CN201115227Y - Temperature equalizing device of heat radiation module - Google Patents

Abstract

A temperature equalizing device of a heat radiation module is arranged in an electronic device, the electronic device is provided with a first electronic heating element, the heat radiation module comprises a first heat radiation fin, a second heat radiation fin and a temperature equalizing slice, the first heat radiation fin is arranged at one side of the first electronic heating element, the second heat radiation fin is arranged at the other side of the first electronic heating element, and the temperature equalizing slice is attached to the outer edges of the first heat radiation fin and the second heat radiation fin. The temperature equalizing device of the heat dissipation module formed by the method can enable the first heat dissipation sheet and the second heat dissipation sheet to realize temperature balance, and the first heat dissipation sheet and the second heat dissipation sheet can realize the temperature equalizing effect, so that the heat dissipation efficiency is improved, and the electronic heating element cannot be damaged due to overhigh temperature.

Description

Temperature equalization device for heat dissipation module

technical field

The utility model relates to a temperature equalizing device for a heat dissipation module, in particular to a temperature equalizing device which can assist electronic heating elements in heat dissipation, has a good temperature equalizing effect and can improve heat dissipation efficiency.

Background technique

With the rapid development of the computer industry, the heat generation of electronic heating elements such as central processing units, memory, and chips is getting higher and higher, and the size is getting smaller and smaller. In order to effectively dissipate these dense heat to the environment outside the system to maintain The electronic heating element can operate normally at the allowable temperature, and usually a radiator and a fan with a large area are attached to the surface of the electronic heating element to assist the electronic heating element in dissipating heat.

Please refer to FIG. 1, which discloses a known heat dissipation module 7, which can be used to assist electronic heating elements 8 such as memory to dissipate heat. The heat dissipation module 7 includes a first heat sink 71, a second heat sink 72 and a plurality of clamps 73 The first heat sink 71 and the second heat sink 72 are made of metal materials with good thermal conductivity such as copper and installed on opposite sides of the electronic heating element 8 . The clamp 73 is sandwiched outside the first heat sink 71 and the second heat sink 72 at intervals, so that the first heat sink 71 and the second heat sink 72 can be in close contact with both sides of the electronic heating element 8 , so that the high temperature generated by the electronic heating element 8 can be transmitted to the first heat sink 71 and the second heat sink 72, so that the first heat sink 71 and the second heat sink 72 can be used to assist in heat dissipation.

The above-mentioned heat dissipation module 7 is usually used to assist the heat dissipation of another electronic heating element (not shown) such as a chip. The heat dissipation module 7 contacts the other electronic heating element with the first heat dissipation fin 71 (or the second heat dissipation fin 72), The high temperature generated by the other electronic heating element can be transmitted to the first heat sink 71 so that the first heat sink 71 can be used to assist in heat dissipation.

Since the first heat sink 71 is used to assist the heat dissipation of the two electronic heating elements at the same time, the first heat sink 71 will bear a higher temperature, but the first heat sink 71 and the second heat sink 72 dissipate heat respectively, and the high temperature cannot be transmitted to The second heat sink 72, the first heat sink 71 and the second heat sink 72 cannot achieve the effect of uniform temperature, so that the heat dissipation efficiency of the heat dissipation module 7 is reduced, and the electronic heating element is easily damaged due to excessive temperature, which affects the entire normal functioning of electronic devices.

In view of the above-mentioned situation in the prior art, it is necessary to propose a temperature equalizing device for a heat dissipation module that is reasonably designed and can effectively improve the above-mentioned defects.

Contents of the invention

The main purpose of the utility model is to provide a temperature equalizing device for a heat dissipation module, which can achieve the effect of temperature uniformity, improve heat dissipation efficiency, and avoid electronic heating elements from being damaged due to excessive temperature.

In order to achieve the above object, the utility model provides a temperature equalizing device for a heat dissipation module, which is arranged in an electronic device, the electronic device has a first electronic heating element, and the heat dissipation module includes: a first heat dissipation fin, which is installed on the One side of the first electronic heating element; a second cooling fin installed on the other side of the first electronic heating element; and a temperature uniform thin sheet attached to the first cooling fin and the second cooling fin.

According to the temperature equalizing device of the heat dissipation module conceived in the present invention, the first heat dissipation fin and the second heat dissipation fin are in contact with opposite sides of the first electronic heating element.

According to the temperature equalizing device of the heat dissipation module conceived in the present invention, the temperature equalizing sheet is a copper part, an aluminum part or a graphite part.

According to the temperature uniform device of the heat dissipation module conceived in the present invention, the temperature uniform sheet is attached to the outer edges of the first heat sink and the second heat sink.

According to the temperature equalizing device of the heat dissipation module conceived in the present invention, the electronic device has a second electronic heating element, and the second electronic heating element is in contact with the temperature equalizing sheet, the first cooling fin or the second cooling fin.

The utility model has the following beneficial effects: a temperature uniform sheet is arranged between the first heat sink and the second heat sink of the heat dissipation module of the utility model, and the temperature uniform sheet can provide the function of heat conduction, so that the first heat sink and the second heat sink The heat sink can realize temperature balance, and the first heat sink and the second heat sink can realize the effect of temperature uniformity, improve heat dissipation efficiency, and prevent electronic heating elements from being damaged due to excessive temperature.

In order to further understand the features and technical content of the utility model, please refer to the following detailed description and accompanying drawings of the utility model. However, these drawings are for reference and illustration only, and are not intended to limit the utility model.

Description of drawings

FIG. 1 is a perspective view of a known heat dissipation module;

Fig. 2 is a perspective view of the temperature equalizing device of the heat dissipation module of the present invention;

Fig. 3 is a perspective view of the use state of the temperature equalizing device of the heat dissipation module of the present invention; and

Fig. 4 is a side view of the use state of the temperature equalizing device of the heat dissipation module of the present invention.

Wherein, the reference signs are explained as follows:

1 Circuit board 11 The first electronic heating element 12 The second electronic heating element

2 heat dissipation module 21 first heat sink 22 second heat sink

23 temperature equalizing sheet 7 heat dissipation module 71 first heat sink

72 Second heat sink 73 Fixture 8 Electronic heating element

Detailed ways

Please refer to Fig. 2 to Fig. 4, the utility model provides a kind of temperature equalization device of heat dissipation module, especially a kind of temperature equalization device of heat dissipation module applied to electronic device (such as industrial computer, etc.), the electronic device is equipped with A circuit board (such as a motherboard, etc.) 1, the circuit board 1 is provided with a first electronic heating element 11 and a second electronic heating element 12, in this embodiment, the first electronic heating element 11 is a heating element such as a memory, The second electronic heating element 12 is a heating element such as a chip.

The heat dissipation module 2 includes a first heat dissipation fin 21, a second heat dissipation fin 22 and a temperature uniform sheet 23. The first heat dissipation fin 21 and the second heat dissipation fin 22 are made of metal materials with good thermal conductivity such as copper and installed on the The opposite sides of the first electronic heating element 11 enable the first cooling fin 21 and the second cooling fin 22 to be in contact with both sides of the first electronic heating element 11, so that the first electronic heating element 11 generates The high temperature can be transmitted to the first heat sink 21 and the second heat sink 22 , so as to use the first heat sink 21 and the second heat sink 22 to assist in heat dissipation.

The temperature equalizing sheet 23 is made of materials with good thermal conductivity such as copper parts, aluminum parts or graphite parts. The outer edges of the second heat sink 22 and the first heat sink 21 and the second heat sink 22 can be bonded by means of thermally conductive adhesive.

The second electronic heating element 12 can be in contact with the temperature equalizing sheet 23 , the first heat sink 21 or the second heat sink 22 , so that the high temperature generated by the second electronic heating element 12 can be transferred to the first heat sink 21 and the second heat sink 22, so as to utilize the first heat sink 21 and the second heat sink 22 to jointly assist in heat dissipation; the temperature uniform device of the heat dissipation module of the present invention is formed in the above manner.

The utility model mainly arranges a temperature uniform sheet 23 between the first heat sink 21 and the second heat sink 22 of the heat dissipation module 2, and the temperature uniform sheet 23 can provide the function of heat conduction, so that the first heat sink 21 and the second heat sink Sheet 22 enables temperature balancing. When the first heat sink 21 is exposed to a higher temperature, the high temperature can be transferred to the second heat sink 22 through the temperature equalizing sheet 23 . Conversely, when the second heat sink 22 is subjected to a higher temperature, the high temperature can be transmitted to the first heat sink 21 through the temperature equalizing sheet 23 . Therefore, the first heat dissipation fin 21 and the second heat dissipation fin 22 can realize the effect of uniform temperature, and then make the first heat dissipation fin 21 and the second heat dissipation fin 22 have a good heat dissipation effect, thereby improving their heat dissipation efficiency. The electronic heating elements 11, 12 will not be damaged due to overheating, so that the electronic heating elements 11, 12 and even the entire electronic device can maintain normal operation.

The above description is only used to illustrate the preferred embodiments of the present utility model, and is not intended to limit the scope of patent protection of the present utility model. Therefore, the equivalent changes made by using the description of the utility model and the contents of the accompanying drawings should be included in this document. within the protection scope of utility model rights.

Claims (5)

1. the temperature equalization system of a radiating module, it is arranged in the electronic installation, and this electronic installation has the first electronic heating element, it is characterized in that, and this radiating module comprises:

First fin, it is installed on a side of this first electronic heating element;

Second fin, it is installed on the opposite side of this first electronic heating element; And

The samming thin slice, it is attached at this first fin and this second fin.

2. the temperature equalization system of radiating module as claimed in claim 1 is characterized in that, this first fin and the relative contact both sides of this second fin with this first electronic heating element.

3. the temperature equalization system of radiating module as claimed in claim 1 is characterized in that, this samming thin slice is copper spare, aluminum component or graphite piece.

4. the temperature equalization system of radiating module as claimed in claim 1 is characterized in that, this samming thin slice is attached at the outer rim of this first fin and this second fin.

5. the temperature equalization system of radiating module as claimed in claim 1 is characterized in that, this electronic installation has the second electronic heating element, and this second electronic heating element contacts with this samming thin slice, this first fin or this second fin.

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