CN201084731Y - A two-color chip light-emitting diode - Google Patents

Abstract

The utility model discloses a two-color chip type light-emitting diode, which comprises two kinds of chips with different luminous colors, a substrate, and an encapsulating colloid for encapsulating the chip on the substrate, and is characterized in that the substrate is a metal substrate and has metal substrate electrodes Structure, the chip and the electrode metal substrate electrodes are connected by conductive leads, and the encapsulation colloid encapsulates the chip, conductive leads, and electrode metal substrates together, and connects the mutually insulated metal substrates together, and connects the mutually independent electrode parts. Together. The utility model adopts a metal base plate as the base plate of the two-color chip type light-emitting diode, improves the heat dissipation capacity of the two-color chip type light-emitting diode, and provides a two-color chip type light-emitting diode with high luminous efficiency, low production cost and stable photoelectric characteristics.

Description

A two-color chip light-emitting diode

technical field

The utility model relates to the technical field of light-emitting diodes, in particular to a two-color chip-type light-emitting diode.

Background technique

Two-color chip light-emitting diodes are widely used in indoor display screens, backlights, toys, decorative lighting, etc. The two-color chip light-emitting diodes with known structures all use PCB printed circuit boards as substrates. As shown in Figure 1, it is a basic structure diagram of a known two-color chip type LED, and the main structure includes a PCB printed circuit board 7, electrodes 2, chips 3-1, 3-2, conductive leads 4, adhesive, epoxy resin . The electrodes 2-1, 2-2 of the two-color chip type light-emitting diodes are respectively connected to the electrodes on the chips 3-1, 3-2 through the conductive leads 4. The epoxy resin encapsulates the chips 3-1 and 3-2, thereby forming an independent light-emitting structure of two-color chip-type light-emitting diodes.

The two-color chip light-emitting diodes produced by printed circuit boards have the disadvantages of low luminous efficiency, fast aging and attenuation, poor heat dissipation performance, and high production costs. Especially when used in large-scale applications such as display screens, it is easy to produce uneven color changes. Phenomenon.

Contents of the invention

The purpose of the utility model is to provide a two-color chip light-emitting diode with high luminous efficiency, stable photoelectric characteristics, low production cost and good heat dissipation effect in order to solve the deficiencies of the prior art.

The utility model adopts the following technical solutions to achieve the above object: a two-color chip light-emitting diode, including two kinds of chips with different luminous colors, a substrate, and an encapsulating colloid for encapsulating the chip on the substrate. It is characterized in that the The substrate is a metal substrate. According to the electrical characteristics of the LED, the positive and negative electrodes of the two-color chip LED are separated from the substrate. The chip and the electrode part of the metal substrate are connected by conductive leads, and the chip, conductive leads, and metal substrate are packaged together by the packaging colloid , thereby forming an independent light-emitting structure of a two-color chip-type light-emitting diode.

As a further illustration of the above solution, the chip is connected to the metal substrate through an adhesive.

The two chips with different luminescent colors are all placed on the same substrate plane.

There are four metal substrate electrodes, two of which are independent electrodes as the positive poles of the two-color chip LED; the other two electrodes are used as the negative poles of the two-color chip LED, and the electrodes of the latter can be connected to each other or have independent electrical connections characteristic.

The surface of the metal substrate is provided with a metal coating with a high light reflection coefficient.

The metal substrate is provided with a through hole, and the packaging colloid penetrates into the through hole on the metal substrate during the molding process, so as to increase the bonding strength between the packaging colloid and the metal substrate.

The encapsulation colloid adopts epoxy resin.

The beneficial effect that the present invention can reach by adopting above-mentioned technical solution is:

1. The metal substrate with a higher thermal conductivity than ordinary circuit boards is used as the substrate of the two-color chip light-emitting diode, which effectively guarantees the photoelectric stability and overall heat dissipation of the device;

2. Using the metal material substrate as the substrate of the two-color chip light-emitting diode, the production material cost is significantly lower than that of the PCB printed circuit board;

3. The surface coating of the substrate is a metal coating with a high reflection coefficient, such as silver, which can effectively improve the light reflection ability of the substrate and improve the luminous efficiency of the two-color chip LED;

4. Increase the contact area between the metal substrate and the packaging colloid, and at the same time eliminate the lateral force through the through-hole structure to ensure the reliability of the two-color chip LED.

Description of drawings

Fig. 1 is a schematic structural diagram of a known two-color chip type light-emitting diode;

Fig. 2 is a schematic diagram of the structure of a two-color chip type light-emitting diode of the present invention.

Explanation of Reference Signs: 1. Metal substrate 2. Electrode 2-1, Positive pole 2-2, Positive pole 2-3, Negative pole 2-4, Negative pole 3, Chip 4, Conductive lead 5, Encapsulation colloid 6, Through hole 7, PCB printed circuit board

Detailed ways

As shown in Figure 2, the dual-color chip light-emitting diode of the present invention includes two kinds of chips 3 with different luminous colors, a metal substrate 1, and an encapsulating compound 5 for encapsulating the chip on the chip carrier substrate. In this embodiment, the encapsulating colloid 5. Epoxy resin is used, and the metal substrate 1 is formed by stamping or corrosion process; the electrodes of the metal substrate are connected to the chip electrodes through conductive leads 4. In this embodiment, there are four electrodes of the two-color chip light-emitting diode, two of which are connected together, and the metal The substrate is therefore divided into three independent parts, in which two independent electrodes 2-1 and 2-2 are used as the anode of the two-color chip LED, and the negative electrode 2-3 and the negative electrode 2-4 are connected together to form a common cathode structure The two-color chip light-emitting diode; the chip 3 is placed in the middle of the metal substrate 1, the chip 3 is connected with the metal substrate 1 through an adhesive, and the electrodes 2-1, 2-2, 2-3, 2-4 are distributed in the The periphery of the chip 3, the chip 3 and the electrode metal substrate are connected by conductive leads, and the epoxy resin encapsulates the chip 3, the conductive leads 4, and the pins of the electrode metal substrate, and connects the three independent parts of the metal substrate 1 Together, thus forming a two-color chip LED.

In this embodiment, the surface of the metal substrate 1 is provided with silver with a high light reflection coefficient as the metal substrate surface coating material, which can improve the light reflection ability of the metal substrate; the metal substrate 1 is provided with through holes, and the epoxy resin is formed The process penetrates into the through hole 6 on the metal substrate, thus increasing the bonding strength between the epoxy resin and the metal substrate.

Claims (8)

1. double-colored flat type LED, comprise two kinds of different chips of glow color, substrate, with the packing colloid of Chip Packaging on substrate, it is characterized in that, described substrate is a metal substrate, three or more part that metal substrate is divided into mutually insulated forms electrode, be connected by conductive lead wire between chip and the electrode metal electrode of substrate, packing colloid is packaged together chip, conductive lead wire, metal substrate, and separate electrode is partly linked together.

2. double-colored flat type LED according to claim 1 is characterized in that, two kinds of different chips of described glow color all are placed on the same metal substrate plane.

3. double-colored flat type LED according to claim 1 is characterized in that described chip links together by adhesive and metal substrate.

4. double-colored flat type LED according to claim 1, it is characterized in that, described metal substrate electrode has four, two positive poles that electrode is double-colored flat type LED wherein, two other electrode is as the negative pole of double-colored flat type LED, and two negative poles of double-colored flat type LED interconnect.

5. double-colored flat type LED according to claim 4 is characterized in that, and is separate between four electrodes of described metal substrate.

6. novel dual-color flat type LED according to claim 1 is characterized in that described metallic substrate surfaces is provided with the coat of metal with reflecting properties.

7. double-colored flat type LED according to claim 1 is characterized in that described metal substrate is provided with through hole.

8. double-colored flat type LED according to claim 1 is characterized in that, described packing colloid adopts epoxy resin.

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