CN201246695Y - Ceramic heat radiation substrate for chip LED encapsulation - Google Patents

Abstract

The utility model relates to a ceramic heat dissipation substrate for LED packaging, in particular to a ceramic heat dissipation substrate for chip LED packaging. The upper side of the substrate is provided with a patch area and a wiring area, and the lower side of the substrate is provided with a bottom pad that is connected to the two electrodes of the chip through the base metallization wiring pattern. Wiring patterns to realize electrical conduction holes for upper and lower electrical conduction, the substrate is made of ceramic materials such as alumina or aluminum nitride or LTCC, which is used to improve the overall mechanical strength of the substrate, metallization of wiring patterns and electrical conduction holes The metallization material is tungsten or molybdenum or silver or copper, and the electrical conduction hole is located on the edge or inside of the substrate. The utility model has the beneficial effects of: improving the heat dissipation performance of the SMD chip LED packaging substrate, improving the problems of large light decay and lifespan decline of the LED chip caused by temperature rise; enhancing the high and low temperature impact resistance of the LED product, improving the reliability of the product, stability.

Description

A ceramic heat dissipation substrate for chip LED packaging

technical field

The utility model relates to a ceramic heat dissipation substrate for LED packaging, in particular to a ceramic heat dissipation substrate for chip LED packaging.

Background technique

As a new type of light source, LED has achieved unprecedented development due to its incomparable advantages such as energy saving, environmental protection, long life, fast start-up speed, controllable luminous spectrum and forbidden band size to make the chroma higher than traditional light sources. With the increase of LED current intensity and light emission, the calorific value of LED chips also increases. For high-power LEDs, 80% of the input energy is consumed in the form of heat. If the heat cannot be discharged to the outside in time, it will cause the temperature rise effect of the chip, and the lifespan and light output of the LED will be greatly reduced; the thermal conductivity of the traditionally used PCB package base is only about 0.36W/mK, which is far from meeting the needs of high-power LEDs. LED thermal requirements. Moreover, the thermal expansion coefficient is very different from that of the LED chip. When the temperature changes greatly or the packaging operation is improper, it is easy to generate thermal distortion, which can cause chip defects and reduce luminous efficiency. The ceramic packaging substrate has become an ideal heat dissipation substrate material for LEDs, especially high-power LEDs, because of its high thermal conductivity, thermal expansion coefficient matching with LED crystals, and high electrical insulation strength, which can effectively solve these problems.

The structure of the substrate for LED packaging in the prior art is shown in FIGS. 1 to 3 , the base material is a PCB board, and copper is used as the metallization material. Among them, the patch area 1 is used to install the chip; the wiring area 2 is connected to one electrode of the chip through the welding wire; the bottom pad 3 is connected to the two electrodes of the chip through the base metallization wiring; the electrical conduction hole 4 is connected to the upper and lower two electrodes. Layer metallization wiring to achieve upper and lower electrical conduction.

The disadvantages and reasons of the above package base structure are as follows: 1) The thermal conductivity of the PCB board is low, resulting in relatively poor heat dissipation of the substrate. 2) The difference between the thermal expansion coefficient of the PCB board and the LED chip is too large. When the temperature changes greatly, it is easy to cause chip defects and reduce the luminous efficiency, resulting in greatly reduced luminous efficiency and life, failing to meet the technical requirements of high power and long life.

Based on the shortcomings of the existing substrates for LED packaging, the inventors designed "a ceramic heat dissipation substrate for chip-type LED packaging".

Utility model content

The technical problem to be solved by the utility model is to provide a method to improve the heat dissipation performance of the SMD high-power LED packaging base, improve the problem of large light decay and life-span reduction of the LED chip due to temperature rise, and enhance the LED product. A ceramic heat sink substrate for chip LED packaging that is resistant to high and low temperature shock performance and improves product reliability and stability.

The technical scheme that the utility model solves its technical problem adopts is:

A ceramic heat dissipation substrate for chip LED packaging. The upper side of the substrate is provided with a patch area for mounting chips and a wire bonding area for connecting chip electrodes through welding wires. The lower side of the substrate is provided with metallized wiring patterns through the base. Realize the bottom pads connected to the two electrodes of the chip, and the substrate is also provided with electrical conduction holes for connecting the upper and lower layers of metallized wiring patterns to realize electrical conduction between the upper and lower layers. The substrate is made of alumina or aluminum nitride or LTCC ceramics ( Low temperature co-fired ceramics) material, used to improve the overall mechanical strength and heat dissipation performance of the substrate, the metallization material of the metallized wiring pattern and the electrical conduction hole is metal such as tungsten or silver or copper, and the electrical conduction hole is located on the edge or inside of the substrate , the electrical conduction hole may be single or multiple, may be circular or other shapes, and may be one or more.

The substrate can be provided with connected high thermal conductivity columns and heat dissipation pads, the high thermal conductivity columns are arranged inside the substrate, the upper side of the high thermal conductivity columns is connected to the patch area, and the high thermal conductivity columns are used to export the heat generated by the chip. The heat dissipation pad is arranged on the lower side of the substrate for dissipating the heat derived from the high thermal conductivity column, and the lower side of the high thermal conductivity column is connected with the heat dissipation pad.

The high thermal conductivity column is filled with metals such as silver, tungsten, molybdenum or copper, and is used to enhance the heat transfer effect of the substrate.

A single ceramic heat dissipation substrate can be installed with a single chip or multiple chips, and the internal wiring pattern and design layers of the bottom layer can be changed according to the number and types of chips installed.

The concrete production technological process of the present utility model is as follows: 1. or 2.

①Raw material dispersion→casting→slicing→punching (cavity)→potting (printing hole)→plane printing→(grooving)→glue removal/sintering→electroplating.

②Raw material dispersion→casting→slicing→punching (cavity)→grooving→glue removal/sintering→potting (printing hole)→plane printing→metallization and sintering→electroplating.

The utility model has the beneficial effects of a ceramic heat dissipation substrate for chip LED packaging: improving the heat dissipation performance of the SMD chip LED packaging substrate, improving the problems of large light decay and lifespan decline of LED chips caused by temperature rise; enhancing the durability of LED products High and low temperature shock performance, improve product reliability and stability. Compared with the prior art, the utility model has the following characteristics:

(1) Good heat dissipation. The substrate material of the utility model is ceramic materials such as alumina or aluminum nitride or LTCC (low temperature co-fired ceramics), with high thermal conductivity, and high thermal conductivity metal can also be installed in the base patch area. Filled thermal columns. It solves the key problem of heat dissipation of the base very well.

(2) The thermal expansion coefficient of the ceramic material is close to that of the LED chip, and it has strong resistance to high and low temperature impact, which improves the reliability and stability of the LED product.

Description of drawings

Below in conjunction with accompanying drawing and embodiment the utility model is further described.

1 is a top view of the overall structure of the substrate structure for LED packaging in the prior art;

2 is a bottom view of the overall structure of the substrate structure for LED packaging in the prior art;

3 is a cross-sectional view of the overall structure of the substrate structure for LED packaging in the prior art;

Fig. 4 is a top view of the overall structure of Embodiment 1 of the utility model;

Fig. 5 is a bottom view of the overall structure of Embodiment 1 of the utility model;

Fig. 6 is a sectional view of the overall structure of Embodiment 1 of the utility model;

Fig. 7 is a top view of the overall structure of Embodiment 2 of the utility model;

Fig. 8 is a bottom view of the overall structure of the second embodiment of the utility model;

Fig. 9 is a cross-sectional view of the overall structure of the second embodiment of the utility model;

Fig. 10 is a top view of the overall structure of the third embodiment of the utility model;

Fig. 11 is a bottom view of the overall structure of the third embodiment of the utility model;

Fig. 12 is a sectional view of the overall structure of the third embodiment of the utility model.

Detailed ways

With reference to Fig. 4 and Fig. 12, the utility model is implemented like this:

A ceramic heat dissipation substrate for chip-type LED packaging, the upper side of the substrate (10) is provided with a patch area (1) for mounting chips and a bonding area (2) for connecting chip electrodes through welding wires, and the lower side of the substrate is There is a bottom pad (3) that is connected to the two electrodes of the chip through the base metallization wiring pattern, and the substrate is also provided with an electrical conduction hole (4) for connecting the upper and lower layers of the metallization wiring pattern to realize the upper and lower electrical conduction, The substrate (10) is made of ceramic materials such as alumina or aluminum nitride or LTCC, which is used to improve the overall mechanical strength and heat dissipation performance of the substrate, and the metallization material of the metallized wiring pattern and the electrical conduction hole (4) is tungsten or silver Or copper and other metals, the electrical conduction hole (4) is located at the edge or inside of the substrate (10), can be circular or other shapes, and can be single or multiple.

In this embodiment, the substrate (10) is provided with connected high thermal conductivity pillars (5) and heat dissipation pads (6), the high thermal conductivity pillars (5) are arranged inside the substrate (10), and the high thermal conductivity pillars (5) The side is connected to the patch area (1), the high thermal conductivity column (5) is used to export the heat generated by the chip, and the heat dissipation pad (6) is arranged on the lower side of the substrate (10), and is used to transfer the high thermal conductivity column (5) to the bottom of the substrate (10). ) is dissipated, and the lower side of the high thermal conductivity column (5) is connected to the heat dissipation pad (6). The high thermal conductivity column (5) is filled with metals such as silver, tungsten, molybdenum or copper, and is used to enhance the heat transfer effect of the substrate (10).

The above is only a preferred embodiment of a ceramic heat dissipation substrate for chip LED packaging of the present invention, and does not limit the technical scope of the present invention. Any minor modifications, equivalent changes and modifications still fall within the scope of the technical contents of the present utility model.

Claims (3)

1, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation, the upside of this substrate (10) is provided with Chip Area (1) that is used to install chip and the routing district (2) that passes through welding lead connection-core plate electrode, the downside of substrate is provided with the bottom land (3) that is connected with two electrodes of chip by the realization of pedestal metallization wiring figure, substrate also is provided with and is used to connect double-layer metallization wiring figure up and down and conducts hole (4) with what realize the power-on and power-off conducting, it is characterized in that: described substrate (10) is made by ceramic materials such as aluminium oxide or aluminium nitride or LTCC, metallization wiring figure and conduct hole (4) and make by tungsten or silver or copper metal, conduct hole (4) and be positioned at substrate (10) edge or inside, conduct hole (4) for circular, the quantity that conducts hole (4) be single or single more than.

2, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation according to claim 1, it is characterized in that described substrate (10) is provided with the heat radiation pad (6) that is used for the high heating column (5) that chip heat is derived and is used for the dissipation of high heating column (5) derivation heat is come out, high heating column (5) is located at substrate (10) inside, the upside of high heating column (5) is connected with Chip Area (1), heat radiation pad (6) is located at the downside of substrate (10), and the downside of high heating column (5) is connected with heat radiation pad (6).

3, a kind of ceramic heat radiation substrate for sheet-shaped LED encapsulation according to claim 2 is characterized in that described high heating column (5) forms by silver, tungsten, molybdenum or copper are metal filled, is used to strengthen the heat-transfer effect of substrate (10).

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