CN201126818Y - Memory heat sink - Google Patents

Abstract

The utility model discloses a memory heat abstractor, including a first fin and a second fin. The second heat sink includes a combination portion corresponding to the first heat sink structure and a fixing structure. The second heat sink forms a pivot point with the first heat sink through the joint part and is combined with a fixing structure to clamp the memory between the first heat sink and the second heat sink.

Description

memory cooling device

technical field

The utility model relates to a storage heat dissipation device, in particular to a storage (memory memory) heat dissipation device which is easy to assemble and has a simplified structure, so as to save assembly time and cost.

Background technique

With the advancement of technology, today's computer systems continue to develop towards a trend of thinner and smaller, and relatively more and more attention has been paid to the heat dissipation design of computer systems. Generally, a common heat dissipation method in a computer system is to use a fan device to take away the heat generated by an internal heat source to achieve a heat dissipation effect. However, for some small computer systems (such as notebook computers), it is difficult to add a fan device to assist in heat dissipation due to the small internal space. Therefore, an additional heat dissipation structure must be designed for the heat source. Dedicated heat sink on the memory, etc. At present, most memory heat sinks use a set of heat sinks to attach to both sides of the memory, and then use additional fasteners to clamp the memory between the heat sinks, or use thermally conductive double-sided adhesive as the heat sink and memory Adhesive medium between to achieve fastening effect. However, the above-mentioned existing methods often increase the complexity of assembly, and under the influence of high temperature, there may be doubts about the viscosity of the thermally conductive double-sided adhesive or the deterioration of the heat dissipation effect.

Therefore, in order to solve the above-mentioned conventional problems, the idea of the present utility model is produced.

Utility model content

The main purpose of the utility model is to provide a storage heat dissipation device which is easy to assemble and has a simplified structure, so as to save assembly time and cost.

In order to achieve the above-mentioned purpose, the storage heat dissipation device of the present invention includes a first heat dissipation fin and a second heat dissipation fin. The second heat sink includes a joint portion and a fixing structure corresponding to the structure of the first heat sink. The second heat sink forms a fulcrum with the first heat sink through the joint portion, and is combined with a fixing structure to clamp the memory between the first heat sink and the second heat sink, so as to achieve the effect of easy disassembly.

In addition, another type of memory cooling device of the present invention includes a first cooling fin and a second cooling fin. The second cooling fin includes two fixing structures, and each fixing structure is oppositely arranged at two ends of the second cooling fin. The second heat sink is fastened with the first heat sink through each fixing structure, and is used to clamp the memory between the first heat sink and the second heat sink, so as to achieve the effect of easy disassembly.

The utility model has the advantages that, since the cooling fins are combined compactly and stably, the storage cooling device is not easy to fall off from the storage, thereby greatly improving the heat dissipation effect, and it is also simple and convenient in terms of disassembly and assembly, and reduces the Production costs.

Description of drawings

Fig. 1 is the structural diagram of the first embodiment of the memory cooling device of the present utility model;

FIG. 2 is a schematic diagram of assembly of the first embodiment of the memory cooling device of the present invention;

FIG. 3 is a structural diagram of a second embodiment of the storage cooling device of the present invention;

Fig. 4 is a schematic diagram of assembly of the second embodiment of the memory cooling device of the present invention;

FIG. 5 is a structural diagram of a third embodiment of the memory cooling device of the present invention;

FIG. 6 is an assembly schematic diagram of a third embodiment of the storage heat dissipation device of the present invention;

FIG. 7 is a structural diagram of a fourth embodiment of the memory cooling device of the present invention;

FIG. 8 is a schematic diagram of assembly of the fourth embodiment of the memory cooling device of the present invention;

FIG. 9 is a structural diagram of a fifth embodiment of the storage heat dissipation device of the present invention;

FIG. 10 is an assembly schematic diagram of the fifth embodiment of the memory cooling device of the present invention.

Description of main component symbols

Memory cooling device 1, 1a, 1b, 1c, 1d

First cooling fins 10, 10a, 10b, 10c, 10d

Jack 11, 11c

convex ring 12

Second cooling fins 20, 20a, 20b, 20c, 20d

Joints 21, 21a, 21b, 21c, 21d

Fixed structure 22, 22a, 22b, 22c, 22d

Thermal pad 30

memory 40

Detailed ways

In order to let your examining committee members better understand the technical content of the present utility model, several preferred specific embodiments are specially cited as follows.

Please refer to FIG. 1 and FIG. 2 together below, which are the structure diagram and assembly schematic diagram of the first embodiment of the memory cooling device of the present invention. As shown in FIG. 1 , the memory cooling device 1 of the present invention includes a first cooling fin 10 and a second cooling fin 20 . The second heat sink 20 includes a joint portion 21 and a fixing structure 22 corresponding to the structure of the first heat sink 10 . The connecting portion 21 is disposed on two ends of the second heat sink 20 opposite to a fixing structure 22 . As shown in FIG. 2, the second heat sink 20 forms a fulcrum with the first heat sink 10 through the joint portion 21, and is combined with a fixing structure 22 to clamp the memory 40 between the first heat sink 10 and the second heat sink 20. between. In this embodiment, the joint portion 21 is a protruding piece structure, and an insertion hole 11 corresponding to the protruding piece structure is provided on the first heat sink 10 . When intending to use the memory cooling device 1 of the present utility model to clamp the memory 40, first insert the tab structure of the second heat sink 20 obliquely into the socket 11 of the first heat sink 10, so that the first heat sink 10 and the second heat sink The heat sink 20 forms a contact point, and uses this contact point as a fulcrum to make the second heat sink 20 rotate relative to the first heat sink 10, and finally the first heat sink 10 and the second heat sink are connected by a fixed structure 22 20 binding fixed. In this embodiment, a fixing structure 22 is a hook. During the rotation process of the second heat sink 20 relative to the first heat sink 10, as the angle between the two becomes smaller gradually, the contact area between the fin structure and the first heat sink 10 also increases accordingly, so it can be Through the metal material characteristics of the heat sink, the contact surface between the fin structure and the first heat sink 10 produces a metal compressive force, so as to enhance the tightness of the combination of the first heat sink 10 and the second heat sink 20, so that the memory cooling device 1 It is not easy to fall off from the storage device 40 and improves the cooling effect.

In addition, as shown in FIG. 2 , the memory cooling device 1 of the present invention may further include a thermal pad 30 disposed on the inner surface of the first heat sink 10 or the second heat sink 20 . The thermal pad 30 is made of compressible material with good heat conduction effect. Through the disposition of the thermal pad 30 , when the first heat sink 10 and the second heat sink 20 are combined, the contact between the memory 40 and the memory heat sink 1 can be made closer, making the combination more stable and maintaining a good heat dissipation effect.

Please refer to FIG. 3 and FIG. 4 together below, which are the structure diagram and assembly schematic diagram of the second embodiment of the memory cooling device of the present invention. As shown in Figure 3, the storage cooling device 1a of the present utility model is a variation of the aforementioned first embodiment. A protruding ring 12 corresponding to the fixing hole is provided on the piece 10a. As shown in FIG. 4 , the first cooling fin 10 a and the second cooling fin 20 a are combined and fixed by the engaging effect generated by inserting the protruding ring 12 into the fixing hole. In addition to the fixing structure 22a used in the above embodiment, other structural members with the same fastening effect can also be used instead, not limited to the above embodiment.

Please refer to FIG. 5 and FIG. 6 , which are the structure diagram and assembly schematic diagram of the third embodiment of the memory cooling device of the present invention. As shown in Figure 5 and Figure 6, the memory cooling device 1b of the present utility model is a variation of the aforementioned first embodiment. Instead, the joint portion 21 b is used to directly form the fulcrum of the first heat sink 10 b and the second heat sink 20 b, and cooperate with a fixing structure 22 b to clamp the memory 40 . The joint part 21b can also provide an elastic force to assist the joint, fixation and separation of the first heat sink 10b and the second heat sink 20b, so as to achieve the effect of easy disassembly. In addition to the structure of the joint portion 21b adopted above, the joint portion 21b can also be replaced by other structural members that can provide the same fulcrum effect, without being limited to the above-mentioned embodiment.

Please refer to FIG. 7 and FIG. 8 , which are the structure diagram and assembly schematic diagram of the fourth embodiment of the memory cooling device of the present invention. As shown in FIG. 7 , the memory cooling device 1c of the present utility model is a modification of the aforementioned first embodiment. The joint portion 21c is arranged on one side of the second heat sink 20c, and the fixing structure 22c is oppositely arranged on the second heat sink. 20c at both ends. As shown in FIG. 8, the storage cooling device 1c forms a fulcrum with the first heat sink 10c by using the joint portion 21c located above the second heat sink 20c, and makes the second heat sink 20c rotate relative to the first heat sink 10c, and finally passes through the The fixing structures 22c located at both ends of the second heat sink 20c are used to combine and fix the first heat sink 10c and the second heat sink 20c. In this embodiment, the second heat sink 20c is provided with two symmetrical joint portions 21c to provide a more stable memory clamping effect of the memory heat sink 1c. In addition, in this embodiment, each joint portion 21c is a protruding fin structure, and an insertion hole 11c corresponding to each protruding fin structure is provided on the first heat sink 10c, but each joint portion 21c can also be formed by the aforementioned third embodiment. The latch or spring element used in the example or other structural elements that can provide the same fulcrum effect can be replaced, and the present embodiment is not limited thereto.

Please refer to FIG. 9 and FIG. 10 together below, which are the structure diagram and assembly schematic diagram of the fifth embodiment of the memory cooling device of the present invention. As shown in FIG. 9 , the memory cooling device 1d of the present invention includes a first cooling fin 10d and a second cooling fin 20d. The second heat sink 20d includes two fixing structures 22d, and each fixing structure 22d is disposed opposite to two ends of the second heat sink 20d. As shown in FIG. 10 , the second heat sink 20d is fastened with the first heat sink 10d through each fixing structure 22d to clamp the memory between the first heat sink 10d and the second heat sink 20d. In this embodiment, each fixing structure 22d is a hook, but it can also be replaced by the combination of the fixing hole and the protruding ring used in the second embodiment or other structural parts that can provide the same fixing effect instead of using This example is limited. The memory cooling device 1d of the present invention may further include two coupling parts, which can be used to combine the first cooling fin 10d and the second cooling fin 20d through the structure of the aforementioned fourth embodiment.

In addition, the storage cooling devices 1a, 1b, 1c, and 1d of the present invention may also include the thermal pads 30 disclosed in the first embodiment above. The closer contact effect between 1b, 1c, and 1d makes the combination more stable and maintains a good heat dissipation effect.

Claims (15)

1. A storage cooling device for dissipating heat generated by the storage, characterized in that the storage cooling device includes: a first cooling fin; and a second cooling fin, including a combination corresponding to the structure of the first cooling fin part and a fixing structure; wherein the second heat sink forms a fulcrum with the first heat sink through the joint part, and combines the fixing structure to clamp the memory between the first heat sink and the second heat sink between. 2. The memory heat dissipation device according to claim 1, wherein the joint portion is disposed at two ends of the second heat sink opposite to the fixing structure. 3 . The memory cooling device according to claim 1 , wherein the joint portion is a protruding fin structure, and an insertion hole corresponding to the protruding fin structure is provided on the first heat sink. 4. The memory cooling device according to claim 1, wherein the joint part is a pin or a spring. 5. The memory cooling device according to claim 1, further comprising a plurality of fixing structures, the joint part is arranged on one side of the second heat sink, and the plurality of fixing structures are arranged on the second heat sink both ends of the slice. 6 . The memory cooling device according to claim 5 , wherein the joint portion is a protruding fin structure, and an insertion hole corresponding to the protruding fin structure is provided on the first heat sink. 7. The memory cooling device according to claim 5, wherein the joint portion is a pin or a spring. 8 . The memory cooling device according to claim 1 , further comprising a thermal pad disposed on an inner surface of the first cooling fin or the second cooling fin. 9. The memory cooling device according to claim 1, wherein the fixing structure is a hook. 10. The memory cooling device according to claim 1, wherein the fixing structure is a fixing hole, and a protruding ring corresponding to the fixing hole is provided on the first cooling fin. 11. A storage cooling device for dissipating heat generated by the storage, characterized in that the storage cooling device includes: a first cooling fin; and a second cooling fin, including two fixing structures, each of which is arranged on Both ends of the second heat sink; wherein the second heat sink is fastened with the first heat sink through each of the fixing structures, so as to clamp the memory on the first heat sink and the second heat sink between. 12 . The memory heat dissipation device according to claim 11 , further comprising a heat conduction pad disposed on an inner surface of the first heat dissipation fin or the second heat dissipation fin. 13. The memory cooling device according to claim 11, wherein each of the fixing structures is a hook. 14. The memory cooling device according to claim 11, wherein each of the fixing structures is a fixing hole, and a protruding ring corresponding to the fixing hole is provided on the first cooling fin. 15. The memory cooling device as claimed in claim 11, further comprising two combining portions for combining the first heat sink and the second heat sink.

Images