CN201199520Y - Internal memory radiating fins for full buffer die set - Google Patents

Abstract

The utility model discloses a full buffered module memory radiating fin, which is composed of a front radiating fin and a rear radiating fin; an FB-DIMM memory is clamped between the front radiating fin and the rear radiating fin; the inner sides of the front radiating fin and the rear radiating fin are pasted with thermal interface chips which are completely jointed with the FB-DIMM memory, and the peripheries of the front radiating fin and the rear radiating fin are all provided with a plurality of fins. The whole structure is stable and easy to install. The peripheries of the front radiating fin and the rear radiating fin are provided with a plurality of protruding strip structures, which can increase the air current perturbation around the memory and obviously improve the heat exchange. The full buffer module memory radiating fin is used by matching with a high speed personal computer and a server, has good heat dissipation effect, and meets the needs of overclocking.

Description

Full buffer module internal memory fin

Technical field

The utility model relates to a kind of fin of electronic information technical field, especially a kind of full buffer module internal memory fin, i.e. computer FB-DIMM (Fully Buffered DIMM, full buffer internal memory module) internal memory fin.

Background technology

Because computer technology constantly develops, arithmetic speed constantly increases, and especially various server performances are more and more higher, and the internal memory caloric value is increasing, and the requirement of following to the internal memory heat resistance is also improving day by day.

Disclose multinomial technology at personal computer internal memory heat dissipation problem at present, and at the heat radiation of server high-performance internal memory or a blank, especially the server heat radiation requires height, fast operation, the cabinet inside structure is also different with conventional computer.Therefore in order to reduce the internal memory temperature more quickly and effectively, make it adapt to long-time full load even overclocking needs, be necessary to improve existing heat radiating fin structure, improve the internal memory service condition, improve useful life.

How to develop the fin that heat radiation is good, stable, the life-span is long and cost is low that is fit to server memory, and then capture commercial first chance, become at present and caused one of project that industry does one's utmost to pay close attention to.

The utility model content

Main purpose of the present utility model is at the deficiencies in the prior art, a kind of full buffer module internal memory fin is provided, two fin closely contact with internal memory by good heat conducting material before and after utilizing, design heat radiating fin structure form makes it guarantee to improve heat exchange efficiency to greatest extent under the prerequisite cheaply, satisfies the target of server to internal memory heat radiation high request.

The utility model is achieved through the following technical solutions, and two fin were formed middle clamping FB-DIMM memory chip before and after full buffer module internal memory fin described in the utility model comprised; Launch some fins around two fin, increase heat exchange area, increase the surrounding air disturbance; Two fin inboards, front and back stick the hot interface sheet, fit fully with the FB-DIMM memory chip, and fin has greatly strengthened heat exchange, and radiating effect is good, and fin is inboard fine with chip applying effect, has reduced contact heat resistance, the firm and installation easily of total.

Fin around the described fin when machining with heat sink body on same plane, can be according to using needs upwards cocked with its interval property, cocked radian is decided on service condition.General server internal memory row gap is limited, and fin height has enough spaces in the time of will guaranteeing to install a plurality of internal memory.

Compared with prior art, the utility model has the advantages that: the utility model can increase the efficiently radiates heat area; Because the wind direction in the cabinet is the horizontal fin of plunderring, so the strip fin of perk can strengthen near the air agitation the fin, and then make the heat exchange coefficient of fin surface increase, and fast the caloric value of internal memory is taken away, improved the internal memory radiating effect to a great extent; The fin inside structure has guaranteed closely to fit with the internal memory surface; Select different hot interface sheets for use at different parts, reduced contact heat resistance to greatest extent, under low-cost prerequisite, can satisfy server memory heat radiation requirement, guarantee the work of internal memory long-term stability.

Description of drawings

Fig. 1 is the exploded view of the utility model embodiment.

Fig. 2 is the stereogram of preceding fin.

Fig. 3 is the partial enlarged drawing of preceding fin.

Fig. 4 is 3 main views of preceding fin;

Wherein Fig. 4 a is an end view, and Fig. 4 b is a vertical view, and Fig. 4 c is a front view.

Fig. 5 is the stereogram of back fin.

Fig. 6 is 3 main views of back fin;

Wherein Fig. 6 a is an end view, and Fig. 6 b is a vertical view, and Fig. 6 c is a front view.

Fig. 7 is the forward and backward view of FB-DIMM internal memory;

Wherein Fig. 7 a is a front view, and 7b is a rearview;

Figure number explanation: fin before 10,11AMB respective slot, 12 DIE respective slot, 13 welding angle respective slot, fin around 14 fin, 20 back fin, fin around 21 fin, 30 FB-DIMM internal memories, 31FB-DIMM internal memory AMB (Advanced Memory Buffer, senior memory cache), 32FB-DIMM internal memory DIE (central die), 33FB-DIMM internal memory welding angle, 34FB-DIMM memory dram s (memory modules).

Embodiment

Below in conjunction with accompanying drawing embodiment of the present utility model is elaborated: present embodiment is being to implement under the prerequisite with technical solutions of the utility model; provided detailed execution mode and concrete operating process, but protection range of the present utility model is not limited to following embodiment.

The utility model is according to existing server FB-DIMM internal memory environment for use and instructions for use, exploitation a kind of at the some fins of edge perk, and inside structure is according to the stamping forming fin of corresponding internal storage structure.

At first see also shown in the accompanying drawing 1, Fig. 1 has shown the entire infrastructure of the utility model internal memory fin.This fin constitutes middle clamping FB-DIMM internal memory 30 by preceding fin 10 and back fin 20.Two fin, 10,20 medial surfaces stick the high hot interface sheet of conductive coefficient and are attached to the both sides of FB-DIMM internal memory 30, and then with FB-DIMM internal memory 30 insulation and closely contact, protect the DRAMs (memory modules) 34 on the internal memory.

See also Fig. 2 to Fig. 6, it has shown the concrete structure of preceding fin 10 and back fin 20.Average line cuts out some strip fins 14,21 that can perk around two fin 10,20, increases area of dissipation, strengthens the surrounding air disturbance.Fin 14,21 around the fin when machining with heat sink body 10,20 on same plane, can be according to using needs upwards cocked with its interval property, cocked radian is decided on service condition.Two fin 10,20 are processed by aluminium alloy, the conductive coefficient height, and in light weight, expense is low.

Fig. 7 is the tow sides shape of FB-DIMM internal memory.Preceding fin 10 inboards are according to the AMB31 and the some grooves of the DIE32 physical dimension punching press hole of FB-DIMM internal memory 30, increase contacts with FB-DIMM internal memory 30, as shown in Figure 3, one of them groove 11 is used to cooperate the AMB31 structure of FB-DIMM internal memory 30, this groove 11 is slightly larger than AMB31, guarantees during installation that the AMB31 surface closely contacts with heat-conducting silicone grease on the preceding fin 10; Fin 10 inboards were middle before another groove 12 was located at, and were used to cooperate the DIE32 structure of FB-DIMM internal memory 30, and this groove 12 is slightly larger than DIE32, guaranteed during installation that the DIE32 surface closely contacts with heat-conducting silicone grease on the fin 10; With DIE corresponding groove 12 both sides welding angle 33 corresponding groove 13 are arranged respectively, be used to cooperate DIE32 welding angle 33 on every side, purpose is that welding angle 33 does not contact with preceding fin 10 when guaranteeing installation, guarantees to insulate.Note will not welding angle 33 clashing and breaking during installation.

Step up with geometrical clamp at last, be installed in the memory bank.The geometrical clamp material is a stainless steel, guarantees to step up intensity.Firm and the installation easily of total.Fin edge, front and back is provided with the strip fin of some perks, increases internal memory surrounding air flow disturbance, can significantly strengthen heat exchange.The utility model uses to cooperate ultrafast personal computer and server, and good heat dissipation effect satisfies the overclocking needs.

Claims (9)

1. full buffer module internal memory fin, constitute by preceding fin and back fin, the one FB-DIMM internal memory of clamping therebetween, it is characterized in that, fin and back fin medial surface stick the hot interface sheet with the FB-DIMM internal memory is fitted fully before described, preceding fin and back fin be equipped with some fins all around.

2. full buffer module internal memory fin as claimed in claim 1 is characterized in that: fin before described around fin and the back fin and heat sink body are on same plane.

3. full buffer module internal memory fin as claimed in claim 1 is characterized in that: there is an AMB corresponding groove with the FB-DIMM internal memory fin inboard before described.

4. full buffer module internal memory fin as claimed in claim 1 or 2 is characterized in that: the fin inboard is middle before described a DIE corresponding groove with the FB-DIMM internal memory.

5. full buffer module internal memory fin as claimed in claim 3 is characterized in that: fin is inboard before described respectively has a welding angle corresponding groove with DIE corresponding groove both sides.

6. as claim 2 or 5 described full buffer module internal memory fin, it is characterized in that: the fin inboard with the AMB corresponding groove, scribble gluey heat-conducting silicone grease before described with DIE corresponding groove and FB-DIMM internal memory contact-making surface.

7. full buffer module internal memory fin as claimed in claim 1 or 2 is characterized in that: fin and fin inboard, back are pasted with the sheet heat-conducting glue with cushioning effect before described.

8. full buffer module internal memory fin as claimed in claim 1 or 2 is characterized in that: fin and back fin before described, its material is an aluminium alloy.

9. full buffer module internal memory fin as claimed in claim 1, it is characterized in that: described fin is bar shaped, and perk laterally at interval.

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