的技术问题在于,提供一种电路板及应用其的机体,其由条状导电结构来作为接地的媒介,以同时具有表面平整以及增加接地面积的优点。The technical problem to be solved by the utility model is to provide a circuit board and a body using it, which uses a strip-shaped conductive structure as a grounding medium, so as to have the advantages of smooth surface and increased grounding area.
为了实现上述目的,本实用新型提出一种电路板,其特征在于,包括:In order to achieve the above object, the utility model proposes a circuit board, which is characterized in that it includes:
一主体,具有一贯孔及一接地面,该贯孔贯穿该主体,该接地面环绕该贯孔;以及a body having a through hole extending through the body and a ground plane surrounding the through hole; and
多个条状导电结构,设置在该接地面上,且各该条状导电结构的长度大于该贯孔的孔缘到该接地面的外缘的间距。A plurality of strip-shaped conductive structures are arranged on the ground plane, and the length of each strip-shaped conductive structure is greater than the distance from the edge of the through hole to the outer edge of the ground plane.
上述的电路板,其中,该些条状导电结构的形状为弧状。In the above-mentioned circuit board, the strip-shaped conductive structures are arc-shaped.
上述的电路板,其中,各该条状导电结构的两端分别位于该贯孔的孔缘与该接地面的外缘。In the above-mentioned circuit board, two ends of each strip-shaped conductive structure are respectively located at the edge of the through hole and the outer edge of the ground plane.
上述的电路板,其中,该主体包括:The above-mentioned circuit board, wherein the main body includes:
一基板;a substrate;
一导电层,设置于该基板上;以及a conductive layer disposed on the substrate; and
一绝缘层,设置于该导电层上,且具有一孔洞,经由该孔洞露出的该导电层为该接地面,该贯孔的位置对应于该孔洞的位置,以贯穿该基板及该导电层。An insulating layer is arranged on the conductive layer and has a hole. The conductive layer exposed through the hole is the ground plane. The through hole is positioned corresponding to the hole to penetrate the substrate and the conductive layer.
上述的电路板,其中,该主体还包括:The above-mentioned circuit board, wherein the main body also includes:
一保护层,设置于该接地面上,该些条状导电结构经由该保护层设置于该接地面上,且电性耦接于该保护层。A protection layer is disposed on the ground plane, and the strip-shaped conductive structures are disposed on the ground plane through the protection layer and are electrically coupled to the protection layer.
为了实现上述目的,本实用新型还提出一种机体,其特征在于,包括:In order to achieve the above purpose, the utility model also proposes a body, which is characterized in that it includes:
一固定件;a fixing piece;
一电路板,设置于该固定件上,该电路板包括:A circuit board is arranged on the fixture, and the circuit board includes:
一主体,具有一第一贯孔及一接地面,该第一贯孔贯穿该主体,该接地面环绕该第一贯孔;及a main body having a first through hole and a ground plane, the first through hole passing through the main body, the ground plane surrounding the first through hole; and
多个条状导电结构,设置在该接地面上,且各该条状导电结构的长度大于该第一贯孔的孔缘到该接地面的外缘的间距;A plurality of strip-shaped conductive structures are arranged on the ground plane, and the length of each strip-shaped conductive structure is greater than the distance from the edge of the first through hole to the outer edge of the ground plane;
一导电壳体,具有一第二贯孔及一组设面,该第二贯孔贯穿该导电壳体,该组设面环绕该第二贯孔,该导电壳体设置于该电路板上,使得该组设面接触该些条状导电结构,且该第二贯孔的位置对应于该第一贯孔的位置;以及A conductive shell has a second through hole and a set of surfaces, the second through hole runs through the conductive shell, the set surface surrounds the second through hole, the conductive shell is arranged on the circuit board, making the assembly surface contact the strip-shaped conductive structures, and the position of the second through hole corresponds to the position of the first through hole; and
一导电锁合件,经由该第二贯孔及该第一贯孔锁合在该固定件,使得该电路板固定在该导电壳体与该固定件之间。A conductive locking part is locked on the fixing part through the second through hole and the first through hole, so that the circuit board is fixed between the conductive casing and the fixing part.
上述的机体,其中,该些条状导电结构的形状为弧状。In the above-mentioned body, the strip-shaped conductive structures are arc-shaped.
上述的机体,其中,各该条状导电结构的两端分别位于该第一贯孔的孔缘与该接地面的外缘。In the above-mentioned body, two ends of each strip-shaped conductive structure are respectively located at the edge of the first through hole and the outer edge of the grounding plane.
上述的机体,其中,该主体包括:The above-mentioned body, wherein the main body includes:
一基板;a substrate;
一导电层,设置于该基板上;以及a conductive layer disposed on the substrate; and
一绝缘层,设置于该导电层上,且具有一孔洞,经由该孔洞露出的该导电层为该接地面,该第一贯孔的位置对应于该孔洞的位置,以贯穿该基板及该导电层。An insulating layer is arranged on the conductive layer and has a hole, the conductive layer exposed through the hole is the ground plane, the position of the first through hole corresponds to the position of the hole, so as to penetrate the substrate and the conductive layer layer.
上述的机体,其中,该主体还包括:The above-mentioned body, wherein the main body also includes:
一保护层,设置于该接地面上,该些条状导电结构经由该保护层设置于该接地面上,且电性耦接于该保护层。A protection layer is disposed on the ground plane, and the strip-shaped conductive structures are disposed on the ground plane through the protection layer and are electrically coupled to the protection layer.
本实用新型的有益功效在于,本实用新型所揭露的电路板及应用其的机体,由贯孔与条状导电结构来形成一接地路径。导电锁合件利用此一接地路径来将电路板接地于导电壳体,以减少电路板上的电子组件间的电磁干扰。另外,由于条状导电结构的厚度实质上相同,因此,设置在条状导电结构上的导电组件可平贴且面接触各个条状导电结构,以增加接地面积。The beneficial effect of the utility model is that, the circuit board disclosed in the utility model and the machine body using it form a grounding path by the through hole and the strip-shaped conductive structure. The conductive lock utilizes the grounding path to ground the circuit board to the conductive housing, so as to reduce electromagnetic interference between electronic components on the circuit board. In addition, since the thicknesses of the strip-shaped conductive structures are substantially the same, the conductive components disposed on the strip-shaped conductive structures can be flatly attached and surface-contacted with each strip-shaped conductive structure, so as to increase the grounding area.
以下结合附图和具体实施例对本实用新型进行详细描述,但不作为对本实用新型的限定。The utility model will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the utility model.
附图说明 Description of drawings
其中,附图标记Among them, reference signs
图1为根据本实用新型第一实施例的电路板的示意图;1 is a schematic diagram of a circuit board according to a first embodiment of the present invention;
图2为根据本实用新型的另一种电路板的示意图;Fig. 2 is the schematic diagram according to another kind of circuit board of the present utility model;
图3A为根据本实用新型第二实施例的应用图1中的电路板的机体的爆炸图;3A is an exploded view of a body applying the circuit board in FIG. 1 according to a second embodiment of the present invention;
图3B为图3A中的机体于组设时的剖面图。FIG. 3B is a cross-sectional view of the body in FIG. 3A when assembled.
其中,附图标记Among them, reference signs
100:机体100: Body
110:电路板110: circuit board
111、111’:主体111, 111': subject
111a:基板111a: Substrate
111b:导电层111b: conductive layer
111c:绝缘层111c: insulating layer
111d:保护层111d: protective layer
112:条状导电结构112: strip conductive structure
120:固定件120: Fixing piece
130:导电壳体130: Conductive housing
140:导电锁合件140: Conductive lock
d:间距d: Spacing
h1:孔洞h1: hole
h21、h22:贯孔h21, h22: through hole
r1:孔缘r1: hole edge
r2:外缘r2: outer edge
s1:接地面s1: ground plane
s2:组设面s2: Assembly surface
具体实施方式 Detailed ways
下面结合附图对本实用新型的结构原理和工作原理作具体的描述:Below in conjunction with accompanying drawing, structural principle and working principle of the present utility model are specifically described:
本实用新型主要是提供一种电路板及应用其的机体。电路板包括一主体及多个条状导电结构。主体具有一贯孔及一接地面。贯孔贯穿主体。接地面环绕贯孔。条状导电结构设置在接地面上。各条状导电结构的长度大于贯孔的孔缘到接地面的外缘的间距。The utility model mainly provides a circuit board and a machine body using the circuit board. The circuit board includes a main body and a plurality of strip-shaped conductive structures. The main body has a through hole and a ground plane. The through hole runs through the main body. A ground plane surrounds the via. The strip conductive structure is arranged on the ground plane. The length of each strip-shaped conductive structure is greater than the distance from the edge of the through hole to the outer edge of the ground plane.
以下举出较佳实施例,配合图式详细说明本实用新型的电路板及应用其的机体。然而,本领域技术人员当可明了,此些图式与文字仅为说明之用,并不会对本实用新型的欲保护范围造成限缩。The preferred embodiments are listed below, and the circuit board of the present utility model and the body to which it is applied are described in detail in conjunction with the drawings. However, those skilled in the art should understand that these drawings and words are for illustration purposes only, and will not limit the protection scope of the present invention.
第一实施例first embodiment
请参照图1,其为根据本实用新型第一实施例的电路板的示意图。电路板110包括一主体111及多个条状导电结构112。主体111包括一基板111a、一导电层111b及一绝缘层111c。导电层111b设置于基板111a上,且绝缘层111c设置于导电层111b上。Please refer to FIG. 1 , which is a schematic diagram of a circuit board according to a first embodiment of the present invention. The
绝缘层111c具有一孔洞h1。经由孔洞h1露出的导电层111b为主体111的一接地面s1。主体111的一贯孔h21的位置对应于孔洞h1,以贯穿基板111a及导电层111b。接地面s1环绕贯孔h21。The insulating
条状导电结构112的材料例如是锡,且以焊接的方式设置在接地面s1上。各条状导电结构112的长度大于贯孔h1的孔缘r1到接地面s1的外缘r2的间距d,且此些条状导电结构112的厚度实质上相同。于本实施例中,各条状导电结构112具有长度大于间距d的特性例如可利用形状上的设计来达到。举例来说,如图1所示,各条状导电结构112的形状可例如是弧状,且其两端分别位于贯孔h1的孔缘r1与接地面s1的外缘r2。The strip
如此一来,本实施例的电路板110形成一接地路径。当电路板110设置在一导电壳体中时,一导电组件可利用此一接地路径来将电路板110接地于导电壳体,以减少电路板110上的电子组件间的电磁干扰。另外,由于条状导电结构112的厚度实质上相同,因此,设置在条状导电结构112上的导电组件可平贴且面接触各个条状导电结构112,以增加接地面积。In this way, the
另外,为了避免接地面s1直接与外界环境接触而氧化,接地面s1上可设置一层可导电的保护层。请参照图2,其为根据本实用新型的另一种电路板的示意图。主体111’可还包括一保护层111d,设置在接地面s1上。如此一来,条状导电结构112经由保护层111d设置在接地面s1上,且电性耦接于接地面s1,以提供一接地路径。In addition, in order to prevent the ground plane s1 from being directly oxidized in contact with the external environment, a conductive protective layer may be provided on the ground plane s1 . Please refer to FIG. 2 , which is a schematic diagram of another circuit board according to the present invention. The main body 111' may further include a
第二实施例second embodiment
本实施例将第一实施例中揭露的电路板110应用于图3A及图3B中的机体100内。以下主要说明电路板110应用在机体100的结构特征与配置关系。与第一实施例中相同的特征将将不再重复说明。此外,未经过变动或调整的组件将沿用与第一实施例相同的标号,且于此不再赘述。In this embodiment, the
请同时参照图3A及图3B,图3A为根据本实用新型第二实施例应用图1中的电路板的机体的爆炸图,且图3B为图3A中的机体于组设时的剖面图。机体100包括图1所示的电路板110、一固定件120、一导电壳体130及一导电锁合件140。Please refer to FIG. 3A and FIG. 3B at the same time. FIG. 3A is an exploded view of the body applying the circuit board in FIG. 1 according to the second embodiment of the present invention, and FIG. 3B is a cross-sectional view of the body in FIG. 3A when assembled. The
电路板110设置于固定件120上。导电壳体130具有一贯孔h22及一组设面s2。贯孔h22是贯穿导电壳体130,且组设面s2为环绕贯孔h22。导电壳体130设置于电路板110上,使得组设面s2接触条状导电结构112,且贯孔h22的位置对应于贯孔h21的位置。导电锁合件140经由贯孔h22及贯孔h21锁合在固定件120,使得电路板110固定在导电壳体130与固定件140之间。The
如此一来,电路板110形成一接地路径。导电锁合件140利用此一接地路径来将电路板110接地于导电壳体130,以减少电路板110上的电子组件间的电磁干扰。In this way, the
本实用新型上述实施例所揭露的电路板及应用其的机体,由贯孔与条状导电结构来形成一接地路径。导电锁合件利用此一接地路径来将电路板接地于导电壳体,以减少电路板上的电子组件间的电磁干扰。另外,由于条状导电结构的厚度实质上相同,因此,设置在条状导电结构上的导电组件可平贴且面接触各个条状导电结构,以增加接地面积。In the circuit board disclosed in the above-mentioned embodiments of the present invention and the machine body using it, a grounding path is formed by the through hole and the strip-shaped conductive structure. The conductive lock utilizes the grounding path to ground the circuit board to the conductive housing, so as to reduce electromagnetic interference between electronic components on the circuit board. In addition, since the thicknesses of the strip-shaped conductive structures are substantially the same, the conductive components disposed on the strip-shaped conductive structures can be flatly attached and surface-contacted with each strip-shaped conductive structure, so as to increase the grounding area.
当然,本实用新型还可有其它多种实施例,在不背离本实用新型精神及其实质的情况下,熟悉本领域的技术人员当可根据本实用新型作出各种相应的改变和变形,但这些相应的改变和变形都应属于本实用新型所附的权利要求的保护范围。Of course, the utility model can also have other various embodiments, and those skilled in the art can make various corresponding changes and deformations according to the utility model without departing from the spirit and essence of the utility model, but These corresponding changes and deformations should all belong to the protection scope of the appended claims of the present utility model.
Claims (10)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200920006848U CN201383899Y (en) | 2009-03-20 | 2009-03-20 | Circuit board and machine body applying same |
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| CN200920006848U CN201383899Y (en) | 2009-03-20 | 2009-03-20 | Circuit board and machine body applying same |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684241A (en) * | 2013-11-29 | 2015-06-03 | 英业达科技有限公司 | Circuit board |
| CN114765308A (en) * | 2021-01-13 | 2022-07-19 | 矽品精密工业股份有限公司 | Electronic device and circuit board thereof |
-
2009
- 2009-03-20 CN CN200920006848U patent/CN201383899Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104684241A (en) * | 2013-11-29 | 2015-06-03 | 英业达科技有限公司 | Circuit board |
| CN104684241B (en) * | 2013-11-29 | 2017-12-08 | 英业达科技有限公司 | Circuit board |
| CN114765308A (en) * | 2021-01-13 | 2022-07-19 | 矽品精密工业股份有限公司 | Electronic device and circuit board thereof |
| CN114765308B (en) * | 2021-01-13 | 2024-04-19 | 矽品精密工业股份有限公司 | Electronic device and circuit board thereof |
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Granted publication date: 20100113 Termination date: 20180320 |