CN201143058Y - Semi-conductor cooling and warming bed - Google Patents
Semi-conductor cooling and warming bed Download PDFInfo
- Publication number
- CN201143058Y CN201143058Y CNU2007201931256U CN200720193125U CN201143058Y CN 201143058 Y CN201143058 Y CN 201143058Y CN U2007201931256 U CNU2007201931256 U CN U2007201931256U CN 200720193125 U CN200720193125 U CN 200720193125U CN 201143058 Y CN201143058 Y CN 201143058Y
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- China
- Prior art keywords
- heat
- temperature controller
- temperature
- outer cover
- insulation layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000001816 cooling Methods 0.000 title description 5
- 238000010792 warming Methods 0.000 title description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 26
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 24
- 238000009413 insulation Methods 0.000 claims abstract description 19
- 230000005855 radiation Effects 0.000 claims description 26
- 239000004411 aluminium Substances 0.000 claims description 19
- 239000000523 sample Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 claims description 3
- 239000006185 dispersion Substances 0.000 abstract 5
- 238000010438 heat treatment Methods 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000005057 refrigeration Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
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- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
Abstract
The utility model relates to a semi-conducting warm-cool bed which essentially comprises an external fan, an external heat-dispersion aluminum block, a temperature controller, an air flue, air outlets, a outer cover, an internal heat-dispersion aluminum block, a sealed inner cavity, temperature-difference semiconductor components, a heat insulation layer and a user plane, wherein, the heat insulation layer is arranged on the inner layer of the outer cover; the air outlets are respectively arranged on both sides of the front end of the outer cover; the front end of the outer cover is provided with a power socket, a power switch and a air inlet; in the front cavity of the outer cover and the heat insulation layer, a switch power supply, the external fan and the temperature controller are mounted; wires are connected with the switch power supply and the temperature controller; the external fan is connected with the temperature controller by the wires; at the opening at the middle part of the front end of the heat insulation layer, the temperature-difference semiconductor components are mounted, two ends of the temperature-difference semiconductor components are provided with the external heat-dispersion aluminum block and the internal heat-dispersion aluminum block respectively; the wires are connected with the temperature-difference semiconductor components and the temperature controller; an internal fan is mounted at the back end of the internal heat-dispersion aluminum block; a heat detector, which is connected with the temperature controller by the wires, is mounted in the sealed inner cavity.
Description
Technical field
The utility model relates to a kind of semiconductor changes in temperature bed, and relating to a kind of specifically is the bed that carries out cold and hot temperature transition that main devices is made by semiconductor thermoelectric, belongs to family life apparatus field.
Background technology
Along with the raising of China's resident living level, the mattress that utilizes semiconductor thermoelectric to make has entered into part resident's family.Usually, semiconductor thermoelectric is that galvanic power supply is connected with the semiconductor thermoelectric device when work, and because of semiconductor thermoelectric possesses cold-thermal effect, when direct current passed through, the one side of semiconductor thermoelectric can be freezed, and another side can heat; When changing sense of current, the refrigeration of semiconductor thermoelectric, the also corresponding meeting of the face that heats change.The known mattress that utilizes the semiconductor thermoelectric device to make mainly contains two kinds at present, a kind of semiconductor cold-hot Pet bed (patent No. is CN00264369.3), it mainly is made of bedstead and bed board placed on it, all or part of of bed board is metallic plate, in bedstead, be provided with median septum and semiconductor refrigerating heating combined equipment, the semiconductor refrigerating heating combined equipment comprises semiconductor refrigerating spare, heat transfer piece and radiator, fixedly connected with metallic plate in the top of heat transfer piece, the one side of semiconductor refrigerating spare is close to heat transfer piece, another side held against heat sink, radiator are positioned at the below of median septum.Use this combined connecting structure to make Pet bed and can produce certain disadvantage, carry out heat conduction or refrigeration together, very easily cause uneven in temperature even on its use face, influence result of use because the heat transfer piece of the one side of semiconductor thermoelectric and its top fitted tightly.(patent No. is another kind of environment-friendly electronic cold and warm mattress: CN02221653.7) mainly be made up of mattress face shield, soft fiber, semiconductor cooler and cold and hot conduction carrier.It is that the temperature difference and the heat that utilize its contact interface to produce were distributed to energy conduction on the surface of mattress by carrier metal and water pump, circulating water pipe, thereby realize the cooling and warming purpose after the semiconductor thermoelectric device was fed electric current.Because this mattress is by utilizing outside semiconductor thermoelectric as Cooling and Heat Source, water is as transmitting medium, use water pump and circulating water pipe to carry out the heat transmission, so the mattress that uses this structure to make, water coil in its surface are easy to produce situation uneven in temperature, use external cold and hot main frame and water pump, not only can increase the cost of mattress, be not easy to maintenance and use, and its heat conduction efficiency is lower, noise is too big.
In sum, semiconductor thermoelectric carries out the energy transmission by Metal Contact face or water, energy consumption height not only, can cause use face phenomenon uneven in temperature to occur, and heating, can not change automatically when freezing, can't realize the automatic constant-temperature and the round-the-clock use of mattress, be unfavorable for promoting the use of and popularizing.
The utility model content
The purpose of this utility model is to provide a kind of semiconductor changes in temperature bed at the problems referred to above, this bed mainly is made up of heat-insulation layer cavity, use face, outer cover, semiconductor thermoelectric, fin, fan, Switching Power Supply, temperature controller major part, it utilizes the cold-thermal effect of semiconductor thermoelectric, when direct current passes through it, the heat absorption of one end, other end heat release, and, realize the purpose of controlling refrigeration and heating by changing the Fang Xiang of electric current.When this bed uses in the winter time, can play the effect of heating, and when using summer, can play the effect of refrigeration, and have power consumption less, noise is low, and can carry out the automatic cooling/heating conversion, and is easy to operate, the advantage of being convenient to keep in repair.
In order to achieve the above object, the utility model is realized by following technological means.
A kind of semiconductor changes in temperature bed (seeing accompanying drawing), it mainly includes external fan (1), outer heat radiation aluminium block (2), temperature controller (3), air channel (4), air outlet (6), air outlet (15), outer cover (7), interior heat radiation aluminium block (8), airtight inner chamber (11), semiconductor thermoelectric device (13), heat-insulation layer (14), use face (20), wherein: the internal layer at outer cover (7) is provided with the heat-insulation layer made from heat-barrier material (14), both sides at outer cover (7) front end are respectively arranged with air outlet (6), air outlet (15), front end at outer cover (7) is provided with supply socket (17), power switch (21), air inlet (19), supply socket (17) is joined with Switching Power Supply (16), in the ante-chamber of outer cover (7) and heat-insulation layer (14), be provided with Switching Power Supply (16) is installed, external fan (1), temperature controller (3), lead (18) and Switching Power Supply (16), temperature controller (3) links to each other, and external fan (1) links to each other with temperature controller (3) by lead; Opening part setting at the middle part of heat-insulation layer (14) front end is equipped with semiconductor thermoelectric device (13), the two ends of semiconductor thermoelectric device (13) be provided with respectively be equipped with outside heat radiation aluminium block (2) and interior heat radiation aluminium block (8), lead (5) links to each other with temperature controller (3) with semiconductor thermoelectric device (13), in the setting of the rear end of interior heat radiation aluminium block (8) internal fan (12) is installed, internal fan (12) is linked to each other with temperature controller (3) by lead (5); Be provided with in airtight inner chamber (11) temperature-sensing probe (10) is installed, lead (9) links to each other temperature-sensing probe (10) with temperature controller (3).
When using this in the winter time, at first the power supply with 220 volts civilian alternating current inserts supply socket (17), turn on the power switch (21), connect with Switching Power Supply (16), by Switching Power Supply (16) 220 volts alternating current voltage is adjusted into 3～48 volts direct current (can select) according to the quantity of the semiconductor thermoelectric device of being installed, this moment, electric current was connected by lead (18) and temperature controller (3), semiconductor thermoelectric device (13) is connected by lead (5) and temperature controller (3), after semiconductor thermoelectric device (13) energising, its front end heat absorption, the rear end heat radiation, and can uniformly heat energy be diffused into whole airtight inner chamber (11) by interior heat radiation aluminium block (8) and internal fan (12), because the outer periphery of airtight inner chamber (11) is equipped with heat-insulation layer (14), heat in the airtight inner chamber (11) can keep for a long time, and distributes heating by use face (20).
When using this summer, the power supply of 220 volts civilian alternating currents is inserted supply socket (17), turn on the power switch (21), connect with Switching Power Supply (16), by Switching Power Supply (16) 220 volts alternating current voltage is adjusted into 3～48 volts direct current (can select) according to the quantity of the semiconductor thermoelectric device of being installed, at this moment, temperature controller (3) can be adjusted the direction of output current automatically according to the temperature of setting, this moment, electric current was by lead (5) and external fan (1), semiconductor thermoelectric device (13), internal fan (12) is connected, after semiconductor thermoelectric device (13) energising, its rear end heat absorption, the front end heat radiation, by interior heat radiation aluminium block (8), internal fan (12) is diffused into cold air in the airtight inner chamber (11), and by outer heat radiation aluminium block (2), external fan (1), semiconductor thermoelectric device (13) passes through air channel (4) with heat, air outlet (6) sheds, and can make airtight inner chamber (11) and use face (20) keep nice and cool like this.
The utility model semiconductor changes in temperature bed, the scope of application is extensive, can be made into family room with said method and use products such as bed with bed, spring mattress bed, sofa, seat and pet.
The utility model mainly has following beneficial effect:
1, production cost is low, heat radiation evenly, power consumption is less, noise is low, can carry out the automatic cooling/heating conversion, and is easy to operate, is convenient to maintenance;
2, by changing the sense of current, when using in the winter time, can play the effect of heating, and when using summer, can play the effect of refrigeration, guarantee convenient use of product under all weather conditions.
Description of drawings
Accompanying drawing 3 is front end face schematic diagrames of the utility model semiconductor changes in temperature bed;
Accompanying drawing 4 is schematic perspective views of the utility model semiconductor changes in temperature bed;
As shown in the figure, each structure division of above-mentioned a kind of semiconductor changes in temperature bed is represented by following Arabic numerals:
External fan, 2. outer heat radiation aluminium flake, 3. temperature controller, 4. the air channel, 5. lead, 6. air outlet, 7. outer cover, 8. in heat radiation aluminium flake, 9. temperature-sensing probe lead, 10. temperature-sensing probe, 11. airtight inner chambers, 12. internal fans, 13. semiconductor thermoelectric devices, 14. heat-insulation layers, 15. air outlets, 16. Switching Power Supplies, 17. supply sockets, 18. leads, 19. air inlets, 20. use faces, 21. power switches.
The utility model is described in further detail below in conjunction with embodiment and Figure of description:
The specific embodiment
Embodiment
Shown in Figure 1, a kind of semiconductor changes in temperature bed, make a rectangular outer cover (7) with plastics or timber, be provided with the heat-insulation layer made from heat-barrier material (14), be respectively arranged with air outlet (6), air outlet (15) in the both sides of outer cover (7) front end at the internal layer of outer cover (7).
Fig. 1, shown in Figure 3, front end at outer cover (7) is provided with supply socket (17), power switch (21), air inlet (19), supply socket (17) is joined with Switching Power Supply (16), in the ante-chamber of outer cover (7) and heat-insulation layer (14), be provided with Switching Power Supply (16), external fan (1), temperature controller (3) are installed, lead (18) links to each other with Switching Power Supply (16), temperature controller (3), and external fan (1) links to each other with temperature controller (3) by lead; Opening part setting at the middle part of heat-insulation layer (14) front end is equipped with semiconductor thermoelectric device (13), the two ends of semiconductor thermoelectric device (13) be provided with respectively be equipped with outside heat radiation aluminium block (2) and interior heat radiation aluminium block (8), lead (5) links to each other with temperature controller (3) with semiconductor thermoelectric device (13), in the setting of the rear end of interior heat radiation aluminium block (8) internal fan (12) is installed, internal fan (12) is linked to each other with temperature controller (3) by lead (5); Be provided with in airtight inner chamber (11) temperature-sensing probe (10) is installed, lead (9) links to each other temperature-sensing probe (10) with temperature controller (3).To use face (20) and outer cover (7) to be fixed together with bolt.
When using this in the winter time, at first the power supply with 220 volts civilian alternating current inserts supply socket (17), turn on the power switch (21), connect with Switching Power Supply (16), by Switching Power Supply (16) 220 volts alternating current voltage is adjusted into 3～48 volts direct current (can select) according to the quantity of the semiconductor thermoelectric device of being installed, this moment, electric current was connected by lead (18) and temperature controller (3), semiconductor thermoelectric device (13) is connected by lead (5) and temperature controller (3), after semiconductor thermoelectric device (13) energising, its front end heat absorption, the rear end heat radiation, and can uniformly heat energy be diffused into whole airtight inner chamber (11) by interior heat radiation aluminium block (8) and internal fan (12), because the outer periphery of airtight inner chamber (11) is equipped with heat-insulation layer (14), heat in the airtight inner chamber (11) can keep for a long time, and distributes heating by use face (20).
When using this summer, the power supply of 220 volts civilian alternating currents is inserted supply socket (17), turn on the power switch (21), connect with Switching Power Supply (16), by Switching Power Supply (16) 220 volts alternating current voltage is adjusted into 3～48 volts direct current (can select) according to the quantity of the semiconductor thermoelectric device of being installed, at this moment, temperature controller (3) can be adjusted the direction of output current automatically according to the temperature of setting, this moment, electric current was by lead (5) and external fan (1), semiconductor thermoelectric device (13), internal fan (12) is connected, after semiconductor thermoelectric device (13) energising, its rear end heat absorption, the front end heat radiation, by interior heat radiation aluminium block (8), internal fan (12) is diffused into cold air in the airtight inner chamber (11), and by outer heat radiation aluminium block (2), external fan (1), semiconductor thermoelectric device (13) passes through air channel (4) with heat, air outlet (6) sheds, and can make airtight inner chamber (11) and use face (20) keep nice and cool like this.
Claims (1)
1, a kind of semiconductor changes in temperature bed, it mainly includes external fan (1), outer heat radiation aluminium block (2), temperature controller (3), air channel (4), air outlet (6), outer cover (7), interior heat radiation aluminium block (8), airtight inner chamber (11), semiconductor thermoelectric device (13), heat-insulation layer (14), use face (20), it is characterized in that: the internal layer at outer cover (7) is provided with the heat-insulation layer made from heat-barrier material (14), both sides at outer cover (7) front end are respectively arranged with air outlet (6), air outlet (15), front end at outer cover (7) is provided with supply socket (17), power switch (21), air inlet (19), supply socket (17) is joined with Switching Power Supply (16), in the ante-chamber of outer cover (7) and heat-insulation layer (14), be provided with Switching Power Supply (16) is installed, external fan (1), temperature controller (3), lead (18) and Switching Power Supply (16), temperature controller (3) links to each other, and external fan (1) links to each other with temperature controller (3) by lead; Opening part setting at the middle part of heat-insulation layer (14) front end is equipped with semiconductor thermoelectric device (13), the two ends of semiconductor thermoelectric device (13) be provided with respectively be equipped with outside heat radiation aluminium block (2) and interior heat radiation aluminium block (8), lead (5) links to each other with temperature controller (3) with semiconductor thermoelectric device (13), in the setting of the rear end of interior heat radiation aluminium block (8) internal fan (12) is installed, internal fan (12) is linked to each other with temperature controller (3) by lead (5); Be provided with in airtight inner chamber (11) temperature-sensing probe (10) is installed, lead (9) links to each other temperature-sensing probe (10) with temperature controller (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201931256U CN201143058Y (en) | 2007-10-31 | 2007-10-31 | Semi-conductor cooling and warming bed |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201931256U CN201143058Y (en) | 2007-10-31 | 2007-10-31 | Semi-conductor cooling and warming bed |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201143058Y true CN201143058Y (en) | 2008-11-05 |
Family
ID=40079929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201931256U Expired - Fee Related CN201143058Y (en) | 2007-10-31 | 2007-10-31 | Semi-conductor cooling and warming bed |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201143058Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102599757A (en) * | 2012-04-05 | 2012-07-25 | 广州大学 | Multifunctional intelligent mattress |
| CN106852604A (en) * | 2015-12-09 | 2017-06-16 | 哈尔滨市三和佳美科技发展有限公司 | Temperature controlling bed |
-
2007
- 2007-10-31 CN CNU2007201931256U patent/CN201143058Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102599757A (en) * | 2012-04-05 | 2012-07-25 | 广州大学 | Multifunctional intelligent mattress |
| CN102599757B (en) * | 2012-04-05 | 2014-08-20 | 广州大学 | Multifunctional intelligent mattress |
| CN106852604A (en) * | 2015-12-09 | 2017-06-16 | 哈尔滨市三和佳美科技发展有限公司 | Temperature controlling bed |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081105 Termination date: 20101031 |