CN201190979Y - High heat dissipation LED lighting device - Google Patents

Abstract

High heat dissipation LED lighting device, including heat dissipation base, LED chip, circuit board, characterized in that: the heat dissipation base is provided with a recess; the LED chip is installed at the bottom of the inner cavity of the heat dissipation base and thermally combined ;The circuit board is provided with a through hole matching the concave part of the heat dissipation base, and the circuit board is fixedly connected with the heat dissipation base through the through hole set on the concave part; the positive and negative wiring of the LED chip passes through the heat dissipation base The corresponding threading holes are connected to the wiring circuit of the circuit board; the inner cavity of the concave part is filled with a transparent packaging body that encapsulates the LED chip and some wiring. In the above-mentioned high heat dissipation LED lighting device, the LED chip is installed on the inner bottom surface of the recessed part and directly thermally combined with the heat dissipation base. The inner cavity of the recessed part of the base is beneficial to the coating of the white light phosphor and the adjustment of the emission angle of the illumination light; the structure is simple, and the assembly and maintenance of the lamp are convenient.

Description

High heat dissipation LED lighting device

technical field

The utility model relates to a lamp, in particular to a high heat dissipation LED lighting device.

Background technique

With the development of LED technology, LED applications are increasingly diversified, from early power indicator lights to LED lighting products with advantages such as power saving, long life, and high visibility. However, only a small part of the high-power LED input power is converted into light, and the rest is converted into heat. If the heat is not discharged to the outside in time, the temperature of the LED chip interface will be too high, which will affect the luminous efficiency and luminous life. The traditional LED lighting device packaging method is to arrange the LED chip on the circuit board, the two electrodes of the LED chip are respectively connected to the circuit board circuit to form a circuit, and the bottom surface of the circuit board is connected to the high heat dissipation base. The heat energy emitted by the LED chip passes through the circuit board and then is removed by the heat dissipation base. However, because the printed circuit board is a non-high heat conductor, its thermal conductivity is low and the heat dissipation performance is poor, so the heat energy generated by the LED chip cannot be evacuated in time and If it is excluded, it will directly lead to an increase in the junction temperature of the LED chip, and the heat accumulation effect and thermal resistance of the lamp are too large, which will easily cause the LED chip to have a short service life and light decay, and thus increase energy consumption.

In order to improve the heat dissipation requirements of the LED lighting device, the invention patent with the patent number of 02802732.9 discloses a lighting device using LEDs, as shown in Figure 8: the LED chip 1 is loaded in the receiving groove of the protrusion 2a of the aluminum heat dissipation base 2 In 2b, the protruding part 2a is inserted into the corresponding hole 3a of the circuit board 3, and the heat dissipation base 2 and the circuit board 3 are closely attached together; the receiving groove 2b is filled with a transparent package. In this light-emitting device using LEDs, the LED chip is directly installed on the heat dissipation base, and the heat generated by the LED chip is directly discharged through the heat dissipation base, which improves the heat dissipation effect of the lamp to a certain extent. However, since the heat dissipation base 2 is closely attached to the back of the circuit board 3, after the lamp is installed, the heat dissipation base is located at the back of the lamp, and its heat dissipation channel is not smooth, which affects the heat dissipation effect; the receiving groove of the protrusion 2a of the heat dissipation base 2 2b and the transparent encapsulation body poured into the hole 3a of the circuit board have a complex structure and cumbersome manufacturing process. Based on the above, the existing package structure of the LED light emitting device still needs to be improved, so as to further improve the heat dissipation effect and simplify the structure.

Contents of the invention

The purpose of the utility model is to overcome the deficiencies of the prior art, and provide a high heat dissipation LED lighting device, which has good heat dissipation and prolongs the service life of the LED; the structure is simple, easy to manufacture and maintain, and the product cost is reduced.

The purpose of this utility model is achieved through the following technical solutions:

The LED lighting device with high heat dissipation includes a heat dissipation base with high thermal conductivity, an LED chip, and a circuit board, and is characterized in that: the heat dissipation base is provided with a recess for accommodating the LED chip; Assembled at the bottom of the inner cavity of the depression; the circuit board is provided with a through hole sleeved on the outer peripheral surface of the depression of the heat dissipation base, and the circuit board is fixedly connected with the heat dissipation base through the through hole sleeved on the depression The positive and negative wiring of the LED chip is connected to the wiring circuit of the circuit board through the corresponding threading hole on the heat dissipation base; the inner cavity of the concave part is filled with a transparent package that encapsulates the LED chip and some wiring.

The concave part of the heat dissipation base is stepped, and the upper ring is provided with steps; the circuit board device is arranged with wiring circuits on the middle and lower part of the steps and on the side opposite to the heat dissipation base, and the wiring holes are opened on the steps.

The depression of the heat dissipation base is in the shape of an inverted cone, the through hole of the circuit board is sleeved on the top of the depression, the opposite surface of the circuit board and the heat dissipation base are closely connected and fixed together, and the other side of the circuit board is wired Circuit; the threading hole is opened on the side wall of the recessed part at the lower part of the circuit board.

The depression of the heat dissipation base is in an inverted conical shape, the through hole of the circuit board is set in the middle of the depression, the circuit board and the heat dissipation base have a distance, and a wiring circuit is laid on the side of the circuit board opposite to the circuit board; The threading hole is provided on the side wall of the recessed part on the top of the circuit board.

A reflective film that reflects LED light is coated on the inner surface of the concave portion of the heat dissipation base.

The utility model has the following beneficial effects:

High heat dissipation LED light-emitting device, the LED chip is installed on the inner bottom surface of the concave part and directly thermally combined with the heat dissipation base, the circuit board is assembled on the lower part of the heat dissipation base, after the lamp is installed, the heat dissipation base is located at the front of the lamp, its The heat dissipation channel is smooth, which reduces the thermal impedance and improves the heat dissipation effect; the inner cavity of the concave part of the heat dissipation base is conducive to the coating of white light phosphor and the adjustment of the emission angle of the lighting light; there are holes on the circuit board, which are convenient for fixing the heat dissipation base, which greatly shortens the The wiring distance between the LED chip P, N level and the circuit board; its structure is simple, it is convenient for the assembly and maintenance of the lamp, and it saves the cost. This product can be used for general lighting or LCD backlight boards; the chip with thermoelectric separation (P, N electrodes) on the front side, the small chip is driven by low current, and the light efficiency is higher than that of the big chip, which is very suitable for packaging this product.

Description of drawings

Below in conjunction with accompanying drawing, the utility model is described in further detail.

Fig. 1 is a structural sectional view of the first embodiment of the utility model.

FIG. 2 is a top view of FIG. 1 .

FIG. 3 is a schematic structural diagram of the circuit board in FIG. 2 .

Fig. 4 is a structural sectional view of the second embodiment of the present invention.

FIG. 5 is a top view of FIG. 4 .

FIG. 6 is a bottom view of FIG. 4 .

Fig. 7 is a structural sectional view of the third embodiment of the utility model.

Fig. 8 is a cross-sectional view showing the structure of a conventional light-emitting device using LEDs.

Detailed ways

Embodiment 1: With reference to Fig. 1, Fig. 2. The high heat dissipation LED light emitting device includes an LED chip 1 , a heat dissipation base 2 , a circuit board 3 and a transparent packaging body 4 for encapsulating the LED chip 1 . The heat dissipation base is made of high thermal conductivity aluminum or other metal materials.

Refer to Figure 1 and Figure 2. The heat dissipation base 2 is provided with a concave portion 21, the concave portion 21 is stepped, and the upper ring is provided with a step 22; the concave portion below the step 22 forms an inverted conical cavity that is conducive to coating white phosphor powder; the step 22 Correspondingly, the two sides of the two sides are provided with threading holes 23 for the electrode wiring to pass through, and the threading holes 23 penetrate the thickness of the step 22 . In order to improve the light reflectivity, a reflective film that reflects LED light is evenly coated on the inner surface of the recessed portion 21 .

Refer to Figures 1 to 3. The circuit board 3 is correspondingly provided with a through hole 31 (see FIG. 3 for details), and the through hole 31 is tightly fitted on the recess 21 at the bottom of the step 22 to assemble the circuit board 3 and the heat dissipation base 2 together. After the circuit board is assembled, there is a gap between the circuit board 3 and the step 22. On the one hand, the gap can prevent circuit short circuit to ensure the safety of the circuit, and on the other hand, it can increase the effective heat dissipation area of the heat dissipation base to improve the heat dissipation effect. The wiring circuit 5 is laid on the side of the circuit board 3 opposite to the heat dissipation base 2 , and the wiring circuit 5 extends to the vicinity of the outer peripheral surface of the recessed portion 21 . The positive and negative poles of the LED chip 1 are electrically connected to the wiring circuit 5 of the circuit board through the wiring 6 passing through the corresponding threading hole 23 . A transparent encapsulation body 4 made of epoxy resin, silica gel or other transparent materials is poured into the inner cavity of the recessed portion 21 to encapsulate the LED chip 1 and part of the wires 6 . The package body 4 is made of epoxy resin, silica gel or other transparent materials, which are not specifically limited here. In order to ensure the safety of wiring, the transparent encapsulation body 4 is integrally poured into the wiring hole 23; but not limited thereto, the wiring hole 23 may also be filled with insulating glue.

Embodiment 2: the difference between this embodiment and embodiment 1 is:

Refer to Figures 4 to 6. The recessed part 21 of the heat dissipation base 2 has an opening as a whole, that is, the light outlet is large, and the bottom is small, in an inverted conical shape, and the recessed part 21 is not provided with steps. The through hole 31 of the circuit board 3 fits on the top of the recessed portion 21 ; A threading hole 23 is provided on the side wall of the recessed portion 21 at the bottom of the circuit board 3 . The positive and negative poles of the LED chips 1 on the inner bottom surface of the recessed portion 21 of the thermal bonding device are electrically connected to the wiring circuit 5 of the circuit board through the wiring 6 passing through the corresponding hole 23 . The rest of the structure is the same as that of Embodiment 1, and will not be described in detail here.

Embodiment 3: the difference between this embodiment and embodiment 1 is:

Refer to Figure 7. The recessed part 21 of the heat dissipation base 3 has an opening as a whole, that is, a large light outlet and a small bottom, in an inverted conical shape, and the recessed part 21 is not provided with steps. The through hole 31 of the circuit board 3 is tightly fitted in the middle of the recessed part 21; there is a certain distance between the circuit board 3 and the heat dissipation base 2, and the wiring circuit 5 is laid on the side of the circuit board 3 opposite to the heat dissipation base 2. A threading hole 23 is provided on the side wall of the recessed portion 21 on the upper part of the circuit board 3 . The positive and negative poles of the LED chips 1 on the inner bottom surface of the recessed portion 21 of the thermal bonding device are electrically connected to the wiring circuit 5 of the circuit board through the wiring 6 passing through the corresponding hole 23 . The rest of the structure is the same as that of Embodiment 1, and will not be described in detail here.

The above is only a preferred embodiment of the utility model, so the scope of implementation of the utility model cannot be limited with this, that is, the equivalent changes and modifications made according to the patent scope of the utility model and the content of the specification should still belong to the utility model. Within the scope covered by the utility model patent.

Claims (5)

1, the LED light-emitting device of high-cooling property comprises cooling base, led chip, the circuit board of high-termal conductivity, and it is characterized in that: described cooling base is provided with the depressed part that is used for ccontaining led chip; Led chip fixedly is assemblied in the intracavity bottom of described depressed part by its radiating end; Circuit board is provided with the through hole that is sheathed on the cooling base depressed part outer peripheral face, and circuit board is fixed together by through hole and the cooling base that is set on the depressed part; The corresponding through wires hole that the wiring of described led chip positive and negative electrode is passed on the cooling base is connected with the wiring circuit of circuit board; The transparent encapsulating body of described depressed part inner chamber perfusion packaging LED chips, part wiring.

2. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: the depressed part of described cooling base is step-like, and wherein top loop is provided with step; Circuit board arrangement is laid wiring circuit in the middle and lower part of step and the one side relative with cooling base, and described through wires hole is opened on the step.

3. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: it is tapered that the depressed part of described cooling base is rounding, the through hole of circuit board is sheathed on the top of depressed part, the opposite face of circuit board and cooling base is close to and is fixed together, and the another side of circuit board is laid wiring circuit; Described through wires hole is opened on the depressed part sidewall of circuit board bottom.

4. the LED light-emitting device of high-cooling property according to claim 1, it is characterized in that: it is tapered that the depressed part of described cooling base is rounding, the through hole of circuit board is sheathed on the middle part of depressed part, circuit board and cooling base have spacing, simultaneously lay wiring circuit with the circuit board opposed circuit boards; Described through wires hole is opened on the depressed part sidewall on circuit board top.

5. according to the LED light-emitting device of the arbitrary described high-cooling property of claim 1 to 4, it is characterized in that: apply reflection LED reflection of light film on the inner surface of described cooling base depressed part.

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