CN201167446Y - Heat radiation module - Google Patents

Abstract

The utility model discloses a heat dissipation module for the heat dissipation of electronic component generates heat, this heat dissipation module include fixing base, radiator and samming board, and wherein logical groove has been seted up to the fixing base, and the radiator includes bottom plate and interval arrangement and pastes and connect in two or more than two fin of bottom plate, the bottom plate pastes to connect to fix the fixed orifices has been seted up to one side of fixing base, and these fins have the accommodation space corresponding to the shaping of fixed orifices department, the samming board holding is at the logical inslot of fixing base, and the one side of this samming board is pasted and is connected the radiator bottom, and the another side is then pasted and connect electronic component generates heat to can effectively save heat dissipation module's manufacturing cost, can improve radiating efficiency again by a wide margin.

Description

Cooling module

technical field

The utility model relates to a heat dissipation module, in particular to a heat dissipation module used for heat dissipation of a heating electronic component.

Background technique

When an electronic product is running or in use, its internal components will emit high heat. If the heat is not removed in time, the efficiency of the electronic component will be reduced or even burnt, resulting in product damage.

Generally known heat sinks are directly bonded to the surface of the heat-generating electronic component by the aluminum heat sink, so that the heat can be conducted to the surface of the heat sink, and then the heat is taken away by the flowing air to achieve the effect of heat dissipation.

However, the calculation and processing speed of the electronic components used in electronic products has been greatly increased, and the waste heat generated by them has also been greatly increased. The heat dissipation performance of the above-mentioned heat dissipation device is no longer applicable.

Therefore, another known heat dissipation device has been developed. By means of a metal block with good conductivity, such as copper and other metals, one side is attached to the surface of the heating electronic component, and the other side is attached to the aluminum heat sink; the metal block is used to dissipate heat Rapid conduction to the heat sink to achieve higher heat dissipation performance.

However, the performance of using conduction to dissipate heat is still limited. Therefore, another known heat dissipation device has been developed. Two or more U-shaped heat pipes are installed in the aluminum heat sink, and the bottom of the heat pipe is connected to the heat sink. The electronic components are attached to each other, and the waste heat of the electronic components is quickly brought to the radiator by using the phase change of the working fluid inside the heat pipe to achieve higher heat dissipation efficiency.

However, the contact mode between the heat pipe and the electronic component is only line contact. If two or more heat pipes arranged at intervals are used, the contact mode between the heat pipe and the electronic component can be close to surface contact, so as to achieve better heat dissipation performance; however, such a This also increases the manufacturing cost of the cooling device.

Utility model content

In view of this, the main purpose of the present invention is to provide a heat dissipation module for heat dissipation of electronic components, which has the characteristics of good heat dissipation efficiency and low manufacturing cost.

In order to achieve the above object, the technical solution of the present utility model is achieved in that:

The heat dissipation module in the utility model is installed and connected with the heating electronic components, and the heat dissipation module includes:

The fixing seat is provided with a through slot;

The radiator includes a base plate and two or more heat sinks arranged at intervals and attached to the base plate. The base plate is attached and fixed above the fixing seat. A fixing hole is opened on one side of the base plate. These heat sinks correspond to An accommodating space is formed at the fixing hole; and

The temperature chamber is accommodated in the through groove of the fixing seat, one side of the temperature chamber is attached to the bottom of the radiator, and the other side is attached to the heating electronic component.

The cooling module in the utility model quickly transfers the heat of the heating electronic component to the cooling body through the surface contact between the temperature chamber and the heating electronic component, so as to improve the cooling performance of the cooling module, and has a simple structure and low manufacturing cost.

Description of drawings

Fig. 1 is the three-dimensional exploded view of the cooling module in the utility model;

Fig. 2 is the three-dimensional assembly diagram of the cooling module in the utility model;

Fig. 3 is a schematic cross-sectional view of the cooling module shown in Fig. 2 along line A-A;

FIG. 4 is a schematic cross-sectional view along line A-A after the heat dissipation module shown in FIG. 2 is combined with the heat-generating electronic component.

Explanation of reference signs

10 fixed seat

11 through slot 12 through hole

13 block

20 radiator

21 Fixing hole 22 Heat sink

221 heat dissipation channel 222 accommodation space

23 Bottom plate

30 Vapor plate

31 Flange

40 fixed components

50 heat transfer medium

60 Heating electronic components

70 circuit board

Detailed ways

The detailed description and technical content of the utility model are as follows in conjunction with the accompanying drawings.

Please refer to Figure 1 and Figure 2, which are the three-dimensional exploded view and the three-dimensional combined view of the utility model. The utility model provides a heat dissipation module for heat dissipation of heating electronic components. The heat dissipation module includes a fixing seat 10, a radiator 20 and Vapor Chamber 30.

The fixed seat 10 is provided with a through groove 11, and its two sides are respectively provided with through holes 12, and the fixed seat 10 is made of a metal with good thermal conductivity, such as copper, silver and other metals; Above the seat 10, the radiator 20 is made of aluminum metal.

The heat sink 20 includes a base plate 23 and two or more heat sinks 22 arranged at intervals and attached to the base plate 23. The base plate 23 is attached and fixed above the fixing seat 10, and two fixing holes are provided on both sides of the base plate 23. 21 , these cooling fins 22 are formed with two accommodating spaces 222 corresponding to the two fixing holes 21 , and a cooling channel 221 is formed between each cooling fin 22 .

The vapor chamber 30 is accommodated in the through groove 11 and connected to the fixing seat 10. One side of the vapor chamber 30 is attached to the bottom of the radiator 20, and the other side is attached to the heating electronic component (not shown); in addition, the fixed A stopper 13 is formed on the inner wall of the through groove 11 of the seat 10 , and a flange 31 corresponding to the stopper 13 is formed on the outside of the chamber 30 , and the stopper 13 and the flange 31 are embedded and connected.

The vapor chamber (Vapor Chamber) 30 is a vacuum chamber with a microstructure on the inner wall. When the heat is transferred from the heat source to the evaporation area, the working fluid in the chamber will begin to vaporize in the liquid phase in a low vacuum environment. Phenomenon. At this time, the working fluid will absorb heat energy and its volume will expand rapidly, and the gaseous working fluid will soon fill the entire cavity; when the gaseous working fluid contacts a relatively cold area, it will condense, and the gaseous working fluid will be released by condensation. Heat accumulated during evaporation. The condensed liquid working fluid will return to the evaporation heat source through the capillary phenomenon of the microstructure, and this operation will be repeated in the cavity. The working principle of the vapor chamber is the same as that of the general heat pipe. The difference is that the heat pipe is a one-dimensional line heat conduction method, while the vapor chamber is a two-dimensional surface heat conduction method.

Please refer to FIG. 3 and FIG. 4 , which are respectively a schematic cross-sectional view of the cooling module shown in FIG. 2 along line A-A and a schematic cross-sectional view of the cooling module shown in FIG. The contact surface of the fixing seat 10, the vapor chamber 30 and the radiator 20 is coated with a heat-conducting medium 50, whose function is to accelerate the rate of heat conduction, and transfer the heat absorbed by the vapor chamber 30 to the fixing seat 10, so that the heat-generating electronic components The waste heat generated by 60 will not accumulate in the vapor chamber 30.

The cooling module uses the fixing component 40 to pass through the through hole 12 and the fixing hole 21 and is locked and connected with the circuit board 70 to fix the cooling module on the circuit board 70 . The fixing component 40 is a bolt.

The bottom surface of the vapor chamber 30 is attached to and connected to the heating electronic component 60, and the size of the vapor chamber 30 can match the size of the heating electronic component 60, so that one side of the vapor chamber 30 is completely in contact with one side of the heating electronic component 60. To achieve the best thermal performance.

Therefore the cooling module of the present utility model has the following advantages:

1. Utilize the vapor chamber 30 and the heating electronic component 60 to achieve surface contact to achieve the best heat conduction performance, and the waste heat generated by the heating electronic component 60 can be quickly removed from the circuit board 70 and the electronic component 60 .

2. The heat-conducting medium 50 can further enhance the heat transfer efficiency, and quickly transfer the heat energy of the vapor chamber 30 to the fixing seat 10 and the heat sink 20 , so that waste heat will not accumulate in the vapor chamber 30 .

3. The heat dissipation module only uses the combination of the vapor chamber 30 and the heat dissipation body 20, which can effectively save the manufacturing cost of the heat dissipation module and greatly improve the heat dissipation efficiency.

Claims (6)

1. A cooling module installed and connected to a heating electronic component, characterized in that the cooling module includes: The fixing seat is provided with a through slot; The radiator includes a base plate and two or more heat sinks arranged at intervals and attached to the base plate. The base plate is attached and fixed above the fixing seat. A fixing hole is opened on one side of the base plate. These heat sinks correspond to An accommodating space is formed at the fixing hole; and The temperature chamber is accommodated in the through groove of the fixing seat, one side of the temperature chamber is attached to the bottom of the radiator, and the other side is attached to the heating electronic component. 2. The heat dissipation module according to claim 1, further comprising a heat conduction medium coated on the contact surface of the vapor chamber, the fixing base and the heat dissipation body. 3. The heat dissipation module according to claim 1, wherein a heat dissipation channel is formed between any two of the heat dissipation fins. 4. The heat dissipation module according to claim 3, wherein the fixing seat is provided with a through hole corresponding to the fixing hole for piercing and fixing the fixing assembly of the heat dissipation module, and the fixing When the component is passed and fixed to the through hole, it is also passed and fixed to the fixing hole. 5. The heat dissipation module according to claim 4, wherein the fixing components are bolts. 6. The heat dissipation module according to claim 1, wherein a stopper is formed on the inner wall of the through groove of the fixing seat, and a protrusion corresponding to the stopper and embedded and connected is formed on the outer side of the temperature chamber. edge.

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