CN201081166Y - High-power LED device with multi-channel heat dissipation - Google Patents
High-power LED device with multi-channel heat dissipation Download PDFInfo
- Publication number
- CN201081166Y CN201081166Y CNU2007200725105U CN200720072510U CN201081166Y CN 201081166 Y CN201081166 Y CN 201081166Y CN U2007200725105 U CNU2007200725105 U CN U2007200725105U CN 200720072510 U CN200720072510 U CN 200720072510U CN 201081166 Y CN201081166 Y CN 201081166Y
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- radiator
- circuit board
- printed circuit
- metal base
- heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
一种多通道散热的高功率LED器件，属基本电气元件领域。包括载有发光二极管光源的印刷电路板和位于印刷电路板下方的第一散热器，其在印刷电路板的上方和/或侧面，设置第二散热器，在发光二极管光源上方设置光学透镜，在发光二极管光源与光学透镜之间，设置荧光粉层，在发光二极管光源与荧光粉层以及发光二极管光源与第一散热器之间，设置硅胶层，其第二散热器和第一散热器通过紧固件固定成为一体。由于具有了多通道散热能力，其整体热量传递快、散热效果好，有助于开发更高功率、更高亮度的LED照明器件，可广泛用于高功率照明用发光二极管光源器件的制造领域，在汽车照明、交通灯、建筑照明、特种照明等领域，具有广阔的应用前景。
A high-power LED device with multi-channel heat dissipation belongs to the field of basic electrical components. It includes a printed circuit board carrying a light emitting diode light source and a first heat sink located below the printed circuit board, a second heat sink is arranged on the upper side and/or side of the printed circuit board, an optical lens is arranged above the light emitting diode light source, and A fluorescent powder layer is arranged between the light emitting diode light source and the optical lens, a silica gel layer is arranged between the light emitting diode light source and the fluorescent powder layer, and between the light emitting diode light source and the first heat sink, and the second heat sink and the first heat sink pass through the tight The firmware is fixed into one. Due to the multi-channel heat dissipation capability, the overall heat transfer is fast and the heat dissipation effect is good, which is conducive to the development of LED lighting devices with higher power and higher brightness, and can be widely used in the manufacturing field of LED light source devices for high-power lighting. It has broad application prospects in automotive lighting, traffic lights, architectural lighting, special lighting and other fields.
Description
Technical field
The utility model belongs to the essential electronic element field, relates in particular to a kind of heat abstractor of LED for illumination light source device.
Background technology
LED (Light Emitting Diode, light emitting diode) is as a kind of novel energy-saving lighting body, and is little because of volume, driving voltage is low, reaction speed is fast, shatter-proof characteristic is good, long service life and to characteristics such as environmental hazard are low, is widely used.
The high-capacity LED device is mainly used in fields such as automotive lighting, traffic lights, architectural lighting, special lighting at present.
LED produces wide cause and force by the magnitude of current of diode core knot proportional.Can produce a bigger light output flow so increase electric current, promptly when the electric current that applies increased, diode core interface can produce more light.
Yet this mode has been left over hot polymerization collection problem, when heat becomes excessive, damages LED easily.
Practice shows that LED can not strengthen the fundamental cause of input power, is because LED can emit a large amount of heat in the course of the work, and the tube core junction temperature is risen rapidly, and input power is high more, and heating effect is big more.The rising of temperature will cause the variation and the decay of device performance, even lose efficacy.Thereby, how effectively to solve high-capacity LED device heat dissipation problem and become and become increasingly conspicuous.
Reduce the main method of LED temperature-rise effect, the one, manage to improve the electro-optical efficiency (claiming external quantum efficiency again) of device, make input power as much as possible be transformed into luminous energy, another important approach is to manage to improve the heat leakage ability of device, the heat that junction temperature is produced is dispersed in the surrounding environment by all means and goes.
Current, the high-capacity LED electroluminescent lamp that is adopted on the market, improving its device heat leakage ability mainly is that the heat that led chip produces is transferred to the heat abstractor (being commonly called as heat sink) that is positioned at the printed circuit board (PCB) below by heat exchange pattern via the printed circuit board (PCB) below the chip, by heat sink heat is dispersed in the surrounding environment again, be that heat mainly is to transmit by vertical mode, see Fig. 1.
The day for announcing is on January 3rd, 2007, notification number is to disclose a kind of " power type LED light source device " in the Chinese patent of CN2854812Y, it discloses a kind of " power type LED light source device ", this power type LED light source device adopts half encapsulating structure, its electrode external member wherein portion is provided with stepped hole, the heat sink formula radiator that adopts the silver-plated material of fine copper to make is installed in the stepped hole of described electrode external member, and chip is positioned at heat sink top, and line is communicated with chip with cathode electrode and anode electrode; Lens are positioned at the top of electrode external member, owing to adopting heat conduction and light, electric system separated structures, have overcome the shortcoming of conventional aluminum substrate surface covering PCB line construction, have improved luminous efficiency greatly.Simple in structure, adopt the silver-plated material of fine copper as heat sink, improved heat transfer efficiency greatly, improved the anti-ageing ability of product, it is more convenient that product is connected with external power supply, combines more flexible more efficient with cooling system, make things convenient for the integrated of product, making more, the realization of high-power illumination product becomes possibility.
The structure of prior art scheme such as Fig. 1 institute, wherein 1 expression printed circuit board (PCB), 2 expression led light sources; The solid black arrow represents that heat is through the vertical transmission means of printed circuit board (PCB), this causes the heat transmission to be limited in vertically, and ignored the lateral transport of institute's heat content in printed circuit board (PCB), thereby be unfavorable for the faster transmission of heat and scatter and disappear, thereby be unfavorable for developing more high power, the LED illuminating device of high brightness more.
The utility model content
Technical problem to be solved in the utility model provides a kind of high-capacity LED device of multi-channel cooling, and it has better heat transmittability and radiating effect, helps to develop more high power, the LED illuminating device of high brightness more.
The technical solution of the utility model is: the high-capacity LED device that a kind of multi-channel cooling is provided, comprise metal base printed circuit board that is loaded with LED source and first radiator that is positioned at the metal base printed circuit board below, it is characterized in that: metal base printed circuit board is provided with at least one LED source; Above metal base printed circuit board and/or the side, second radiator is set; Optical lens is set above LED source; Between LED source and optical lens, phosphor powder layer is set; Between LED source and phosphor powder layer and the LED source and first radiator, layer of silica gel is set; Its second radiator and first radiator fixedly become one by securing member.
Its described LED source just/negative electrode links to each other with the circuit layer of metal base printed circuit board respectively, draws through lead.
Constitute embedded/inserted type structure between its described metal base printed circuit board and second radiator.
Between the described metal base printed circuit board and second radiator, the first insulating heat-conduction material layer is set.
Between the described metal base printed circuit board and first radiator, the second insulating heat-conduction material layer is set.
The surface of its described second radiator is provided with plough groove type, channel-type or tab style radiator structure.
Its described first radiator is heat sink formula radiator.
The described optical lens and second radiator are fixed.
Described securing member is a screw.
Compared with the prior art, the utility model has the advantages that:
1. utilize radiator, both increased area of dissipation, also make the heat that led light source produced comparatively fast to transmit by vertical and horizontal, strengthened heat transfer efficiency with many raceway grooves radiator structure.
2. because of behind the radiator that adopts many raceway grooves radiator structure, have better heat radiating effect, effectively reduce the led chip junction temperature, strengthened the device luminous efficiency, have higher brightness, be applicable to fields such as automotive lighting, traffic lights, architectural lighting, special lighting.
3. can make full use of the display mode of LED active illuminating, utilize a plurality of devices to form light emitting device package, form the large area light emitting face source of multicolour, high brightness.
Description of drawings
Fig. 1 is a heat bang path schematic diagram in the prior art;
Fig. 2 is a structural representation of the present utility model;
Fig. 3 is the concrete structure schematic diagram of embodiment.
1 is metal base printed circuit board among the figure, and 2 is LED source, and 3 is second radiator, and 4 is the first insulating heat-conduction material layer, 5 is radiator structure, and 6 is the second insulating heat-conduction material layer, and 7 is securing member, and 8 is optical lens, 9 is phosphor powder layer, and 10 is layer of silica gel, and 11 is first radiator.
The specific embodiment
Below in conjunction with drawings and Examples the utility model is described further.
Among Fig. 1, the structure of prior art scheme as shown in the figure, wherein printed circuit board (PCB) 1 is provided with led light source 2, solid black arrow among the figure is represented transmission means and the direction of transfer of heat through printed circuit board (PCB), this causes the heat transmission to be limited in vertically, and ignored the lateral transport of institute's heat content in printed circuit board (PCB), thus be unfavorable for the faster transmission of heat and scatter and disappear, thereby be unfavorable for developing more high power, the LED illuminating device of high brightness more.
Among Fig. 2, above metal base printed circuit board 1 and/or the side, be provided with second radiator 3, constitute embedded/inserted type structure between the metal base printed circuit board and second radiator, between the metal base printed circuit board and second radiator, be provided with the first insulating heat-conduction material layer 4.
The surface of its second radiator is provided with plough groove type, channel-type or tab style radiator structure 5.
The optional aluminium matter of the material of second radiator, copper or other have the material of high thermal conductivity.
By the heat bang path shown in the figure hollow core arrow and direction as seen, the setting of second radiator, make the heat in the metal base printed circuit board can carry out the heat conduction of a plurality of passage/directions, not only can vertically transmit, and can lateral transport and/or the side direction transmission, its whole heat transmission is fast, good heat dissipation effect.
Its second spreader surface is provided with plough groove type, channel-type or tab style radiator structure, has increased area of dissipation, satisfies the heat radiation needs of a plurality of passage/directions, also can adopt the radiator structure of other type that helps increasing area of dissipation or radiating rate.
Among Fig. 3, on the architecture basics of Fig. 2, above LED source, be provided with optical lens 8, between LED source and optical lens, be provided with phosphor powder layer 9, between LED source and phosphor powder layer and the LED source and first radiator, be provided with layer of silica gel 10, the second radiators and first radiator 11 and fixedly become one by securing member 7 (among the figure be example with the screw).
Its LED source just/negative electrode links to each other with the circuit layer of metal base printed circuit board respectively, draws (not shown) through lead again.Draw for the ease of its lead, lead extraction channel or interval can be left in a side of second radiator.
Between the metal base printed circuit board and first radiator, be provided with the second insulating heat-conduction material layer 6.
Its first radiator is heat sink formula radiator of the prior art or other heat abstractors.
The described optical lens and second radiator are fixed.
During actual the manufacturing, at least one light-emitting diode chip for backlight unit is disposed on the printed circuit board (PCB), by solid brilliant technology light-emitting diode chip for backlight unit is bonded on the printed circuit board (PCB), the positive and negative electrode of chip links to each other with the circuit layer of printed circuit board (PCB) respectively, is drawn by lead again; Then the printed circuit board (PCB) embedding is had in second radiator of radiator structure, fill with the insulating heat-conduction material of high thermal conductivity coefficient in gap between the two, adds proper silica gel again and place the optical lens of definite shape, can be packaged into device; At last by insulating heat-conduction material be bonded at first radiator, one aluminium matter heat sink on, be fixed together by screw, make printed circuit board (PCB) and additional cooler and heat sink bonding firm, with faster transmission heat.
The purpose that first, second insulating heat-conduction material layer is set is in order better to carry out the heat transmission, to guarantee radiating effect.
Because the utility model is provided with second radiator and attached radiator structure thereof, increased area of dissipation, make it have the multi-channel cooling ability, heat in the metal base printed circuit board can carry out the heat conduction of a plurality of passage/directions, fast, the good heat dissipation effect of its whole heat transmission helps to develop more high power, the LED illuminating device of high brightness more.
For those of ordinary skills, can make various possible being equal to according to foregoing description and replace or change, and all these changes or replacement all should belong to the protection domain of the utility model claims.
The utility model can be widely used in the manufacturing field of high power illumination with the LED source device, in fields such as automotive lighting, traffic lights, architectural lighting, special lightings, has broad application prospects.
Claims (9)
1. the high-capacity LED device of a multi-channel cooling comprises the metal base printed circuit board that is loaded with LED source and is positioned at first radiator of metal base printed circuit board below, it is characterized in that:
Metal base printed circuit board is provided with at least one LED source;
Above metal base printed circuit board and/or the side, second radiator is set;
Optical lens is set above LED source;
Between LED source and optical lens, phosphor powder layer is set;
Between LED source and phosphor powder layer and the LED source and first radiator, layer of silica gel is set;
Its second radiator and first radiator fixedly become one by securing member.
2. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that described LED source just/negative electrode links to each other with the circuit layer of metal base printed circuit board respectively, draws through lead.
3. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that constituting between the described metal base printed circuit board and second radiator embedded/inserted type structure.
4. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that between the described metal base printed circuit board and second radiator, the first insulating heat-conduction material layer being set.
5. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that between the described metal base printed circuit board and first radiator, the second insulating heat-conduction material layer being set.
6. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that the surface of described second radiator, be provided with plough groove type, channel-type or tab style radiator structure.
7. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that described first radiator is heat sink formula radiator.
8. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that the described optical lens and second radiator are fixed.
9. according to the high-capacity LED device of the described multi-channel cooling of claim 1, it is characterized in that described securing member is a screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200725105U CN201081166Y (en) | 2007-07-17 | 2007-07-17 | High-power LED device with multi-channel heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007200725105U CN201081166Y (en) | 2007-07-17 | 2007-07-17 | High-power LED device with multi-channel heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201081166Y true CN201081166Y (en) | 2008-07-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007200725105U Expired - Lifetime CN201081166Y (en) | 2007-07-17 | 2007-07-17 | High-power LED device with multi-channel heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201081166Y (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102518955A (en) * | 2009-05-21 | 2012-06-27 | 沈育浓 | Light source package |
| CN104411086A (en) * | 2014-11-04 | 2015-03-11 | 广东明路电力电子有限公司 | Power PCB and processing method thereof |
| CN105927869A (en) * | 2016-06-15 | 2016-09-07 | 重庆惠科金扬科技有限公司 | Light bar, backlight module and display device |
| CN106229311A (en) * | 2016-08-22 | 2016-12-14 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN112283601A (en) * | 2019-07-24 | 2021-01-29 | 艾乐购动力技术公司 | LED lamp and lighting fixture |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
-
2007
- 2007-07-17 CN CNU2007200725105U patent/CN201081166Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102518955A (en) * | 2009-05-21 | 2012-06-27 | 沈育浓 | Light source package |
| CN104411086A (en) * | 2014-11-04 | 2015-03-11 | 广东明路电力电子有限公司 | Power PCB and processing method thereof |
| CN105927869A (en) * | 2016-06-15 | 2016-09-07 | 重庆惠科金扬科技有限公司 | Light bar, backlight module and display device |
| CN106229311A (en) * | 2016-08-22 | 2016-12-14 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN106229311B (en) * | 2016-08-22 | 2019-06-07 | 成都众乐泰科技有限公司 | A kind of production technology of LED light emitting diode |
| CN112283601A (en) * | 2019-07-24 | 2021-01-29 | 艾乐购动力技术公司 | LED lamp and lighting fixture |
| CN112492862A (en) * | 2021-01-05 | 2021-03-12 | 四川赛狄信息技术股份公司 | High-power printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CREE SHANGHAI OPTO DEVELOPMENT LIMITED. Free format text: FORMER OWNER: HUAGANG PHOTOELECTRICITY( SHANGHAI ) CO., LTD. Effective date: 20090619 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20090619 Address after: No. 879, Putuo District Road, Zhongjiang Road, Shanghai, 22, zip code: 200333 Patentee after: Shanghai Cree Optoelectronic Development Co., Ltd. Address before: No. 879, Putuo District Road, Zhongjiang Road, Shanghai, 22, zip code: 200333 Patentee before: COTCO Optic Technology (Shanghai) Limited |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080702 |