CN201097102Y - Vertical flow guiding type thin plate chemical treatment device - Google Patents
Vertical flow guiding type thin plate chemical treatment device Download PDFInfo
- Publication number
- CN201097102Y CN201097102Y CNU2007201292182U2007201292182U CN200720129218U CN201097102Y CN 201097102 Y CN201097102 Y CN 201097102Y CN U2007201292182U2007201292182 U CNU2007201292182U2007201292182 U CN U2007201292182U2007201292182U CN 200720129218 U CN200720129218 U CN 200720129218U CN 201097102 Y CN201097102 Y CN 201097102Y
- Authority
- CN
- China
- Prior art keywords
- flow
- light sheet
- solution
- thin plate
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000011282 treatment Methods 0.000 title claims abstract description 64
- 239000000126 substance Substances 0.000 title claims abstract description 44
- 238000012993 chemical processing Methods 0.000 claims abstract 7
- 238000000034 method Methods 0.000 claims description 13
- 238000004140 cleaning Methods 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims 1
- 239000000463 material Substances 0.000 abstract description 12
- 238000012545 processing Methods 0.000 abstract description 10
- 230000000694 effects Effects 0.000 abstract description 8
- 239000012530 fluid Substances 0.000 abstract description 5
- 239000007921 spray Substances 0.000 abstract description 5
- 238000006243 chemical reaction Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 description 40
- 230000036632 reaction speed Effects 0.000 description 6
- 238000011161 development Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002085 persistent effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
技术领域 technical field
本实用新型涉及一种,尤其涉及一种垂直导流式薄板材化学处理装置。The utility model relates to a device, in particular to a vertical diversion type thin plate chemical treatment device.
背景技术 Background technique
随着资讯时代的来临,印刷电路板(PCB)为各种电子产品重要的组件,并主导着精密电子产品在功能上及任何周边部分作精密设计的关键地位。现有的印刷电路板的制作流程包含:表面处理、压膜、曝光、显影(Developing)、水洗、蚀刻(Etching)、除膜(Stripping)等处理。亦即其包括有化学处理及清洗等的流程。传统上印刷电路板在作上述化学处理过程大都以水平型的设备为主。With the advent of the information age, the printed circuit board (PCB) is an important component of various electronic products, and plays a key role in the precision design of precision electronic products in terms of function and any peripheral parts. The existing manufacturing process of printed circuit boards includes: surface treatment, lamination, exposure, developing, washing, etching, stripping and other treatments. That is to say, it includes processes such as chemical treatment and cleaning. Traditionally, most of the above-mentioned chemical treatment processes for printed circuit boards are based on horizontal equipment.
然而,随着印刷电路板向薄形化发展,以符合现今高科技产品所需,所以印刷电路板的厚度愈来愈薄,常见的规格约0.06mm~1.2mm左右,铜皮厚度则为18~70μm。再者,薄板材的线路愈来愈精细,也极易受损。因此,传统用来化学处理的水平型设备,无论是输送方式及对薄板材喷洒化学溶液(例如显影液)的方式,已无法达到预期的处理品质,甚至易使薄板材受到极大损伤。However, with the development of thinner printed circuit boards to meet the needs of today's high-tech products, the thickness of printed circuit boards is getting thinner and thinner. Common specifications are about 0.06mm to 1.2mm, and the thickness of copper skin is 18mm. ~70μm. Furthermore, the circuits of thin sheets are getting finer and more delicate, and they are also very easy to be damaged. Therefore, the traditional horizontal equipment used for chemical treatment, whether it is the way of conveying or spraying chemical solutions (such as developer solution) on thin plates, can no longer achieve the expected processing quality, and even easily damages the thin plates.
针对薄板材的化学处理及清洗流程,已有业者赏试改变为图1所示的垂直型设备来处理,亦即该薄板材13被夹固在挂架(Rack)14上,借吊车移动到各个指定的处理槽11进行清洗或化学处理。但该处理槽11内的化学溶液12虽然有在循环,但是其流动性仍嫌不足,而为使槽内的化学溶液12具有较高的流动性,许多方法乃被使用,例如利用一鼓风机将空气输入处理槽11底端,使溶液可受到气泡的作用,或是在处理槽11内设有注水管,帮助溶液的流动性,借以达到增加薄板材13的表面交换及反应速度。For the chemical treatment and cleaning process of the thin plate, some operators have tried to change it to the vertical equipment shown in Figure 1 for processing, that is, the
然而,在上述现有技术(Prior Art)中,其对于帮助化学溶液流动虽具有一定的效果,但随着印刷电路板、铝板材等薄板的品质要求愈来愈高,且对于处理槽11的体积要求愈来愈小,以达到不占空间的目的;所以,目前使用的化学处理槽仍有其未尽完善之处。Yet in above-mentioned prior art (Prior Art), although it has certain effect for helping chemical solution to flow, but along with the quality requirement of thin plates such as printed circuit board, aluminum plate material more and more higher, and for the
本创作人有鉴于此,乃再接再励,以其先前在电镀等湿制程的经验,不断研究改进,以期能提供PCB或铝板等薄板材在显影、蚀刻、除膜等化学处理及清洗流程一种更佳的方法。In view of this, the creator of this paper is making persistent efforts, using his previous experience in electroplating and other wet processes, to continuously research and improve, in order to provide PCB or aluminum plates and other thin plates with chemical treatment and cleaning processes such as development, etching, and film removal. A better way.
实用新型内容Utility model content
本实用新型所要解决的主要技术问题在于,克服现有技术存在的上述缺陷,而提供一种垂直导流式薄板材化学处理装置,具有不伤害板材表面的功效,而且可以通过左右摇摆、振动及超音波辅助,提供更大化学溶液于板材的表面交换及反应速度,以达到更佳效果,进而提升处理品质。The main technical problem to be solved by the utility model is to overcome the above-mentioned defects in the prior art, and provide a vertical diversion type thin plate chemical treatment device, which has the effect of not damaging the surface of the plate, and can Ultrasonic assistance provides greater surface exchange and reaction speed of the chemical solution on the plate to achieve better results and improve the treatment quality.
本实用新型解决其技术问题所采用的技术方案是:The technical scheme that the utility model solves its technical problem adopts is:
一种垂直导流式薄板材化学处理装置,其特征在于,包含:一处理槽,是上方呈开口的狭长型体,底部设有流出口;一薄板材,是被夹固在一挂架(Rack)上,并由上而下垂直置入该处理槽;一导流单元,是装设在该处理槽开口的前后两侧,用以导入化学溶液,并使该溶液呈流体束喷向该薄板材的前后两侧表面而向下快速流动,且令该导入的溶液流量大于该处理槽底部的流出量,使该槽内充满溶液,使该薄板材悬浮于该处理槽内。A vertical diversion type thin plate chemical treatment device is characterized in that it includes: a treatment tank, which is a long and narrow body with an opening on the top, and an outlet at the bottom; a thin plate, which is clamped on a hanger ( Rack) and vertically placed into the treatment tank from top to bottom; a flow guide unit is installed on the front and rear sides of the opening of the treatment tank to introduce chemical solution and spray the solution to the treatment tank in the form of a fluid beam. The front and rear sides of the sheet material flow downward quickly, and the flow rate of the introduced solution is greater than the flow rate at the bottom of the treatment tank, so that the tank is filled with solution, and the thin plate material is suspended in the treatment tank.
前述的垂直导流式薄板材化学处理装置,其特征在于所述处理槽上还包括设有左右摇摆、振动及超音波其中任一或其组合式所构成的辅助装置。The aforementioned vertical diversion type thin plate chemical treatment device is characterized in that the treatment tank also includes an auxiliary device composed of any one of left and right swing, vibration and ultrasonic waves or a combination thereof.
前述的垂直导流式薄板材化学处理装置,其中处理槽包括用以提供该薄板材的化学处理及清洗流程。In the aforementioned vertical diversion type thin plate chemical treatment device, the treatment tank includes a chemical treatment and cleaning process for providing the thin plate.
前述的垂直导流式薄板材化学处理装置,其中薄板材包括印刷电路板(PCB)、铝板材及其他等效材料。In the aforementioned vertical diversion chemical treatment device for thin plates, the thin plates include printed circuit boards (PCBs), aluminum plates and other equivalent materials.
前述的垂直导流式薄板材化学处理装置,其中导流单元包括二支前、后喷流管,是分别设置在该开口的前后两侧的斜板上,其相向对应的内侧设有多个喷嘴,由该喷嘴向该薄板材两侧及处理槽内注入化学溶液。The aforementioned vertical diversion type thin plate chemical treatment device, wherein the diversion unit includes two front and rear spray pipes, which are respectively arranged on the inclined plates on the front and rear sides of the opening, and the corresponding inner sides are provided with a plurality of A nozzle is used to inject chemical solution into both sides of the sheet and into the treatment tank through the nozzle.
前述的垂直导流式薄板材化学处理装置,其中处理槽下方设有回收装置,可使所述导流单元导入该处理槽内及溢流的化学溶液,且该回收装置包括与一泵及过滤器连接,可将回收的化学溶液送至该导流单元的二支前、后喷流管,使化学溶液不断循环过滤。The aforementioned vertical diversion type thin plate chemical treatment device, wherein a recovery device is provided under the treatment tank, so that the diversion unit can be introduced into the treatment tank and the overflowing chemical solution, and the recovery device includes a pump and a filter The recovered chemical solution can be sent to the two front and rear spray pipes of the diversion unit, so that the chemical solution can be continuously circulated and filtered.
设计原理是在一个狭窄的处理槽上开口两侧提供溶液向下流动,如果溶液的供应大于处理槽底端所出的溶液,则槽内必然充满溶液,甚至溢流至槽侧,故当待处理的板材置入处理槽时,因前后导流影响,是呈趋向处理槽中央而悬浮于槽内,进而使板材表面不易接触到槽壁,具有不伤害板材表面的功效。The design principle is to provide the solution to flow downward on both sides of the upper opening of a narrow treatment tank. If the supply of solution is greater than the solution coming out of the bottom of the treatment tank, the tank must be filled with solution, and even overflow to the side of the tank, so when waiting When the processed plate is placed in the treatment tank, due to the influence of front and rear flow diversion, it tends to the center of the treatment tank and is suspended in the tank, so that the surface of the plate is not easy to touch the tank wall, and has the effect of not damaging the surface of the plate.
再者,由于溶液往下快速流动,利用该导流效应提供搅拌及冲刷板材表面,获得良好的溶液交换,增加化学反应速度,而且可以通过左右摇摆、振动及超音波辅助,提供更大化学溶液于板材的表面交换及反应速度,以达到更佳效果,进而提升处理品质。Furthermore, because the solution flows down quickly, the diversion effect is used to provide stirring and scour the surface of the plate, so as to obtain good solution exchange and increase the chemical reaction speed, and can provide a larger chemical solution through side-to-side swing, vibration and ultrasonic assistance. Exchange and reaction speed on the surface of the plate to achieve better results and improve the quality of treatment.
本实用新型的有益效果是:具有不伤害板材表面的功效,而且可以通过左右摇摆、振动及超音波辅助,提供更大化学溶液于板材的表面交换及反应速度,以达到更佳效果,进而提升处理品质。The beneficial effect of the utility model is: it has the effect of not damaging the surface of the plate, and can provide greater exchange and reaction speed of the chemical solution on the surface of the plate through left and right swinging, vibration and ultrasonic assistance, so as to achieve a better effect and further improve Handling quality.
附图说明 Description of drawings
下面结合附图和实施例对本实用新型进一步说明。Below in conjunction with accompanying drawing and embodiment the utility model is further described.
图1是现有一种化学处理装置的示意图Figure 1 is a schematic diagram of an existing chemical treatment device
图2是本实用新型较佳实施例的侧面剖视图Fig. 2 is a side sectional view of a preferred embodiment of the present invention
图3是本实用新型较佳实施例的正面剖视图Figure 3 is a front sectional view of a preferred embodiment of the present invention
图4是本实用新型较佳实施例的导流构架图Fig. 4 is the guide frame diagram of the preferred embodiment of the utility model
图中标号说明:Explanation of symbols in the figure:
20处理槽 21开口20 processing slots 21 openings
22流出口 23斜板22 outflow outlet 23 inclined plate
24溢流通道 30薄板材24
31挂架 40导流单元31
41前喷流管 42后喷流管41
411、421喷嘴 50回收装置411, 421 nozzles 50 recovery devices
60泵 70过滤器60 pump 70 filter
80前侧溶液 81前导流80
90后侧溶液 91后导流90
具体实施方式 Detailed ways
首先,请参阅图2~图4所示,本实用新型较佳实施例所揭示的化学处理装置包含有:First, please refer to Figures 2 to 4, the chemical treatment device disclosed in the preferred embodiment of the present invention includes:
一处理槽20,是上方呈开口21的狭长型体,底部设有一个以上的流出口22。所述处理槽20是呈上下等宽的型体为较佳,但不限定于此,亦即特殊状况时,亦可设制成上宽下窄的形态。再者,本实施例中该开口21上前后两侧设有向外扩张的斜板23,且于该二片前后斜板23的左、右两侧形成溢流通道24。借此,一薄板材30是被夹固在一挂架31上,并可由上而下垂直置入该处理槽20。A
一导流单元40,装设在该处理槽20开口21的前后两侧,本实施例中是将其装设在该前后斜板23上,用以导入化学溶液,其包括二支前、后喷流管41、42是分别设置在该开口前后两侧的斜板23上,其相向对应的内侧设有多个喷嘴411、421,由该喷嘴411、421向该薄板材30两侧及处理槽20内注入化学溶液。并使该溶液呈流体束喷向该薄板材30的前后两侧表面而向下快速流动,且令该导入的溶液大于该处理槽20底部的流出口22,以使该槽内充满溶液,使该薄板材30悬浮于该处理槽20内。A
于是,如图4所示,当待处理的薄板材30置入该处理槽20时,借由该导流单元40的作用,前侧溶液80及后侧溶液90分别于前后两侧流动,形成前导流81及后导流91两股流力,进而使薄板件30趋向处理槽20中央,而悬浮于槽内,且该化学溶液的流体导流是前后皆在进行,可达到平衡效果,并在流动状态中,仍可使薄板材30左右摇摆、振动及使用超音波等其中任一或其组合式所构成的辅助装置,提供更大化学溶液于薄板材30的表面交换及反应速度,以达到更佳效果。Therefore, as shown in FIG. 4, when the
当然,前述导流单元40所导入处理槽20或溢流的化学溶液,可借由一设在处理槽20下方的回收装置50予以回收,并不会浪费。该回收装置50还包括一泵60及一过滤器70连接,可将回收的化学溶液送至该导流单元405的二支前、后喷流管41、42,使化学溶液不断循环过滤,可常保清洁,且化学溶液由上方流向下方,此一导流过程中,可将待处理的薄板件30表面上产生的粉尘或颗粒带走,使板件表面干净平滑。Certainly, the chemical solution introduced into the
前述导流式处理方法及装置可以广泛应用于薄板材的化学处理及清洗的流程。例如PCB的显影(Developing)、蚀刻(Etching)、除膜(Stripping)、清洗等流程。此外铝板材等其他等效材质相关的处理亦适用。The aforementioned diversion treatment method and device can be widely used in the chemical treatment and cleaning process of thin plates. For example, PCB development (Developing), etching (Etching), film removal (Stripping), cleaning and other processes. In addition, the treatment related to other equivalent materials such as aluminum sheet is also applicable.
所以,本实用新型以一导流原理所设计而成的化学处理装置,是充分运用流体力学中液体的流动特性,以及材料力学中薄板材的特性,使得板材的化学反应是在平衡流动中充分交换而完成,且不易接触到槽壁,可防止板件损伤,以达到最佳处理品质。Therefore, the chemical treatment device designed by the utility model based on the principle of diversion is to make full use of the flow characteristics of liquid in fluid mechanics and the characteristics of thin plates in material mechanics, so that the chemical reaction of the plates is fully balanced in the flow. It is completed by exchange, and it is not easy to touch the tank wall, which can prevent damage to the plate and achieve the best processing quality.
以上所述,仅是本实用新型的较佳实施例而已,并非对本实用新型作任何形式上的限制,凡是依据本实用新型的技术实质对以上实施例所作的任何简单修改、等同变化与修饰,均仍属于本实用新型技术方案的范围内。The above is only a preferred embodiment of the utility model, and does not limit the utility model in any form. Any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the utility model, All still belong to within the scope of the technical solution of the utility model.
综上所述,本实用新型在结构设计、使用实用性及成本效益上,完全符合产业发展所需,且所揭示的结构亦是具有前所未有的创新构造,具有新颖性、创造性、实用性,符合有关新型专利要件的规定,故依法提起申请。In summary, the utility model fully meets the needs of industrial development in terms of structural design, practicability and cost-effectiveness, and the disclosed structure also has an unprecedented innovative structure, novelty, creativity and practicability, and meets the needs of industrial development. According to the requirements of the new patent requirements, the application is filed in accordance with the law.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201292182U2007201292182U CN201097102Y (en) | 2007-08-22 | 2007-08-22 | Vertical flow guiding type thin plate chemical treatment device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201292182U2007201292182U CN201097102Y (en) | 2007-08-22 | 2007-08-22 | Vertical flow guiding type thin plate chemical treatment device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201097102Y true CN201097102Y (en) | 2008-08-06 |
Family
ID=39924154
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201292182U2007201292182U Expired - Lifetime CN201097102Y (en) | 2007-08-22 | 2007-08-22 | Vertical flow guiding type thin plate chemical treatment device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201097102Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815407A (en) * | 2010-05-10 | 2010-08-25 | 苏州创峰光电科技有限公司 | Sheet immersing treatment method and device |
| CN103663987A (en) * | 2012-09-21 | 2014-03-26 | 弘塑科技股份有限公司 | Settled reaction tank structure |
| CN108672355A (en) * | 2018-05-10 | 2018-10-19 | 深圳市志凌伟业技术股份有限公司 | A kind of product cleaning line multistage is lengthened by support plate or so adjacent nozzle |
-
2007
- 2007-08-22 CN CNU2007201292182U2007201292182U patent/CN201097102Y/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101815407A (en) * | 2010-05-10 | 2010-08-25 | 苏州创峰光电科技有限公司 | Sheet immersing treatment method and device |
| CN103663987A (en) * | 2012-09-21 | 2014-03-26 | 弘塑科技股份有限公司 | Settled reaction tank structure |
| CN108672355A (en) * | 2018-05-10 | 2018-10-19 | 深圳市志凌伟业技术股份有限公司 | A kind of product cleaning line multistage is lengthened by support plate or so adjacent nozzle |
| CN108672355B (en) * | 2018-05-10 | 2021-04-13 | 深圳市志凌伟业技术股份有限公司 | Product cleaning line with multiple sections of lengthened left and right adjacent nozzles close to supporting plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5272197B2 (en) | Downward substrate thinning device and thinning system using the same | |
| CN203816979U (en) | Cleaning device for glass substrate | |
| CN201097102Y (en) | Vertical flow guiding type thin plate chemical treatment device | |
| TWM334597U (en) | Chemical processing device of thin plate material having vertical flow-guide type | |
| JP4677216B2 (en) | Flat surface treatment equipment | |
| US10099262B2 (en) | Specific device for cleaning electronic components and/or circuits | |
| WO2011105072A1 (en) | Substrate treating method and substrate treating apparatus | |
| JP2011176085A (en) | Substrate treating method, and substrate treating apparatus | |
| CN210481555U (en) | Roll-to-roll horizontal plating bath device | |
| JP3137488U (en) | Equipment for chemical treatment of vertical shunt type thin plate materials | |
| CN219678816U (en) | Flip plate flushing equipment to remove residual bath liquid | |
| JP3079698B2 (en) | Surface treatment equipment for printed wiring boards | |
| CN206835469U (en) | A kind of pcb sprays tin streamline | |
| JPS60198889A (en) | Method and device for treating circuit board | |
| CN210183658U (en) | High-speed circulation of small blind hole PCB removes subassembly of gluing | |
| CN220043786U (en) | Novel etching device | |
| JP3237141U (en) | Two-fluid system | |
| JP5087786B2 (en) | Method and apparatus for removing photoresist in photoetching | |
| JP5627404B2 (en) | Dry film resist thinning method | |
| CN2516566Y (en) | Erosion thin copper machine | |
| JP2017076639A (en) | Board developing system | |
| CN218902909U (en) | Ultrasonic washing tank for PCB dry film | |
| CN210579513U (en) | A Hole Whole Device Applicable to FPC Black Hole Line Equipment | |
| CN206879226U (en) | A kind of high-density interconnected circuit board DES production systems | |
| CN212093469U (en) | Surface deburring device for N-Si substrate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080806 |